JP2013165277A - Semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To divide a wiring board after collective sealing without adding stress to an attachment surface of external terminals of the wiring board.SOLUTION: A semiconductor device manufacturing method comprises: preparing a multi-piece substrate 7 on which a plurality of device regions are formed on a principal surface; fixing semiconductor chips to the plurality of device regions, respectively; collectively resin sealing the plurality of semiconductor chips after fixing the semiconductor chips to form a collective sealing part 8; dividing the collective sealing part 8 and the multi-piece substrate 7 for each device region by dicing; scrubbing, after the division, a surface of each sealing part by a brush; subsequently, housing each semiconductor device once in a pocket of a tray; further, transferring each semiconductor device from the tray individually; and dicing the substrate at the time of substrate division after collective sealing by vacuum suction of a surface of the collective sealing part 8. Accordingly, the multi-piece substrate 7 can be divided without adding stress to an attachment surface of external terminals of the multi-piece substrate 7.

Description

  The present invention relates to a semiconductor manufacturing technique, and more particularly to a technique effective when applied to singulation of a resin sealing portion by dicing.

  In a CSP (Chip Size Package) which is a small semiconductor device, a semiconductor chip mounted on a substrate has been devised.

  Therefore, as for the method for dividing the substrate for CSP, for example, JP 2001-23936 A (Patent Document 1), JP 2001-24003 A (Patent Document 2), JP 2001-77057 A (Patent Document). 3), JP-A-2001-85449 (Patent Document 4) and JP-A-2000-77363 (Patent Document 5).

  Japanese Patent Laid-Open No. 2001-23936 discloses a hole or bar code as a mark for identifying a jig in a substrate dividing apparatus. Japanese Patent Application Laid-Open No. 2001-24003 discloses a method for improving productivity by using a dedicated jig when dividing a CSP substrate. Furthermore, Japanese Patent Application Laid-Open No. 2001-77057 discloses a technique for dividing a CSP substrate into individual pellet units and then removing the contamination attached to the back surface of the pellets before being stored in the transport tray. Japanese Patent Application Laid-Open No. 2001-85449 discloses a CSP substrate holding technique when a CSP substrate is divided into individual pellet units and then stored in a transport tray. Furthermore, Japanese Patent Application Laid-Open No. 2000-77363 discloses a technique in which a CSP is cut in a state of being stored in a dedicated jig, and then washed and dried.

JP 2001-23936 A JP 2001-24003 A JP 2001-77057 A JP 2001-85449 A JP 2000-77363 A

  However, in the division of the CSP substrate, the structure of the jig used at the time of division and whether the holding surface of the substrate (the suction surface in the case of vacuum suction) is the front or back surface are important factors. The substrate holding member (jig) disclosed in Japanese Patent Application Laid-Open No. 2001-85449 includes a first hole for sucking and holding each divided pellet, and a pellet in a region adjacent to the first hole. It has a second hole for sucking and holding during jig transportation, and a third hole (fine through hole) that prevents the holding force from being lowered due to air leakage from the first hole, and its structure is complicated. Therefore, it is a problem that it becomes an expensive jig.

  Further, the jig becomes large and heavy for securing the air path of the three holes, and there is a problem that the manufacturing cost and space of the jig handling mechanism increase.

  Further, there is no clear description in the above five publications regarding whether the holding surface of the substrate is the front or back of the substrate.

  An object of the present invention is to provide a technique that makes it possible to divide an external terminal mounting surface of a wiring board without applying stress.

  Another object of the present invention is to provide a technique capable of easily recognizing a division position when a wiring board is divided.

  Furthermore, the other object of this invention is to provide the technique which can remove easily the cutting waste adhering to the external terminal attachment surface of a wiring board.

  The above and other problems, objects, and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  That is, the present invention includes the following steps. (A) preparing a wiring board having a main surface on which a plurality of device regions are formed, a back surface opposite to the main surface, and a dicing region located between the plurality of device regions; (b) a) a step of fixing a plurality of semiconductor chips to the plurality of device regions of the wiring substrate after the step; (c) after the step (b), the plurality of semiconductor chips on the main surface of the wiring substrate; A step of forming a collective sealing portion that collectively covers the semiconductor chips; (d) after the step (c), a plurality of external terminals on the back surface of the wiring board so as to correspond to each of the plurality of device regions; (E) After the step (d), the step of disposing the wiring board on a dicer cut stage; (f) After the step (e), the dicing region from the back side of the wiring substrate. Along da A step of dividing the collective sealing portion and the wiring substrate by running a blade for singing to obtain a plurality of assemblies; (g) after the step (f), each of the plurality of assemblies (H) After the step (g), each of the plurality of assemblies is placed on a spin stage via a substrate holding jig, the spin stage is rotated, and the plurality of assemblies A step of spraying air on each of the plurality of assemblies to dry each of the plurality of assemblies.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  When the substrate is divided after batch sealing, the surface of the batch sealing portion is vacuum-sucked and diced, so that the external terminal mounting surface of the wiring board can be divided without applying stress, and the external terminal mounting surface of the substrate can be divided. It is possible to prevent scratches. Furthermore, the accuracy and reliability of dicing can be improved.

It is a perspective view which partially fractures and shows an example of the structure of the semiconductor device assembled by the manufacturing method of the semiconductor device of Embodiment 1 of this invention. FIG. 2 is a cross-sectional view illustrating a structure of the semiconductor device illustrated in FIG. 1. It is sectional drawing which shows an example of the structure after the wire bonding in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is a fragmentary sectional view which shows an example of the state at the time of package resin sealing in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is a top view which shows an example of the structure by the side of the external terminal attachment surface of the assembly after the collective resin sealing in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is a side view which shows the structure of the assembly shown in FIG. It is a top view which shows the structure by the side of the package sealing part of the assembly shown in FIG. It is a front view which shows the structure of the assembly shown in FIG. It is a top view which shows an example of the structure of the board | substrate holding jig used with the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is a side view which shows the structure of the board | substrate holding jig shown in FIG. It is sectional drawing which shows an example of the structure of the jig | tool transfer hand used with the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is sectional drawing which shows an example of the clamp state of the assembly by the jig transfer hand and board | substrate holding jig shown in FIG. It is sectional drawing which shows an example of the structure which has arrange | positioned the assembly shown in FIG. 12 on the dicer cut stage. It is sectional drawing which shows an example of the dicing state of the board | substrate width direction after resin sealing in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is sectional drawing which shows an example of the dicing state of the board | substrate longitudinal direction after resin sealing in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is sectional drawing which shows an example of the washing | cleaning and drying state of the external terminal attachment surface of the wiring board after the dicing in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is sectional drawing which shows an example of the transfer method from the inversion hand of the assembly to the draining hand in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is sectional drawing which shows an example of the holding | maintenance state of the assembly by the draining hand shown in FIG. It is sectional drawing which shows an example of the water absorption method of the surface of the sealing part of the assembly in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is sectional drawing which shows an example of the cleaning method of the board | substrate holding jig in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is sectional drawing which shows an example of the adsorption state of the assembly by the reversing hand in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is sectional drawing which shows an example of the inversion method in the assembly adsorption state by the inversion hand shown in FIG. It is sectional drawing which shows an example of the transfer method of the assembly from the inversion hand shown in FIG. 22 to the contamination removal zigzag stage. It is a top view which shows an example of the state of the 1st transfer stage at the time of transferring an assembly to a contamination removal zigzag stage by the transfer method shown in FIG. It is a top view which shows an example of the state of the 2nd transfer stage at the time of transferring an assembly to a contamination removal zigzag stage by the transfer method shown in FIG. It is sectional drawing which shows an example of the state after the transfer of the assembly transferred to the contamination removal zigzag stage by the transfer method shown in FIG. It is sectional drawing which shows an example of the contamination removal method of the surface of the sealing part of the assembly in the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is sectional drawing which shows an example of the holding state by zigzag collective adsorption of the assembly body after the contamination removal shown in FIG. It is sectional drawing which shows an example of the transfer method of the assembly body by zigzag collective adsorption shown in FIG. It is a top view which shows an example of the state after transfer to the zigzag pocket tray of the assembly body by zigzag collective adsorption shown in FIG. FIG. 31 is a side view showing a partially broken example of a method for conveying an individual piece of an assembly from a staggered pocket tray shown in FIG. 30. FIG. 32 is a side view showing a partially broken example of the electrical test method after individual piece conveyance shown in FIG. 31. FIG. 33 is a side view illustrating a partially broken example of the appearance inspection method after individual piece conveyance illustrated in FIG. 32. It is a side view which shows an example of the classification | category state to the tray for every discrimination | determination of the assembly based on the test | inspection shown to FIG. It is a manufacturing process flow figure which shows a part of example of the procedure from the dicing after collective sealing to contamination removal and tray accommodation of the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is a manufacturing process flow figure which shows a part of example of the procedure from the dicing after collective sealing to contamination removal and tray accommodation of the manufacturing method of the semiconductor device of Embodiment 1 of this invention. It is a top view which shows the structure of the board | substrate holding jig of the modification of Embodiment 1 of this invention. It is sectional drawing which shows the structure of the board | substrate holding jig of the modification shown in FIG. It is sectional drawing which shows the clamp method of the assembly body by the board | substrate holding jig of the modification shown in FIG. 37, and the jig transfer hand of a modification. It is an expanded partial sectional view which shows the sensor OFF state at the time of the clamp in the jig | tool transfer hand of the modification shown in FIG. It is an expanded partial sectional view which shows the sensor ON state at the time of clamping in the jig | tool transfer hand of the modification shown in FIG. It is sectional drawing which shows an example of the board | substrate holding state by the porous jig | tool used with the manufacturing method of the semiconductor device of Embodiment 2 of this invention. It is sectional drawing which shows the board | substrate holding | maintenance state of the modification in the manufacturing method of the semiconductor device of Embodiment 2 of this invention. It is sectional drawing which shows the dicing method of the modification in the manufacturing method of the semiconductor device of Embodiment 2 of this invention. It is sectional drawing which shows the holding | maintenance state of the assembly of the modification in Embodiment 2 of this invention. It is a top view which shows the structure of the assembly body of the modification shown in FIG. It is sectional drawing which shows the structure of the assembly shown in FIG. It is a top view which shows the structure of the assembly of the other modification in Embodiment 2 of this invention. It is sectional drawing which shows the structure of the cross section cut | disconnected along the AA line of FIG. It is a fragmentary sectional view which shows the structure of the cross section cut | disconnected along the BB line of FIG. It is a back view which shows the structure of the assembly shown in FIG. It is a top view which shows the structure of the assembly of the other modification in Embodiment 2 of this invention. FIG. 53 is a cross-sectional view showing a cross-sectional structure cut along line CC in FIG. 52. FIG. 53 is a back view showing the structure of the assembly shown in FIG. 52. It is a top view which shows the structure of the assembly of the other modification in Embodiment 2 of this invention. It is sectional drawing which shows the structure of the cross section cut | disconnected along the DD line | wire of FIG. It is a reverse view which shows the structure of the assembly shown in FIG. It is sectional drawing which shows the manufacturing method of the semiconductor device of the modification in Embodiment 2 of this invention.

  In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

  Further, in the following embodiment, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments, but they are not irrelevant to each other unless otherwise specified. The other part or all of the modifications, details, supplementary explanations, and the like are related.

  Also, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), particularly when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and it may be more or less than the specific number.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted.

(Embodiment 1)
FIG. 1 is a partially cutaway perspective view showing an example of the structure of a semiconductor device assembled by the method of manufacturing a semiconductor device according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the structure of the semiconductor device shown in FIG. 3 is a cross-sectional view showing an example of the structure after wire bonding, FIG. 4 is a partial cross-sectional view showing an example of a state at the time of batch resin sealing, and FIG. 5 is an external terminal mounting surface of the assembly after the batch resin sealing. FIG. 6 is a side view showing the structure of the assembly shown in FIG. 5, FIG. 7 is a plan view showing the structure on the collective sealing portion side of the assembly shown in FIG. Is a front view showing the structure of the assembly shown in FIG. 6, FIG. 9 is a plan view showing an example of the structure of a substrate holding jig used in the method of manufacturing a semiconductor device according to the first embodiment of the present invention, and FIG. FIG. 11 is a side view showing the structure of the substrate holding jig shown in FIG. Sectional drawing which shows an example of the structure of the jig | tool transfer hand used with the manufacturing method of the semiconductor device of form 1, FIG. 12 is an example of the clamp state of the assembly by the jig | tool transfer hand and board | substrate holding jig shown in FIG. FIG. 13 is a sectional view showing an example of a structure in which the assembly shown in FIG. 12 is arranged on a dicer cut stage. FIG. 14 is a sectional view showing an example of a dicing state in the substrate width direction after resin sealing. 15 is a cross-sectional view showing an example of the dicing state in the longitudinal direction of the substrate after resin sealing, FIG. 16 is a cross-sectional view showing an example of the cleaning / drying state of the external terminal mounting surface of the wiring board after dicing, and FIG. FIG. 18 is a cross-sectional view showing an example of a state in which the assembly is held by the draining hand shown in FIG. 17, and FIG. FIG. 20 is a cross-sectional view showing an example of a method for cleaning the substrate holding jig, FIG. 21 is a cross-sectional view showing an example of an adsorbed state of the assembly by the reversing hand, and FIG. 22 is a cross-sectional view showing an example of the reversing method in the assembly attracting state by the reversing hand shown in FIG. 21, and FIG. 23 shows an example of the transferring method of the assembly from the reversing hand shown in FIG. 24 is a cross-sectional view, FIG. 24 is a plan view showing an example of the state of the first transfer stage when the assembly is transferred to the contamination removal staggered stage by the transfer method shown in FIG. 23, and FIG. 25 is the transfer shown in FIG. FIG. 26 is a plan view showing an example of the state of the second transfer stage when the assembly is transferred to the contamination-free staggered stage by the method, and FIG. 26 is transferred to the contamination-free staggered stage by the transfer method shown in FIGS. 27 is a cross-sectional view showing an example of a state after the loaded assembly is transferred, FIG. 27 is a cross-sectional view showing an example of a contamination removal method on the surface of the sealing portion of the assembly, and FIG. 28 is a view after removing the contamination shown in FIG. FIG. 29 is a cross-sectional view showing an example of a holding state by zigzag collective adsorption of the assembly, FIG. 29 is a cross-sectional view showing an example of a method for transferring the assembly by zigzag collective adsorption, and FIG. 30 is a zigzag collective adsorption shown in FIG. FIG. 31 is a side view showing an example of a method for conveying an individual piece of an assembly from the zigzag pocket tray shown in FIG. 30, and FIG. 32 is a plan view showing an example of the state after the assembly is transferred to the zigzag pocket tray. 31 is a side view showing an example of the electrical test method after individual piece conveyance shown in FIG. 31, FIG. 33 is a side view showing an example of the appearance inspection method after individual piece conveyance shown in FIG. 32, and FIG. Assembly based on the inspection indicated FIG. 35 and FIG. 36 are manufacturing process flow diagrams showing a part of an example of a procedure from dicing after collective sealing to contamination removal and tray storage. .

  In the semiconductor device of the first embodiment shown in FIGS. 1 and 2, the semiconductor chip 1 is mounted on the main surface 3 a of the individual substrate 3, and the semiconductor chip 1 and the individual substrate 3 are electrically connected by the wires 4. And a resin-sealed BGA (Ball Grid Array) 9 in which a plurality of ball electrodes 11 as external terminals are provided in a matrix arrangement on the back surface 3b of the individual substrate 3.

  Note that the BGA 9 of the first embodiment is partitioned and formed by dicing lines 7b using a multi-chip substrate 7 which is a wiring substrate in which a plurality of device regions 7a as shown in FIG. 5 are formed in a matrix arrangement. The plurality of device regions 7a are resin-molded in a state of being collectively covered with the cavities 13c of the molding die 13 shown in FIG. 4 (hereinafter referred to as batch molding), and the batch sealing portion shown in FIG. 8 is diced after resin molding and separated into individual pieces.

  The detailed structure of the BGA 9 shown in FIGS. 1 and 2 will be described. The semiconductor chip 1 has a main surface 1b and a back surface 1c, and a plurality of front surface pads 1a and semiconductor elements are formed on the main surface 1b. The individual substrate 3 having a main surface 3a for supporting the semiconductor chip 1 and a back surface 3b opposite to the main surface 3a, and a plurality of connection terminals 3c provided on the main surface 3a, and the back surface 3b of the individual substrate 3 A plurality of wires 4 that connect the ball electrodes 11, which are external terminals provided on the semiconductor chip 1, the pads 1 a of the semiconductor chip 1, and the corresponding connection terminals 3 c of the individual substrate 3, and the main substrate 3. The sealing portion 6 is formed on the surface 3a and seals the semiconductor chip 1 and the plurality of wires 4 with resin.

  The semiconductor chip 1 is fixed on the main surface 3a of the individual substrate 3 via a die bond material 5 which is an adhesive.

  Further, the individual substrate 3 has an area other than the internal wiring 3f for electrically connecting the connection terminal 3c on the main surface 3a and the bump land 3d on the back surface 3b, and the wiring portion exposed on the main surface 3a and the back surface 3b. Insulating film 3e and the like are provided, and ball electrodes 11 as external terminals are respectively provided on bump lands 3d.

  The individual substrate 3 is made of, for example, an epoxy substrate with glass.

  Further, the ball electrode 11 is formed of, for example, solder.

  Further, the semiconductor chip 1 is formed of, for example, silicon, and a semiconductor integrated circuit is formed on each main surface 1b, and a plurality of pads which are surface electrodes for connection are formed on the peripheral portion of the main surface 1b. 1a is formed.

  The resin molding resin used for forming the sealing portion 6 is, for example, a thermosetting epoxy resin.

  Moreover, the wire 4 connected by wire bonding is a gold wire, for example.

  Next, the manufacturing method of BGA9 of this Embodiment 1 is demonstrated.

  First, a multi-piece substrate (wiring substrate) 7 shown in FIG. 5 in which a plurality of device regions 7a each having a plurality of connection terminals 3c are formed in a matrix arrangement is prepared.

  On the other hand, the semiconductor chip 1 is prepared.

  Thereafter, as shown in FIG. 3, each semiconductor chip 1 is die-bonded to mount a plurality of semiconductor chips 1 on one multi-chip substrate 7.

  Further, wire bonding is performed on each semiconductor chip 1, and the pads 1 a of the semiconductor chip 1 and the connection terminals 3 c in the device regions 7 a of the multi-chip substrate 7 corresponding thereto are connected by the wires 4.

  Thereafter, resin sealing is performed by batch molding.

  That is, as shown in FIG. 4, a plurality of semiconductor chips 1 on the multi-piece substrate 7 are arranged inside one cavity 13c of the molding die 13, and the plurality of device regions 7a are collectively formed by the cavity 13c. After covering, a plurality of semiconductor chips 1 are collectively resin-sealed to form a collective sealing portion 8.

  At that time, first, the multi-chip substrate 7 having been wire-bonded is arranged on the mating surface of the lower mold 13b, and further, the plurality of device regions 7a are collectively covered by the cavities 13c of the upper mold 13a so that the upper mold is covered. 13a and the lower mold 13b are clamped.

  Thereafter, a sealing resin is injected into the cavity 13c to perform batch molding.

  In this way, the collective sealing portion 8 shown in FIGS. 6 to 8 is formed.

  In the first embodiment, as shown in FIG. 5 to FIG. 8, the substrate surface which is the collective sealing portion 8 formed on the multi-chip substrate 7 and is an external terminal mounting surface of the multi-chip substrate 7. A structure in which the ball electrodes 11 as a plurality of external terminals are provided on 7c is referred to as an assembly 2. However, in the case of a semiconductor device that does not use the ball electrode 11 as an external terminal, the structure after the collective sealing portion 8 is formed is referred to as an assembly 2.

  Next, the dicing process (separation) of the assembly 2 after collective sealing will be described.

  First, the substrate holding jig 12 which is a plate-like jig used in the dicing process shown in FIGS. 9 and 10 will be described.

  The substrate holding jig 12 includes a plate-like jig main body 12a and a product support portion 12b that supports the assembly 2 and is formed of rubber or the like. The product support portion 12b corresponds to the dicing line 7b. Thus, grooves 12d are formed in a lattice shape.

  Further, each of the quadrangular regions (regions corresponding to one product) formed by being partitioned by the grooves 12d of the product support portion 12b is formed with suction holes (through holes) 12c one by one. At this time, the products are diced one by one while being sucked through the respective suction holes 12c.

  A positioning hole 12e is formed in the jig main body 12a outside the product support portion 12b, and the substrate holding jig 12 can be positioned using the positioning hole 12e during dicing.

  Next, the dicing / contamination removing apparatus used in the first embodiment will be described.

  As shown in FIG. 35, the dicing / contamination removing apparatus has loader units such as a tape loader 19 with balls, a substrate loader 20 with balls, and a substrate loader 21 without balls, as shown in FIG. The loader unit includes a first unit on which a first rack for storing the assembly 2 as a product is stored in each groove portion, and a second unit on which a second rack for storing the assembly 2 in an overlapping manner is mounted. Equipped with.

  Further, the first rack is a type of assembly 2 housed therein, for example, a tape batch sealed product (a type in which a tape substrate is attached to a lead frame), and a substrate batch sealed product (substrate BGA type). And the outlet of the assembly 2 is different. Therefore, the tape batch sealed product is extruded from the first rack, and then conveyed to the tape peeling mold 22 for peeling the lead frame and the assembly 2. On the other hand, the substrate packaged product is extruded from the first rack and then conveyed to the pre-positioning unit. In any type of product, in order to bring the collective sealing portion 8 of the product (the assembly 2) into contact with the substrate holding jig 12, it is set in a state where the collective sealing portion 8 is in the lower side in advance. .

  The product stored in the second rack (assembly 2) is an LGA (Land Grid Array) type product without the ball electrode 11 and is pushed up to the upper part of the rack by an elevator to be the highest product. More sucked and conveyed.

  Subsequently, since the product sucked and transported from each loader needs to be mounted on the substrate holding jig 12 with a certain degree of accuracy, the product is once positioned by the positioning unit (step S1 shown in FIG. 35). The positioning method at this time is a low-cost positioning method that employs a method in which the vacuum suction of the transport unit is once released into a pocket that matches the product outer shape, is dropped by its own weight, and then sucked again.

  Thereafter, the jig product set shown in step S2 of FIG. 35 is performed.

  First, the product (assembled body 2) positioned by the positioning method is sucked by the jig transfer hand 14 as shown in FIG. 11, and the assembled body 2 is set on the substrate holding jig 12 positioned in advance. At this time, the jig transfer hand 14 is positioned while being guided by the substrate holding jig 12 and positioning pins.

  The jig transfer hand 14 includes a hand main body 14a and a sponge 14b.

  Thereafter, as shown in FIG. 12, the sponge surface 14b of the jig transfer hand 14 is brought into contact with the substrate surface 7c (the back surface 3b of the individual substrate 3) which is the external terminal mounting surface of the multiple substrate 7 of the assembly 2. Then, the assembly 2 is clamped and clamped by the jig transfer hand 14 and the substrate holding jig 12.

  Thereby, the assembly 2 which is a product is clamped by the jig transfer hand 14 and the substrate holding jig 12, and is conveyed to the next processing step in the clamped state.

  Subsequently, a dicer cut stage set shown in step S3 is performed.

  That is, the assembly 2 and the substrate holding jig 12 are set on the dicer cut stage 15 by the jig transfer hand 14. At this time, the dicer cut stage 15 and the substrate holding jig 12 clamped by the jig transfer hand 14 are positioned by guide pins or the like.

  As shown in FIG. 13, the dicer cut stage 15 recognizes the presence or absence of the substrate holding jig 12 and the assembly 2 on the stage, so that a jig suction hole 15b that is a system that sucks only the substrate holding jig 12 is used. And a product adsorption hole 15a which is a system for adsorbing the product on the jig.

  Furthermore, the substrate holding jig 12 shown in FIG. 9 is formed with suction holes (through holes) 12c corresponding to the respective device regions 7a of the multi-piece substrate 7 shown in FIG. When the sealing portion 8 is sucked and held, it can be vacuum sucked through the suction holes 12c corresponding to the respective device regions 7a.

  Accordingly, when the collective sealing portion 8 is vacuum-sucked via the substrate holding jig 12, separate exhaust paths (product suction holes 15a and jigs) corresponding to the substrate holding jig 12 and the collective sealing portion 8 respectively. The substrate holding jig 12 and the collective sealing portion 8 can be vacuum-sucked by evacuating from the tool suction hole 15b).

  By using this, it is possible to determine the state on the stage such as (without jig) / (without product with jig) / (with jig and product).

  The transfer of the substrate holding jig 12 and the assembly 2 between the jig transfer hand 14 and the dicer cut stage 15 operates the product suction on the stage side and the jig suction, and the vacuum sensor on the stage side has a specified value. After reaching the level, the product transfer of the jig transfer hand 14 is released, and then the jig clamp is released to retract the jig transfer hand 14 to a position where there is no hindrance to dicing.

  Then, the piece cutting after the dicer recognition shown in step S4 is performed.

  That is, the collective sealing unit 8 and the multi-piece substrate 7 along the dicing line 7b in a state where the surface 8a of the collective sealing unit 8 of the assembly 2 is vacuum-adsorbed by the dicer cut stage 15 via the substrate holding jig 12. Then, dicing is performed and the device area 7a is divided (divided into individual pieces).

  At that time, after the assembly 2 is set on the dicer cut stage 15 via the substrate holding jig 12, first, the wiring pattern formed on the substrate surface 7c of the multi-chip substrate 7 of the assembly 2 is recognized by the dicer. Recognized by the camera, and the cut position is determined.

  After the recognition is completed, the individual piece of the assembly 2 is started to be cut with the numerical value calculated based on the recognition information.

  As shown in FIGS. 14 and 15, dicing of the assembly 2 is performed on the substrate surface (rear surface) of the multi-chip substrate 7 in which the ball electrodes 11 as a plurality of external terminals are attached to the substrate surface (rear surface) 7c. The blade 10 for dicing is entered from the side 7c, and a large number of blades 10 are taken along the dicing line 7b shown in FIG. The take substrate 7 is divided.

  As a result, the collective sealing portion 8 is divided into individual sealing portions 6, and the multi-piece substrate 7 is divided into the individual substrate 3.

  Like the manufacturing method of the semiconductor device of the first embodiment, the surface 8a of the batch sealing portion 8 is vacuum-sucked when the substrate is divided after the batch sealing, and the batch sealing portion 8 and the multi-chip substrate 7 are diced. By doing so, it is possible to divide the multi-chip substrate 7 without applying stress to the substrate surface 7c (back surface) which is the external terminal mounting surface.

  Thereby, it is possible to prevent the back surface 3b (substrate surface 7c) of each individual substrate 3 from being damaged.

  Furthermore, the surface 8a of the collective sealing portion 8 is more likely to be vacuum-sucked as compared with the suction of the multi-chip substrate 7, so that the suction is stabilized and the multi-sealing portion 8 and the multi-chip substrate 7 are surely secured. And the accuracy and reliability of dicing can be improved.

  Further, by vacuum-sucking the surface 8a of the collective sealing portion 8, since the substrate surface 7c of the multi-piece substrate 7 faces upward, it becomes easy to recognize a wiring pattern and the like. The dicing position (division position) can be easily recognized.

  After completion of the individual piece cutting, the cleaning / drying stage set shown in step S5 is performed.

  Here, the assembly 2 and the substrate holding jig 12 are transported using the jig transfer hand 14 and another jig transfer hand 14 provided as a pair.

  That is, in the dicing / contamination removing apparatus of the first embodiment, the jig transfer hand 14 and another jig transfer hand 14 are paired, and the other jig transfer hand 14 is cut into individual pieces. After the product is taken out from the dicer cut stage 15, the product before cutting the individual pieces set in advance on the jig transfer hand 14 is set on the dicer cut stage 15. The utilization rate can be improved.

  The purpose of the cleaning here is to remove the cutting waste (contamination) generated by dicing cutting, and the individual cutting is completed first and held by another jig transfer hand 14. The assembled body 2 and the substrate holding jig 12 are set on a cleaning / drying spin stage 16. The setting method is the same as that of the dicer cut stage 15. The assembly 2 on the substrate holding jig 12 is held by another jig transfer hand 14, and the other is placed on the spin stage 16 for cleaning / drying in the next process. The assembly assembly 2 separated by the jig transfer hand 14 and the substrate holding jig 12 is sandwiched and conveyed.

  At that time, in the other jig transfer hand 14, the substrate holding jig 12 and the hand main body 14 a are positioned by a guide pin or the like, and in a state of being vacuum-adsorbed and fixed on the individualized dicer cut stage 15. The substrate holding jig 12 is clamped after the substrate surface 7 c side of the multi-piece substrate 7 is pressed by a sponge 14 b made of a material that does not damage the ball electrode 11.

  Thereafter, the vacuum suction of the dicer cut stage 15 is released, and the assembly 2 separated into pieces is transported to the spin stage 16 while being fixed so as not to move on the substrate holding jig 12.

  Thereafter, cleaning / drying in step S6 is performed.

  As shown in FIG. 16, in the spin stage 16, the high-pressure cleaning water 16 b is assembled in a state where the assembly 2 separated from the jig / product suction hole 16 a is sucked through the substrate holding jig 12. The cleaning power is improved by spraying from above 2 and rotating the spin stage 16. Further, after cleaning, high-pressure air 16c is jetted from above the assembly 2, and the spin stage 16 is similarly rotated to dry the product (assembly 2).

  The contamination removed by the cleaning / drying of the first embodiment is that of the substrate surface 7c of the multi-piece substrate 7 on the upper part of the product. At this time, the contamination on the surface 8a of the collective sealing portion 8 is contaminated. However, when this contamination is removed in a later step, it is relatively easy to remove the contamination of the collective sealing portion 8, but when the substrate surface 7c, particularly the ball electrode 11 is provided. It is not easy to remove contamination.

  Therefore, as in the first embodiment, the method of adsorbing to the substrate holding jig 12 with the front surface 8a of the collective sealing portion 8 facing downward is the substrate with the substrate surface 7c of the multi-chip substrate 7 facing upward as it is. Since the substrate surface 7c can be cleaned and dried in the state of being mounted on the holding jig 12, the cutting waste adhering to the external terminal mounting surface which is the substrate surface 7c of the multi-cavity substrate 7 can be easily removed, Compared to the method of adsorbing the substrate surface 7c downward, the cleaning of the substrate surface 7c is also very advantageous.

  After cleaning / drying, the reversing hand shown in step S7 is performed.

  First, the assembly 2 that has been cleaned / dried is transferred by the jig transfer hand 14 together with the substrate holding jig 12 onto the reversing hand 17 shown in FIG. The operation when taking out the assembly 2 and the substrate holding jig 12 from the spin stage 16 is the same as that of the dicer cut stage 15, and the jig transfer hand 14 is attached to the reversing hand 17 and the assembly 2 and the substrate holding jig. Guide pins are also used when setting 12.

  The reversing hand 17 has a hand main body 17a and a motor 17c for reversing the front and back of the hand main body 17a, and has four axis degrees of freedom of X, Y, Z, and θ. Further, an opening hole 17b for sucking the assembly 2 through the substrate holding jig 12 is formed in the hand main body 17a.

  Further, the reversing hand 17 sucks only the product (the assembly 2) and uses a mechanical clamp for fixing the substrate holding jig 12, thereby simplifying the vacuum exhaust path and reducing the cost of the reversing hand 17. Can be achieved.

  Next, the draining hand 18 shown in FIG. 17 will be described.

  The draining hand 18 temporarily separates the assembly 2 from the substrate holding jig 12 and sucks and holds only the assembly 2, and includes a hand main body 18 a and an opening hole 18 b for suction formed in the hand main body 18 a. The sponge body 18a has a sponge 18c provided in the hand body 18a and a plurality of through holes 18d provided in the sponge 18c corresponding to each product.

  As shown in FIGS. 17 and 18, the purpose of transferring the product from the reversing hand 17 to the draining hand 18 is to remove moisture remaining on the surface 8 a of the collective sealing portion 8 of the assembly 2 and to reverse the assembly 2. This is to prevent water droplets from wrapping around the substrate surface 7c and to clean the substrate holding jig 12.

  The assembly 2 transferred together with the substrate holding jig 12 onto the reversing hand 17 is sucked and held by the reversing hand 17 through the opening hole 17b of the reversing hand 17. In this state, the draining hand 18 is disposed above the reversing hand 17, and then the reversing hand 17 is raised and the assembly 2 is pressed against the sponge 18 c of the draining hand 18 from below.

  Thereafter, suction is started from the through-hole 18d of the sponge 18c of the draining hand 18, and then suction in the reversing hand 17 is stopped. At this time, since a plurality of through holes 18d are formed in the sponge 18c corresponding to each product, as shown in FIG. The substrate surface 7c of the reference) can be sucked and held.

  A plurality of ball electrodes 11 are attached to the substrate surface 7c. Since the contact partner of the substrate surface 7c is the sponge 18c, the substrate surface 7c can be adsorbed without scratching the ball electrode 11. .

  Then, after confirming that the delivery of the product is completed by the vacuum sensor, the reversing hand 17 is lowered to prevent the product from being displaced.

  Thereby, the draining hand product adsorption shown in step S8 is completed.

  Then, sealing surface water absorption shown in step S9 shown in FIG. 36 is performed.

  Here, the water absorbing sponge 23a is pressed against the surface 8a of the collective sealing portion 8 in a state where the substrate surface 7c of the multi-piece substrate 7 to which the ball electrode 11 is attached is sucked and held by the draining hand 18 through the sponge 18c. Water absorption of the surface 8a of the collective sealing portion 8 is performed.

  That is, as shown in FIG. 19, a water absorbing stage 23 provided with a water absorbing sponge 23 a is disposed below the draining hand 18, and then the water absorbing stage 23 is raised to attach the water absorbing sponge 23 a to the surface 8 a of the collective sealing portion 8. And sucking water from the water absorption holes 23 b formed in the water absorption stage 23 to absorb moisture adhering to the batch sealing portion 8.

  Thereby, it is possible to prevent water droplets from wrapping around the substrate surface 7c when the product is inverted.

  On the other hand, the jig cleaning in step S10 is performed in parallel with step S9.

  Here, the reversing hand 17 is reversed so that the substrate holding jig 12 is disposed below. Further, as shown in FIG. 20, after the jig cleaning stage 24 is arranged below the reversing hand 17, the jig cleaning stage 24 and the reversing hand 17 are brought into close contact with each other, and the substrate holding jig 12 is placed in a sealed space. On the other hand, air blow 24a is sprayed and suction is performed from the dust collection hole 24b of the jig cleaning stage 24 to remove the dirt on the substrate holding jig 12.

  Thereby, it is possible to prevent re-adhesion of the moisture on the substrate holding jig 12 and the cutting waste (product broken material / resin cutting piece for sealing / contamination, etc.) to the product.

  Thereafter, suction hand product suction shown in step S11 is performed.

  That is, as shown in FIG. 21, the assembly 2 as a product is again sucked and held on the substrate holding jig 12 of the reversing hand 17 with the substrate surface 7c facing upward.

  Thereafter, the product reversal shown in step S12 causes the reversing hand 17 to be reversed with the assembly 2 as a product being sucked and held via the substrate holding jig 12 as shown in FIG. The substrate surface 7c is directed downward.

  Thereafter, the contamination removal staggered stage shown in step S13 is performed.

  First, as shown in FIG. 23, a contamination removal staggered stage (staggered stage) 25 provided with a sponge 25a is disposed below the reversing hand 17 holding the assembly 2 with the substrate surface 7c facing downward. Thereafter, the reversing hand 17 holding the assembly 2 by suction is lowered, and the assembly 2 is transferred onto the sponge 25a of the contamination-free staggered stage 25.

  At that time, the separated assemblies 2 are individually separated, and the respective products (BGA 9) are arranged in a staggered pattern on the contamination removal staggered stage 25 as shown in FIG.

  Here, the reason why the products are arranged in a staggered manner will be described.

  First, when removing contaminants by brushing as shown in FIG. 27, the four sides of each sealing portion 6 are made open by leaving spaces on the four sides of each product by staggered arrangement. Brushing spreads and the contamination removal range can be widened.

  Second, when the products are sucked together in the dicer cut state in the contamination removal zigzag stage 25, the contamination removal zigzag stage 25 to 1 is used when the product is conveyed in the next process after the contamination removal is completed. When individual pieces or a plurality of pieces are directly conveyed at the same time, a vacuum leak occurs at the point where the piece removal is lost on the contamination removal staggered stage 25, and the vacuum level of collective suction is lowered and the contamination removal staggered stage. 25, a product misalignment occurs.

  Therefore, it is not preferable to carry individual pieces directly from the contamination removal staggered stage 25, and it is necessary to temporarily transfer the product from the contamination removal staggered stage 25 to a tray where no vacuum leak occurs (in the case of a tray, it is necessary to hold the vacuum suction). Because there is no).

  At that time, it is preferable to transfer the products to the tray at once in order to improve the throughput at the time of transfer, but the transfer accuracy to the tray pocket is a staggered pocket that can guide the four sides of the product. Compared with the case of the aggregate shape of the dicer cut as it is, it becomes looser and can be easily transferred.

  For example, when the interval between adjacent individual products is only the width of the blade 10 (for example, 0.2 mm), it is extremely difficult to manufacture pockets that guide the four sides of the product other than the staggered arrangement.

  Therefore, for the first and second reasons, the respective products are taken out from the assembled assembly 2 and arranged in a staggered pattern on the contamination removal staggered stage 25.

  Next, a method of arranging the products held on the substrate by the reversing hand 17 shown in FIG. 23 on the contamination removal staggered stage 25 as shown in FIG. 26 will be described.

  At that time, when the separated products (BGA 9) are arranged in a staggered manner, all the products are vacuum-adsorbed in advance by the evacuation system of different paths in the reversing hand 17, and then the plurality of the products The evacuation of one of the routes is selectively stopped, and the product is transferred to the contamination removal zigzag stage (zigzag stage) 25 for each of the stopped routes, and this product is sequentially repeated for each route. A staggered arrangement is made on the contamination removal staggered stage 25.

  For example, when the first to fourth different types of vacuum exhaust systems for forming the staggered arrangement in the reversing hand 17 are provided, first, only the first vacuum exhaust system is evacuated. Stop, transfer only the product corresponding to the first evacuation system to the contamination removal zigzag stage 25 by sucking and holding the product. This state is shown in FIG.

  Subsequently, the evacuation of only the second evacuation system is stopped, and only the product corresponding to the second evacuation system is sucked and held and transferred onto the contamination removal staggered stage 25. This state is shown in FIG.

  In this way, the products are sequentially transferred onto the contamination removal staggered stage 25, and all the products are adsorbed and held on the contamination removal staggered stage 25 in a staggered arrangement.

  Note that a sponge 25a is provided on the contamination removal staggered stage 25 as shown in FIG. 26, and further, through holes 25c are formed in the sponge 25a at locations corresponding to each of the staggered products. Yes.

  Therefore, in the contamination removal staggered stage 25, when the vacuum is exhausted from the opening hole 25b, the back surface 3b of each product in the staggered arrangement can be sucked and held through the through hole 25c of the sponge 25a. In this state, in each product (BGA 9), the back surface 3b of the individual substrate 3 is vacuum-sucked, and the surface 8a of the sealing portion 6 faces upward.

  Then, the contamination removal shown in step S14 is performed.

  Here, as shown in FIG. 27, the rotatable brush 26 is rotated, and the back surface 3b of each individual substrate 3 provided with the plurality of ball electrodes 11 is adsorbed and held in a staggered arrangement via the sponge 25a. The surface 8 a of the sealing portion 6 of the BGA 9 is rubbed with the rotated brush 26.

  At that time, the surface 8a of the sealing portion 6 is dried by the water absorption of the sealing surface in step S9, and the surface 8a of the sealing portion 6 in a dry state can be rubbed with the brush 26. Contamination can be reliably removed. That is, contamination due to resin waste generated during dicing for individualization is easier to remove when the surface 8a of the sealing portion 6 is dry. Therefore, in the contamination removal according to the first embodiment, Since the surface 8a of the sealing portion 6 is directed upward and the surface 8a is rubbed with the brush 26, contamination can be reliably removed.

  When the sealing portion 6 is rubbed with the brush 26, the rotating brush 26 may be moved along the sealing portion 6 in a staggered arrangement, or the contamination removal staggered stage 25 may be moved. However, both may be moved.

  Further, since each BGA 9 is arranged in a staggered manner on the contamination removal staggered stage 25, the rotated brush 26 can be brought into contact with each of the four side surfaces of the sealing portion 6. This contamination can also be removed.

  Therefore, in the contamination removal according to the first embodiment, it is possible to remove the contamination adhered to almost the entire surface from the four side surfaces of the sealing portion 6 to the surface 8a.

  In addition, it is preferable that the brush 26 is formed with the material which has electroconductivity for antistatic.

  Further, in the contamination removal by the brush 26, the contamination is scattered around. Therefore, the scattered contamination is evacuated from the opening hole 25b of the contamination removal staggered stage 25 and collected, thereby preventing the contamination from being scattered. be able to.

  Thereafter, transfer to the zigzag pocket shown in step S15 is performed.

  Here, a staggered pocket tray (tray) 28 in which the pockets are formed in a staggered arrangement is prepared in advance, and each BGA 9 after contamination removal is collectively sucked and held in a staggered arrangement and once transferred to the staggered pocket tray 28. Each BGA 9 is stored in a staggered arrangement in the staggered pocket 28a of the staggered pocket tray 28.

  At this time, the surfaces 8a of the respective sealing portions 6 are collectively collected by the zigzag collective suction hand 27 that can adsorb the plurality of BGAs 9 on the contamination-removed zigzag stage 25 as shown in FIG. Adsorbed and held, and transferred to the staggered pocket tray 28 shown in FIGS.

  Thereby, since BGA9 can be transferred collectively, the throughput of transfer can be improved.

  The staggered pocket 28a of the staggered pocket tray 28 is preferably provided with guides corresponding to the four sides of the product.

  Thereafter, the individual piece conveyance shown in step S16 is performed.

  That is, as shown in FIG. 31, one or a plurality of BGAs 9 are taken out from the zigzag pocket tray 28 and conveyed individually.

  In the individual piece conveyance, since the BGA 9 is stored in each pocket, a vacuum leak does not occur even if one or a plurality of BGAs 9 are picked up to generate a pocket pocket.

  Therefore, in the individual piece conveyance, the surface 8a of each sealing portion 6 of each desired number (for example, four) of the BGAs 9 is picked up and picked up by the individual piece adsorption hand 29, and FIG. It is conveyed to a positioning pocket 30, a test unit or an appearance inspection unit as shown in FIG.

  For example, when the electrical test shown in step S17 is performed, as shown in FIG. 32, the product (BGA 9) conveyed by the first piece suction hand 29a is delivered to and from the second piece suction hand 29b. It is stored in the positioning pocket 30 that also serves as temporary placement. Then, after being sucked by the second piece suction hand 29b and inserted into the testing socket 31, an electrical test is performed by an electrically connected tester. The product for which the test has been completed is transported to the next step by the third piece suction hand 29c.

  The second piece suction hand 29b inserts the product into the testing socket 31, and at the same time, the third piece suction hand 29c removes the product from the testing socket 31, thereby increasing the processing capacity. Can be improved.

  Further, in the appearance inspection shown in step S18, by measuring the individual cut dimensional accuracy (measuring the distance of each of the four sides from the reference position), it is possible to prevent a defective product out of the specification tolerance from flowing to the next process, and Prevents the creation of defects by dicer. Further, the presence / absence of a missing ball is inspected to prevent a defect from flowing into the next process.

  Note that the appearance inspection apparatus has specifications that allow other inspection items (for example, foreign matter adhesion) to be added.

  Further, in order to shorten the time relating to the appearance inspection, as shown in FIG. 33, it is conveyed to the upper side of the appearance inspection camera 32 while being adsorbed by the fourth piece adsorption hand 29d, and the appearance inspection camera 32 there Inspection is performed.

  In the tray storage shown in step S19, the trays are classified into non-defective products, test failures, appearance defects, and the like, and are transported and stored by the fourth piece suction hand 29d.

  In other words, the tray storage unit is provided with three types of trays, that is, a non-defective product storage tray 33, a test failure storage tray 34, and a defective appearance storage tray 35, and includes a tray loader / product storage unit / tray unloader. Further, the dicing / contamination removing device has a function of automatically performing re-inspection when the yield determined by the number of test failures cannot be secured. At that time, the three types of trays are classified into a non-defective product storage tray 33 / primary test, poor appearance tray / secondary test, poor appearance tray, and the like.

  Next, the substrate holding jig 12 and the jig transfer hand 14 according to a modification of the first embodiment will be described.

  37 is a plan view showing the structure of a substrate holding jig according to a modification of the first embodiment of the present invention, FIG. 38 is a sectional view showing the structure of the substrate holding jig according to the modification shown in FIG. 37, and FIG. Sectional drawing which shows the clamp method of the assembly body by the board | substrate holding jig of the modification shown in 37 and the jig transfer hand of a modification, FIG. 40 is a sensor at the time of clamping in the jig transfer hand of the modification shown in FIG. FIG. 41 is an enlarged partial cross-sectional view showing the sensor ON state during clamping in the jig transfer hand of the modification shown in FIG. 39.

  The modified substrate holding jig 12 shown in FIGS. 37 and 38 is substantially the same as the substrate holding jig 12 shown in FIG. 9, but in addition to the jig main body 12a and the product support portion 12b, FIG. Guide pins 12f for guiding the assembly 2 shown in FIG. 39 and projecting members 12g such as hexagonal screws used for jig recognition are provided.

  In addition to the jig transfer hand 14 shown in FIG. 11, the jig transfer hand 14 of the modification shown in FIG. 39 includes a suction pad 14 c that recognizes the protruding member 12 g of the substrate holding jig 12 shown in FIG. 38. Is provided.

  Therefore, as the jig recognition operation, the jig transfer hand 14 moves on the protruding member 12g on the applied jig according to preset product type data and descends to the height at which the protruding member 12g should be. Thereby, after descending, the vacuum sensor is operated, and if the vacuum sensor is turned on, it is judged normal, and if not, it is judged as abnormal.

  With the above operation, when the substrate holding jig 12 and the jig transfer hand 14 according to the second embodiment are used, it can be confirmed whether or not the product to be cut matches the jig. Use of a jig different from the product can be prevented.

  40 and 41 show the jig recognition by the optical sensor 14d. For example, when the substrate holding jig 12 is not provided with the protruding member 12g, the pin member 14e has the optical sensor 14d. On the other hand, when the projection member 12g is provided, the pin member 14e is pushed up to shield the optical sensor 14d.

  Whether or not the product to be cut matches the jig is checked by turning on / off the optical sensor 14d.

(Embodiment 2)
42 is a cross-sectional view showing an example of a substrate holding state by a porous jig used in the method of manufacturing a semiconductor device according to the second embodiment of the present invention, FIG. 43 is a cross-sectional view showing a substrate holding state of a modification, and FIG. FIG. 45 is a cross-sectional view showing a holding state of the modified assembly according to the second embodiment of the present invention, and FIG. 46 shows the structure of the modified assembly shown in FIG. 47 is a cross-sectional view showing the structure of the assembly shown in FIG. 46, FIG. 48 is a plan view showing the structure of another modification of the second embodiment of the present invention, and FIG. 49 is FIG. FIG. 50 is a partial sectional view showing the structure of the cross section cut along the line BB of FIG. 48, and FIG. 51 is the assembly shown in FIG. FIG. 52 is a back view showing the structure of the body. FIG. The top view which shows the structure of the assembly of the other modification in the form 2, FIG. 53 is sectional drawing which shows the structure of the cross section cut | disconnected along CC line of FIG. 52, FIG. 54 is the assembly of FIG. FIG. 55 is a plan view showing the structure of an assembly according to another modification, FIG. 56 is a cross-sectional view showing a cross-sectional structure cut along the line DD in FIG. 55, and FIG. FIG. 58 is a rear view showing the structure of the assembly shown in FIG. 55, and FIG.

  The second embodiment describes a jig used at the time of dicing at the time of singulation after batch sealing and a dicing method using the same in the manufacture of a semiconductor device, and is adopted in the first embodiment. Instead of the substrate holding jig 12, a porous jig 36 having a plurality of holes 36a is used.

  As shown in FIG. 42, a support block 37 in which a plate-like porous jig 36 is incorporated and capable of holding the assembly 2 after the batch sealing is prepared, and individual pieces by dicing on the support block 37 are prepared. To do.

  That is, the assembly 2 is placed on the porous jig 36 that is incorporated in the support block 37 and has a plurality of holes 36a via the weak adhesive sheet 38 with the collective sealing portion 8 facing the weak adhesive sheet 38 side. Deploy.

  Therefore, the assembly 2 is disposed on the porous jig 36 with the weak adhesive sheet 38 interposed therebetween with the collective sealing portion 8 facing the weak adhesive sheet 38 side.

  In this state, the collective sealing portion 8 of the assembly 2 is held by vacuum suction from the suction hole 37a of the support block 37 via the weak adhesive sheet 38 and the porous jig 36. The blade 10 is made to enter from the substrate surface 7c to which 11 is attached, and then dicing is performed to make individual pieces.

  The porous jig 36 is formed with a plurality of holes 36a penetrating the front and back surfaces almost uniformly over the entire surface, and is made of, for example, a material or metal that can be baked and manufactured.

  Further, the weak adhesive sheet 38 is one in which an adhesive material is applied on both surfaces thereof, and prevents the blade 10 from entering here.

  By performing dicing using the porous jig 36 and the weak adhesive sheet 38 in this way, it is possible to prevent cutting powder from adhering to the sealing portion 6, and the porous adhesive 36 can be made by simply replacing the weak adhesive sheet 38. The jig 36 can be made compatible with the exchange of types, and the porous jig 36 can be made compatible with various types.

  That is, the porous jig 36 and the weak pressure-sensitive adhesive sheet 38 are not uniform, but can be used for various types. Thereby, the versatility of the porous jig | tool 36 is improved and cost reduction can be aimed at.

  Also, the weak adhesive sheet 38 is used repeatedly with the premise that it is used with a uniform adhesive force during the dicing process and the subsequent pick-up process, unlike a dicing tape having a normal ultraviolet curable adhesive. This makes it possible to reduce the member cost in the dicing process.

  Further, since the weak adhesive sheet 38 is interposed even when the assembly 2 is warped, it is possible to prevent the assembly body 2 from causing an adsorption error.

However, the weak adhesive sheet 38 is not necessarily used.
Next, FIG. 43 is a modification to FIG. 42, in which a soft resin sheet 39 is used instead of the weak adhesive sheet 38. In this case, when the blade 10 interferes with the soft resin sheet 39 at the time of dicing, the sheet itself can escape by the soft resin (gel), and the entry of the blade 10 can be stopped.

  With respect to the soft resin sheet 39 as well, it is possible to reduce the member cost by repeatedly using it in the dicing process. In addition, by using a soft resin, damage to the soft resin sheet 39 during dicing can be suppressed, and the number of times that the resin can be used repeatedly can be increased.

  Further, in the modification shown in FIG. 44, the batch sealing portion 8 of the assembly 2 is directed upward while the substrate surface 7c of the multi-piece substrate 7 to which the ball electrode 11 is attached is directed downward, and the batch sealing portion is 8 is adsorbed and held by a support block 37 via a porous jig 36 and a weak adhesive sheet 38 from above, and when dicing, a blade 10 for dicing is applied from below the multi-piece substrate 7. Dicing is performed by entering.

  According to the modification shown in FIG. 44, the cutting powder 40 at the time of dicing falls and scatters directly downward, so that it is possible to reduce the cutting powder 40 (contamination) from adhering to the assembly 2 as much as possible.

  Next, the modification shown in FIG. 45 is a case where the wiring board is the tape substrate 41, and the assembly 43 having the tape substrate 41 is attached to the metal frame member 42 as shown in FIGS. In this state, dicing (dividing into pieces) is performed.

  That is, the tape substrate 41 has a thickness of, for example, 100 μm or less and is very thin, and thus has a low rigidity. Therefore, dicing is performed by increasing the rigidity of the tape substrate 41 at the time of dicing. The collective sealing portion 8 formed on the tape substrate 41 and the frame member 42 are connected to the weak adhesive sheet 38 and the porous jig 36. Dicing (dividing into pieces) is performed by suction and holding.

  In this case, the process of peeling the tape substrate 41 from the frame member 42 becomes unnecessary, and the number of assembly processes can be reduced.

  48 to 57 show various shapes of the frame member 42 and the fixing method of the tape substrate 41.

  48 to 51 has a large opening window 42a corresponding to the collective sealing portion 8 of the tape substrate 41, and the collective sealing portion 8 is disposed in the open window 42a. Further, the tape substrate 41 and the frame member 42 are fixed by holding the tape substrate 41 by applying tension by fixing pins 42b provided at the four corners. Further, a plurality of slits 42c for running away from the blade 10 during dicing are formed around the outside of the opening window 42a.

  The frame member 42 shown in FIGS. 52 to 54 is for fixing the tape substrate 41 by sandwiching it with the frame member 42 from both front and back sides, and the fixing method is, for example, a magnet fixing method or a pin fixing method. .

  The frame member 42 shown in FIGS. 55 to 57 has a bar 42d that supports the surface 8a of the collective sealing portion 8, and the bar 42d has a lattice shape corresponding to the dicing line 7b (see FIG. 5). Each of the bars 42d is provided with a recess 42e that is a relief of the blade 10.

  In the frame member 42 shown in FIGS. 55 to 57, the tape substrate 41 is held by applying tension by the fixing pins 42b provided at the four corners.

  Next, a method for manufacturing a semiconductor device according to a modification of the second embodiment will be described.

  FIG. 58 shows a case where the porous jig 36 and the support block 37 according to the second embodiment are used when the semiconductor wafer 44 is diced instead of the assembly 43.

  In the wafer dicing shown in FIG. 58, the weak adhesive sheet 38 as shown in FIG. 42 is not used, and instead, wafer dicing is performed by using the protective sheet 45 previously attached to the back surface 44a of the semiconductor wafer 44. Do.

  That is, the semiconductor wafer 44 is disposed on the porous jig 36 with the protective sheet 45 interposed, and is sucked and held through the porous jig 36 from the back surface 44 a side of the semiconductor wafer 44 and half-cut by the blade 10.

  In this case, since it is not necessary to use the weak adhesive sheet 38, the cost of wafer dicing can be reduced.

  If the support block 37 in which the porous jig 36 of the second embodiment is incorporated in this way is used, not only dicing after batch sealing but also wafer dicing, the dicing and contamination removal of the second embodiment. An apparatus can be used.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments of the invention. However, the present invention is not limited to the embodiments of the invention, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

  In the first and second embodiments, the case where the semiconductor device is the BGA 9 has been described. However, the semiconductor device is formed by forming the collective sealing portion 8 on the wiring substrate and dicing the collective sealing portion 8. If so, other semiconductor devices such as LGA (Land Grid Array) and QFN (Quad Flat Non-leaded Package) may be used.

  Further, the dicing / contamination removing apparatus can be used in wafer dicing as described in the modification of the second embodiment.

  The present invention is suitable for an individualization technique by dicing.

DESCRIPTION OF SYMBOLS 1 Semiconductor chip 1a Pad 1b Main surface 1c Back surface 2 Assembly 3 Piece board (wiring board)
3a Main surface 3b Back surface 3c Connection terminal 3d Bump land 3e Insulating film 3f Internal wiring 4 Wire 5 Die bond material 6 Sealing part 7 Multi-cavity substrate (wiring substrate)
7a Device area 7b Dicing line 7c Substrate surface (back surface)
8 Collective sealing part 8a Surface 9 BGA (semiconductor device)
10 Blade 11 Ball electrode 12 Substrate holding jig (plate jig)
12a Jig body 12b Product support part 12c Suction hole (through hole)
12d Groove 12e Positioning hole 12f Guide pin 12g Projection member 13 Molding die 13a Upper die 13b Lower die 13c Cavity 14 Jig transfer hand 14a Hand body 14b Sponge 14c Adsorption pad 14d Optical sensor 14e Pin member 15 Dicer cut stage 15a Product suction hole 15b Jig suction hole 16 Spin stage 16a Jig / product suction hole 16b Washing water 16c Air 17 Reversing hand 17a Hand body 17b Opening hole 17c Motor 18 Draining hand 18a Hand body 18b Opening hole 18c Sponge 18d Through hole 19 Ball Tape loader with goods 20 Board loader with balls 21 Board loader without balls 22 Tape peeling mold 23 Water absorption stage 23a Water absorption sponge 23b Water absorption hole 24 Jig cleaning stage 24a Air blow 24b Dust collection hole 25 Contamination removal staggered stage (staggered stage)
25a Sponge 25b Opening hole 25c Through hole 26 Brush 27 Staggered collective suction hand 28 Staggered pocket tray (tray)
28a Staggered pocket 29 Single piece suction hand 29a First piece suction hand 29b Second piece suction hand 29c Third piece suction hand 29d Fourth piece suction hand 30 Positioning pocket 31 Testing socket 32 Appearance inspection camera 33 Non-defective product storage tray 34 Test failure storage tray 35 Appearance failure storage tray 36 Porous jig 36a Hole 37 Support block 37a Suction hole 38 Weak adhesive sheet 39 Soft resin sheet 40 Cutting powder 41 Tape substrate (wiring substrate)
42 Frame member 42a Open window 42b Fixing pin 42c Slit 42d Bar 42e Recess 43 Assembly 44 Semiconductor wafer 44a Back surface 45 Protective sheet

Claims (5)

A method for manufacturing a semiconductor device comprising the following steps:
(A) preparing a multi-chip substrate having a main surface on which a plurality of device regions are formed, a back surface opposite to the main surface, and a dicing region located between the plurality of device regions;
(B) After the step (a), a step of fixing a plurality of semiconductor chips to the plurality of device regions of the multi-piece substrate, respectively.
(C) After the step (b), a step of forming a collective sealing portion that collectively covers the plurality of semiconductor chips on the main surface of the multi-cavity substrate;
(D) After the step (c), attaching a plurality of external terminals to the back surface of the multi-chip substrate so as to correspond to each of the plurality of device regions;
(E) After the step (d), by dividing the batch sealing portion and the multi-piece substrate along the dicing region, a single-piece substrate that is a part of the multi-piece substrate; Obtaining a plurality of assemblies each having a sealing portion that is formed on the individual substrate and is a part of the batch sealing portion;
(F) After the step (e), washing the plurality of assemblies;
(G) After the step (f), a step of adsorbing the surfaces of the sealing portions of the plurality of assemblies with a first hand;
here,
The first hand is provided with a plurality of different vacuum exhaust paths,
The plurality of assemblies are respectively adsorbed via the plurality of vacuum exhaust paths,
(H) After the step (g), the first hand adsorbing the plurality of assemblies is moved above the first stage, and the individual substrates of the plurality of assemblies are Delivering the plurality of assemblies to the first stage so as to face the first stage;
here,
In the step (h), by selectively stopping the plurality of evacuation paths of the first hand, the plurality of assemblies are arranged on the first stage in a staggered manner in a plan view,
(I) A step of rubbing each of the sealing portions of the plurality of assemblies with a brush after the step (h).   2. The device according to claim 1, wherein after the step (b) and before the step (c), the plurality of semiconductor chips and the plurality of device regions are electrically connected through a plurality of wires, respectively. A method for manufacturing a semiconductor device.   The method of manufacturing a semiconductor device according to claim 1, wherein each of the plurality of external terminals attached in the step (d) is a ball electrode.   In the step (c), a molding die having an upper die having a cavity and a lower die facing the upper die is prepared, and all of the plurality of semiconductor chips are located in the cavity. The multi-cavity substrate is disposed on the lower die, the upper die and the lower die are clamped, and a sealing resin is injected into the cavity to The method for manufacturing a semiconductor device according to claim 1, wherein the batch sealing portion that covers the plurality of semiconductor chips at once is formed on the main surface. The method for manufacturing a semiconductor device according to claim 1, wherein the step (f) includes the following steps (f1) to (f4):
(F1) Disposing each of the plurality of assemblies on a spin stage via a substrate holding jig and injecting cleaning water toward the plurality of assemblies while rotating the spin stage;
(F2) A step of injecting air toward the plurality of assemblies while rotating the spin stage after the step (f1);
(F3) After the step (f2), each of the plurality of assemblies is set on the draining hand such that the surface of the sealing portion of each of the plurality of assemblies contacts the water absorbing sponge of the draining hand. And adsorbing the surface of each sealing portion of the plurality of assemblies through a plurality of through holes provided in the water-absorbing sponge of the draining hand;
(F4) After the step (f3), a step of pressing the surface of the sealing portion of each of the plurality of assemblies against the water-absorbing sponge of the draining hand.

Images