CN109273398B - Wafer flattening and fixing device - Google Patents
Wafer flattening and fixing device Download PDFInfo
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- CN109273398B CN109273398B CN201811137141.2A CN201811137141A CN109273398B CN 109273398 B CN109273398 B CN 109273398B CN 201811137141 A CN201811137141 A CN 201811137141A CN 109273398 B CN109273398 B CN 109273398B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
A wafer leveling and fixing device includes: a bearing table; the adsorption fixing part is provided with a pre-fixing unit and a loading fixing unit; and a negative pressure unit; the edge pressing fixing part is used for flatly fixing the edge area of the warped wafer loaded and fixed on the adsorption fixing part; and the detection part includes negative pressure detecting element who installs on the absorption fixed part and the roughness detecting element who installs on the blank pressing fixed part, and the blank pressing fixed part has: a support; the edge pressing unit can move up and down relative to the adsorption fixing part and is provided with a pressure plate and a plurality of edge pressing heads arranged on the pressure plate; the air injection unit is used for injecting a vertically downward air flow; and the edge pressing motor is used for driving the edge pressing unit and the air injection unit to move, the warped wafer is pre-fixed and loaded onto the loading fixing unit, the air injection unit injects air to the warped wafer, meanwhile, the edge pressing unit moves downwards to flatten the edge area of the pre-fixed warped wafer, and the loading fixing unit adsorbs and fixes the flattened warped wafer.
Description
Technical Field
The present invention relates to a fixing device.
Background
Fan-Out WLP (Fan-Out Wafer Level Packaging) Fan-Out Wafer Level Packaging is a high-end Packaging technology, and a solder ball is used to replace a traditional DIP pin, so that higher integration Level can be realized in single-chip Packaging, better electrical properties are achieved, packaging cost can be reduced, calculation speed is increased, and power consumption is reduced. However, in some process steps of fan-out wafer level packaging, such as die deposition, die bonding, etc., the wafer is warped due to the uneven pressure on the wafer, which affects the flatness of the silicon wafer and the pressure on the die, and the reconstructed wafer contains plastic, silicon and metal materials, the ratio of silicon to colloid is different in three directions X, Y, Z, and the wafer is warped due to the expansion and contraction of the mold during heating and cooling.
The surface unevenness of the wafer caused by the warpage of the wafer is a significant challenge for the existing packaging process equipment. When the ball planting process is carried out on the wafer, the printing ball planting process is carried out after the wafer is fixed through vacuum adsorption, and the wafer is difficult to be completely adsorbed and fixed due to the warping of the wafer, so that the surface flatness of the ball to be printed is low, and the accuracy and firmness of the ball planting are reduced.
Disclosure of Invention
The invention aims to solve the problem that the warping of the wafer cannot be leveled and fixed to influence the subsequent process, and provides a wafer leveling and fixing device.
The invention provides a wafer flattening and fixing device, which is used for flattening and fixing a warped wafer placed in packaging equipment, and is characterized by comprising the following components: a carrier table installed in the encapsulation apparatus; the adsorption fixing part is arranged on the bearing platform, is used for adsorbing and fixing the warped wafer, and is provided with a pre-fixing unit, a loading fixing unit and a negative pressure unit, wherein the pre-fixing unit and the loading fixing unit can move up and down relative to the bearing platform, and the negative pressure unit is used for respectively providing vacuum negative pressure for the pre-fixing unit and the loading fixing unit; the edge pressing fixing part is arranged in the packaging equipment, is positioned right above the adsorption fixing part and is used for flatly fixing the edge area of the warped wafer loaded and fixed on the adsorption fixing part; and a detection part for detecting the flatness of the warped wafer, including a negative pressure detection unit mounted on the adsorption fixing part and a flatness detection unit mounted on the edge pressing fixing part, wherein the edge pressing fixing part has: the bracket is fixed on the packaging equipment; a pressing unit mounted on the bracket, movable up and down with respect to the adsorption fixing part, for pressing the edge area, and having a pressure plate and a plurality of pressing heads mounted on the pressure plate; the air injection unit is arranged on the edge pressing unit, can move up and down relative to the adsorption fixing part and is used for injecting vertically downward air flow; and the edge pressing motor is fixed on the support and used for driving the edge pressing unit and the air injection unit to move, the warped wafer is pre-fixed and loaded on the loading fixing unit, the air injection unit injects air to the warped wafer, meanwhile, the edge pressing unit moves downwards to flatten the edge area of the pre-fixed warped wafer, and the loading fixing unit adsorbs and fixes the flattened warped wafer.
The wafer flattening and fixing device provided by the invention can also have the characteristics that: the pressure plate is provided with a circular center piece and a plurality of strip-shaped pieces, the strip-shaped pieces are uniformly distributed in a central radial mode, and one ends of the strip-shaped pieces are fixed on the center piece.
The wafer flattening and fixing device provided by the invention can also have the characteristics that: the edge pressing heads are arranged on the strip-shaped components and located at the other ends of the strip-shaped components, one edge pressing head is arranged on each strip-shaped component, and every two edge pressing heads are symmetrically arranged on an extension line of one diameter of the central component.
The wafer flattening and fixing device provided by the invention can also have the characteristics that: the plurality of edge pressing heads are arranged in a circular ring shape, and the circle center of each edge pressing head is coincident with that of the center piece.
The wafer flattening and fixing device provided by the invention can also have the following characteristics that: the loading and fixing unit is arranged on the bearing platform, is used for loading and fixing the warped wafer and is provided with a base plate, a plurality of adsorption holes and a plurality of base plate through holes, wherein the plurality of adsorption holes and the plurality of base plate through holes are arranged on the base plate, and the base plate through holes are positioned in the central area of the base plate and are used for allowing the pre-fixing unit to pass through.
The wafer flattening and fixing device provided by the invention can also have the characteristics that: the chassis is circular, the plurality of adsorption holes are arranged in a plurality of circles of circular adsorption hole rings, the circle centers of the plurality of circles of adsorption hole rings are overlapped with the circle center of the chassis, and the adsorption hole rings are arranged from inside to outside along the diameter direction of the chassis.
The wafer flattening and fixing device provided by the invention can also have the following characteristics that: the pre-fixing unit is arranged on the bearing table and comprises a plurality of adsorption fixing rods, and each adsorption fixing rod penetrates through one chassis through hole.
The wafer flattening and fixing device provided by the invention can also have the following characteristics that: wherein, negative pressure unit includes: the chassis negative pressure assembly is arranged below the chassis and is communicated with the plurality of adsorption holes; the pre-fixing negative pressure assembly is communicated with the pre-fixing assembly; and the pressure adjusting assembly is respectively arranged on the chassis negative pressure assembly and the fixed rod negative pressure assembly and is used for respectively adjusting the negative pressure supplied to the chassis negative pressure assembly and the fixed rod negative pressure assembly.
The wafer flattening and fixing device provided by the invention can also have the following characteristics that: the chassis negative pressure assembly comprises a plurality of chassis joints and a plurality of chassis negative pressure pipelines respectively communicated with the chassis joints, the chassis joints are annular and are arranged in one-to-one correspondence with the adsorption hole rings, and seven chassis joints sequentially generate negative pressure from inside to outside.
The wafer flattening and fixing device provided by the invention can also have the following characteristics that: wherein, the pressure regulating assembly includes a plurality of chassis pressure regulating valves and a plurality of absorption pole pressure regulating valves.
Action and Effect of the invention
The flattening and fixing device comprises an adsorption fixing part and a blank holder fixing part, so that the edge of a warped wafer can be flattened after the warped wafer is pre-fixed and loaded on the chassis, and then all areas of the back surface of the warped wafer are adsorbed and fixed through the adsorption holes on the chassis.
Meanwhile, the edge pressing fixing part provided by the invention is provided with the edge pressing unit and the air injection unit, so that downward air flow can be injected in the process of flattening the edge area of the warped wafer, the air flow can generate vertical downward uniform pressure while not contacting the position with the chip structure on the warped wafer, the warped wafer is flattened in the whole area in advance, particles on the surface of the warped wafer can be removed, and the particles generated in the operation process are prevented from falling into the surface of the warped wafer to influence the yield.
The flattening and fixing device is also provided with a detection part, so that the flatness of the flattened and fixed warped wafer can be detected and confirmed, the flatness of the fixed warped wafer is ensured to be within an error range, and the smooth proceeding of subsequent operation is ensured.
Drawings
FIG. 1 is a schematic view of a wafer leveling and fixing device according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a pre-fixing unit according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a chassis according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a binder unit according to an embodiment of the present invention;
FIG. 5 is a schematic view of a structure of a binder head according to an embodiment of the present invention;
FIG. 6 is a flow chart of the warped wafer flat mounting in the embodiment of the present invention; and
FIG. 7 is a flow chart of the warped wafer release in an embodiment of the present invention.
Detailed Description
In order to make the technical means, the creation features, the achievement objects and the effects of the present invention easy to understand, the following embodiments specifically describe the composition, the working principle, the implementation method and the beneficial effects of the wafer leveling and fixing device provided by the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a wafer leveling and fixing device according to an embodiment of the invention.
As shown in fig. 1, the flat fixing device 100 in this embodiment is used for flat fixing of a warped wafer placed in a packaging apparatus, and includes a carrier table 1, an absorption fixing portion, a pressing fixing portion, a detection portion, and a control portion.
The carrier table 1 is mounted in the packaging apparatus and can be moved horizontally between the various stations in the packaging apparatus.
The adsorption fixing part is arranged on the bearing platform 1 and used for adsorbing and fixing the warped wafer and comprises a pre-fixing unit 2, a loading fixing unit 3 and a negative pressure unit.
Fig. 2 is a schematic structural diagram of a pre-fixing unit according to an embodiment of the present invention.
As shown in fig. 2, the pre-fixing unit 2 is mounted on the carrier table 1, and has a plurality of suction fixing bars 21 and a fixing bar driving motor.
The adsorption fixing rod 21 can vertically move up and down with respect to the carrier table 1. In this embodiment, the number of the adsorption fixing rods 21 is three, and the three adsorption fixing rods 21 are arranged in a regular triangle. The adsorption fixing rod 21 includes a rod body and a fixing head installed at one end of the rod body.
The rod body is hollow rod-shaped.
The fixing head is horn-shaped, is communicated with the rod body and is used for contacting with the back surface of the warped wafer during fixing, and the part of the top end of the fixing head contacting with the wafer is made of flexible materials.
The fixing rod driving motor is installed on the bearing table 1, and drives the three adsorption fixing rods 21 to vertically move up and down at a certain speed at the same time. In this embodiment, the moving speed of the adsorption fixing rod 21 is 1 to 500mm/s.
The chassis fixing component of the loading fixing unit 3 is installed on the bearing table 1 and comprises a supporting jig 31, a chassis 32 and a chassis driving motor.
Fig. 3 is a schematic structural diagram of a chassis according to an embodiment of the present invention.
As shown in fig. 3, the base plate 32 is circular and fixed on the supporting fixture 31 for loading and fixing the warped wafer, and has a plurality of suction holes 321 and a plurality of base plate through holes 322 for allowing the suction fixing rods 21 to pass through. The diameter of the chassis 32 in this embodiment is: 330mm.
The plurality of adsorption holes 321 have the same diameter, penetrate through the base plate 32, and are arranged in a plurality of circles of annular adsorption hole rings. The centers of the adsorption hole rings are coincident with the center of the chassis 32 and are arranged from inside to outside along the diameter direction of the chassis. A plurality of absorption holes 321 are seven rings of circular absorption hole circles in this embodiment and are arranged, and the diameter of seven rings of absorption hole circles is respectively: 40mm, 80mm, 110mm, 140mm, 180mm, 226mm and 276mm.
12 adsorption holes 321 are respectively and uniformly distributed in two adsorption hole rings with the diameters of 40mm and 80mm, 24 adsorption holes 321 are respectively and uniformly distributed in two adsorption hole rings with the diameters of 110mm and 140mm, 36 adsorption holes 321 are respectively and uniformly distributed in two adsorption hole rings with the diameters of 180mm and 226mm, and 48 adsorption holes 321 are respectively and uniformly distributed in an adsorption hole ring with the diameter of 276mm.
The chassis through holes 322 are located in the central region of the chassis 32, and each chassis through hole 322 is penetrated by one suction fixing rod 21. In this embodiment, the number of the chassis through holes 322 is three, and the chassis through holes are arranged in a regular triangle, the center of the regular triangle is overlapped with the center of the chassis 32, and the three chassis through holes 322 are arranged between two adsorption hole rings with the diameters of 40mm and 80 mm.
The chassis driving motor is fixed on the bearing platform 1, located below the supporting jig 31, connected with the supporting jig 31, and used for driving the supporting jig 31 and the chassis 32 to vertically move up and down at a certain speed relative to the bearing platform 1. In this embodiment, the moving speed of the supporting fixture 31 and the chassis 32 is 1-500mm/s.
The negative pressure unit is used for respectively providing vacuum negative pressure for the pre-fixing unit 2 and the loading fixing unit 3 and comprises a negative pressure main pipeline, a vacuum filter, a chassis negative pressure assembly, a pre-fixing negative pressure assembly and a pressure adjusting assembly.
The negative pressure unit is communicated with an external vacuum generating device through a negative pressure main pipeline.
The vacuum filter is arranged on the negative pressure main pipeline and is used for filtering the airflow flowing through the main pipeline.
The chassis negative pressure subassembly is installed in chassis 32 below, includes that the chassis connects and many chassis negative pressure pipeline with a plurality of chassis that the adsorption hole circle one-to-ones set up, and the chassis connects for seven in this embodiment, and every chassis connects and a chassis negative pressure pipeline intercommunication.
The chassis joint is ring-shaped and is communicated with a plurality of adsorption holes on the corresponding adsorption hole ring. One end of the chassis joint is arranged below the chassis, and the other end of the chassis joint is communicated with the main negative pressure pipeline through a chassis negative pressure pipeline. And a sealing strip is arranged between each chassis joint and the chassis and used for sealing and preventing negative pressure leakage.
The pre-fixing negative pressure assembly comprises a plurality of fixing rod joints and a plurality of fixing rod negative pressure pipelines, wherein the fixing rod joints and the fixing rod negative pressure pipelines are arranged in a one-to-one correspondence mode through the adsorption fixing rods 21, the number of the fixing rod joints in the embodiment is three, and each fixing rod joint is communicated with one fixing rod negative pressure pipeline.
One end of the fixed rod joint is fixed at the lower end of the adsorption fixed rod and communicated with the adsorption fixed rod, and the other end of the fixed rod joint is communicated with the total negative pressure pipeline through a fixed rod negative pressure pipeline. And a sealing strip is arranged between each fixed rod joint and the adsorption fixed rod and used for sealing and preventing negative pressure leakage.
The pressure regulating assembly includes a plurality of chassis pressure regulating valves and a plurality of rod pressure regulating valves. In this embodiment, the number of the chassis pressure regulating valves is seven, and the number of the fixing rod pressure regulating valves is three.
The chassis pressure regulating valve is arranged on the chassis negative pressure pipeline and used for regulating the negative pressure in the pipeline, and each chassis negative pressure pipeline is provided with one chassis pressure regulating valve. When the device is used in the embodiment, the seven chassis pressure regulating valves are sequentially opened or closed, so that the seven circles of adsorption hole rings sequentially generate negative pressure from inside to outside or sequentially release the negative pressure from outside to inside.
The fixed rod pressure regulating valve is arranged on the fixed rod negative pressure pipeline and used for regulating the negative pressure in the pipeline, and a fixed rod pressure regulating valve is arranged on each chassis negative pressure pipeline. When the vacuum suction device is used in the embodiment, the three fixing rod pressure regulating valves are opened or closed simultaneously, so that the three suction fixing rods 21 generate negative pressure simultaneously or release the negative pressure simultaneously.
The edge pressing fixing part is arranged on the packaging equipment and used for flattening the edge area of the warped wafer loaded on the adsorption fixing part, and comprises a support 4, a driving unit, an edge pressing unit 5 and an air injection unit 6. When the warping wafer is leveled and fixed, the edge pressing fixing part is positioned right above the adsorption fixing part.
The bracket 4 comprises a vertical rod and a horizontal rod which are perpendicular to each other. One end of the vertical rod is fixed on the packaging equipment by using a bolt, and the other end of the vertical rod is fixedly connected with one end of the horizontal rod.
The driving unit is arranged on the other end of the horizontal rod and is provided with a telescopic push rod, a connecting block and a blank pressing motor 7.
One end of the push rod is arranged on the edge pressing motor 7, and the other end of the push rod is fixed with a connecting block.
The edge pressing motor 7 is used for driving the push rod to vertically extend and retract.
The edge pressing unit 5 and the air injection unit 6 are both arranged on the connecting block and vertically move up and down at the speed of 1-500mm/s under the drive of the edge pressing motor 7.
The edge pressing unit 5 is used for pressing and flattening the edge area of the warped wafer, and includes a platen 51 and a plurality of edge pressing heads 52 mounted on the platen 51. In this embodiment, the edge region of the warped wafer is a region without a chip structure at the circumferential position of the wafer.
FIG. 4 is a schematic view of the structure of a binder unit according to an embodiment of the present invention.
As shown in fig. 4, the platen 51 is mounted on the connecting block, and has a circular center member and a plurality of strips of equal length, which are uniformly arranged in a radial shape at the center, and one ends of the strips are fixed on the center member. The connection position of the pressure plate 51 and the connecting block is positioned at the center of the center piece. In this embodiment, the number of the strips is 8, the center piece and the eight strips are integrally formed, the distance from the center of the center piece to the farthest ends of the eight strips is 220mm, and the width of each strip is 20mm.
The edge pressing heads 52 are fixed in edge pressing head mounting holes at the other ends of the strip-shaped members by using bolts, one edge pressing head is mounted on each strip-shaped member, and every two edge pressing heads 52 are symmetrically arranged on an extension line of one diameter of the central member. The plurality of edge pressing heads 52 are arranged in a circular ring shape with the center coinciding with the center of the central piece, and the distances from the center of the central piece to the eight edge pressing heads 52 are all 95mm in the embodiment.
FIG. 5 is a schematic view of a structure of a blank holder according to an embodiment of the present invention
As shown in fig. 5, the edge pressing head 52 has a support shaft and a suction cup.
One end of the supporting shaft is fixed in the edge pressing head mounting hole, and the other end of the supporting shaft is provided with a sucker.
The chuck is used for contacting and flattening the edge area of the warped wafer loaded on the adsorption fixing part, and is made of conductive nitrile rubber. The diameter of the sucker in the embodiment is 2-3mm, and the thickness of the sucker is 1-2mm.
When the edge pressing unit presses the edge area of the warped wafer flat, the pressure applied by the suction cup to the edge area is 90-120 kpa. The vertical distance between the suction cup and the chassis 32 is less than or equal to 200mm.
The gas injection unit 6 is used for injecting a gas flow vertically and downwardly, and comprises a gas injection head, a gas pipeline and a gas regulating valve, wherein the gas flow injected by the gas injection unit in the embodiment is compressed clean air.
One end of the gas pipeline is communicated with the gas spraying head, and the other end of the gas pipeline is communicated with an external gas source.
The gas regulating valve is arranged in the gas pipeline and used for controlling the circulation of gas, and the flow rate of the gas flow is 5-15 m/s.
The detection part is used for detecting the flatness of the warped wafer and comprises a negative pressure sensor and a distance sensor.
The negative pressure sensor is arranged on the negative pressure main pipeline and used for detecting the negative pressure in the negative pressure main pipeline.
And the distance sensor 8 is fixed on the connecting block and used for detecting the flatness of the surface of the warped wafer. The distance sensor 8 in this embodiment is a laser distance sensor, and represents the flatness of the surface of the warped wafer by measuring the distances between five measurement points on the surface of the warped wafer and the distance sensor, respectively. In this embodiment, five measurement points are respectively located in five circles of adsorption Kong Juanshang, and the diameters of the five circles of adsorption hole circles where the five measurement points are respectively: 110mm, 140mm, 180mm, 226mm and 276mm.
And the control part is respectively connected with the fixed rod driving motor, the chassis pressure regulating valves, the fixed rod pressure regulating valves, the edge pressing motor 7, the gas regulating valve, the negative pressure sensor and the distance sensor 8 and used for controlling the adsorption fixing part to adsorb and fix the warped wafer, controlling the edge pressing fixing part to flatten the edge area of the warped wafer, judging the flatness according to a negative pressure signal and a distance signal from the negative pressure sensor and the distance sensor 8, and further controlling the operation of the adsorption fixing part and the edge pressing fixing part to ensure that the flatness of the fixed warped wafer is in a preset range. The flatness range of the warped wafer surface in this embodiment is +8mm.
FIG. 6 is a flow chart of the warped wafer flat mounting in an embodiment of the present invention.
As shown in fig. 6, the method for flatly fixing the warped wafer in this embodiment is as follows:
step S1-1, after the warped wafer reaches the preset position, the chassis driving motor drives the supporting jig 31 and the chassis 32 to descend together, the fixed rod driving motor drives the adsorption fixed rod 21 to ascend, the fixed rod pressure regulating valve is opened to generate negative pressure, the warped wafer is pre-fixed, and then the step S1-2 is carried out.
Step S1-2, the chassis driving motor drives the supporting jig 31 and the chassis 32 to rise together to the height flush with the adsorption fixed rod 21, the pre-fixed warped wafer is loaded, and then the step S1-3 is carried out.
And S1-3, driving the edge pressing unit 5 and the air injection unit 6 to move downwards simultaneously by the edge pressing motor 7, simultaneously opening the air regulating valve, injecting compressed air to the surface of the warped wafer by the air injection head, flattening the edge area of the warped wafer by the edge pressing unit 5, and then entering the step S1-4.
And S1-4, sequentially starting the chassis pressure regulating valves, sequentially generating negative pressure by the adsorption hole rings from inside to outside, adsorbing and fixing the warped wafer loaded on the chassis 32, and then entering the step S1-5.
And S1-5, detecting the negative pressure in the negative pressure main pipeline by the negative pressure sensor, entering S1-6 when the negative pressure value displayed by the negative pressure signal is between 60kpa and 80kpa, and entering S1-7 when the negative pressure value displayed by the negative pressure signal is not between 60kpa and 80 kpa.
And S1-6, stopping air injection by the air injection head, driving the edge pressing unit 5 and the air injection unit 6 to simultaneously ascend by the edge pressing motor 7, and then entering S1-10.
And S1-7, simultaneously closing the fixed rod pressure regulating valve and the chassis pressure regulating valve, opening again after delaying for 0.2 second, and then entering S1-8.
And S1-8, detecting the negative pressure in the negative pressure main pipeline by the negative pressure sensor, entering S1-6 when the negative pressure value displayed by the negative pressure signal is between 60kpa and 80kpa, and entering S1-9 when the negative pressure value displayed by the negative pressure signal is not between 60kpa and 80 kpa.
And S1-9, sending an alarm prompt and then entering an ending state.
And S1-10, detecting the space between the surface of the wafer and the distance sensor by the distance sensor 8, confirming the flatness range, and then entering an ending state.
FIG. 7 is a flow chart of the warped wafer release in an embodiment of the present invention.
As shown in fig. 7, the method for releasing the warped wafer in this embodiment is as follows:
step S2-1, the chassis driving motor drives the supporting jig 31 and the chassis 32 to rise to the height flush with the adsorption fixed rod 21, the fixed rod pressure regulating valve is opened to generate negative pressure, and then the step S2-2 is carried out.
And S2-2, driving the edge pressing unit 5 and the air injection unit 6 to move downwards simultaneously by the edge pressing motor 7, flattening the edge area of the warped wafer by the edge pressing unit 5, and then entering the step S2-3.
And S2-3, closing the chassis pressure regulating valves at intervals of 0.2 second in sequence, releasing negative pressure of the adsorption hole rings from outside to inside in sequence, and then entering the step S2-4.
And S2-4, closing the pressure regulating valve of the fixed rod, releasing the negative pressure by the adsorption fixed rod 21, and then entering the step S2-5.
And S2-5, driving the edge pressing unit 5 and the air injection unit 6 to move upwards simultaneously by the edge pressing motor 7, driving the supporting jig 31 and the chassis 32 to descend together by the chassis driving motor, and then entering an end state.
Effects and effects of the embodiments
The flattening and fixing device comprises an adsorption fixing part and an edge pressing fixing part, the edge of a warped wafer can be flattened after the warped wafer is pre-fixed and loaded on the chassis, and then all areas of the back surface of the warped wafer are adsorbed and fixed through the adsorption holes in the chassis.
Meanwhile, the edge pressing fixing part provided by the invention is provided with the edge pressing unit and the air injection unit, so that downward air flow can be injected in the process of flattening the edge area of the warped wafer, the air flow can generate vertical downward uniform pressure while not contacting the position with the chip structure on the warped wafer, the warped wafer can be flattened in the whole area in advance, particles on the surface of the warped wafer can be removed, and the particles generated in the operation process are prevented from falling into the surface of the warped wafer to influence the yield.
The flattening fixing device provided by the embodiment of the invention is also provided with a detection part, so that the flatness of the flattened and fixed warped wafer can be detected and confirmed, the flatness of the fixed warped wafer is ensured to be within an error range, and the smooth operation of the subsequent operation is ensured.
Furthermore, the edge pressing unit provided by the embodiment of the invention is provided with the pressure plate, the pressure plate is composed of the central part and the strip-shaped parts which are uniformly distributed in a radial shape, and the edge pressing heads which are distributed in a circular ring shape are arranged on the strip-shaped parts, so that downward pressure can be uniformly distributed on the edge position, and the wafer damage caused by uneven stress is avoided.
Meanwhile, the whole pressure plate is small and portable due to the arrangement of the central piece and the strip-shaped pieces, so that the surface of the warped wafer can be conveniently observed in the pressing process, and the detection of the distance sensor cannot be hindered.
The leveling and fixing device provided by the embodiment of the invention has the advantages that the pre-fixing part capable of moving up and down is used for positioning and pre-fixing the warped wafer, so that the warped wafer can be prevented from being shifted in position in the process of being loaded on the chassis, and the subsequent operation is prevented from being influenced; the loading fixing part is provided with the chassis and the plurality of adsorption holes arranged on the chassis, so that the warped wafer can be further adsorbed and fixed on the chassis after being pre-fixed, and the plurality of adsorption holes jointly fix the warped wafer, so that each part of the warped wafer is well fixed, the missing position is avoided, the good flatness of the fixed whole warped wafer is ensured, and the flat fixing is carried out by adopting a plurality of point-shaped negative pressure adsorption modes, so that the downward suction force is enough to ensure that the warped wafer is well fixed, the falling or the deviation is not easy to occur, the adsorption force borne by the warped wafer can be uniformly dispersed on the whole wafer, and the damage of the wafer caused by the overlarge local stress due to the uneven stress is avoided.
Because the plurality of adsorption holes in the leveling and fixing device are arranged in the form of a plurality of circles of circular adsorption hole rings, the adsorption hole rings are overlapped with the circle center of the base plate and are sequentially arranged from inside to outside, the arrangement of the adsorption holes is matched with the shape of the warped wafer, the missing regions during adsorption and fixing are avoided, the stability of the regions of the warped wafer is ensured during adsorption and fixing of the circular adsorption hole rings, the regions in the same radius range are fixed at the same time, and the improvement of the flatness of the whole warped wafer is facilitated.
According to the fixing and releasing mode, the warped wafer can be fixed in regions during fixing, flatness is improved beneficially, pressure is relieved from circle to circle during releasing, and damage to the wafer caused by uneven stress on the wafer is avoided.
The above embodiments are preferred examples of the present invention, and are not intended to limit the scope of the present invention.
Claims (10)
1. The utility model provides a wafer levels fixing device for it is fixed to level to place warpage wafer in packaging equipment, its characterized in that includes:
a carrier mounted in the encapsulation apparatus;
the adsorption fixing part is arranged on the bearing platform, is used for adsorbing and fixing the warped wafer, and is provided with a pre-fixing unit, a loading fixing unit and a negative pressure unit, wherein the pre-fixing unit and the loading fixing unit can move up and down relative to the bearing platform, and the negative pressure unit is used for respectively providing vacuum negative pressure for the pre-fixing unit and the loading fixing unit;
the edge pressing fixing part is arranged in the packaging equipment, is positioned right above the adsorption fixing part and is used for flatly fixing the edge area of the warped wafer loaded and fixed on the adsorption fixing part; and
the detection part is used for detecting the flatness of the warped wafer and comprises a negative pressure detection unit arranged on the adsorption fixing part and a flatness detection unit arranged on the edge pressing fixing part,
wherein, the blank holder fixed part has:
the bracket is fixed on the packaging equipment;
a pressing unit which is mounted on the bracket, can move up and down relative to the adsorption fixing part, is used for flattening the edge area, and is provided with a pressing disc and a plurality of pressing heads mounted on the pressing disc;
an air injection unit mounted on the edge pressing unit, movable up and down relative to the adsorption fixing part, and used for injecting vertically downward air flow; and
the edge pressing motor is fixed on the bracket and used for driving the edge pressing unit and the air injection unit to move,
the warped wafer is pre-fixed and loaded on the loading and fixing unit, the air injection unit injects air to the warped wafer, meanwhile, the edge pressing unit moves downwards to flatten the edge area of the pre-fixed warped wafer, and the loading and fixing unit adsorbs and fixes the flattened warped wafer.
2. The wafer planarizing fixture apparatus of claim 1, wherein: wherein the pressure plate is provided with a circular central piece and a plurality of strip-shaped pieces,
a plurality of the strip-shaped pieces are uniformly distributed in a radial shape at the center,
one end of the strip-shaped piece is fixed on the central piece.
3. The wafer planarizing fixture apparatus of claim 2, wherein: wherein the edge pressing head is arranged on the strip-shaped piece and is positioned at the other end of the strip-shaped piece,
each strip-shaped element is provided with one edge pressing head,
every two crimping heads are symmetrically arranged on a diameter extension line of the central part.
4. The wafer planarizing fixture apparatus of claim 2, wherein: the edge pressing heads are arranged in a circular ring shape, and the circle centers of the edge pressing heads are coincident with the circle center of the central piece.
5. The wafer flattening fixture of claim 1, wherein: the loading and fixing unit is arranged on the bearing table, is used for loading and fixing the warped wafer, and is provided with a base plate, a plurality of adsorption holes and a plurality of base plate through holes, wherein the plurality of adsorption holes and the plurality of base plate through holes are arranged on the base plate, and the base plate through holes are positioned in the central area of the base plate and are used for the pre-fixing unit to pass through.
6. The wafer planarizing fixture apparatus of claim 5, wherein: wherein the base plate is in a circular shape,
a plurality of the adsorption holes are arranged in a plurality of circles of circular adsorption hole rings,
the circle centers of the multiple circles of adsorption hole rings are overlapped with the circle center of the base plate and are arranged from inside to outside along the diameter direction of the base plate.
7. The wafer planarizing fixture apparatus of claim 6, wherein: wherein the pre-fixing unit is arranged on the bearing table and comprises a plurality of adsorption fixing rods,
each adsorption fixing rod penetrates through one chassis through hole.
8. The wafer planarizing fixture of claim 7, wherein: wherein the negative pressure unit includes:
the chassis negative pressure assembly is arranged below the chassis and is communicated with the adsorption holes;
the pre-fixing negative pressure assembly is communicated with the pre-fixing unit; and
and the pressure adjusting assembly is respectively arranged on the chassis negative pressure assembly and the fixed rod negative pressure assembly and is used for respectively adjusting the negative pressure supplied to the chassis negative pressure assembly and the fixed rod negative pressure assembly.
9. The wafer planarizing fixture of claim 8, wherein: wherein the chassis negative pressure assembly comprises a plurality of chassis joints and a plurality of chassis negative pressure pipelines respectively communicated with the chassis joints,
the chassis joints are annular and are arranged in one-to-one correspondence with the adsorption hole rings,
and the seven chassis joints sequentially generate negative pressure from inside to outside.
10. The wafer planarizing fixture of claim 8, wherein: wherein, the pressure regulating assembly includes a plurality of chassis pressure regulating valves and a plurality of absorption pole pressure regulating valves.
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| CN110517968B (en) * | 2019-08-19 | 2022-12-20 | 西安奕斯伟材料科技有限公司 | Warping degree control method and device |
| CN111473039A (en) * | 2020-03-04 | 2020-07-31 | 上海精测半导体技术有限公司 | Flexible panel leveling apparatus and method |
| CN111267017B (en) * | 2020-03-17 | 2022-05-13 | 华天慧创科技（西安）有限公司 | Support tool for avoiding middle deformation during wafer film coating and working method |
| CN111430286B (en) * | 2020-04-03 | 2024-08-06 | 上海微松工业自动化有限公司 | Automatic loading and unloading device for wafer test and loading and unloading method thereof |
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| CN101393885A (en) * | 2008-10-31 | 2009-03-25 | 中茂电子(深圳)有限公司 | Fixing/releasing auxiliary device for a wafer detection platform, the wafer detection platform and method therefor |
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