KR102012668B1 - Lighting system for line - Google Patents

Abstract

The present invention relates to a line lighting system using a high density chip size package (CSP) LED module, and more particularly to a high brightness LED module using a high density chip size package (CSP) LED module. To improve the glass inspection speed of the inspection equipment using the line scan camera, and to apply the controller to realize the control of the individual modules, and to improve the light uniformity, the high density chip size package (CSP) LED module It relates to the line lighting system used.
A line lighting system using a high density chip size package (CSP) LED module according to the present invention includes a main block, at least one chip size package light emitting diode module mounted on a front surface of the main block, and the chip. A condenser lens disposed on the front surface of the size package light emitting diode module, a diffuser plate disposed on the front surface of the condensing lens, and a controller connected to the chip size package light emitting diode module and controlling the chip size package light emitting diode module. .

Description

Lighting system for line using high density Chip Size Package (CSP) LED module

The present invention relates to a line lighting system using a high density chip size package (CSP) LED module, and more particularly to a high brightness LED module using a high density chip size package (CSP) LED module. To improve the glass inspection speed of the inspection equipment using the line scan camera, and to apply the controller to realize the control of the individual modules, and to improve the light uniformity, the high density chip size package (CSP) LED module It relates to the line lighting system used.

In general, the production process of the semiconductor or display is made by mass production method using automated equipment. In the mass production process of semiconductors and displays, a process of inspecting the produced goods is arranged to identify and manage the yield and defect rate in the process. Together, camera inspection has gradually been replaced.

In order to quickly inspect a product using such a camera, high brightness line lighting is required along with an industrial camera capable of capturing images at high speed. As an example of such line lighting, Patent No. 10-1040747 includes an antireflection plate. Disclosed is an inspection lighting apparatus including an optical member, a light irradiation unit for irradiating light from the side of the floodlight plate, and a frame supporting the optical member and the light irradiation unit.

Further, as another example, Korean Patent No. 10-0639926 discloses a pair of light emitting members, a plurality of LEDs, and a cylindrical lens corresponding to each of these LEDs, such that the irradiated light is collected at a predetermined area of the surface of the inspection object. The surface inspection illumination device which sets the positional relationship and pitch of each cylindrical lens is disclosed.

By the way, the conventional lighting device of this type used a Chip On Board (COB) type of lighting, which is limited in reducing the distance between the light emitters in the structure of the COB type lighting due to the poor recognition of the camera due to low brightness and There was a problem that errors frequently occur.

In addition, by controlling the entire LED with a single PCB, there was a problem that can not be detected in advance when the inspection product defective or camera inspection failure, there was a problem that can not control the light uniformity because the individual channel is not adjusted.

(Patent Document 1) Korean Registered Patent No. 10-1040747

(Patent Document 2) Korean Patent Registration No. 10-0639926

The present invention has been made to solve the above-described problems, line illumination system using a high density chip size package (CSP) LED module capable of realizing high brightness by increasing the density of the LED module and individually controlling each module The purpose is to provide.

An object of the present invention described above, the main block, at least one chip size package light emitting diode module mounted on the front portion of the main block, a condensing lens disposed on the front surface of the chip size package light emitting diode module, the light condensing Using a high density chip size package (CSP) LED module including a diffuser plate disposed in front of the lens, and a controller connected to the chip size package light emitting diode module and controlling the chip size package light emitting diode module. By providing a line illumination system.

According to a preferred feature of the invention, the chip size package light emitting diode module includes a circuit board and a chip size package light emitting diode disposed on the circuit board, wherein the chip size package light emitting diode module includes an upper semiconductor layer, an active layer and a lower portion A semiconductor stacked structure including a semiconductor layer, a plurality of contact holes penetrating the lower semiconductor layer and the active layer to expose the upper semiconductor layer, and a plurality of contact holes disposed on a first surface of the semiconductor stacked structure and through the plurality of contact holes. A first electrode pad connected to the upper semiconductor layer, and disposed on the first surface of the semiconductor stack such that the first electrode pad does not overlap with each other and electrically connected to the lower semiconductor layer, A second electrode pad overlapping the first electrode pad and sidewalls of the upper semiconductor layer and the lower semiconductor layer. To each other may include a refractive index of the protective insulating layer with another insulation layer.

According to another preferred aspect of the present invention, a plurality of the chip size packaged light emitting diode module is mounted on one main block, and the controller is capable of controlling the circuit boards of the plurality of chip sized packaged light emitting diode modules, respectively. It may be a controller.

According to another preferred feature of the invention, each of the circuit board is equipped with a temperature sensor, the controller can control the circuit board to maintain a specific temperature range by receiving a signal transmitted from the temperature sensor.

According to another preferred feature of the invention, the main block is formed in the longitudinal direction, the air for cooling the chip size package light emitting diode module is formed to penetrate the side of the body and mounted on the front portion of the body It may have a plurality of outlets formed in the rear portion so that the air line is introduced, and the air supplied through the air line can be discharged.

According to another preferred feature of the invention, the body has a plurality of cooling fins protruding toward the air line to transfer heat formed from the chip size package light emitting diode module to the air passing through the air line. Can be.

According to another preferred feature of the present invention, the main block is formed under the cover extending from the lower end of the body to the front, respectively coupled to both side portions of the body to be penetrated so that air can flow into the air line A pair of side covers which have suction ports and extend in the direction of the front portion of the body so as to fix both sides of the condenser lens and the diffusion plate, coupled to the upper surface portion of the body and extending in the direction of the front portion of the body; It may be formed and may include a top cover for fixing the image side of the light collecting lens and the diffusion plate.

According to the line illumination system using a high density chip size package (CSP) LED module according to the present invention, illumination of high brightness is possible due to the chip size package light emitting diode module disposed on a circuit board.

In addition, according to the line lighting system using a high density chip size package (CSP) LED module according to the present invention, the temperature sensor is mounted on the circuit board, respectively, it is possible to individually check and control the state.

In addition, according to the line lighting system using a high density chip size package (CSP) LED module according to the present invention, a multi-channel controller is applied to enable individual control of each circuit board.

In addition, according to the line lighting system using a high density chip size package (CSP) LED module according to the present invention, by having an air-cooled cooling structure using an air line, efficient cooling of the system is possible.

1 is a perspective view of a line illumination system using a high density chip size package (CSP) LED module according to an embodiment of the present invention.
FIG. 2 is an exploded view of a line illumination system using the high density Chip Size Package (CSP) LED module shown in FIG.
3 is a cross-sectional view of a line illumination system using the high density Chip Size Package (CSP) LED module shown in FIG.
4 is a main structural diagram of a line lighting system using a high density chip size package (CSP) LED module shown in FIG.
FIG. 5 is a state diagram of a line lighting system using the high density chip size package (CSP) LED module shown in FIG. 1; FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments described below are just described in detail enough to be easily carried out by those of ordinary skill in the art, which does not mean that the protection scope of the present invention is limited. Do not.

1 to 5, a line illumination system using a high density chip size package (CSP) LED module according to an embodiment of the present invention will be described. According to an embodiment of the present invention, a line lighting system using a high density chip size package (CSP) LED module includes a main block 100, a chip size package light emitting diode module 200, a condenser lens 300, and a diffusion lens. The plate 400 and the controller 500 are included.

As shown in FIGS. 1 to 3, the main block 100 includes a body 110, an air line 120, and an outlet 130, and includes an undercover 140, a side cover 150, and a top. The cover 160 may further include.

The main block 100 serves as a body so that the chip size package light emitting diode module 200, the condenser lens 300, and the diffusion plate 400 can be mounted, and the high density chip size package for glass inspection according to the present invention. (CSP: Chip Size Package) When a line lighting system using an LED module is mounted on a production line, it is formed lengthwise to fit the width of the product or camera to inspect the product.

  In detail, the body 110 of the main block 100 has a rectangular cross section and is formed long in the longitudinal direction. The body 110 may be made of a metal having high thermal conductivity, and in particular, the body 110 may be made of a metal having good thermal conductivity, good workability, and relatively good supply and demand of materials, such as aluminum.

2 and 3, the chip size packaged light emitting diode module 200 is mounted on the front surface of the body 110, and the airline 120 penetrates through the body 110 in the length direction. This is to cool the chip size package light emitting diode module 200 to be described later. In general, about 5 atmospheres (5 bar) of compressed air is supplied to a production plant in which line lighting according to the present invention is installed. . This compressed air flows through the air line 120 to prevent the chip size package light emitting diode module from overheating. To this end, the inlet 151 is formed in the side cover 150 to be described later to supply the compressed air to the air line 120, the compressed air passing through the air line 120 may be discharged to the rear portion of the body 110. A plurality of outlets 130 are formed so that.

Meanwhile, in order to increase cooling performance of the chip size package LED module, a plurality of cooling fins 111 protrude from the through part of the body 110 to increase a heat transfer rate with air in the airline 120. . The cooling fin 111 may be formed in a thin plate shape as shown, and may be extrusion molded integrally with the body 110 when the body 110 is formed.

The undercover 140 of the main block 100 extends from the lower side of the body 110 to the front portion as shown in FIGS. 2 and 3. The undercover 140 may be extrusion molded integrally with the body when the body 110 is formed, and thus may be made of the same material as the body 110, for example, a material such as aluminum.

The condenser lens 300 and the diffusion plate 400 are seated and coupled to the undercover 140, and thus serve as a bottom plate to which the condenser lens 300 and the diffusion plate 400 can be stably coupled and supported. On the upper surface of the undercover 140, a concave groove (no reference number) may be formed to be concave to fit the outer surface of the condenser lens 300 so that the condenser lens 300 can be stably seated, and thus the condenser lens 300 To help you position yourself correctly and consistently.

Side cover 150 is coupled to both sides of the body 110, as shown in Figure 2, is formed in the form extending toward the front portion of the body 110. Therefore, both side surfaces of the condenser lens 300 and the diffusion plate 400 which are coupled to both side surfaces of the body 110 and disposed on the front surface of the body 110 are fixed. The side cover 150 has a suction port 151 formed at a position corresponding to the air line 120 to allow the compressed air to flow into the air line 120. Here, the connection structure of the compressed air line is a structure in which a tab is formed in the inlet 151 so that the compressed air line supplied from the production plant is connected, and a fitting suitable for the size is coupled to the tab, so that the compressed air supply line is connected to the fitting. Is done. However, this connection structure is not shown separately because it is a commonly used method in the production process.

Top cover 160 is coupled to the upper surface of the body 110, as shown in Figures 2 and 3, is coupled to the upper surface of the body 110 is formed in a form extending toward the front portion of the body (110). The top cover 160 also serves to fix the condenser lens 300 and the diffuser plate 400, and for this purpose, a groove is concave to fit the outer surface of the condenser lens 300 similarly to the undercover 140. None) can be formed long.

The chip size package light emitting diode module 200 includes a circuit board 210 and a chip size package light emitting diode 220 and is mounted on the front side of the main block 100 to produce light by emitting light. do. One chip size package light emitting diode module 200 may be mounted on one main block 100, but as shown in FIG. 2, a plurality of chip size package light emitting diode modules 200 of one main block may be mounted. Can be mounted. In addition, each circuit board 210 may be equipped with a temperature sensor (not shown), so that the controller 500 receives a signal from each circuit board 210 individually to each chip size package light emitting diode module. By monitoring and controlling the 200 to maintain a specific temperature range, a line illumination system using a high density Chip Size Package (CSP) LED module according to the present invention can achieve a high level of light uniformity.

The circuit board 210 may be formed of a printed circuit board, and generally serves as a PCB used for controlling a semiconductor. The circuit board 210 controls each chip size package light emitting diode 220, and is connected to the multi-channel controller 500 to be described later.

The chip size package light emitting diode 220 is disposed on the circuit board 210 and serves as a light emitter. To this end, the chip size package light emitting diode 220 may include a semiconductor stack structure 221, a first contact layer 222, a second contact layer 223, a first electrode pad 224, a second electrode pad 225, The protective insulating layer 226 includes a connection terminal 227, and may further include a bump 228 and a sheet 229.

Referring to FIG. 4, the chip size package light emitting diode 220 has a form in which a contact layer, an electrode pad, and a protective insulating layer are disposed on the semiconductor stack structure 221. The first conductive upper semiconductor layer 221a and the second conductive lower semiconductor layer 221c are stacked in this order, and the active layer 221b is interposed therebetween.

The upper semiconductor layer 221a, the active layer 221b, and the lower semiconductor layer 221c may be formed of a compound semiconductor of III-N series, and the upper semiconductor layer 221a and the lower semiconductor layer 221c may each be a single layer. Or multilayers. The upper semiconductor layer 221a or the lower semiconductor layer 221c may include a contact layer and a cladding layer, or may include a superlattice layer.

The active layer 221b may be a single quantum well structure or a multi quantum well structure, the upper semiconductor layer 221a may be an n-type semiconductor structure, and the lower semiconductor layer 221c may be a p-type semiconductor structure. Can be.

The first contact layer 222 is disposed under the first insulating layer 226a to be described later, and penetrates the lower semiconductor layer 221c and the active layer 221b of the semiconductor stacked structure 221 to the upper semiconductor layer 221a. Connected. The second contact layer 223 is disposed under the lower semiconductor layer 221c and is connected to the lower semiconductor layer 221c of the semiconductor stacked structure 221. Here, the second contact layer 223 may include a reflective metal layer and may reflect light generated by the active layer 221b.

The protective insulating layer 226 may be divided into a first insulating layer 226a and a second insulating layer 226b according to the arrangement. The first insulating layer 226a covers the second contact layer 223 and at the same time. The sidewall of the semiconductor laminate structure 221 is covered. In addition, the first insulating layer 226a insulates the first contact layer 222 from the second contact layer 223, and insulates the lower semiconductor layer 221c and the active layer 221b from the first contact layer 222. Let's do it. The first insulating layer 226a may be formed of a single layer of a silicon oxide film or a silicon nitride film, or may be formed of a multilayer of insulating layers having different refractive indices.

The second insulating layer 226b covers the first contact layer 222 under the first contact layer 222. Meanwhile, the second insulating layer 226b may cover the first insulating layer 226a and may cover sidewalls of the semiconductor stack structure 221. The second insulating layer 226b may be formed of a single layer or multiple layers.

The first electrode pad 224 and the second electrode pad 225 are disposed under the second insulating layer 226b, and the first electrode pad 224 penetrates through the second insulating layer 226b to form a first contact layer. 222 is connected. In addition, the second electrode pad 225 is connected to the second contact layer 223 through the second insulating layer 226b and the first insulating layer 226a. In this case, the second electrode pad 225 is disposed not to overlap the first electrode pad 224.

The connection terminal 227 is connected under the first and second electrode pads 225, and the connection terminal 227 is electrically connected to the circuit board 210 described above. Meanwhile, bumps 228 may be formed between the connection terminals 227, and the bumps 228 serve as a path for dissipating heat generated in the semiconductor stack structure 221.

The sheet 229 is positioned to contact the upper semiconductor layer 221a and may be formed of a phosphor sheet having a uniform thickness. It may also be made of a non-uniformly doped substrate or sapphire substrate or silicon substrate for wavelength conversion.

The condenser lens 300 is disposed in front of the chip size package light emitting diode module 200, and serves to increase luminance by refracting light generated from the module. The condenser lens 300 is seated on the upper surface of the undercover 140 of the main block 100 and both sides and the top of the condenser lens 300 are fixed by the side cover 150 and the top cover 160.

The diffusion plate 400 is disposed in front of the condenser lens 300 and evenly diffuses the light concentrated by the condenser lens 300 to irradiate uniform light. The diffusion plate 400 may be formed of a multi-refraction plate, both sides and the upper and lower portions may be fixed by the side cover 150, undercover 140, top cover 160 of the main block 100.

The controller 500 is electrically connected to the chip size package LED module 200 and controls each module. The controller 500 may be a multi-channel controller capable of controlling each of a plurality of modules with one controller.

A use state of a line lighting system using a high density chip size package (CSP) LED module according to an embodiment of the present invention as described above will be described with reference to FIG. 5.

The line illumination system 1 using a high density chip size package (CSP) LED module according to the present invention is a high speed camera photographing and analysis inspection apparatus 20 for inspecting the glass 10 at a high speed in a production line of a display. Used with). Thus, as shown in Figure 5, the inspection equipment 20 for checking the state of the glass 10 above the produced glass 10 is located. At this time, the direction of the light is disposed so as to illuminate the upper surface of the glass 10 so that the camera of the inspection equipment 20 can accurately capture the state of the glass 10 at the front and rear or left and right of the inspection equipment 20. And it connects the compressed air supplied from the factory to the inlet 151 formed in the main block 100 to perform the cooling. In addition, by supplying electricity to the controller 500 to monitor and control the status of each module at the same time to adjust the brightness so that the camera of the inspection equipment 20 can accurately capture the glass 10.

In this process, the user can shorten the distance between the luminous bodies to enable high-intensity illumination, enabling high-speed inspection, and the individual sensors can be individually checked and controlled by applying a temperature sensor to each circuit board and applying a multi-channel controller. By using the air-cooled cooling structure used, a line lighting system using a high density Chip Size Package (CSP) LED module for glass inspection, which enables efficient cooling of the system, can be used.

Although the embodiments of the present invention have been described above, it will be understood by those skilled in the art that various modifications may be made without departing from the scope of the claims of the present invention.

10: glass 20: inspection equipment
100: main block 110: body
111 cooling pin 120 air line
130: outlet 140: undercover
150: side cover 151: inlet
160: top cover 200: chip size package light emitting diode module
210: circuit board 220: chip size package light emitting diode
221 semiconductor stack structure 221a upper semiconductor layer
221b: active layer 221c: lower semiconductor layer
222: first contact layer 223: second contact layer
224: first electrode pad 225: second electrode pad
226 protective insulating layer 226a first insulating layer
226b: second insulating layer 227: connection terminal
228: Bump 229: Sheet
300: condenser lens 400: diffuser plate
500: controller

Claims (7)

Main block; A plurality of chip size package light emitting diode modules mounted on the main block; A condenser lens disposed on a front surface of the plurality of chip size package light emitting diode modules; A diffusion plate disposed in front of the condenser lens; A temperature sensor mounted on a circuit board of each of the plurality of chip size package light emitting diode modules; Connected to the plurality of chip size package light emitting diode modules to control the plurality of chip size package light emitting diode modules, and to receive a signal transmitted from the temperature sensor to control each circuit board to maintain a specific temperature range. Include multi-channel controllers,
The main block may include a body formed in a longitudinal direction, an air line through which air for cooling a chip size package light emitting diode module formed to penetrate a side of the body, and mounted on a front surface of the body, and the chip size. A plurality of cooling fins protruding toward the air line to transfer the heat generated from the package light emitting diode module to the air passing through the air line, and formed in the rear portion so that the air supplied through the air line can be discharged And a plurality of outlets, an under cover extending from the lower end of the body to the front side, and a suction port coupled to both side portions of the body to penetrate air to allow the air to flow therethrough. Extending in the direction of the front of the body to secure both sides of the plate Bonded to the upper surface portion of the pair of side covers and the body, which is formed extending in the direction of the front part of the body and characterized in that it comprises a top cover to secure the upper portion of the condenser lens and the diffuser plate,
The undercover and the top cover are formed to face concave grooves corresponding to the outer surface of the condenser lens to correspond to the condenser lens installation position so that the condenser lens can be stably seated. Characterized in that the grooves for fixing the formed to face each other,
The chip size package light emitting diode module includes a circuit board and a chip size package light emitting diode disposed on the circuit board, wherein the chip size package light emitting diode includes a semiconductor stack structure including an upper semiconductor layer, an active layer, and a lower semiconductor layer; A first contact layer electrically connected to the upper semiconductor layer through the lower semiconductor layer and the active layer, a second contact layer electrically connected to the lower semiconductor layer from below, and a first surface of the semiconductor laminate structure A first electrode pad disposed on the first semiconductor pad and connected to the upper semiconductor layer, and a second electrode pad disposed on the first surface of the semiconductor laminate so as not to overlap with the first electrode pad and electrically connected to the lower semiconductor layer. And an insulating layer covering sidewalls of the upper semiconductor layer and the lower semiconductor layer, the insulating layers having different refractive indices from each other. Line illumination system using a high density Chip Size Package (CSP) LED module comprising a protective insulating layer. delete delete delete delete delete delete

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