TWI701417B - Drying block structure and storage device - Google Patents

Abstract

A drying block structure is provided, including a main body and a protective layer. The main body has a honeycomb and substantially circular shape. The protective layer covers the main body and has a porous structure. The main body and the protective layer are integrally formed as one piece.

Description

Dry block structure and storage device

This disclosure relates to a dry block structure.

In the semiconductor industry, the produced wafers are usually stored in a front opening shipping box (FOSB) before further processing. However, the residual fluoride ions in the wafer process chemically react with the contacts on the wafer to cause corrosion, and water vapor is a catalyst for bonding pad corrosion (RMA) on the wafer. Therefore, it is necessary to control the moisture in the front-opening shipping box when packaging and storing wafers.

At present, the commonly used method in the industry is to reduce the residual amount of fluoride ions by optimizing the production process, or to use a desiccant to control the moisture in the front-opening shipping box to prevent corrosion. A common practice in the industry is usually to provide an additional set of bags outside the front-opening shipping box to cover the front-opening shipping box, and to set a desiccant between the front-opening shipping box and the bag to absorb moisture. Generally speaking, in order to facilitate the use of an automatic packaging machine to fix the desiccant with tape, the desiccant is also placed on the outside of the front-opening shipping box.

However, since the conventional desiccant is not located in the front-opening shipping box, but outside the front-opening shipping box, this setting method is not as effective as the moisture absorption inside the front-opening shipping box. expected. In addition, due to the structural limitation of the existing desiccant, it is impossible to directly install the desiccant in the front-opening shipping box.

The present disclosure provides a dry block structure including a body and a protective layer. The main body has a honeycomb structure and a roughly circular shape. The protective layer covers the body, has a porous structure, and is integrally formed with the body.

In some embodiments of the present disclosure, the body includes linear sides, arc-shaped sides, and grooves, and the grooves extend from the center of the body to the linear sides. In the extending direction of the straight side, the width of the groove is smaller than the length of the straight side. In the direction perpendicular to the extending direction of the straight side, the depth of the groove is smaller than the thickness of the body. In some embodiments, the drying block structure further includes a plate-shaped element and a positioning element. The plate-shaped element is disposed in the groove, and the positioning element is disposed on the plate-shaped element. The material of the body includes a porous material, and the material of the plate-shaped element includes a semiconductor material. In some embodiments, the length of the groove is less than the radius of the body.

The present disclosure also provides a storage device for storing wafers, including a casing and a dry block structure. The casing has a plurality of grooves, wherein the wafer is arranged in one of the grooves, and the dry block structure is arranged in the other of the grooves, and the diameter of the dry block structure is approximately the same as the diameter of the wafer.

Many different implementation methods or examples are disclosed below to implement different features of the provided target. Of course, these embodiments are only for illustration, and should not be used to limit the scope of the disclosure.

Please refer to FIG. 1, the main body 110 of the drying block structure 100 has a honeycomb structure, and a groove 120 is provided on one side of the main body 110 (as shown by the dotted line). In FIGS. 2 to 7, the diameter of the dry block structure 100 is D, and the periphery of the main body 110 has a straight side 112 and an arc side 114. In addition, a plate-shaped element 130 may also be provided in the groove 120.

In FIGS. 3 and 4, the groove 120 of the drying block structure 100 extends from the center of the main body 110 to the linear side 112. It should be noted that in the extending direction of the linear side 112 (X direction), the width L1 of the groove 120 is smaller than the length L2 of the linear side 112. For example, in some embodiments, the diameter D of the dry block structure may be 30.5 cm, and the width L1 of the groove 120 and the length L2 of the linear side 112 may be 6 cm and 12 cm, respectively. However, the present disclosure does not This is limited. In addition, since the groove 120 extends from the center of the body 110 to the linear side 112, the length of the groove 120 may be less than the radius of the body 110.

In some embodiments, in the normal direction (Z direction) of the dry block structure 100, the depth T1 of the groove 120 is smaller than the thickness T2 of the body 110. For example, in some embodiments, the depth T1 of the groove 120 may be about 50% of the thickness T2 of the body 110. In some embodiments, the body 110 may have a thickness of 3 mm, and the groove 120 may have a depth of 1.5 mm, but the disclosure is not limited thereto.

By designing the linear side 112 on the main body 110, a suitable sensing device can be used to sense the position of the drying block structure 100, and the determination result can be enhanced. For example, the linear side 112 can increase the signal strength received by the sensing device. In addition, the groove 120 is designed on the main body 110 to allow the use of a robotic arm to take the dry block structure 100 to achieve the purpose of automation.

Please refer to Figure 8. In some embodiments, the plate-shaped element 130 may be disposed at the center of the body 110 (as shown by the central axis O and the radius r of the body 110). In some embodiments, the material of the plate element 130 may be the same as the material of the wafer W (FIG. 13). For example, the plate-shaped element 130 may include a semiconductor material (such as silicon). In some embodiments, the plate-shaped element 130 may have a circular shape, and its diameter may be about 6 cm. However, this disclosure is not limited to this. For example, in some embodiments, the plate-shaped element 130 may also have other shapes, for example, may have the same shape as the groove 120 to increase the contact area with the robot arm.

By arranging the plate-shaped element 130 in the groove 120, it is possible to provide a force application point when the mechanical arm is used to take the dry block structure 100 (for example, the plate-shaped element 130 can be vacuumed to take the dry block structure 100). Moreover, by designing the plate-shaped element 130 to be the same material as the wafer W (FIG. 13), the material contamination of the wafer W due to the debris that may be generated when the plate-shaped element 130 is in use can be avoided.

Please refer to Figure 9 and Figure 10. The plate element 130 may have a positioning element 132 thereon. The positioning element 132 may include, for example, a radio frequency identification (RFID) circuit, which may allow external sensing devices to sense it. Therefore, even if the drying block structure 100 is placed in an opaque packaging bag, the positioning element 132 can be used to determine the position of the drying block structure 100, thereby allowing automated operations.

In some embodiments, the positioning element 132 may be provided on the front side of the plate-shaped element 130 (arranged in the Z direction), while the back side (-Z direction) of the plate-shaped element 130 does not have the positioning element 132, as shown in Figs. 9 and Figure 10 shows. In this way, the back surface of the plate-shaped element 130 can be ensured to be a flat surface, thereby allowing the robotic arm to suck the back surface of the plate-shaped element 130 in a vacuum, so that the plate-shaped element 130 is fixed on the robotic arm for easy handling.

Please refer to Figure 11. The dry block structure 100 can be formed by pressing the porous material 200 and the mold 300 above the protective layer 250 and the lower mold 310. The upper mold 300 and the lower mold 310 may have mutually corresponding shapes (for example, a honeycomb shape). In some embodiments, the porous material 200 may include silicone, and the protective layer 250 may include polymer (for example, polyethylene) fibers, but the disclosure is not limited thereto. In some embodiments, the porous material 200 and the protective layer 250 may be porous materials. In some embodiments, heating may be performed when the porous material 200 and the protective layer 250 are pressed together (for example, heating at a temperature less than 120 degrees) to further enhance the pressing effect of the porous material 200 and the protective layer 250. In some embodiments, the material of the protective layer 250 may have the characteristics of high tear resistance, high moisture penetration, wear resistance, antistatic, and high stability, thereby preventing the dry block structure 100 from affecting the storage device 1 Wafer W (Figure 13).

Please refer to Figure 12. After demolding, the protective layer 250 of the dry block structure 100 may be wrapped around the porous material 200 and formed integrally with the porous material 200. The molded porous material 200 can be used as the body 110 and can have a honeycomb structure. In this way, the surface area of the body 110 can be increased to increase the adsorption reaction rate, and the honeycomb structure can enhance the structural strength of the body 110. In addition, by integrally forming the protective layer 250 and the porous material 200, the possibility of debris caused by the friction between the porous material 200 and the protective layer 250 can be prevented, thereby preventing contamination.

Since the porous material 200 may have a porous structure, the adsorption area can be increased, thereby improving the moisture absorption effect. In addition, the protective layer 250 covering the body 110 can prevent the debris that may be generated by the porous material 200 during use from falling out of the dry block structure 100 and affecting subsequent manufacturing processes, thereby not affecting the yield. Furthermore, the protective layer 250 can increase the friction of the dry block structure 100, thereby preventing the dry block structure 100 from sliding and colliding with other components or generating debris during subsequent manufacturing processes.

In some embodiments, after the drying block structure 100 adsorbs the moisture in the storage device 1, the drying block structure 100 can also be heated (for example, using a temperature of about 80 degrees to about 90 degrees) to remove the adsorbed water. The air is removed, and the drying block structure 100 can be activated again to allow the drying block structure 100 to be reused to reduce costs and achieve environmental protection.

Please refer to Figure 13. The storage device 1 includes a housing 10 with a plurality of grooves 12 in the housing 10 for arranging wafers W. In addition, a dry block structure 100 may be provided in the storage device 1. In some embodiments, the storage device 1 may be an existing front opening shipping box (FOSB), and the diameter of the drying block structure 100 may be set to be approximately the same as the diameter of the wafer W, so as to dry The block structure 100 can be arranged in the groove 12 at the bottom of the storage device 1 without changing the structure of the storage device 1. In some embodiments, a tenon (not shown) may be provided in the storage device 1 to further fix the position of the drying block structure 100.

Since no components are provided at the bottom of the general front-opening shipping box, the placement of the drying block structure 100 at the bottom of the storage device 1 will not affect the storage capacity of the wafer W. Furthermore, since the moisture concentration at the bottom of the storage device 1 will be greater than the moisture concentration at the top of the storage device 1, arranging the dry block structure 100 as the bottom of the storage device 1 can further enhance the moisture absorption effect of the dry block structure 100 .

In addition, by arranging the dry block structure 100 in the storage device 1 instead of outside the storage device 1, the reaction path required for absorbing moisture can be reduced to further enhance the moisture absorption effect of the dry block structure 100. For example, please refer to FIG. 14. If the drying block structure 100 is placed outside the storage device 1, the relative humidity (RH) in the storage device 1 is approximately fixed after being placed for 1 hour.

However, if the drying block structure 100 is placed in the storage device 1, compared to placing the drying block structure 100 outside the storage device 1, the relative humidity in the storage device 1 can be further reduced, and the suction can be sustained for a long time. Wet time. In some embodiments, by placing the dry block structure 100 in the storage device 1, the relative humidity in the storage device 1 can be reduced to below 25%, so as to suppress the chemical reaction catalyzed by moisture, thereby reducing The probability of corrosion of the contacts on the wafer can improve the yield of the product.

In summary, the present disclosure provides a dry block structure. By designing the drying block structure to have a shape similar to that of the existing wafer, it is allowed to directly place the drying block structure in the existing storage device without changing the structure of the storage device. In addition, the drying block structure disclosed in the present disclosure can also solve the problem of picking by the robot arm, and can also enable the sensing device to easily sense the position of the drying block structure, which is beneficial to automatic operation.

1: storage device

10: Shell

12: Groove

100: Dry block structure

110: body

112: Straight side

114: curved side

120: Groove

130: plate element

132: Positioning components

200: porous material

250: protective layer

300: Upper mold

310: Lower mold

D: diameter

L1: width

L2: length

O: Central axis

r: radius

T1: depth

T2: thickness

W: Wafer

The embodiments of the disclosure will be described in detail below in conjunction with the accompanying drawings. It should be noted that, according to standard practices in the industry, various features are not drawn to scale and are only used for illustration. In fact, the size of the element can be arbitrarily enlarged or reduced to clearly show the features of the present disclosure. Figure 1 is a three-dimensional view of the drying block structure of some embodiments of the disclosure. Figure 2 is a top view of the drying block structure of some embodiments of the disclosure. Figure 3 is a bottom view of the drying block structure of some embodiments of the disclosure. Figure 4 is a front side view of the drying block structure of some embodiments of the disclosure. Figure 5 is a rear side view of the drying block structure of some embodiments of the disclosure. Figure 6 is a left side view of the drying block structure of some embodiments of the disclosure. Figure 7 is a right side view of the drying block structure of some embodiments of the disclosure. Figure 8 is a cross-sectional view of the dry block structure of some embodiments of the disclosure. Figure 9 is a top view of a plate-shaped element according to some embodiments of the disclosure. Fig. 10 is a bottom view of the plate-shaped element according to some embodiments of the disclosure. FIG. 11 is a schematic diagram of manufacturing the drying block structure of some embodiments of the disclosure. Figure 12 is a schematic diagram of the dry block structure of some embodiments of the disclosure. Figure 13 is a schematic diagram of a storage device according to some embodiments of the disclosure. Figure 14 shows the relationship between relative humidity and time in the storage device when the drying block structure is placed in different positions.

100: Dry block structure

110: body

112: Straight side

114: curved side

120: Groove

130: plate element

Claims (9)

A storage device for storing a wafer, comprising: a housing with a plurality of grooves in the housing, wherein the wafer is arranged in one of the grooves; and a dry block structure arranged In the other of the grooves, the diameter of the dry block structure is approximately the same as the diameter of the wafer, and the dry block structure includes a body having a honeycomb structure and a substantially circular shape; and A protective layer covers the body, has a porous structure, and is integrally formed with the body. According to the storage device described in item 1 of the scope of patent application, the body includes a straight side and an arc side. According to the storage device described in item 2 of the scope of patent application, the main body further includes a groove extending from the center of the main body to the linear side. According to the storage device described in item 3 of the scope of patent application, in the extending direction of the linear side, the width of the groove is smaller than the length of the linear side. According to the storage device described in item 3 of the scope of patent application, in the direction perpendicular to the extending direction of the linear side, the depth of the groove is less than the thickness of the body. The storage device described in item 3 of the scope of the patent application further includes a plate-shaped element disposed in the groove. According to the storage device described in claim 6, wherein the material of the body includes a porous material, and the material of the plate-shaped element includes a semiconductor material. The storage device described in item 6 of the scope of patent application further includes a positioning element arranged on the plate-shaped element. The storage device according to item 3 of the scope of patent application, wherein the length of the groove is smaller than the radius of the body.

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