CN109256356B - Wafer leveling and fixing device - Google Patents
Wafer leveling and fixing device Download PDFInfo
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- CN109256356B CN109256356B CN201811137378.0A CN201811137378A CN109256356B CN 109256356 B CN109256356 B CN 109256356B CN 201811137378 A CN201811137378 A CN 201811137378A CN 109256356 B CN109256356 B CN 109256356B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A leveling fixing device for leveling and fixing a warped wafer placed in a packaging apparatus, comprising: a carrying platform; the adsorption fixing part is provided with a pre-fixing unit and a loading fixing unit which can move up and down relative to the bearing table, and a negative pressure unit for respectively providing vacuum negative pressure for the pre-fixing unit and the loading fixing unit; the detection portion comprises a negative pressure detection unit and a flatness detection unit, the adsorption fixing portion is provided with a pre-fixing unit, a loading fixing unit and a negative pressure unit, the negative pressure unit is used for providing vacuum negative pressure for the pre-fixing unit and the loading fixing unit respectively, the pre-fixing unit can move up and down relative to the bearing table, the loading fixing unit is provided with a chassis, a plurality of adsorption holes and a plurality of chassis through holes, the adsorption holes are formed in the chassis, the chassis through holes are located in the central area of the chassis and used for the pre-fixing unit to pass through, and after the pre-fixing unit pre-fixes the warpage wafer, the loading fixing unit starts negative pressure to adsorb and fix the pre-fixed warpage wafer.
Description
Technical Field
The present invention relates to a fixing device.
Background
Fan Out WLP (Fan-Out Wafer Level Packaging; FOWLP) Fan-Out wafer level packaging is a high-end packaging technology, and a solder ball is adopted to replace a conventional DIP pin, so that higher integration level can be realized in a single-chip package, better electrical properties are possessed, the packaging cost can be reduced, the calculation speed is increased, and the power consumption is reduced. However, in some process steps, such as die deposition and die bonding, the flatness of the silicon wafer and the pressure on the die are affected due to the uneven pressure, so that the wafer is warped, and the reconstructed wafer contains plastic, silicon and metal materials, the ratio of silicon to colloid is different in the direction X, Y, Z, and the wafer is warped due to thermal expansion and contraction of the mold during heating and cooling.
Wafer surface irregularities caused by warpage of wafers are a significant challenge for existing packaging process equipment. When the wafer is subjected to the ball implantation process, the wafer is required to be subjected to the ball implantation process after being subjected to vacuum adsorption and fixation, and the wafer is difficult to be completely adsorbed and fixed due to the warpage of the wafer, so that the surface flatness of the ball to be printed is low, and the accuracy and the firmness of the ball implantation are reduced.
Disclosure of Invention
The invention aims to solve the problem that the wafer warpage cannot be flatly fixed and affects the subsequent processes, and aims to provide a wafer flattening and fixing device.
The invention provides a wafer leveling and fixing device, which is used for leveling and fixing a warping wafer placed in packaging equipment, and is characterized by comprising the following components: a carrier mounted in the encapsulation apparatus; the adsorption fixing part is arranged on the bearing table and is used for adsorbing and fixing the warping wafer; and a detecting section for detecting flatness of the warped wafer, including a negative pressure detecting unit and a flatness detecting unit, wherein the adsorption fixing section has: the device comprises a pre-fixing unit, a loading fixing unit and a negative pressure unit, wherein the negative pressure unit is used for respectively providing vacuum negative pressure for the pre-fixing unit and the loading fixing unit, the pre-fixing unit is installed on a bearing table and can move up and down relative to the bearing table, the loading fixing unit is used for pre-fixing a warpage wafer, the loading fixing unit is installed on the bearing table and can move up and down relative to the bearing table, the loading fixing unit is used for loading and fixing the warpage wafer, the device is provided with a chassis, a plurality of adsorption holes and a plurality of chassis through holes, the chassis through holes are arranged on the chassis, the chassis through holes are located in a central area of the chassis, the device is used for the pre-fixing unit to pass through, and after the pre-fixing unit pre-fixes the warpage wafer, the loading fixing unit starts the negative pressure to adsorb and fix the pre-fixed warpage wafer.
The wafer leveling and fixing device provided by the invention can also have the characteristics that: wherein, a plurality of absorption holes are the annular absorption hole circle of multiturn circle and arrange.
The wafer leveling and fixing device provided by the invention can also have the characteristics that: the chassis is circular, and the circle centers of the multiple circles of adsorption hole rings are overlapped with the circle centers of the chassis and are distributed from inside to outside along the diameter direction of the chassis.
The wafer leveling and fixing device provided by the invention can also have the characteristics that: the pre-fixing assembly comprises at least three adsorption fixing rods, and each adsorption fixing rod penetrates through one chassis through hole.
The wafer leveling and fixing device provided by the invention can also have the characteristics that: the adsorption rod comprises a rod body and a fixing head arranged at one end of the rod body, the rod body is in a hollow rod shape, and the fixing head is in a horn shape.
The wafer leveling and fixing device provided by the invention can also have the characteristics that: wherein, the negative pressure unit includes: the chassis negative pressure assembly is arranged below the chassis and communicated with the plurality of adsorption holes; the pre-fixing negative pressure component is communicated with the pre-fixing component; and the pressure adjusting component is respectively arranged on the chassis negative pressure component and the fixed rod negative pressure component and is used for respectively adjusting the negative pressure provided for the chassis negative pressure component and the fixed rod negative pressure component.
The wafer leveling and fixing device provided by the invention can also have the characteristics that: the negative pressure regulating unit further comprises a total negative pressure pipeline and a vacuum filter, one end of the negative pressure pipeline is communicated with an external vacuum generating device, the other end of the negative pressure pipeline is respectively communicated with the chassis negative pressure component and the pre-fixed negative pressure component, and the vacuum filter is arranged on the negative pressure pipeline and used for filtering air flow in the negative pressure pipeline.
The wafer leveling and fixing device provided by the invention can also have the characteristics that: the chassis negative pressure assembly comprises a plurality of chassis joints and a plurality of chassis negative pressure pipelines which are respectively communicated with the chassis joints, the chassis joints are in a circular ring shape and are arranged in one-to-one correspondence with the adsorption hole rings, and the chassis joints sequentially generate negative pressure from inside to outside.
The wafer leveling and fixing device provided by the invention can also have the characteristics that: wherein, the pre-fixed negative pressure assembly includes many absorption pole joints and many absorption pole negative pressure pipeline that connect the intercommunication with the absorption pole respectively, and absorption pole joint and absorption pole one-to-one set up.
The wafer leveling and fixing device provided by the invention can also have the characteristics that: the pressure regulating assembly comprises a plurality of chassis pressure regulating valves and a plurality of adsorption rod pressure regulating valves.
Effects and effects of the invention
The leveling and fixing device has the advantages that the leveling and fixing device is provided with the pre-fixing part capable of moving up and down to position and pre-fix the warped wafer, so that the warped wafer can be prevented from being shifted in position in the process of being loaded on the chassis, and the follow-up operation is influenced; the loading and fixing part is provided with the chassis and the plurality of adsorption holes arranged on the chassis, so that the warpage wafer can be further adsorbed and fixed on the chassis after being pre-fixed, the plurality of adsorption holes are used for fixing the warpage wafer together, each part of the warpage wafer is well fixed, missing positions are avoided, good flatness of the whole warpage wafer after being fixed is ensured, the whole warpage wafer is flatly fixed in a mode of adopting a plurality of point-shaped negative pressure adsorption, the enough downward suction force is provided for ensuring that the warpage wafer is well fixed, falling or offset is not easy to occur, the adsorption force received by the warpage wafer is uniformly dispersed on the whole wafer, and damage to the wafer due to overlarge local stress caused by uneven stress is avoided.
Meanwhile, the leveling fixing device is also provided with the detecting part, so that the leveling of the fixed and leveled warping wafer can be detected and confirmed, the leveling of the fixed and leveled warping wafer is ensured to be within an error range, and the subsequent operation is ensured to be smoothly carried out.
Drawings
FIG. 1 is a schematic view of a wafer leveling and fixing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a pre-fixing unit according to an embodiment of the present invention;
FIG. 3 is a schematic view of a chassis according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a side pressing unit according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a blank holder according to an embodiment of the present invention;
FIG. 6 is a flow chart of a warp wafer leveling fixture in an embodiment of the invention; and
FIG. 7 is a flowchart of a warp wafer release in an embodiment of the invention.
Detailed Description
In order to make the technical means, creation characteristics, achievement purposes and effects of the present invention easy to understand, the following embodiments specifically describe the composition, working principle, implementation method and beneficial effects of the wafer leveling fixing device provided by the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a wafer leveling and fixing device according to an embodiment of the invention.
As shown in fig. 1, the leveling and fixing device 100 in the present embodiment is used for leveling and fixing a warpage wafer placed in a packaging apparatus, and has a carrier 1, an adsorption fixing portion, a binder fixing portion, a detecting portion, and a control portion.
The carrier 1 is mounted in a packaging apparatus and is horizontally movable between stations in the packaging apparatus.
The adsorption fixing part is arranged on the bearing table 1 and is used for adsorbing and fixing the warping wafer, and comprises a pre-fixing unit 2, a loading fixing unit 3 and a negative pressure unit.
Fig. 2 is a schematic structural diagram of a pre-fixing unit according to an embodiment of the invention.
As shown in fig. 2, the pre-fixing unit 2 is mounted on the carrying table 1, and has a plurality of adsorption fixing rods 21 and a fixing rod driving motor.
The suction fixing lever 21 is vertically movable up and down with respect to the loading table 1. In this embodiment, three adsorption fixing rods 21 are provided, and the three adsorption fixing rods 21 are arranged in a regular triangle. The adsorption fixing rod 21 includes a rod body and a fixing head mounted at one end of the rod body.
The rod body is in a hollow rod shape.
The fixing head is in a horn shape and communicated with the rod body and is used for contacting with the back surface of the warping wafer during fixing, and the contact part of the top end of the fixing head and the wafer is made of flexible materials.
The fixed rod driving motor is installed on the loading table 1 for driving the three adsorption fixed rods 21 to vertically move up and down at a certain speed at the same time. The moving speed of the suction fixing lever 21 in this embodiment is 1 to 500mm/s.
The loading fixing unit 3 is mounted on the loading table 1 by a chassis fixing assembly including a supporting jig 31, a chassis 32 and a chassis driving motor.
Fig. 3 is a schematic structural diagram of a chassis according to an embodiment of the present invention.
As shown in fig. 3, the chassis 32 is circular and is fixed on the supporting jig 31 for loading and fixing the warpage wafer, and is provided with a plurality of suction holes 321 and a plurality of through holes 322 for passing the suction fixing rods 21 through the chassis. The diameter of the chassis 32 in this embodiment is: 330mm.
The plurality of adsorption holes 321 have the same diameter and penetrate the chassis 32 to form a plurality of circles of circular ring-shaped adsorption hole circles. The circle centers of the adsorption hole rings are coincident with the circle center of the chassis 32 and are distributed from inside to outside along the diameter direction of the chassis. In this embodiment, the plurality of adsorption holes 321 are arranged in seven circles of annular adsorption hole circles, and the diameters of the seven circles of adsorption hole circles are respectively: 40mm, 80mm, 110mm, 140mm, 180mm, 226mm and 276mm.
The two adsorption hole rings with the diameters of 40mm and 80mm are respectively and uniformly provided with 12 adsorption holes 321, the two adsorption hole rings with the diameters of 110mm and 140mm are respectively and uniformly provided with 24 adsorption holes 321, the two adsorption hole rings with the diameters of 180mm and 226mm are respectively and uniformly provided with 36 adsorption holes 321, and the adsorption hole rings with the diameters of 276mm are respectively and uniformly provided with 48 adsorption holes 321.
The chassis through holes 322 are located in a central region of the chassis 32, and each chassis through hole 322 is penetrated by one suction fixing rod 21. In this embodiment, the chassis through holes 322 are three, and are arranged in a regular triangle, the center of the regular triangle overlaps with the center of the chassis 32, and the three chassis through holes 322 are arranged between two adsorption hole rings with diameters of 40mm and 80 mm.
The chassis driving motor is fixed on the bearing table 1, is positioned below the supporting jig 31, is connected with the supporting jig 31, and is used for driving the supporting jig 31 and the chassis 32 to vertically move up and down at a certain speed relative to the bearing table 1. The moving speed of the supporting jig 31 and the chassis 32 in this embodiment is 1-500mm/s.
The negative pressure unit is used for providing vacuum negative pressure for the pre-fixing unit 2 and the loading fixing unit 3 respectively and comprises a negative pressure main pipeline, a vacuum filter, a chassis negative pressure component, a pre-fixing negative pressure component and a pressure regulating component.
The negative pressure unit is communicated with an external vacuum generating device through a negative pressure main pipeline.
The vacuum filter is arranged on the negative pressure main pipeline and is used for filtering the air flow flowing through the main pipeline.
The chassis negative pressure assembly is installed below the chassis 32, and includes a plurality of chassis joints and a plurality of chassis negative pressure pipelines, which are arranged in one-to-one correspondence with the adsorption hole rings, and in this embodiment, the number of the chassis joints is seven, and each chassis joint is communicated with one chassis negative pressure pipeline.
The chassis joint is circular and communicated with a plurality of adsorption holes on the corresponding adsorption hole ring. One end of the chassis joint is arranged below the chassis, and the other end of the chassis joint is communicated with the total negative pressure pipeline through the chassis negative pressure pipeline. Sealing strips are arranged between each chassis joint and the chassis and used for sealing and preventing negative pressure leakage.
The pre-fixing negative pressure assembly comprises a plurality of fixing rod joints and a plurality of fixing rod negative pressure pipelines, wherein the fixing rod joints and the fixing rod negative pressure pipelines are arranged in one-to-one correspondence with the adsorption fixing rods 21, three fixing rod joints are arranged in the embodiment, and each fixing rod joint is communicated with one fixing rod negative pressure pipeline.
One end of the fixed rod joint is fixed at the lower end of the adsorption fixed rod and is communicated with the adsorption fixed rod, and the other end of the fixed rod joint is communicated with the total negative pressure pipeline through a fixed rod negative pressure pipeline. Sealing strips are arranged between each fixing rod joint and the adsorption fixing rods and used for sealing and preventing negative pressure leakage.
The pressure regulating assembly includes a plurality of chassis pressure regulating valves and a plurality of fixed rod pressure regulating valves. In the embodiment, the number of the chassis pressure regulating valves is seven, and the number of the fixed rod pressure regulating valves is three.
The chassis pressure regulating valves are arranged on the chassis negative pressure pipelines and used for regulating the negative pressure in the pipelines, and each chassis negative pressure pipeline is provided with one chassis pressure regulating valve. In the implementation of the market, the seven chassis pressure regulating valves are sequentially opened or closed when in use, so that the seven circles of adsorption hole rings sequentially generate negative pressure from inside to outside or sequentially release the negative pressure from outside to inside.
The fixed rod pressure regulating valve is arranged on the fixed rod negative pressure pipeline and used for regulating the negative pressure in the pipeline, and each bottom plate negative pressure pipeline is provided with a fixed rod pressure regulating valve. In this embodiment, the three fixing rod pressure regulating valves are opened or closed simultaneously in use, so that the three adsorption fixing rods 21 simultaneously generate negative pressure or simultaneously release negative pressure.
The edge pressing fixing part is installed on the packaging equipment and is used for flattening the edge area of the warping wafer loaded on the adsorption fixing part, and comprises a bracket 4, a driving unit, an edge pressing unit 5 and an air injection unit 6. When the warp wafer starts to be fixed flatly, the blank holding fixing part is positioned right above the adsorption fixing part.
The bracket 4 comprises a vertical rod and a horizontal rod which are mutually perpendicular. One end of the vertical rod is fixed on the packaging equipment by using a bolt, and the other end of the vertical rod is fixedly connected with one end of the horizontal rod.
The driving unit is arranged on the other end of the horizontal rod and is provided with a telescopic pushing rod, a connecting block and a blank pressing motor 7.
One end of the pushing rod is arranged on the edge pressing motor 7, and the other end of the pushing rod is fixed with a connecting block.
The blank holder motor 7 is used for driving the pushing rod to vertically move up and down in a telescopic manner.
The blank holder unit 5 and the air injection unit 6 are both installed on the connection block and are simultaneously moved vertically up and down at a speed of 1-500mm/s by the drive of the blank holder motor 7.
The edge pressing unit 5 is for pressing the edge area of the warped wafer flat, and includes a platen 51 and a plurality of edge pressing heads 52 mounted on the platen 51. In this embodiment, the edge area of the warped wafer is an area without a chip structure at the circumferential position of the wafer.
Fig. 4 is a schematic structural diagram of a side pressing unit according to an embodiment of the invention.
As shown in fig. 4, the pressing plate 51 is mounted on the connection block, and has a circular central member and a plurality of bar members of equal length, the plurality of bar members are uniformly arranged in a radial shape at the center, and one end of each bar member is fixed on the central member. The connection of the pressure plate 51 and the connecting block is located at the center of the center piece. In the embodiment, 8 strip-shaped pieces are arranged, the center piece and the eight strip-shaped pieces are integrally formed, the distance from the center of the center piece to the far end of the eight strip-shaped pieces is 220mm, and the width of the strip-shaped pieces is 20mm.
The binder heads 52 are fixed in binder head mounting holes at the other ends of the strips by bolts, one binder head is mounted on each strip, and each two binder heads 52 are symmetrically arranged on an extension line of one diameter of the center piece. The plurality of edge pressing heads 52 are arranged in a ring shape with the center of the circle coincident with the center of the center piece, and the distances from the center of the center piece to the eight edge pressing heads 52 are 95mm in the embodiment.
FIG. 5 is a schematic view of a blank holder according to an embodiment of the present invention
As shown in fig. 5, the edge-pressing head 52 has a support shaft and a suction cup.
One end of the supporting shaft is fixed in the blank holder mounting hole, and the other end is provided with a sucker.
The suction cup is used for contacting and flattening the edge area of the warped wafer loaded on the suction fixing part, and is made of conductive nitrile rubber. In this embodiment, the diameter of the suction cup is 2-3mm, and the thickness is 1-2mm.
When the edge pressing unit presses the edge area of the warped wafer, the pressure applied by the sucker to the edge area is 90kpa-120kpa. The vertical distance between the suction cup and the chassis 32 is less than or equal to 200mm.
The air jet unit 6 is used for vertically jetting air flow downwards, and comprises an air jet head, an air pipeline and an air regulating valve, wherein the air flow jetted by the air jet unit in the embodiment is compressed clean air.
One end of the gas pipeline is communicated with the gas jet head, and the other end of the gas pipeline is communicated with an external gas source.
The gas regulating valve is arranged in the gas pipeline and is used for controlling the circulation of gas, and the flow rate of the gas flow is 5-15 m/s.
And the detection part is used for detecting the flatness of the warped wafer and comprises a negative pressure sensor and a distance sensor.
The negative pressure sensor is arranged on the negative pressure main pipeline and used for detecting the negative pressure in the negative pressure main pipeline.
The distance sensor 8 is fixed on the connection block for detecting the flatness of the warped wafer surface. The distance sensor 8 in this embodiment is a laser distance sensor, and the flatness of the surface of the warped wafer is characterized by measuring the distances between five measurement points of the surface of the warped wafer and the distance sensor, respectively. In this embodiment, five measurement points are respectively located on five circles of adsorption hole circles, and the diameters of the five circles of adsorption hole circles where the five measurement points are located in this embodiment are respectively: 110mm, 140mm, 180mm, 226mm and 276mm.
The control part is respectively connected with the fixed rod driving motor, the chassis driving motor, the plurality of chassis pressure regulating valves, the plurality of fixed rod pressure regulating valves, the blank pressing motor 7, the gas regulating valve, the negative pressure sensor and the distance sensor 8, and is used for controlling the adsorption fixing part to adsorb and fix the warped wafer, controlling the blank pressing fixing part to flatten the edge area of the warped wafer, judging the flatness according to the negative pressure signals and the distance signals from the negative pressure sensor and the distance sensor 8, and further controlling the operation of the adsorption fixing part and the blank pressing fixing part, so that the flatness of the fixed warped wafer is in a preset range. The flatness range of the warped wafer surface in this embodiment is +8mm.
FIG. 6 is a flow chart of a warp wafer leveling fixture in an embodiment of the invention.
As shown in fig. 6, the method for flattening and fixing the warped wafer in this embodiment is as follows:
and S1-1, after the warped wafer reaches a preset position, the chassis driving motor drives the supporting jig 31 and the chassis 32 to descend together, the fixed rod driving motor drives the adsorption fixed rod 21 to ascend, the fixed rod pressure regulating valve is opened, negative pressure is generated, the warped wafer is pre-fixed, and then step S1-2 is carried out.
In step S1-2, the chassis driving motor drives the supporting jig 31 and the chassis 32 to rise together to a height flush with the suction fixing rod 21, and the pre-fixed warped wafer is loaded and then enters step S1-3.
In the step S1-3, the edge pressing motor 7 drives the edge pressing unit 5 and the air injection unit 6 to move downwards simultaneously, the air regulating valve is opened simultaneously, the air injection head injects compressed air to the surface of the warped wafer, the edge pressing unit 5 flattens the edge area of the warped wafer, and then the step S1-4 is carried out.
And S1-4, sequentially starting chassis pressure regulating valves, sequentially generating negative pressure from inside to outside by the adsorption hole ring, adsorbing and fixing the warped wafer loaded on the chassis 32, and then entering the step S1-5.
And step S1-5, detecting the negative pressure in the negative pressure main pipeline by the negative pressure sensor, entering the step S1-6 when the negative pressure value displayed by the negative pressure signal is between 60kpa and 80kpa, and entering the step S1-7 when the negative pressure value displayed by the negative pressure signal is not between 60kpa and 80 kpa.
In the step S1-6, the jet head stops jetting, the blank holder motor 7 drives the blank holder unit 5 and the jet unit 6 to rise at the same time, and then the process goes to the step S1-10.
And S1-7, closing the fixed rod pressure regulating valve and the chassis pressure regulating valve simultaneously, and restarting after 0.2 seconds, and then entering step S1-8.
Step S1-8, the negative pressure sensor detects the negative pressure in the negative pressure main pipeline, when the negative pressure value displayed by the negative pressure signal is between 60kpa and 80kpa, the step S1-6 is carried out, and when the negative pressure value displayed by the negative pressure signal is not between 60kpa and 80kpa, the step S1-9 is carried out.
And S1-9, sending out an alarm prompt, and then entering an ending state.
And S1-10, detecting the surface of the wafer and the distance sensor by the distance sensor 8, confirming the flatness range, and then entering an end state.
FIG. 7 is a flowchart of a warp wafer release in an embodiment of the invention.
As shown in fig. 7, the method for releasing the warped wafer in this embodiment is as follows:
in step S2-1, the chassis driving motor drives the supporting jig 31 and the chassis 32 to rise to the height flush with the adsorption fixing rod 21, the fixing rod pressure regulating valve is opened to generate negative pressure, and then step S2-2 is performed.
In step S2-2, the edge pressing motor 7 drives the edge pressing unit 5 and the air injection unit 6 to move downwards at the same time, the edge pressing unit 5 flattens the edge area of the warped wafer, and then the step S2-3 is performed.
And S2-3, sequentially closing the chassis pressure regulating valve at intervals of 0.2 seconds, sequentially releasing negative pressure from outside to inside by the adsorption hole ring, and then entering the step S2-4.
And S2-4, closing the fixed rod pressure regulating valve, releasing negative pressure by the adsorption fixed rod 21, and then entering step S2-5.
In step S2-5, the edge pressing motor 7 drives the edge pressing unit 5 and the air injection unit 6 to move upwards at the same time, and the chassis driving motor drives the supporting jig 31 and the chassis 32 to descend together, and then enter an end state.
Effects and effects of the examples
The leveling and fixing device provided by the embodiment of the invention has the advantages that the pre-fixing part capable of moving up and down is used for positioning and pre-fixing the warped wafer, so that the warped wafer can be prevented from being shifted in position in the process of being loaded on the chassis, and the subsequent operation is influenced; the loading and fixing part is provided with the chassis and the plurality of adsorption holes arranged on the chassis, so that the warpage wafer can be further adsorbed and fixed on the chassis after being pre-fixed, the plurality of adsorption holes are used for fixing the warpage wafer together, each part of the warpage wafer is well fixed, missing positions are avoided, good flatness of the whole warpage wafer after being fixed is ensured, the whole warpage wafer is flatly fixed in a mode of adopting a plurality of point-shaped negative pressure adsorption, the enough downward suction force is provided for ensuring that the warpage wafer is well fixed, falling or offset is not easy to occur, the adsorption force received by the warpage wafer is uniformly dispersed on the whole wafer, and damage to the wafer due to overlarge local stress caused by uneven stress is avoided.
Meanwhile, the flattening and fixing device provided by the embodiment of the invention is also provided with the detection part, so that the flatness of the fixed and flattened warped wafer can be detected and confirmed, the flatness of the fixed and warped wafer is ensured to be within an error range, and the subsequent operation is ensured to be smoothly carried out.
Further, as the plurality of adsorption holes are arranged in the multi-ring annular adsorption hole ring in the flattening and fixing device, and the adsorption hole rings are overlapped with the circle center of the chassis and are sequentially distributed from inside to outside, the arrangement of the adsorption holes is matched with the shape of the warpage wafer, missing areas during adsorption and fixing are avoided, the annular adsorption hole ring ensures the stability of the warpage wafer areas during adsorption and fixing, and the areas in the same radius range are simultaneously fixed, so that the flattening degree of the whole warpage wafer is improved.
Because the vacuum negative pressure of each adsorption hole ring can independently run and be opened circle by circle, the vacuum negative pressure is fixed from inside to outside during fixing, and released from outside to inside during releasing, the warpage wafer can be fixed in a region by the fixing and releasing modes, the improvement of flatness is facilitated, the pressure is relieved circle by circle during releasing, and the damage to the wafer caused by uneven stress of the wafer is avoided.
The above embodiments are preferred examples of the present invention, and are not intended to limit the scope of the present invention.
Claims (8)
1. A wafer leveling and fixing device for leveling and fixing a warped wafer placed in a packaging apparatus, comprising:
a carrier mounted in the encapsulation apparatus;
the adsorption fixing part is arranged on the bearing table and is used for adsorbing and fixing the warping wafer; and
a detecting part for detecting the flatness of the warped wafer, comprising a negative pressure detecting unit and a flatness detecting unit,
wherein the adsorption fixing portion has: a pre-fixing unit, a loading fixing unit and a negative pressure unit for providing vacuum negative pressure to the pre-fixing unit and the loading fixing unit respectively,
the pre-fixing unit is arranged on the bearing table and can move up and down relative to the bearing table and is used for pre-fixing the warping wafer,
the loading fixing unit is arranged on the bearing table, can move up and down relative to the bearing table, is used for loading and fixing the warping wafer, and is provided with a chassis, a plurality of adsorption holes and a plurality of chassis through holes which are arranged on the chassis, the chassis through holes are positioned in the central area of the chassis and are used for the pre-fixing unit to pass through,
after the pre-fixing unit pre-fixes the warpage wafer, the loading fixing unit starts negative pressure to adsorb and fix the pre-fixed warpage wafer;
wherein the adsorption holes are distributed in a plurality of circles of circular ring-shaped adsorption hole circles;
wherein the pre-fixing unit comprises at least three adsorption fixing rods,
each adsorption fixing rod passes through one chassis through hole.
2. The wafer leveling fixture of claim 1, wherein:
wherein the chassis is round,
the circle centers of the adsorption hole rings are overlapped with the circle centers of the chassis, and are distributed from inside to outside along the diameter direction of the chassis.
3. The wafer leveling fixture of claim 1, wherein:
wherein the adsorption rod comprises a rod body and a fixing head arranged at one end of the rod body,
the rod body is in a hollow rod shape,
the fixed head is in a horn shape.
4. The wafer leveling fixture of claim 1, wherein:
wherein, the negative pressure unit includes:
the chassis negative pressure assembly is arranged below the chassis and is communicated with the plurality of adsorption holes;
a pre-fixed negative pressure assembly in communication with the pre-fixed unit; and
and the pressure adjusting assembly is respectively arranged on the chassis negative pressure assembly and the fixed rod negative pressure assembly and is used for adjusting the negative pressure provided for the chassis negative pressure assembly and the fixed rod negative pressure assembly respectively.
5. The wafer leveling fixture of claim 4, wherein:
wherein the negative pressure regulating unit also comprises a total negative pressure pipeline and a vacuum filter,
one end of the negative pressure main pipeline is communicated with an external vacuum generating device, the other end of the negative pressure main pipeline is respectively communicated with the chassis negative pressure component and the pre-fixed negative pressure component,
the vacuum filter is arranged on the negative pressure main pipeline and is used for filtering air flow in the negative pressure main pipeline.
6. The wafer leveling fixture of claim 4, wherein:
wherein the chassis negative pressure component comprises a plurality of chassis joints and a plurality of chassis negative pressure pipelines which are respectively communicated with the chassis joints,
the chassis joints are circular and are arranged in one-to-one correspondence with the adsorption hole rings,
and the chassis joints sequentially generate negative pressure from inside to outside.
7. The wafer leveling fixture of claim 4, wherein:
wherein the pre-fixed negative pressure component comprises a plurality of adsorption rod joints and a plurality of adsorption rod negative pressure pipelines which are respectively communicated with the adsorption rod joints,
the adsorption rod joints are arranged in one-to-one correspondence with the adsorption rods.
8. The wafer leveling fixture of claim 4, wherein:
the pressure regulating assembly comprises a plurality of chassis pressure regulating valves and a plurality of adsorption rod pressure regulating valves.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811137378.0A CN109256356B (en) | 2018-09-28 | 2018-09-28 | Wafer leveling and fixing device |
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| CN201811137378.0A CN109256356B (en) | 2018-09-28 | 2018-09-28 | Wafer leveling and fixing device |
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| CN109256356A CN109256356A (en) | 2019-01-22 |
| CN109256356B true CN109256356B (en) | 2023-05-02 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111211083B (en) * | 2020-01-13 | 2022-07-26 | 长江存储科技有限责任公司 | Wafer bearing device |
| CN111613566B (en) * | 2020-05-29 | 2023-07-28 | 北京工业大学 | Ultrathin wafer transfer device |
| CN115742043B (en) * | 2022-10-26 | 2023-06-30 | 广东技标实业有限公司 | Non-standard design mechanism for working disc of cutting machine |
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| CN101393885A (en) * | 2008-10-31 | 2009-03-25 | 中茂电子(深圳)有限公司 | Fixing/releasing auxiliary device for a wafer detection platform, the wafer detection platform and method therefor |
| CN103021919B (en) * | 2012-12-27 | 2015-08-26 | 上海交通大学 | A kind of wafer prealignment device |
| CN104538331B (en) * | 2014-12-12 | 2018-06-05 | 通富微电子股份有限公司 | A kind of device and method of silicon wafer warpage processing |
| CN106340485A (en) * | 2015-07-10 | 2017-01-18 | 上海微电子装备有限公司 | Wafer bonding clamping device, aligning machine, bonding machine and warping substrate adsorption method |
| CN108206144B (en) * | 2016-12-19 | 2021-02-02 | 苏州能讯高能半导体有限公司 | Adsorption method of warped wafer and device using same |
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