KR102056800B1 - Lighting apparatus for inspection - Google Patents

Abstract

The present invention has a rectangular cross-sectional shape is formed long in the longitudinal direction and the air line through which compressed air passes to be formed so as to pass through both sides, and is formed extending from the lower side toward the front portion to serve as a bottom plate An undercover, a top cover extending from the upper surface of the body toward the front portion to serve as a top plate, and extending from both sides of the body toward the front portion to serve as a side plate and corresponding to an air line of the body; A main block comprising a side cover having a suction port formed therein; A plurality of high density chip size package light emitting diode modules mounted on the front part of the body and accommodated in the main block; A condenser lens disposed in front of the high density chip size package light emitting diode module and accommodated inside the main block and refracting light generated from the chip size package light emitting diode module to increase luminance; A diffuser plate disposed in front of the condenser lens to receive uniform light by uniformly diffusing the light concentrated by the condenser lens; And a multi-channel controller connected to the plurality of high density chip size package light emitting diode modules to monitor and individually control the plurality of high density chip size package light emitting diode modules, respectively.

Description

Lighting apparatus for inspection

The present invention relates to a lighting device for inspection using a high density chip size package (CSP) LED module, and more particularly to a high brightness LED using a high density chip size package (CSP) LED module. Implement the module to improve the glass inspection speed of the inspection equipment using the line scan camera, and to apply the controller to realize the control of the individual modules, the high density chip size package (CSP) LED module with improved optical uniformity It relates to an inspection lighting device using.

In general, the production process of the semiconductor or display is made by mass production method using automated equipment. In the mass production process of semiconductors and displays, a process of inspecting the produced goods is arranged to identify and manage the yield and defect rate in the process. Together, camera inspection has gradually been replaced.

In order to quickly inspect a product using such a camera, high brightness line lighting is essential along with an industrial camera capable of capturing images at high speed. As an example of such line lighting, Patent No. 10-1040747 includes an antireflection plate. Disclosed is an inspection lighting apparatus including an optical member, a light irradiation unit for irradiating light from the side of the floodlight plate, and a frame supporting the optical member and the light irradiation unit.

Further, as another example, Korean Patent No. 10-0639926 discloses a pair of light emitting members, a plurality of LEDs, and a cylindrical lens corresponding to each of these LEDs, such that the irradiated light is collected at a predetermined area of the surface of the inspection object. The surface inspection illumination device which sets the positional relationship and pitch of each cylindrical lens is disclosed.

By the way, the conventional lighting device of this type used a Chip On Board (COB) type of lighting, which is limited in reducing the distance between the light emitters in the structure of the COB type lighting due to the poor recognition of the camera due to low brightness and There was a problem that errors frequently occur.

In addition, by controlling the entire LED with a single PCB, there was a problem that can not be detected in advance when the inspection product defective or camera inspection failure, there is a problem that can not control the light uniformity because the individual channel is not adjusted.

Korean Patent Registration No. 10-1040747 Korea Patent Registration No. 10-0639926

The present invention has been made to solve the above problems,

An object of the present invention is to achieve a high brightness by applying a high density chip size package (CSP) LED module, which is a high-density LED is arranged in a high density to obtain a bright light amount, and the high brightness light is passed through the condensing lens to uniform It is to provide a test illumination device to obtain a high brightness and high heat radiation by maximizing the cooling effect by having an air line and cooling fins through which compressed air passes.

In addition, another object of the present invention is to provide a test lighting device capable of individually checking the status by monitoring a plurality of high density Chip Size Package (CSP) LED modules, respectively, each control is possible.

Inspection apparatus according to an embodiment of the present invention provided to achieve the above object is formed in the cross-sectional rectangular shape is formed long in the longitudinal direction and through which the compressed air passes through the inner side is formed A body which is formed to extend toward the front portion from the lower side of the body to serve as a bottom plate, a top cover which extends toward the front portion from the upper surface of the body to serve as a top plate, and a front surface on both sides of the body A main block extending toward the side and serving as a side plate, the main block including a side cover having a suction port at a position corresponding to an air line of the body; A plurality of high density chip size package light emitting diode modules mounted on the front part of the body and accommodated in the main block; A condensing lens disposed in front of the high density chip size package light emitting diode module and received inside the main block to refract light generated from the high density chip size package light emitting diode module to increase luminance; A diffuser plate disposed in front of the condenser lens to receive uniform light by uniformly diffusing the light concentrated by the condenser lens; And a multi-channel controller connected to the plurality of high density chip size package light emitting diode modules to monitor and individually control the plurality of high density chip size package light emitting diode modules, respectively.

The high density chip size package light emitting diode module may include a circuit board and a chip size package light emitting diode densely arranged on the circuit board.

Here, the circuit board is equipped with a temperature sensor, the multi-channel controller to check the individual state of the high-density chip-size package light emitting diode module based on the measured temperature transmitted from the temperature sensor and to individually control to maintain a specific temperature range Characterized in that.

The chip size package light emitting diode includes a semiconductor stacked structure including an upper semiconductor layer, an active layer, and a lower semiconductor layer, a first contact layer electrically connected to the upper semiconductor layer through the lower semiconductor layer and the active layer; A second contact layer electrically connected to the lower semiconductor layer from below, a first electrode pad disposed on a first surface of the semiconductor stacked structure and connected to the upper semiconductor layer, and a first surface of the semiconductor stacked structure A protective insulating layer disposed so as not to overlap with the first electrode pad and electrically connected to the lower semiconductor layer, and an insulating layer covering sidewalls of the upper semiconductor layer and the lower semiconductor layer and having different refractive indices from each other; Characterized in that comprises a.

And, the body of the main block is provided with a plurality of cooling fins protruding through the air line to transfer the heat generated from the high density chip size package light emitting diode module to the air passing through the air line. The cooling fin is characterized in that the extrusion molding integrally with the body during the molding. In addition, the rear portion of the body is characterized in that it is provided with a plurality of outlets for discharging the compressed air passing through the air line.

In addition, the undercover and the top cover are formed to face concave grooves corresponding to the outer surface of the condenser lens to correspond to the condenser lens installation position so that the condenser lens can be stably seated. It is characterized in that the groove for fixing the diffusion plate is formed facing each other.

According to an embodiment of the present invention, by using a plurality of high density chip size package (CSP) LED module to realize a high brightness lighting effect of improving the glass inspection speed of the inspection equipment using a line scan camera have.

In addition, a plurality of high-density chip size package (CSP) LED modules can be individually checked by mounting a temperature sensor on each circuit board, and a plurality of high-density chip size package (CSP) LEDs can be checked. Multi-channel controllers that individually control the modules are applied to improve the optical uniformity.

In addition, the heat generated from the high density Chip Size Package (CSP) LED module is efficiently cooled through an air-cooled cooling structure using air lines and cooling fins formed in the air lines, thereby minimizing LED efficiency degradation due to heat generation. It is effective to let.

1 is a perspective view of a lighting device for inspection according to an embodiment of the present invention.
Figure 2 is an exploded perspective view of the inspection lighting device according to an embodiment of the present invention.
3 is a cross-sectional view of the inspection lighting device according to an embodiment of the present invention.
4 is a main structural diagram of a high density chip size package (CSP) light emitting diode module in an inspection lighting apparatus according to an embodiment of the present invention;
Figure 5 is a state of use of the inspection lighting device according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments described below are just described in detail enough to be easily carried out by those of ordinary skill in the art, which does not mean that the protection scope of the present invention is limited. Do not.

1 to 5, the inspection lighting apparatus according to an embodiment of the present invention includes a main block 100, a high density chip size package light emitting diode module 200, a condenser lens 300, and a diffusion plate 400. ), And a controller 500.

As shown in FIGS. 1 to 3, the main block 100 includes a body 110, an air line 120, and an outlet 130, and includes an undercover 140, a side cover 150, and a top. Cover 160.

The main block 100 serves as a body so that the high density chip size package light emitting diode module 200 and the condenser lens 300 and the diffusion plate 400 can be mounted, and the inspection lighting device according to the present invention is produced. When mounted on the line, it is formed lengthwise to fit the width of the product or camera so that the product can be inspected.

In detail, the body 110 of the main block 100 has a rectangular cross section and is formed long in the longitudinal direction. The body 110 may be made of a metal having high thermal conductivity, and in particular, the body 110 may be made of a metal having good thermal conductivity, good workability, and relatively good supply and demand of materials, such as aluminum.

As shown in FIGS. 2 and 3, the body 110 has a high density chip size package light emitting diode module 200 mounted on a front surface thereof, and an air line 120 penetrates through the body 110 in a longitudinal direction. . This is to cool the dense chip size package light emitting diode module 200, which will be described later. Generally, a compressed air having a pressure of about 5 atmospheres (5 bar) is installed in a production plant in which an inspection lighting apparatus according to the present invention is installed. Supplied within. The compressed air flows through the air line 120 to prevent the high density chip size package LED module 200 from overheating. To this end, the inlet 151 is formed in the side cover 150 to be described later to supply the compressed air to the air line 120, the compressed air passing through the air line 120 may be discharged to the rear portion of the body 110. A plurality of outlets 130 are formed so that.

On the other hand, in order to increase the cooling performance of the high density chip size package light emitting diode module, a plurality of cooling fins 111 protrude from the through part of the body 110 to increase the heat transfer rate with the air inside the air line 120. Is formed. The cooling fin 111 may be formed in a thin plate shape as shown, and may be extrusion molded integrally with the body 110 when the body 110 is formed.

The undercover 140 of the main block 100 extends from the lower side of the body 110 to the front portion as shown in FIGS. 2 and 3. The undercover 140 may be extrusion molded integrally with the body when the body 110 is formed, and thus may be made of the same material as the body 110, for example, a material such as aluminum.

The condenser lens 300 and the diffusion plate 400 are seated and coupled to the undercover 140, and thus serve as a bottom plate to which the condenser lens 300 and the diffusion plate 400 can be stably coupled and supported. The concave groove 141 may be formed on the upper surface of the undercover 140 to fit the outer surface of the condenser lens 300 so that the condenser lens 300 may be stably seated. Thus, the condenser lens 300 is accurate and Helps you to position yourself.

Side cover 150 is coupled to both sides of the body 110, respectively, as shown in Figure 2, formed in the form extending toward the front portion of the body 110. Therefore, both side surfaces of the condenser lens 300 and the diffusion plate 400 which are coupled to both side surfaces of the body 110 and disposed on the front surface of the body 110 are fixed. The side cover 150 has a suction port 151 formed at a position corresponding to the air line 120 to allow the compressed air to flow into the air line 120. Here, the connection structure of the compressed air line is a structure in which a tab is formed on the inlet 151 so that the compressed air line supplied from the production plant is connected, and a fitting suitable for the size is coupled to the compressed air supply line to the fitting. Is done. However, this connection structure is not shown separately because it is a commonly used method in the production process.

Top cover 160 is coupled to the upper surface of the body 110, as shown in Figures 2 and 3, is coupled to the upper surface of the body 110 is formed in a form extending toward the front portion of the body (110). The top cover 160 also serves to fix the condenser lens 300 and the diffusion plate 400, and for this purpose, the groove 161 is concave to fit the outer surface of the condenser lens 300 similarly to the undercover 140. It is formed long.

The high density chip size package light emitting diode module 200 includes a circuit board 210 and a chip size package light emitting diode 220 and is mounted on the front of the body 110 of the main block to emit light to produce light. It plays a role. The high-density chip size package light emitting diode module 200 is mounted on the front part of the body 110 to emit light of ultra high brightness. In addition, each circuit board 210 may be equipped with a temperature sensor (not shown), so that the controller 500 individually receives light from each circuit board 210 to emit light of each high density chip size package. By monitoring and controlling the diode module 200 to maintain a specific temperature range, the inspection lighting device using the high density Chip Size Package (CSP) LED module according to the present invention can achieve a high level of light uniformity. do.

The circuit board 210 may be formed of a printed circuit board, and generally serves as a PCB used for controlling a semiconductor. The circuit board 210 controls each chip size package light emitting diode 220, and is connected to the multi-channel controller 500 to be described later.

The chip size package light emitting diode 220 is disposed on the circuit board 210 and serves as a light emitter. To this end, the chip size package light emitting diode 220 includes a semiconductor stack structure 221, a first contact layer 222, a second contact layer 223, a first electrode pad 224, a second electrode pad 225, The protective insulating layer 226 includes a connection terminal 227, and may further include a bump 228 and a sheet 229.

Referring to FIG. 4, the chip size package light emitting diode 220 has a form in which a contact layer, an electrode pad, and a protective insulating layer are disposed on the semiconductor stack structure 221. The first conductive upper semiconductor layer 221a and the second conductive lower semiconductor layer 221c are stacked in this order, and the active layer 221b is interposed therebetween.

The upper semiconductor layer 221a, the active layer 221b, and the lower semiconductor layer 221c may be formed of a compound semiconductor of III-N series, and the upper semiconductor layer 221a and the lower semiconductor layer 221c may each be a single layer. Or multilayers. The upper semiconductor layer 221a or the lower semiconductor layer 221c may include a contact layer and a cladding layer, or may include a superlattice layer.

The active layer 221b may be a single quantum well structure or a multi quantum well structure, the upper semiconductor layer 221a may be an n-type semiconductor structure, and the lower semiconductor layer 221c may be a p-type semiconductor structure. Can be.

The first contact layer 222 is disposed under the first insulating layer 226a to be described later, and penetrates the lower semiconductor layer 221c and the active layer 221b of the semiconductor stacked structure 221 to the upper semiconductor layer 221a. Connected. The second contact layer 223 is disposed under the lower semiconductor layer 221c and is connected to the lower semiconductor layer 221c of the semiconductor stacked structure 221. Here, the second contact layer 223 may include a reflective metal layer and may reflect light generated by the active layer 221b.

The protective insulating layer 226 may be divided into a first insulating layer 226a and a second insulating layer 226b according to the arrangement. The first insulating layer 226a covers the second contact layer 223 and at the same time. The sidewall of the semiconductor laminate structure 221 is covered. In addition, the first insulating layer 226a insulates the first contact layer 222 from the second contact layer 223, and insulates the lower semiconductor layer 221c and the active layer 221b from the first contact layer 222. Let's do it. The first insulating layer 226a may be formed of a single layer of a silicon oxide film or a silicon nitride film, or may be formed of a multilayer of insulating layers having different refractive indices.

The second insulating layer 226b covers the first contact layer 222 under the first contact layer 222. Meanwhile, the second insulating layer 226b may cover the first insulating layer 226a and may cover sidewalls of the semiconductor stack structure 221. The second insulating layer 226b may be formed of a single layer or multiple layers.

The first electrode pad 224 and the second electrode pad 225 are disposed under the second insulating layer 226b, and the first electrode pad 224 penetrates through the second insulating layer 226b to form a first contact layer. 222 is connected. In addition, the second electrode pad 225 is connected to the second contact layer 223 through the second insulating layer 226b and the first insulating layer 226a. In this case, the second electrode pad 225 is disposed not to overlap the first electrode pad 224.

The connection terminal 227 is connected under the first and second electrode pads 225, and the connection terminal 227 is electrically connected to the circuit board 210 described above. Meanwhile, bumps 228 may be formed between the connection terminals 227, and the bumps 228 serve as a path for dissipating heat generated in the semiconductor stack structure 221.

The sheet 229 is positioned to contact the upper semiconductor layer 221a and may be formed of a phosphor sheet having a uniform thickness. It may also be made of a non-uniformly doped substrate or sapphire substrate or silicon substrate for wavelength conversion.

The condenser lens 300 is disposed on the front surface of the high density chip size package light emitting diode module 200, and serves to increase luminance by refracting light generated from the module.

The condenser lens 300 is seated in the concave groove 141 of the undercover 140 and the concave groove 161 of the top cover 160 and is fixed to the side cover 150 on both sides.

The diffusion plate 400 is disposed in front of the condenser lens 300 and evenly diffuses the light concentrated by the condenser lens 300 to irradiate uniform light.

The diffusion plate 400 may be formed of a multi-refractive plate, and is fitted into the grooves (142, 162) formed in the undercover 140 and the top cover 160, as shown in Figure 3, the side cover of both sides Covered and fixed to 150.

The controller 500 is electrically connected to the high density chip size package light emitting diode module 200 and serves to control each high density chip size package light emitting diode module 200. The controller 500 may be a multi-channel controller capable of controlling each of a plurality of modules with one controller.

The use state of the inspection lighting apparatus according to the embodiment of the present invention as described above will be described with reference to FIG.

Inspection lighting device 1 according to the present invention is used in conjunction with the high-speed camera photography and analysis inspection equipment 20 for inspecting the glass 10 at high speed in the production line of the display. Thus, as shown in Figure 5, the inspection equipment 20 for checking the state of the glass 10 above the produced glass 10 is located. At this time, the direction of the light is disposed so as to illuminate the upper surface of the glass 10 so that the camera of the inspection equipment 20 can accurately capture the state of the glass 10 at the front and rear or left and right of the inspection equipment 20. And it connects the compressed air supplied from the factory to the inlet 151 formed in the main block 100 to perform the cooling. In addition, by supplying electricity to the controller 500 to monitor and control the status of each module at the same time to adjust the brightness so that the camera of the inspection equipment 20 can accurately capture the glass 10.

In this process, the inspection lighting device has a short distance between the luminous bodies to enable high-intensity lighting, enabling high-speed inspection, and each circuit board is equipped with a temperature sensor and a multi-channel controller is applied to enable individual status check and control. Efficient cooling is possible by having an air cooling system using air lines and cooling fins.

Although the embodiments of the present invention have been described above, it will be understood by those skilled in the art that various modifications may be made without departing from the scope of the claims of the present invention.

10: glass 20: inspection equipment
100: main block 110: body
111 cooling pin 120 air line
130: outlet 140: undercover
150: side cover 151: inlet
160: top cover 200: high density chip size package light emitting diode module
210: circuit board 220: chip size package light emitting diode
221 semiconductor stack structure 221a upper semiconductor layer
221b: active layer 221c: lower semiconductor layer
222: first contact layer 223: second contact layer
224: first electrode pad 225: second electrode pad
226 protective insulating layer 226a first insulating layer
226b: second insulating layer 227: connection terminal
228: Bump 229: Sheet
300: condenser lens 400: diffuser plate
500: controller

Claims (8)

A cross-section having a rectangular shape and extending in the longitudinal direction and having an airline through which compressed air passes so as to penetrate both sides, and an undercover extending from the lower side of the body toward the front part to serve as a bottom plate; A top cover extending from the upper surface of the body toward the front portion to serve as a top plate, and extending from both sides of the body toward the front portion to serve as a side plate and having a suction port at a position corresponding to the airline of the body; A main block comprising a side cover; A plurality of high density chip size package light emitting diode modules mounted on the front part of the body and accommodated in the main block; A condenser lens disposed in front of the high density chip size package light emitting diode module and accommodated inside the main block and refracting light generated from the chip size package light emitting diode module to increase luminance; A diffuser plate disposed in front of the condenser lens to receive uniform light by uniformly dispersing the light concentrated by the condenser lens; And a multi-channel controller connected to the plurality of high density chip size package light emitting diode modules to monitor and individually control the plurality of high density chip size package light emitting diode modules, respectively.
And the concave grooves facing the outer surface of the condenser lens are formed to face the condenser lens so that the condenser lens can be stably seated on the undercover and the top cover. The method of claim 1,
The high density chip size package light emitting diode module includes a circuit board and a chip size package light emitting diode densely arranged on the circuit board.
The circuit board is equipped with a temperature sensor, and the multi-channel controller is to check the individual state of the high-density chip size package light emitting diode module based on the measured temperature transmitted from the temperature sensor and to individually control to maintain a specific temperature range. Inspection lighting device characterized in that. The method of claim 2,
The chip size package light emitting diode includes a semiconductor stacked structure including an upper semiconductor layer, an active layer, and a lower semiconductor layer, a first contact layer electrically connected to the upper semiconductor layer through the lower semiconductor layer and the active layer, and the lower layer. A second contact layer electrically connected to the semiconductor layer from below, a first electrode pad disposed on a first surface of the semiconductor laminate and connected to the upper semiconductor layer, and a first surface of the semiconductor laminate; A second insulating pad disposed so as not to overlap with the first electrode pad and electrically connected to the lower semiconductor layer, and a protective insulating layer covering sidewalls of the upper semiconductor layer and the lower semiconductor layer and having insulating layers having different refractive indices from each other; Inspection lighting device, characterized in that configured to. The method of claim 1,
The body of the main block is provided with a plurality of cooling fins protruding through the air line to transfer the heat generated from the high density chip size package light emitting diode module to the air passing through the air line Inspection lighting device. The method of claim 4, wherein
The cooling fin is an inspection lighting device, characterized in that the extrusion molding integrally with the body when forming the body. The method of claim 1,
Inspection apparatus according to claim 1, characterized in that the rear portion of the body is provided with a plurality of outlets for the discharge of compressed air passing through the air line. delete The method of claim 1,
The undercover and the top cover is a lighting device for inspection, characterized in that the groove for fixing the diffuser plate to face in accordance with the installation position of the diffuser plate.

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