KR20090053301A

KR20090053301A - Lighting apparatus for inspecting semiconductor device

Info

Publication number: KR20090053301A
Application number: KR1020070120079A
Authority: KR
Inventors: 김광섭
Original assignee: 세크론 주식회사
Priority date: 2007-11-23
Filing date: 2007-11-23
Publication date: 2009-05-27

Abstract

In the lighting device for a semiconductor device of the present invention, a plurality of semiconductor chips are attached to one surface, and a lighting device is applied to a semiconductor device carrier having a plurality of regions where solder balls are attached and arranged to be electrically connected to the semiconductor chip on the other surface. An apparatus, comprising: a ring illumination portion disposed to enclose the semiconductor element carrier loaded therein and emitting light toward a side of the solder ball attached to the semiconductor element carrier; A camera unit for photographing the arrangement of the solder balls; A coaxial illumination unit for applying illumination in the same direction as the camera unit; And a mark lighting unit for applying illumination to the defective mark displayed on the plurality of areas of the semiconductor element carrier.

By using such a lighting device for a semiconductor element of the present invention, the defect display on the semiconductor element carrier can be confirmed accurately and stably, thereby ensuring the reliability and stability of the inspection of the semiconductor element.

Semiconductor device

Description

Lighting apparatus for inspecting semiconductor device

The present invention relates to a lighting device for inspecting a semiconductor device. In particular, the present invention relates to a lighting device for inspecting a semiconductor device that provides lighting for distinguishing the identification mark shown on the material in the semiconductor device manufacturing apparatus.

In general, a semiconductor device manufacturing process includes a process of forming a plurality of semiconductor chips from a wafer, a process of separating each semiconductor chip formed by cutting a wafer, and a printed circuit board having a plurality of regions of the semiconductor chip. wire bonding to each area of the carrier, such as a board (hereinafter referred to as a PCB), and electrically connecting the wires to the semiconductor chip, and molding the carrier to which the semiconductor chip is wire-bonded, and solder balls to the semiconductor chips of each area of the molded carrier. And a step of cutting and classifying the carrier for each region to manufacture the desired semiconductor element.

In such a semiconductor device manufacturing process, a plurality of semiconductor chips are each mounted on a single carrier (PCB) having a plurality of regions, such as molding, and the like, and the plurality of semiconductor chips in the PCB are manufactured by cutting semiconductor devices and It is cut and sorted in the sorting process.

In general, some defective areas may exist among the plurality of areas of the PCB used in the manufacturing process of the semiconductor device.

Therefore, the PCB manufacturer displays a predetermined defect mark (generally an X mark) in the region where the defect occurs, and separates and removes the semiconductor element formed by bonding the semiconductor chip to the defect region in the cutting and sorting process, thereby producing a good product in the good region. Only good semiconductor devices to which semiconductor chips are attached need to be identified.

Therefore, the cutting and sorting apparatus needs to inspect the semiconductor chip attachment region marked with a defect on the material to be cut, and after cutting, only the semiconductor element manufactured to the region where the defect is not marked is transferred to the next step.

Such defect display area inspection is generally performed at the time of inspecting the solder ball array attached to the semiconductor device, and thus the illumination condition is an optimal illumination condition for the inspection of the solder ball array.

Hereinafter, a conventional lighting device for inspecting a semiconductor element will be described with reference to FIG. 1.

As can be seen in Figure 1, the conventional semiconductor device inspection lighting device has a camera 10 capable of imaging one surface of the inspection target PCB 50, the installation direction of the camera on the inspection target PCB 50 and Coaxial lighting unit 20 that provides the same direction of illumination, and reflecting unit 30 for reflecting the light emitted from the coaxial illumination unit 20 in the same direction as the installation direction of the camera, and the inspection target PCB (50) It is configured to include a ring lighting unit 40 for illuminating side lighting.

This conventional semiconductor device inspection lighting device achieves an optimal illumination condition through the coaxial illumination unit 20 and the ring illumination unit 40 to inspect the arrangement of the solder ball attached to one surface of the inspection target PCB (50).

Therefore, due to the lighting conditions of the conventional lighting device for inspecting the semiconductor element, it is not possible to clearly display the defect display indicated on the predetermined region of the PCB of the semiconductor element. Thus, as shown in Fig. 2, the defective display was confirmed not to be clear.

Therefore, with the conventional lighting device for semiconductor element inspection, the defect display mark cannot be inspected efficiently, and it is not possible to stably confirm the defect display mark of the inspection target PCB 50.

In order to solve the problems of the prior art as described above, the present invention is to provide a lighting device for inspecting a semiconductor device that can clearly check the defect display displayed on the PCB, which is a carrier for transporting a plurality of semiconductor devices.

In addition, the present invention is to provide a lighting method for inspecting a semiconductor device that can efficiently check the defect display displayed on the PCB.

Lighting device for a semiconductor device according to an aspect of the present invention for solving the above problems is provided with a plurality of semiconductor chip is attached to one surface, the solder ball is arranged to be attached to the other surface electrically connected to the semiconductor chip on the other side An apparatus for applying illumination to a semiconductor device carrier, comprising: a ring illumination unit arranged to surround the semiconductor device carrier loaded therein and emitting light toward a side of the solder ball attached to the semiconductor device carrier; A camera unit for photographing the arrangement of the solder balls; A coaxial illumination unit for applying illumination in the same direction as the camera unit; And a mark lighting unit for applying illumination to the defective mark displayed on the plurality of areas of the semiconductor element carrier.

In addition, the semiconductor device inspection lighting method according to another aspect of the present invention using the lighting device for the semiconductor device, the step of inspecting the arrangement of the solder ball by turning on the coaxial illumination unit and the ring illumination unit; Turning off the coaxial and ring illumination; And turning on the mark lighting unit to identify the defective mark displayed on the plurality of areas of the semiconductor device carrier.

In the present invention, the lighting device for inspecting a semiconductor device that can clearly check the defect display by achieving the illumination condition that the defect display displayed on the PCB, which is a carrier that carries a plurality of semiconductor elements, is clearly displayed through the mark lighting unit disclosed above. Can be provided.

Therefore, when using the semiconductor device inspection lighting apparatus of the present invention, it is possible to accurately and stably confirm the defect display on the PCB, it is possible to ensure the reliability and stability of the semiconductor element inspection.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

First, referring to FIG. 3, a lighting device for inspecting a semiconductor device according to an exemplary embodiment may include a camera unit 100, a coaxial illumination unit 200, a reflection unit 300, a ring illumination unit 400, and a mark illumination unit ( 600).

The inspection object of the present invention includes a PCB 500 having a plurality of areas for mounting a semiconductor chip on one surface and a plurality of areas for attaching and arranging solder balls to be electrically connected to the loaded semiconductor chip. .

Specifically, the PCB 500 used in the embodiment of the present invention is molded after the plurality of semiconductor devices are wire bonded on one surface thereof, and solder balls are arranged to be electrically connected to the plurality of semiconductor devices on the other surface. I use it. The solder ball arrangement area on the other side of the PCB 500 includes a defect indication given by the PCB manufacturer of the PCB 500 when the corresponding arrangement area is a defective area. Of course, if all the solder ball arrangement area of the PCB 500 is good, the indication of the amount of bullet is not displayed in all areas. This failure indication is made in a variety of ways, depending on the PCB manufacturer.

The coaxial illumination unit 200, the reflection unit 300, and the ring illumination unit 400 used in the present invention are attached to the opposite side of the surface of the PCB 500 to which the semiconductor chip is attached to correspond to the attachment area of the semiconductor chip. The arrangement of the solder balls is arranged to provide optimal illumination for easy imaging and inspection through the camera unit 100.

In particular, the ring illumination unit 400 is arranged to surround the PCB 500 loaded at the center side, as shown in FIG. 3, and is configured to emit light toward the side of the solder ball attached to the PCB 500. .

Therefore, in the present invention, since the camera unit 100, the coaxial lighting unit 200, the reflecting unit 300, and the ring lighting unit 400 can easily perform the inspection of the arrangement of the solder ball is not particularly limited, In the present invention, a detailed description thereof will be omitted.

However, the illumination conditions achieved by the coaxial illuminator 200 and the ring illuminator 400 are optimal for inspecting the arrangement of the solder balls, but are effective for detecting the defects displayed on the lower portion of the solder balls. I can't.

Therefore, a special illumination is needed to efficiently detect only the defect display displayed on the bottom of the solder ball.

The present invention further includes a mark lighting unit 600 that provides an optimal illumination for the defect display in order to easily identify the defect display displayed on the lower portion of the solder ball in the plurality of areas of the PCB 500. Therefore, the mark lighting unit 600 is disposed at an angle at which the illumination can be directly applied to the defect mark on the lower portion of the solder ball instead of the solder ball. Accordingly, since the defective display mark is directly illuminated by the mark illuminating unit 600, the defective display is easily displayed.

Therefore, the inclination angle of the mark illumination unit 600 with respect to the PCB 500 is configured to be different from the inclination angle with respect to the PCB 500 of the ring illumination unit 400, and is preferably configured to exceed this. That is, the mark lighting unit 600 is disposed to have an angle closer to the vertical with respect to the PCB 500.

Meanwhile, the mark lighting unit 600 operates on / off independently of the ring lighting unit 400, and is preferably configured not to share the control line with the ring lighting unit 400 and the power supply unit. Therefore, the ring illumination unit 400 and the mark illumination unit 600 is configured not to affect each other.

Therefore, the mark lighting unit 600 does not have any influence on the solder ball arrangement inspection by the ring lighting unit 400, and it is possible to independently adjust the amount of light so as to be optimal when inspecting the defect display.

Therefore, when the ring illumination unit 400 is turned off and the mark illumination unit 600 is turned on, as shown in FIG. 4, in the case of FIG. 2 where the defect mark written in the area of the PCB 500 is conventional. It is much clearer.

The mark lighting unit 600 is preferably adjusted to have the most advantageous bandwidth for the identification of the bad indication mark, in the embodiment of the present invention is green with a wavelength bandwidth of 490 nm ~ 570 nm is the most responsive (responsive) in the inspection of the bad mark LEDs were used.

Meanwhile, in the exemplary embodiment of the present invention, the mark lighting unit 600 is positioned above the ring lighting unit 400, so that the mark lighting unit 600 has a higher angle with respect to the PCB 500, but the arrangement of the mark lighting unit 600 is a ring. There is no particular limitation as long as it is a position that allows the bad indication mark to be more efficiently identified with respect to the lighting unit 400.

Hereinafter, a semiconductor device inspection lighting method using the semiconductor device inspection lighting apparatus according to an embodiment of the present invention will be described.

The lighting apparatus for inspecting a semiconductor device according to an exemplary embodiment of the present invention includes not only the ring illuminator 400 but also the mark illuminator 600, and the mark illuminator when inspecting an array of solder balls attached to each region of the PCB 500. Keep 600 off to maintain optimal lighting conditions for solder ball array inspection.

Thereafter, when the solder ball arrangement inspection is completed, the coaxial illumination unit 200 and the ring illumination unit 400 are turned off, and instead, the mark illumination unit 600 is turned on, thereby optimizing the defect indication mark displayed in the area of the PCB 500. Illumination conditions are met and the area of the PCB 500 where the bad indication mark is present is checked.

The lighting device for inspecting a semiconductor device according to an exemplary embodiment of the present invention described above relates to a case where the lighting device for inspecting a semiconductor device is applied to a semiconductor device cutting and sorting device. In addition, the semiconductor device manufacturing equipment that needs to check the mark can be applied to any device.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the technical idea of the present invention, and it is obvious that the present invention belongs to the appended claims. Do.

1 is a conceptual view schematically showing a conventional lighting device for a semiconductor device.

FIG. 2 is an image of a defect display photographed by the lighting apparatus for a semiconductor device of FIG. 1.

3 is a conceptual diagram schematically illustrating a lighting device for a semiconductor device according to an embodiment of the present invention.

4 is an image of a defect display photographed by the lighting apparatus for a semiconductor device of FIG. 3.

Claims

A semiconductor device lighting apparatus for applying illumination to a semiconductor device carrier having a plurality of semiconductor chips attached to one surface and having a plurality of regions where solder balls are attached and arranged to be electrically connected to the semiconductor chip on the other surface.

A ring illumination part disposed to surround the semiconductor element carrier loaded on a center side and emitting light toward a side of the solder ball attached to the semiconductor element carrier;

A camera unit for photographing the arrangement of the solder balls;

A coaxial illumination unit for applying illumination in the same direction as the camera unit; And

A mark illumination unit for applying illumination to the defective mark displayed on the plurality of areas of the semiconductor element carrier;

Illumination device for a semiconductor device comprising a.

The method of claim 1,

And the mark lighting unit is turned on / off independently of the ring lighting unit.

The method of claim 1,

The said mark illumination part is arrange | positioned above the said ring illumination part, The lighting apparatus for semiconductor elements characterized by the above-mentioned.

In the illumination method for semiconductor element inspection using the illumination device for semiconductor element inspection of claim 1,

Inspecting the arrangement of the solder balls by turning on the coaxial illuminator and the ring illuminator;

Turning off the coaxial illuminator and the ring illuminator; And

Turning on the mark lighting unit to identify a defective mark displayed on a plurality of areas of the semiconductor element carrier;

Illumination method for inspecting the semiconductor device comprising a.

The method of claim 4, wherein