CN215527679U

CN215527679U - Wafer dotting equipment

Info

Publication number: CN215527679U
Application number: CN202121736482.9U
Authority: CN
Inventors: 唐先冲; 刘伟; 刘乐; 魏寅; 曾岩; 梁天丰; 陈乃盛; 李安平
Original assignee: 深圳米飞泰克科技有限公司
Current assignee: Shenzhen Mifitech Technology Co ltd
Priority date: 2021-07-28
Filing date: 2021-07-28
Publication date: 2022-01-14
Anticipated expiration: 2031-07-28

Abstract

The utility model is suitable for the technical field of wafer test equipment, and provides wafer dotting equipment, which comprises a machine table main body with an inner cavity, a dotting device arranged in the inner cavity, and an upper cover arranged at the top of the machine table main body; the upper cover is provided with a probe card supporting table, and the middle part of the probe card supporting table is provided with an operation port communicated with the inner cavity; the wafer dotting equipment also comprises a dustproof cover, wherein the dustproof cover is used for covering the operation opening or allowing the operation opening to be exposed; the dustproof cover comprises a cover plate main body and a handle arranged on the cover plate main body, and a holding part of the handle protrudes out of the upper surface of the cover plate main body. According to the wafer dotting equipment provided by the utility model, the cover of the operation opening can be realized, floating dust in air is prevented from entering the machine table main body through the operation opening, and further, the wafer in the machine table main body is prevented from being polluted.

Description

Wafer dotting equipment

Technical Field

The utility model belongs to the technical field of wafer test equipment, and particularly relates to wafer dotting equipment.

Background

Wafer testing (CP) is a first station for testing the subsequent packaging of semiconductor devices, and is between wafer fabrication and packaging in the whole chip fabrication process. After the wafer is manufactured, thousands of unpackaged chips are regularly distributed on the whole wafer, and the chips are in contact with the probes to realize the electric connection with the test machine for realizing the electric test during the test so as to pick out the bad chips. The unqualified chips need to be marked by dotting to ensure that the chips packaged subsequently are all qualified products, so that the finished product test yield is improved, the packaging cost is reduced, and the control of a production process in a factory is facilitated. Therefore, wafer testing is one of the key steps to improve the yield of semiconductor devices.

In the wafer testing process, the wafer testing needs to be carried out in a dust-free special environment, and bad chips need to be marked by dotting after part of product testing is finished so as to facilitate normal operation of subsequent processes. The dotting machine is usually formed by reforming a probe station for wafer testing, and floating dust in the air is prone to falling into the machine main body, even falling onto the front surface of a wafer in the machine main body, and causing pollution to the wafer.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wafer dotting device, and aims to solve the technical problem that in the prior art, a wafer is easily polluted during dotting.

The utility model is realized in such a way that a wafer dotting device comprises a machine table main body with an inner cavity, a dotting device arranged in the inner cavity and an upper cover arranged at the top of the machine table main body; a probe card supporting table is arranged on the upper cover, and an operation port communicated with the inner cavity is formed in the middle of the probe card supporting table; the wafer dotting equipment also comprises a dustproof cover, wherein the dustproof cover is used for covering the operation opening or allowing the operation opening to be exposed; the dustproof cover comprises a cover plate main body and a handle arranged on the cover plate main body, wherein part or all of the handle protrudes out of the upper surface of the cover plate main body to form a holding part.

In an optional embodiment, the wafer dotting equipment further comprises a limiting structure, and the limiting structure is used for limiting the relative position of the dust cover and the machine table main body when the dust cover covers the operation opening.

In an optional embodiment, the limiting structure comprises a protruding part protruding from the lower surface of the cover plate main body, and the outer diameter of the protruding part is matched with the caliber of the operation opening.

In an alternative embodiment, the cover plate main body and the boss are both disc-shaped structures, and are integrally formed.

In an alternative embodiment, the handle is a U-shaped structure enclosing a closed cavity with the upper surface of the cover plate main body.

In an alternative embodiment, the handle is located in the middle of the cover body.

In an optional embodiment, the outer diameter of the cover plate main body is 270-310mm, the outer diameter of the protruding portion is 230-250mm, and the thickness of the protruding portion is 4-7 mm.

In an alternative embodiment, the width of the handle is 50-70 mm.

In an alternative embodiment, the cover body is an acrylic cover.

In an optional embodiment, a cleaning bin for placing the dust cover is further disposed on the upper cover or the side wall of the machine table main body.

Compared with the prior art, the utility model has the technical effects that: according to the wafer dotting equipment provided by the embodiment of the utility model, the dustproof cover is arranged, so that an operator can seal the operation opening when the operation opening is not used, floating dust in air is prevented from entering the machine table main body through the operation opening, and the wafer in the machine table main body is prevented from being polluted. Wherein, the shield includes apron main part and installs the handle in the apron main part, and the portion of gripping protrusion in the upper surface of apron main part of handle to make operating personnel touch the lower surface of apron main part when moving aside the shield by the operation mouth as required, and then can not lead to the fact the pollution to the lower surface of apron main part, thereby when having avoided the apron main part to cover the operation mouth, the lower surface of apron main part does not have adnexed dust superficial and falls to the board main part in through the operation mouth.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention or in the description of the prior art will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic cross-sectional structural diagram of a wafer dotting apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of a wafer dotting apparatus according to another embodiment of the present invention;

FIG. 3 is a schematic view of the dust cap of FIG. 2;

FIG. 4 is a schematic top view of a wafer dotting apparatus according to another embodiment of the present invention;

fig. 5 is a schematic top view of a wafer dotting apparatus according to another embodiment of the present invention.

Description of reference numerals:

100. a machine table main body; 200. a dotting device; 300. an upper cover; 400. a probe card supporting table; 500. an operation port; 600. a dust cover; 610. a cover plate main body; 620. a handle; 700. a boss portion; 800. and (5) cleaning the bin.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.

Referring to fig. 1 and 2, in an embodiment of the utility model, a wafer dotting apparatus is provided, which includes a machine main body 100 having an inner cavity, a dotting device 200 disposed in the inner cavity, and an upper cover 300 disposed on a top of the machine main body 100. The upper cover 300 is provided with a probe card supporting table 400, and the middle of the probe card supporting table 400 is provided with an operation port 500 communicated with the inner cavity.

Specifically, since the wafer dotting apparatus is generally formed by modifying a wafer probe station, the wafer probe station generally includes a main body portion for placing the wafer and a probe device movably disposed above the main body portion, wherein the main body portion has a wafer carrying platform for placing the wafer therein, and the operation port 500 is used for the probe device to extend into the main body portion for detecting the wafer. The tool body 100 may include only a body portion of a wafer probe station, or may include both a body portion of a wafer probe station and a probe device, and is not limited thereto. The dotting device 200 includes an image acquisition assembly for viewing the wafer surface and a dotting assembly for inking defective chips. More specifically, the dotting device 200 may be movably mounted at the bottom of the upper cover 300, or may be movably mounted on a sidewall or a bottom plate of the machine main body 100 by other auxiliary devices, which is not limited herein.

In addition, the wafer dotting apparatus further includes a dust cover 600, and the dust cover 600 is used for covering the operation opening 500 or allowing the operation opening 500 to be exposed. The dust cap 600 includes a cap body 610 and a handle 620 mounted on the cap body 610, and a grip portion is formed by protruding a part or all of the handle 620 from the upper surface of the cap body 610. Specifically, the cover plate body 610 may be a plate body, a cover body with an upward convex middle portion, and the like. The upper surface of the cover plate body 610 is the surface above the cover plate when covering the operation opening 500, and the lower surface is the surface below the cover plate when covering the operation opening 500, and is the surface close to the wafer in the machine main body 100.

When the machine body 100 includes the probe device, if the wafer test is not performed, that is, the probe device is far away from the probe card supporting platform 400, the operation port 500 is exposed, and at this time, the floating dust in the air is liable to fall into the machine body 100 through the operation port 500. To avoid this problem, the dust cap 600 may be placed on the operation opening 500 to cover it. When a wafer test is required, the dust cap 600 is removed to expose the operation opening 500.

When the main body 100 includes only a main body portion for placing a wafer in the wafer probe station, the dust cap 600 can be placed on the operation opening 500 at all times to cover the main body portion, and the dust cap 600 can be removed only when an operation through the operation opening 500 is required.

The wafer dotting equipment provided by the embodiment of the utility model is provided with the dustproof cover 600, so that when the operation opening 500 is not used, an operator can seal the operation opening through the dustproof cover 600, thereby preventing floating dust in air from entering the machine table main body 100 through the operation opening 500, and further preventing a wafer in the machine table main body 100 from being polluted. Wherein, the dust cover 600 includes the apron main part 610 and installs the handle 620 on the apron main part 610, and the portion of gripping protrusion in the upper surface of apron main part 610 of handle 620 to make operating personnel touch the lower surface of apron main part 610 when moving away dust cover 600 by operation mouth 500 as required, and then can not cause the pollution to the lower surface of apron main part 610, thereby when having avoided apron main part 610 to cover operation mouth 500, the lower surface of apron main part 610 can not have adnexed floating dust to fall to in the board main part 100 through operation mouth 500.

Because the dust cover 600 has a simple structure, when the dust cover 600 covers the operation opening 500, the position of the dust cover is easy to move by external force, so that the operation opening 500 is completely or partially exposed, and the dust-proof effect is affected. To avoid this, in one embodiment, the wafer dotting apparatus further includes a limiting structure for limiting the relative position of the dust cover 600 and the machine main body 100 when the dust cover 600 covers the operation opening 500.

Specifically, limit structure can be for magnetism inhale structure, grafting structure, bolted connection structure etc. this can realize above-mentioned function. For example, the position-limiting structure may include a magnetic member mounted on the dust cover 600 and magnetically attracted to the probe card supporting platform 400, or a groove formed on the outer peripheral wall of the dust cover 600, and a protrusion connected to the side wall of the probe card supporting platform 400 or the operation opening 500, the protrusion being adapted to engage with the groove. Of course, in other embodiments, the limiting structure may also adopt other implementation manners, which are not limited herein.

Referring to fig. 1 to 3, in an embodiment, the limiting structure includes a protrusion 700 protruding from a lower surface of the cover plate body 610 and having an outer diameter matched with an aperture of the operation opening 500. Specifically, the limiting structure may be an annular structure, a cylindrical structure, or the like for being inserted into and matched with the operation opening 500, and is not limited herein. And the limit structure can be integrally formed on the cover plate main body 610, and can also be fixedly connected to the cover plate main body 610 through bolt connection, glue bonding and other manners. When the operation opening 500 needs to be covered, the dust cap 600 is placed above the operation opening 500, so that the protrusion 700 is embedded in the operation opening 500 or extends into the machine body 100 through the operation opening 500, and the outer edge of the cover plate body 610 is placed on the probe card supporting table 400. With this structure, the dust cap 600 can be easily placed and processed.

In a specific embodiment, the cap body 610 and the boss 700 are each a disk-shaped structure, and are integrally formed. Specifically, the combination of the cover plate body 610 and the protrusion 700 may be manufactured by injection molding, cutting, and the like. By adopting the structure, the connection relationship between the two is stable and the processing is convenient.

Referring to fig. 2 and 3, in one embodiment, the handle 620 is a U-shaped structure enclosing a closed cavity with the upper surface of the cover plate body 610 for easy holding. By adopting the structure, the handle 620 not only ensures the stable connection with the cover plate main body 610, but also does not pollute the part (such as the lower surface of the dust cover 600) of the dust cover 600 which is possibly contacted with the inner cavity of the machine main body 100 when the dust cover 600 is moved, further does not pollute the wafer, and meets the use requirement.

Specifically, the two ends of the handle 620 may extend through the cover main body 610, or may be fixedly connected to the upper surface of the cover main body 610 by an adhesive structure, which is not limited herein. When both ends of the handle 620 penetrate the cover main body 610, the connection relationship with the cover main body 610 is stable.

More specifically, the handle 620 is located in the middle of the cover plate main body 610, so that when the dust cap 600 is moved, the two sides of the dust cap 600 are stressed in a balanced manner, and the hard collision between the protrusion 700 and the sidewall of the operation opening 500 is avoided.

In a specific embodiment, the outer diameter of the cover plate body 610 is 270-310mm, the outer diameter of the protrusion 700 is 230-250mm, and the thickness of the protrusion 700 is 4-7 mm. Thus, the outer diameter of the cover plate main body 610 is larger than the operation opening 500 within a certain range, the protrusion 700 is slightly smaller than the diameter of the operation opening 500, and the thickness of the protrusion 700 is larger than the depth (also the thickness of the top plate) of the operation opening 500, so that when the dust cover 600 covers the operation opening 500, the dust cover 600 can be stably placed on the operation opening 500, and cannot be lifted or separated from the operation opening 500 due to non-vertical upward force, and the stability of the use performance of the dust cover 600 is further ensured.

In a specific embodiment, the width of the handle 620 is 50-70mm, that is, the length of the transverse portion of the U-shaped handle 620 is 50-70mm, which is about 1/5 of the outer diameter of the cover plate main body 610, and the width is such that the enclosed space between the handle 620 and the upper surface of the cover plate main body 610 is enough for four fingers to pass through to achieve stable holding of the handle 620, and at the same time, waste of material due to the handle 620 being too large is avoided.

In one embodiment, the cover body 610 is an acrylic cover, which has good transparency, chemical stability and weather resistance, and is easy to dye and process. The cover plate main body 610 adopts the structure, so that the dust cover 600 is simple in integral structure, attractive in appearance and convenient to use.

In order to further prevent the floating dust in the air from falling into the inner cavity of the machine main body 100 through the dust cover 600, referring to fig. 4 and 5, in an embodiment, a cleaning bin 800 for placing the dust cover 600 is further disposed on the side wall of the machine main body 100 or the upper cover 300. Specifically, the cleaning bin 800 may be an independent structure, detachably mounted on the side wall of the upper cover 300 or the machine main body 100, or may be a semi-closed structure, and forms a bin for placing the dust cover 600 with the side wall of the upper cover 300 or the machine main body 100. A sterilizing lamp, a dust removing device, etc. may be installed in the cleaning chamber 800, or a vacuum chamber may be formed so that the dust cap 600 is not contaminated after being placed therein. Thus, when the operation opening 500 is used, an operator can place the dust cap 600 into the cleaning bin 800 to prevent the dust cap 600 from being contaminated.

More specifically, the cleaning chamber 800 has a supporting frame or a hanger for supporting or suspending the dust cap 600 so as to be placed in the cleaning chamber 800 in a posture perpendicular to the upper cover 300, which can prevent the dust cap 600 from rubbing against the inner wall of the cleaning chamber 800, and can make the floor area of the cleaning chamber 800 smaller.

The foregoing is considered as illustrative only of the preferred embodiments of the utility model, and is presented merely for purposes of illustration and description of the principles of the utility model and is not intended to limit the scope of the utility model in any way. Any modifications, equivalents and improvements made within the spirit and principles of the utility model and other embodiments of the utility model without the creative effort of those skilled in the art are included in the protection scope of the utility model based on the explanation here.

Claims

1. A wafer dotting device comprises a machine table main body with an inner cavity, a dotting device arranged in the inner cavity, and an upper cover arranged at the top of the machine table main body; a probe card supporting table is arranged on the upper cover, and an operation port communicated with the inner cavity is formed in the middle of the probe card supporting table; the wafer dotting equipment is characterized by further comprising a dustproof cover, wherein the dustproof cover is used for covering the operation opening or allowing the operation opening to be exposed; the dustproof cover comprises a cover plate main body and a handle arranged on the cover plate main body, wherein part or all of the handle protrudes out of the upper surface of the cover plate main body to form a holding part.

2. The wafer dotting device according to claim 1, further comprising a limiting structure for limiting the relative position of the dust cover and the machine table main body when the dust cover covers the operation opening.

3. The wafer dotting apparatus according to claim 2, wherein the limiting structure comprises a protrusion portion protruding from the lower surface of the cover plate main body and having an outer diameter matched with the aperture of the operation opening.

4. The wafer dotting apparatus according to claim 3, wherein the cover plate main body and the protrusion are each of a disk-shaped configuration, and are integrally formed.

5. The wafer dotting apparatus according to claim 4, wherein the handle is a U-shaped structure enclosing an enclosed cavity with the upper surface of the cover plate body.

6. The wafer dotting apparatus of claim 5, wherein the handle is located at a central portion of the cover plate body.

7. The wafer dotting apparatus as claimed in claim 6, wherein the outer diameter of the cover plate main body is 270-310mm, the outer diameter of the protrusion portion is 230-250mm, and the thickness of the protrusion portion is 4-7 mm.

8. The wafer dotting apparatus of claim 7, wherein the handle has a width of 50-70 mm.

9. The wafer dotting apparatus according to any one of claims 1 to 8, wherein the cover plate body is an acrylic cover plate.

10. The wafer dotting apparatus according to any one of claims 1 to 8, wherein a cleaning bin for placing the dust cover is further provided on the upper cover or the side wall of the machine table main body.