TWI699245B - Cleaning method of ultrapure water production system - Google Patents
Cleaning method of ultrapure water production system Download PDFInfo
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- TWI699245B TWI699245B TW105129662A TW105129662A TWI699245B TW I699245 B TWI699245 B TW I699245B TW 105129662 A TW105129662 A TW 105129662A TW 105129662 A TW105129662 A TW 105129662A TW I699245 B TWI699245 B TW I699245B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
- B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
- C02F1/444—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis by ultrafiltration or microfiltration
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/02—Non-contaminated water, e.g. for industrial water supply
- C02F2103/04—Non-contaminated water, e.g. for industrial water supply for obtaining ultra-pure water
Abstract
本發明提供一種超純水製造系統的洗淨方法,其能夠有效率地去除超純水製造系統內所混入或產生的有機物、微粒子、離子性物質等雜質。藉由對具備超純水製造裝置、使用點以及將超純水製造裝置與使用點連接的配管的超純水製造系統的至少一部分,以高壓供給超純水,而使附著於超純水製造系統內、特別是配管的內壁等上的微粒子或有機物揚塵,從而物理性地洗淨去除。The present invention provides a cleaning method for an ultrapure water production system, which can efficiently remove impurities such as organic matter, fine particles, ionic substances, etc., mixed or generated in the ultrapure water production system. By supplying ultrapure water at high pressure to at least a part of an ultrapure water production system equipped with an ultrapure water production device, a point of use, and a piping connecting the ultrapure water production device and the point of use, it is attached to the ultrapure water production The fine particles or organic matter in the system, especially on the inner wall of the piping, etc., will be physically cleaned and removed.
Description
本發明是有關於一種超純水製造系統的洗淨方法,特別是有關於新啟動超純水製造系統的情況或停止運轉一定期間後再啟動的情況下的超純水製造系統的配管的洗淨方法。 The present invention relates to a cleaning method of an ultrapure water production system, and particularly relates to the cleaning of the piping of an ultrapure water production system when the ultrapure water production system is newly started or restarted after stopping for a certain period of time. Net method.
先前,於半導體或液晶面板等電子設備製造的領域中,為了洗淨系統,而使用有機物、微粒子、離子性物質等雜質的含量極小的超純水。其中,於半導體的製造步驟中,隨著半導體的微細化‧大容量化,對於所使用的超純水要求非常高的純度。例如,最新的對於半導體製造中使用的超純水的要求水質為電阻率:18.2MΩ‧cm以上、微粒子:1個/mL以下、活菌:1個/L以下、TOC(Total Organic Carbon:總有機碳):1ppb以下、二氧化矽:1ppb以下、金屬類:1ppt以下、離子類:10ppt以下。 Previously, in the field of electronic equipment manufacturing such as semiconductors and liquid crystal panels, ultrapure water with extremely small contents of impurities such as organic matter, fine particles, and ionic substances was used to clean the system. Among them, in the semiconductor manufacturing process, with the miniaturization and larger capacity of semiconductors, very high purity is required for the ultrapure water used. For example, the latest water quality requirements for ultrapure water used in semiconductor manufacturing are electrical resistivity: 18.2MΩ‧cm or more, particles: 1/mL or less, viable bacteria: 1/L or less, TOC (Total Organic Carbon: total Organic carbon): 1ppb or less, silicon dioxide: 1ppb or less, metals: 1ppt or less, ions: 10ppt or less.
如上所述的半導體的製造步驟中使用的超純水是於主要具備預處理系統、一次純水系統、二次純水系統(子系統)的超純水製造裝置中製造,且被供給至使用點。預處理系統是用以使用藉由凝聚過濾、微過濾膜(Micro-Filtration Membrane,MF膜)、超濾膜(Ultrafiltration Membrane,UF膜)等的淨化處理裝置或利用活性碳等的脫氯處理裝置來淨化原水者。一次純水系統是用以利用逆滲透膜(Reverse Osmosis Membrane,RO膜)裝置、 除氣膜裝置、離子交換塔等,將預處理水中所含的離子成分或TOC成分等雜質去除者。子系統主要包括:暫時儲留一次純水的子儲槽、熱交換器、紫外線氧化裝置(紫外線(ultraviolet,UV)裝置)、觸媒式氧化性物質分解裝置、除氣裝置、混合床式離子交換裝置、超濾膜裝置(UF裝置),用以去除一次純水中的極微量的微粒子或微量離子、特別是低分子的微量有機物之類的雜質,以製造純度更高的超純水。具備此種超純水製造裝置的超純水製造系統包括:送水配管,將超純水自子系統向使用點流通;以及返送配管,用以將使用點所未使用的超純水向子系統的子儲槽中循環。 The ultrapure water used in the semiconductor manufacturing process as described above is manufactured in an ultrapure water manufacturing device mainly equipped with a pretreatment system, a primary pure water system, and a secondary pure water system (subsystem), and is supplied to use point. The pretreatment system is used to use purification treatment equipment such as coagulation filtration, micro-filtration membrane (Micro-Filtration Membrane, MF membrane), ultrafiltration membrane (Ultrafiltration Membrane, UF membrane), or dechlorination treatment equipment using activated carbon, etc. Those who come to purify raw water. The primary pure water system is used to use reverse osmosis membrane (Reverse Osmosis Membrane, RO membrane) device, Degassing membrane devices, ion exchange towers, etc., which remove impurities such as ion components or TOC components contained in pretreated water. The subsystems mainly include: a sub-tank for temporarily storing pure water, a heat exchanger, an ultraviolet oxidation device (ultraviolet (UV) device), a catalytic oxidizing substance decomposition device, a degassing device, and a mixed bed ion Exchange devices and ultrafiltration membrane devices (UF devices) are used to remove very small particles or trace ions, especially low-molecular trace organic matter and other impurities in the primary pure water to produce ultrapure water with higher purity. An ultrapure water production system equipped with such an ultrapure water production device includes: water delivery piping to circulate ultrapure water from the subsystem to the point of use; and return piping to deliver the ultrapure water not used at the point of use to the subsystem Circulate in the sub-tank.
通常,於新啟動如上所述的超純水製造系統的情況或停止運轉一定期間後再啟動的情況下,由於系統內混入或產生有機物、微粒子、離子性物質等雜質,故而去除該些雜質,進行系統的洗淨至使用點的超純水滿足要求水質為止。其中,隨著工廠的新建,於新啟動超純水製造系統的情況下,由於施行時在配管的內壁等上附著微粒子或有機物,故而系統的洗淨需要大量的時間,工業的運轉效率下降。 Normally, when the ultrapure water production system as described above is newly started or restarted after stopping operation for a certain period of time, impurities such as organic matter, fine particles, and ionic substances are mixed or generated in the system, so these impurities are removed. The system is cleaned until the ultrapure water at the point of use meets the required water quality. Among them, with the new construction of the factory, when the ultrapure water production system is newly launched, since particles or organic matter adhere to the inner wall of the piping during the implementation, the cleaning of the system takes a lot of time, and the operating efficiency of the industry decreases. .
作為如上所述的系統內所混入或產生的雜質的洗淨方法,例如於專利文獻1中提出了藉由交替提供壓縮氣體及超純水而洗淨配管的內壁的方法,來作為超純水製造裝置的啟動時的洗淨方法。
As a method for cleaning impurities mixed or generated in the system as described above, for example,
[專利文獻1]日本專利特開2004-050048號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2004-050048
已知,附著於超純水製造裝置的配管的內壁等上的微粒子會由於突發的壓力變動而自配管的內壁等上剝離,專利文獻1中,為了加速所述微粒子的剝離,將壓縮氣體與超純水併用來進行洗淨。然而,為了使配管所受到的壓力變動而使用氣體,故於配管內的死空間中殘留有溶存氣體,因此存在導致所製造的超純水的純度下降的可能性。因此,該溶存氣體的去除更需要時間,因此存在難以在短時間內進行超純水製造系統的洗淨的問題。
It is known that fine particles adhering to the inner wall of the pipe of an ultrapure water production device will peel off from the inner wall of the pipe due to sudden pressure fluctuations. In
本發明是基於如上所述的情況而形成,目的在於提供一種能夠將由超純水製造系統內所混入或者系統內所產生的雜質而引起的微粒子有效率地去除的超純水製造系統的洗淨方法。 The present invention is formed based on the above-mentioned situation, and its purpose is to provide a cleaning system for ultrapure water production system that can efficiently remove particles caused by impurities mixed in or generated in an ultrapure water production system. method.
為了解決所述課題,第一,本發明提供一種超純水製造系統的洗淨方法,其是對具備超純水製造裝置、使用點以及將所述超純水製造裝置與所述使用點連接的配管的超純水製造系統的至少一部分進行洗淨的方法,其包括藉由以高壓供給超純水來洗淨的高壓洗淨步驟(發明1)。 In order to solve the above-mentioned problems, firstly, the present invention provides a cleaning method of an ultrapure water production system, which is to provide an ultrapure water production device, a point of use, and connect the ultrapure water production device to the point of use The method of cleaning at least a part of the ultrapure water production system of the piping includes a high-pressure cleaning step of cleaning by supplying ultrapure water at high pressure (Invention 1).
依據所述發明(發明1),藉由高壓供給超純水,可將附著於超純水製造系統內、特別是配管的內壁等上的微粒子有效率地剝離、去除,因此能夠在短時間內進行洗淨作業。 According to the aforementioned invention (Invention 1), by supplying ultrapure water at high pressure, the particles adhering to the ultrapure water production system, especially the inner wall of the piping, etc., can be peeled and removed efficiently, so that it can be removed in a short time. Cleaning operations are carried out inside.
所述發明(發明1)中,較佳為以較所述使用點的施加壓力更高的壓力來連續或間歇地進行所述高壓洗淨步驟中的超純水的供給,或者逐漸上升至較所述使用點的施加壓力更高的壓力來進行所述高壓洗淨步驟中的超純水的供給(發明2)。 In the invention (Invention 1), it is preferable to continuously or intermittently perform the supply of ultrapure water in the high-pressure cleaning step at a pressure higher than the applied pressure at the point of use, or to gradually increase it to a higher pressure. The supply of ultrapure water in the high-pressure washing step is performed by applying a higher pressure at the point of use (Invention 2).
依據所述發明(發明2),藉由以較使用點的施加壓力更高的壓力來連續或間歇地供給超純水,或者藉由逐漸上升至較使用點的施加壓力更高的壓力來進行超純水的供給,可利用所產生的紊流等來有效地去除附著於超純水製造系統的配管的內壁等上的微粒子。此外,本發明的所謂「連續地」是指:以較使用點的施加壓力更高的壓力,且以流速0.5m/sec以上來洗淨0.5小時以上,而使綜合流量成為配管保有水量的10倍以上;所謂「間歇地」是指:以較使用點的施加壓力更高的壓力,且以流速0.5m/sec以上來間歇地綜合洗淨0.5小時以上,而使綜合流量成為配管保有水量的10倍以上;所謂「逐漸地」是指:以流速0.5m/sec以上進行洗淨,以最終成為較使用點的施加壓力更高的壓力的方式,以壓力上升速度0.5×△必要上升壓力/h、壓力上升率10%以上使壓力逐漸地上升。
According to the invention (Invention 2), it is performed by continuously or intermittently supplying ultrapure water at a pressure higher than the applied pressure at the point of use, or by gradually increasing to a pressure higher than the applied pressure at the point of use In the supply of ultrapure water, the generated turbulence can be used to effectively remove particles attached to the inner wall of the piping of the ultrapure water production system. In addition, the term "continuously" in the present invention refers to cleaning at a pressure higher than the applied pressure at the point of use and a flow rate of 0.5 m/sec or more for 0.5 hours or more, so that the total flow rate becomes 10% of the piping water volume. The so-called "intermittently" refers to the intermittent comprehensive cleaning for 0.5 hours or more at a higher pressure than the applied pressure at the point of use and a flow rate of 0.5m/sec or more, so that the overall flow rate becomes the amount of water retained in the
所述發明(發明1、發明2)中,較佳為所述配管的至少一部分包含聚偏二氟乙烯(polyvinylidene fluoride,PVDF)(發明3)。
In the aforementioned inventions (
作為超純水製造系統的配管材料,考慮到於超純水中的溶出物質或施工時的污垢帶入少,而使用聚氯乙烯(polyvinyl chloride,PVC)或聚偏二氟乙烯(PVDF)等。其中,PVDF由於其優異的耐蝕性或耐熱性而適合用作配管材料,但有時會產生加工過程中的熱皺褶或施工過程中的搬送皺褶等變形,此種皺褶中容易進入微粒子等雜質。依據所述發明(發明3),於超純水製造系統的洗淨時,能夠藉由高壓洗淨來伸展所述PVDF配管的皺褶,因此能夠有效地去除進入皺褶中的微粒子等。 As the piping material of the ultrapure water production system, polyvinyl chloride (polyvinyl chloride) is used in consideration of the eluted substances in the ultrapure water and less dirt during construction. chloride, PVC) or polyvinylidene fluoride (PVDF), etc. Among them, PVDF is suitable as a piping material due to its excellent corrosion resistance or heat resistance, but sometimes deformation such as heat wrinkles during processing or transportation wrinkles during construction may occur, and such wrinkles are easy to enter fine particles. And other impurities. According to the invention (Invention 3), when the ultrapure water production system is cleaned, the wrinkles of the PVDF piping can be stretched by high-pressure washing, so that the fine particles etc. entering the wrinkles can be effectively removed.
所述發明(發明1~3)中,較佳為在所述高壓洗淨步驟中的超純水中添加鹼、過氧化氫(H2O2)、臭氧或氣體,或者所述超純水為熱水(發明4)。
In the invention (
依據所述發明(發明4),除了所述高壓洗淨步驟的物理性洗淨效果,進而添加由鹼、過氧化氫(H2O2)或臭氧帶來的化學性洗淨效果、由氣體帶來的物理性洗淨效果、由熱水帶來的殺菌效果等,因此可使洗淨效果更優異。 According to the invention (Invention 4), in addition to the physical cleaning effect of the high-pressure cleaning step, a chemical cleaning effect brought by alkali, hydrogen peroxide (H 2 O 2 ) or ozone, and gas The physical cleaning effect, the sterilization effect brought by hot water, etc., can make the cleaning effect more excellent.
所述發明(發明1~4)中,較佳為包括將所述高壓洗淨步驟後滯留於系統內的超純水擠出至系統外的排出步驟(發明5)。
In the above inventions (
依據所述發明(發明5),由於所述高壓洗淨步驟後滯留於系統內的超純水擠出至系統外,故而能夠防止分散於高壓洗淨步驟後的超純水中的微粒子再附著於配管的內壁等上。 According to the invention (Invention 5), since the ultrapure water remaining in the system after the high-pressure washing step is squeezed out of the system, it is possible to prevent the particles dispersed in the ultrapure water after the high-pressure washing step from reattaching On the inner wall of the piping, etc.
所述發明(發明1~5)中,較佳為所述超純水製造裝置具備超濾膜裝置(UF裝置),且於所述超純水製造系統的洗淨時,代替所述超濾膜裝置(UF裝置)而設置虛設管或者不具有UF功能的虛設UF裝置來通水(發明6)。
In the above inventions (
依據所述發明(發明6),於超純水製造系統的洗淨時,藉由代替UF裝置而使用虛設管或者虛設UF裝置,能夠於洗淨階段防止UF裝置因自配管等上剝離的微粒子而堵塞,因此能夠削減UF裝置所花費的成本。 According to the invention (Invention 6), by replacing the UF device with a dummy tube or a dummy UF device during the cleaning of the ultrapure water production system, it is possible to prevent the UF device from peeling off particles from the piping during the cleaning stage. It is blocked, so the cost of the UF device can be reduced.
依據本發明的超純水製造系統的洗淨方法,能夠將附著於超純水製造系統內、特別是配管的內壁等上的微粒子有效率地剝離、去除,因此可在短時間內進行洗淨作業。 According to the cleaning method of the ultrapure water production system of the present invention, the fine particles adhering to the ultrapure water production system, especially the inner wall of the pipe, etc. can be peeled and removed efficiently, so that the cleaning can be performed in a short time. Net operation.
1:超純水製造系統 1: Ultrapure water manufacturing system
2:預處理系統 2: Pretreatment system
3:一次純水系統 3: Primary pure water system
4:二次純水系統(子系統) 4: Secondary pure water system (subsystem)
41:子儲槽 41: Sub-tank
42:熱交換器 42: heat exchanger
43:紫外線氧化裝置(UV裝置) 43: Ultraviolet oxidation device (UV device)
44:觸媒式氧化性物質分解裝置 44: Catalytic oxidizing substance decomposition device
45:除氣裝置 45: degassing device
46:混合床式離子交換裝置 46: Mixed bed ion exchange device
47:超濾膜裝置(UF裝置) 47: Ultrafiltration membrane device (UF device)
5:使用點 5: point of use
L1、L2、L31~L36、L4:送水配管 L1, L2, L31~L36, L4: water supply piping
R1、R2:返送配管 R1, R2: return piping
P:泵 P: Pump
W:原水 W: Raw water
圖1是表示本發明的一實施形態的超純水製造系統的洗淨方法中使用的超純水製造系統的方塊圖。 Fig. 1 is a block diagram showing an ultrapure water production system used in a cleaning method of an ultrapure water production system according to an embodiment of the present invention.
圖2是表示將實施例1的配管壓力由0.4MPa變更為0.7MPa的情況下的微粒子數與洗淨後經過時間的關係的圖。 2 is a graph showing the relationship between the number of fine particles and the elapsed time after washing when the piping pressure of Example 1 is changed from 0.4 MPa to 0.7 MPa.
圖3是表示實施例2的微粒子數與洗淨後經過時間的關係的圖。 3 is a graph showing the relationship between the number of fine particles in Example 2 and the elapsed time after washing.
圖4是表示比較例的微粒子數與洗淨後經過時間的關係的圖。 Fig. 4 is a graph showing the relationship between the number of fine particles and the elapsed time after washing in a comparative example.
以下,適當參照圖式,對本發明的超純水製造系統的洗淨方法的實施形態進行說明。以下所說明的實施形態是為了使本發明容易理解,對本發明並無任何限定。 Hereinafter, the embodiment of the cleaning method of the ultrapure water production system of the present invention will be described with reference to the drawings as appropriate. The embodiments described below are for making the present invention easy to understand and do not limit the present invention in any way.
[超純水製造系統] [Ultra pure water manufacturing system]
圖1是表示本發明的一實施形態的超純水製造系統的洗淨方法中使用的超純水製造系統的方塊圖。圖1所示的超純水製造系統1是由依次具備預處理系統2、一次純水系統3、二次純水系統(子系統)4的超純水製造裝置,向使用點5供給超純水。供給至預處理系統2中的原水W於利用凝聚過濾、MF膜(微過濾膜)、UF膜(超濾膜)等的淨化處理或利用活性碳等的脫氯處理之後,經過送水配管L1而向一次純水系統3供給。供給至一次純水系統3中的處理水利用RO膜(逆滲透膜)、除氣膜、離子交換塔等去除離子成分或TOC成分等雜質後,經過送水配管L2而向子系統4供給。子系統4中,將處理水中的極微量的微粒子或微量離子、特別是低分子的微量有機物之類的雜質去除,從而製造純度更高的超純水。子系統4中製造的超純水經過送水配管L4而向使用點5輸送。
Fig. 1 is a block diagram showing an ultrapure water production system used in a cleaning method of an ultrapure water production system according to an embodiment of the present invention. The ultrapure
子系統4依次具備:子儲槽41、熱交換器42、紫外線氧化裝置(UV裝置)43、觸媒式氧化性物質分解裝置44、除氣裝置45、混合床式離子交換裝置46、超濾膜裝置(UF裝置)47。子儲槽41用以暫時儲留由一次純水系統3供給的處理水。熱交換器42用以進行處理水的溫度調節。紫外線氧化裝置(UV裝置)43用以藉由利用紫外線照射的氧化處理,將水中的有機物(TOC成分)氧化分解。觸媒式氧化性物質分解裝置44用以利用金屬鈀、氧化鈀、氫氧化鈀等鈀(Pd)化合物或者鉑(Pt)等貴金屬觸媒,
將紫外線氧化裝置(UV裝置)43中產生的H2O2、其他的氧化性物質分解去除。除氣裝置45用以減少處理水中的溶存氧量。混合床式離子交換裝置46用以去除處理水中的陽離子及陰離子來提高處理水的純度。超濾膜裝置(UF裝置)47用以去除自混合床式離子交換裝置46中流出的離子交換樹脂的微粒子等。該些構成子系統4的裝置是由配管L31~L36來分別加以連接。
本實施形態中,於將子儲槽41與熱交換器42連接的送水配管L31中,設置有用以使所供給的超純水的壓力變更的泵P。泵P亦設置於將除氣裝置45與混合床式離子交換裝置46連接的送水配管L35中。
In the present embodiment, the water supply pipe L31 connecting the
本實施形態的超純水製造系統除了送水配管L1、L2、L31~L36、L4以外,還包括:返送配管R1,用以將使用點5所未使用的超純水向子系統4的子儲槽41中循環;以及返送配管R2,用以將洗淨時通過虛設管或者不具有UF功能的虛設UF裝置後的超純水自送水配管L4中直接向子儲槽41中循環。
The ultrapure water production system of this embodiment includes, in addition to the water delivery pipes L1, L2, L31~L36, and L4, the return pipe R1 is used to transfer the unused ultrapure water at the point of
對於自子系統4中向使用點5輸送的處理水的純度有所要求,因此將混合床式離子交換裝置46與超濾膜裝置(UF裝置)47連接的送水配管L36、將子系統4與使用點5連接的送水配管L4及返送配管R1的材料為聚偏二氟乙烯(PVDF)。PVDF由於對鹼等化學溶液的耐化學品性、對殺菌洗淨或利用紫外線的殺菌的耐蝕性、對利用熱水的殺菌洗淨的耐熱性等優異,故而具有抑制雜質於處理水中的溶出的效果。另一方面,於混合床式離子交換
裝置46的前段所要求的處理水的純度不那麼高,因此所述以外的配管的材料並非必須為PVDF。
There are requirements for the purity of the treated water sent from the
[超純水製造系統的洗淨方法] [How to clean the ultrapure water production system]
繼而,對使用如上所述的實施形態的超純水製造系統的洗淨方法進行說明。本實施形態的超純水製造系統的洗淨方法的對象為:子系統4的各裝置41~47、將子系統4的各裝置連接的送水配管L31~L36、將子系統4與使用點5連接的送水配管L4、返送配管R1及返送配管R2。本實施形態中,成為洗淨對象的微粒子的粒徑為10nm~200nm,所謂用於洗淨的超純水是指比電阻值為15MΩcm以上的純水。
Next, the cleaning method using the ultrapure water manufacturing system of the above-mentioned embodiment is demonstrated. The cleaning method of the ultrapure water production system of this embodiment is targeted for: the
<高壓洗淨步驟> <High-pressure cleaning step>
高壓洗淨步驟是利用以高壓供給的超純水,使附著於超純水製造系統內、特別是配管的內壁等上的微粒子或有機物揚塵,從而物理性地去除的步驟。所供給的超純水的壓力是藉由變更配置於子系統4內的泵P的反向器(inverter),或者藉由設置於子系統4內的配管中的閥(未圖示)的開閉來調節。
The high-pressure cleaning step is a step of physically removing fine particles or organic matter adhering to the ultrapure water production system, particularly on the inner wall of the pipe, etc., using ultrapure water supplied at a high pressure. The pressure of the supplied ultrapure water is changed by changing the inverter of the pump P arranged in the
所供給的超純水較佳為溫度為20℃~85℃、流速為0.5m/sec~4.0m/sec、流量為配管容積的10倍。藉由以所述條件來供給超純水,能夠有效率地去除微粒子等。此外,結束洗淨的時間點是藉由利用設置於返送配管R1中的線上微粒子監測器(未圖示)進行測量,根據處理水中所存在的20nm以上的微粒子數是否達到1個/mL以下(以下有稱為「恆定狀態」的情況)來判斷。 It is preferable that the supplied ultrapure water has a temperature of 20°C to 85°C, a flow rate of 0.5m/sec to 4.0m/sec, and a flow rate of 10 times the pipe volume. By supplying ultrapure water under these conditions, fine particles and the like can be efficiently removed. In addition, the time to end the cleaning is measured by an online particle monitor (not shown) installed in the return pipe R1, and it is determined whether the number of particles of 20nm or more in the treated water reaches 1/mL or less ( Hereinafter, there is a case called "constant state") to determine.
高壓洗淨步驟中的超純水的供給可以較使用點5的施加壓力更高的壓力來連續地進行。此處所謂的「連續地」是以較使用點5的施加壓力更高的壓力,以流速0.5m/sec以上洗淨0.5小時以上,而使綜合流量成為配管保有水量的10倍以上。該情況下,使用點5的施加壓力較佳為0.7MPa以下,所供給的超純水的壓力較佳為0.15MPa~0.8MPa的範圍。藉由以所述條件來供給超純水,對於通常的通水中所難以剝落的附著於超純水製造系統的配管的內壁等上的微粒子而言亦能夠容易地進行剝離、去除。
The supply of ultrapure water in the high-pressure washing step can be continuously performed at a higher pressure than the applied pressure at the point of
高壓洗淨步驟中的超純水的供給亦可以較使用點5的施加壓力更高的壓力來間歇地進行。此處所謂的「間歇地」是以較使用點5的施加壓力更高的壓力,以流速0.5m/sec以上間歇地綜合洗淨0.5小時以上,而使綜合流量成為配管保有水量的10倍以上。該情況下,使用點5的施加壓力較佳為0.7MPa以下,所供給的超純水的通常的壓力較佳為0.15MPa~0.8MPa的範圍。藉由以所述條件來供給超純水,可利用所產生的紊流等,有效地去除附著於超純水製造系統的配管的內壁等上的微粒子。
The supply of ultrapure water in the high-pressure washing step may also be performed intermittently at a higher pressure than the applied pressure at the point of
所述間歇的高壓洗淨較佳為於經過既定時間後、進行既定流量的通水後或者確認微粒子測量數成為恆定狀態後進行。藉由以所述方式進行間歇的高壓洗淨,子系統4的配管等容易受到突發的壓力變動,因此附著於配管等上的微粒子的去除效率提高。
The intermittent high-pressure cleaning is preferably performed after a predetermined time has elapsed, after a predetermined flow of water is passed, or after confirming that the measured number of fine particles becomes a constant state. By performing the intermittent high-pressure cleaning in this manner, the piping of the
高壓洗淨步驟中的超純水的供給可以逐漸地上升至較使用點5的施加壓力更高的壓力的方式而進行。此處所謂的「逐
漸地」是以流速0.5m/sec以上來洗淨0.5小時以上,而使綜合流量成為配管保有水量的10倍以上。該情況下,使用點5的施加壓力較佳為0.7MPa以下,所供給的超純水的通常的壓力較佳為0.15MPa~0.8MPa的範圍。藉由以所述條件來供給超純水,可利用所產生的紊流等,來有效地去除附著於超純水製造系統的配管的內壁等上的微粒子。
The supply of ultrapure water in the high-pressure washing step can be performed by gradually increasing the pressure to a pressure higher than the applied pressure at the point of
所述逐漸地進行的高壓洗淨較佳為連續或者階段性地使壓力上升而進行。於連續地使壓力上升的情況下,較佳為以既定的上升速度來進行,於階段性地使壓力上升的情況下,較佳為於經過既定時間後、進行既定流量的通水後或者確認微粒子測量數成為恆定狀態後進行。藉由如上所述般逐漸地進行高壓洗淨,則子系統4的配管等容易受到突發的壓力變動,因此附著於配管等上的微粒子的去除效率提高。
The high-pressure cleaning performed gradually is preferably performed by continuously or stepwise increasing the pressure. In the case of continuously increasing the pressure, it is preferably performed at a predetermined rate of increase, and in the case of increasing the pressure in stages, it is preferable to perform a predetermined flow of water after a predetermined period of time, or to confirm The number of fine particles is measured after it becomes a constant state. By gradually performing high-pressure cleaning as described above, the piping of the
本發明的超純水製造系統的洗淨方法並不限定於所述實施形態,所述高壓洗淨步驟中的超純水亦可添加鹼、過氧化氫(H2O2)、臭氧或氣體,或者所述超純水為熱水。藉由如上所述般將超純水與鹼等加以組合來進行洗淨,除了由超純水帶來的高壓洗淨步驟的物理性洗淨效果,還添加由鹼等帶來的化學性洗淨效果或由氣體帶來的物理性洗淨效果,因此可使本發明的超純水製造系統的洗淨方法所帶來的洗淨效果更優異。以下,對使用所述鹼等進行高壓洗淨步驟時的洗淨效果等進行說明。 The cleaning method of the ultrapure water production system of the present invention is not limited to the above-mentioned embodiment. The ultrapure water in the high-pressure cleaning step may be added with alkali, hydrogen peroxide (H 2 O 2 ), ozone or gas , Or the ultrapure water is hot water. By combining ultrapure water with alkalis, etc. to perform cleaning as described above, in addition to the physical cleaning effect of the high-pressure cleaning step brought by ultrapure water, chemical cleanings caused by alkalis are also added. The cleaning effect or the physical cleaning effect caused by the gas can make the cleaning effect of the cleaning method of the ultrapure water production system of the present invention more excellent. Hereinafter, the cleaning effect when the high-pressure cleaning step is performed using the alkali or the like will be described.
[鹼] [Alkali]
藉由使用鹼,能夠將附著於子系統4的配管等上的微粒子化學性地剝離、分散。添加有鹼的超純水較佳為氫氧化四甲基銨水溶液或者包含膽鹼、苛性鈉、氨的任一者的溶液,較佳為pH值為10以上。另外,利用添加有鹼的超純水的洗淨時間較佳為0.5小時~2小時的範圍。
By using an alkali, it is possible to chemically peel off and disperse the fine particles attached to the piping of the
[過氧化氫] [hydrogen peroxide]
藉由使用過氧化氫(H2O2),可利用過氧化氫(H2O2)的發泡力來化學性地去除附著於子系統4的配管等上的微生物。添加有過氧化氫(H2O2)的超純水的濃度較佳為0.1%以上。另外,利用添加有過氧化氫(H2O2)的超純水的洗淨時間較佳為0.5小時~2小時的範圍。 By using hydrogen peroxide (H 2 O 2), hydrogen peroxide can be used (H 2 O 2) foaming force chemically microorganisms on pipe and other subsystems attached to the 4 removed. The concentration of ultrapure water to which hydrogen peroxide (H 2 O 2 ) is added is preferably 0.1% or more. In addition, the washing time with ultrapure water added with hydrogen peroxide (H 2 O 2 ) is preferably in the range of 0.5 hour to 2 hours.
[臭氧] [ozone]
藉由使用臭氧,可利用臭氧的氧化分解力來化學性地去除附著於子系統4的配管等上的微粒子。添加有臭氧的超純水的濃度較佳為0.1mg/L以上。另外,利用添加有臭氧的超純水的洗淨時間較佳為0.5小時~2小時的範圍。
By using ozone, the oxidative decomposition power of ozone can be used to chemically remove particles attached to the piping of the
[氣體] [gas]
藉由將空氣或氮等氣體連續或者間歇地導入至超純水中,則利用空氣或氮等的氣泡來強烈地攪拌洗淨水,因此能夠將附著於子系統4的配管等上的微粒子物理性地剝離、分散。
By continuously or intermittently introducing gases such as air or nitrogen into ultrapure water, the bubbles of air or nitrogen are used to vigorously agitate the washing water. Therefore, the particles attached to the piping of
[熱水] [Hot water]
藉由高壓洗淨步驟中的超純水為熱水,可對子系統4的配管
等進行殺菌洗淨。熱水的溫度較佳為60℃以上。於利用熱水進行殺菌洗淨的情況下,子系統4的配管較佳為耐熱性優異的PVDF製。
By using the ultrapure water in the high-pressure cleaning step as hot water, the piping of
<排出步驟> <Discharge Step>
另外,本實施形態中,本發明的超純水製造系統的洗淨方法包括將所述高壓洗淨步驟後滯留於系統內的超純水擠出至系統外的排出步驟。排出步驟的通水時間較佳為0.5小時~24小時的範圍。 In addition, in the present embodiment, the cleaning method of the ultrapure water production system of the present invention includes a discharge step of extruding the ultrapure water remaining in the system after the high-pressure cleaning step to the outside of the system. The water passing time in the discharge step is preferably in the range of 0.5 hour to 24 hours.
本實施形態的超純水製造系統的洗淨方法中的所述高壓洗淨步驟、所述鹼等以及所述排出步驟的組合較佳為依次進行:利用添加有鹼的超純水的高壓洗淨步驟、利用添加有過氧化氫(H2O2)的超純水的洗淨、排出步驟。藉由如上所述般加以組合,能夠期待由鹼及過氧化氫(H2O2)帶來的化學洗淨與由超純水的高壓供給帶來的物理洗淨的兩種效果。所述組合中,利用添加有鹼的超純水的高壓洗淨步驟、利用添加有過氧化氫(H2O2)的超純水的洗淨亦可依次重複進行2次。藉由將利用鹼及過氧化氫(H2O2)的洗淨重複進行2次,化學洗淨的效果進一步提高。 The combination of the high-pressure cleaning step, the alkali, etc., and the discharge step in the cleaning method of the ultrapure water production system of this embodiment is preferably performed sequentially: high-pressure cleaning with alkali-added ultrapure water The cleaning step is a cleaning and discharging step using ultrapure water added with hydrogen peroxide (H 2 O 2 ). By combining as described above, two effects of chemical cleaning by alkali and hydrogen peroxide (H 2 O 2 ) and physical cleaning by high-pressure supply of ultrapure water can be expected. In the combination, the high-pressure washing step using alkali-added ultrapure water and the washing using hydrogen peroxide (H 2 O 2 )-added ultrapure water may be sequentially repeated twice. By repeating the washing with alkali and hydrogen peroxide (H 2 O 2 ) twice, the effect of chemical washing is further improved.
所述組合中,亦可將利用添加有鹼的超純水的高壓洗淨步驟分成利用添加有鹼的超純水的洗淨、與利用超純水的高壓洗淨步驟來進行。該情況下,利用超純水的高壓洗淨步驟較佳為於鹼洗淨後進行。此處,所謂鹼洗淨後是指利用鹼的洗淨中經過既定時間後、進行既定流量的通水後或者確認微粒子測量數成為恆 定狀態後。 In the combination, the high-pressure washing step using ultrapure water added with alkali may be divided into a washing step using ultrapure water added with alkali and a high pressure washing step using ultrapure water. In this case, the high-pressure cleaning step using ultrapure water is preferably performed after alkaline cleaning. Here, the so-called after alkaline cleaning means that after a predetermined time has elapsed during alkaline cleaning, after a predetermined flow of water is passed, or the number of particles measured is confirmed to be constant. After setting the state.
另外,於所述組合中,可進而於排出步驟中進行高壓洗淨步驟,亦可於排出步驟後進行高壓洗淨步驟。此處,所謂排出步驟後是指排出步驟中經過既定時間後、進行既定流量的通水後或者確認微粒子測量數成為恆定狀態後。藉由在排出步驟中或者排出步驟後實施高壓洗淨步驟,將僅藉由排出步驟無法徹底擠出或者未徹底擠出的處理水擠出至系統外,因此能夠期待防止分散於處理水中的微粒子再附著於配管的內壁等上的效果。 In addition, in the combination, a high-pressure washing step may be further performed in the discharge step, or a high-pressure washing step may be performed after the discharge step. Here, the term "after the discharge step" refers to after a predetermined time has passed in the discharge step, after a predetermined flow rate of water has been passed, or after confirming that the number of measured particles has become a constant state. By performing a high-pressure washing step during or after the discharge step, the treated water that cannot be completely extruded or not completely extruded only by the discharge step is squeezed out of the system, so it can be expected to prevent fine particles dispersed in the treated water The effect of attaching to the inner wall of the pipe.
利用如上所述的組合的洗淨所需要的時間為2小時~7天。結束洗淨的時間點是藉由利用設置於返送配管R1中的線上微粒子監測器(未圖示)進行測量,根據處理水中所存在的20nm以上的微粒子數是否成為1個/mL以下(恆定狀態)來判斷。 The time required for washing with the above-mentioned combination is 2 hours to 7 days. The time to complete the cleaning is measured by an online particle monitor (not shown) installed in the return pipe R1. It is determined whether the number of particles of 20nm or more in the treated water becomes 1/mL or less (constant state). ) To judge.
此外,超純水製造系統的洗淨時,代替超濾膜裝置(UF裝置)47而設置聚氯乙烯(PVC)製的虛設管(未圖示)或者不具有UF功能的虛設UF裝置(未圖示)。藉由使用虛設管或者虛設UF裝置,能夠於洗淨階段防止UF裝置堵塞,因此可削減UF裝置所花費的成本。此外,於使用虛設管或者虛設UF裝置的情況下,洗淨所需要的時間為12小時~7天。 In addition, when cleaning the ultrapure water production system, instead of the ultrafiltration membrane device (UF device) 47, a dummy pipe made of polyvinyl chloride (PVC) (not shown) or a dummy UF device (not shown) without UF function is installed. Icon). By using a dummy tube or a dummy UF device, clogging of the UF device can be prevented during the cleaning phase, so the cost of the UF device can be reduced. In addition, in the case of using a dummy tube or dummy UF device, the cleaning time is 12 hours to 7 days.
以上,已參照圖式對本發明進行了說明,但本發明並不限定於所述實施形態,可實施多種變更。 Above, the present invention has been described with reference to the drawings, but the present invention is not limited to the above-mentioned embodiment, and various modifications can be implemented.
以下,基於實施例,對本發明進一步進行詳細說明,但 本發明並不限定於以下的實施例。 Hereinafter, the present invention will be further described in detail based on examples, but The present invention is not limited to the following examples.
[實施例1] [Example 1]
使用圖1所示的超純水製造系統來進行子系統4的洗淨。於返送配管R2中設置線上微粒子監測器(粒子檢測系統(Particle Measuring Systems)公司製造,商品名:UDI-20),將返送配管R1的配管壓力由0.4MPa變更為0.7MPa。
The ultrapure water production system shown in FIG. 1 is used to clean the
[結果] [result]
將壓力及微粒子數與洗淨後經過時間的關係示於圖2中。根據本結果可知,若壓力變高,則微粒子揚塵。藉此可知,對於以高壓條件來進行子系統4的配管洗淨而言具有一定的效果。
The relationship between the pressure and the number of fine particles and the elapsed time after washing is shown in FIG. 2. From this result, it can be seen that when the pressure becomes higher, fine particles will raise dust. From this, it can be seen that there is a certain effect for cleaning the piping of the
[實施例2、比較例] [Example 2, Comparative Example]
使用配管徑25A的PVDF製配管來作為返送配管R2,以配管長50m設置2根。其中1根使用添加有鹼的超純水來進行連續高壓洗淨,作為比較例,另1根僅利用添加有鹼的超純水進行洗淨。通水速度均設為0.5m/sec,流量設為3m3。關於返送配管R2的壓力,對於鹼洗淨+連續高壓洗淨(實施例2)設為0.4MPa,對於僅僅鹼洗淨(比較例)設為0.3MPa。通常的通水時的壓力設為0.3MPa。使用設置於返送配管R2中的線上微粒子監測器(UDI-20:粒子監測系統(Particle Measuring Systems)公司製造)來測量微粒子數。 Use a pipe made of PVDF with a pipe diameter of 25A as the return pipe R2, and install two pipes with a pipe length of 50m. One of them was subjected to continuous high-pressure washing with ultrapure water added with alkali. As a comparative example, the other one was washed with only ultrapure water added with alkali. The water flow rate was set to 0.5m/sec, and the flow rate was set to 3m 3 . Regarding the pressure of the return pipe R2, it was set to 0.4 MPa for alkaline cleaning + continuous high-pressure cleaning (Example 2), and 0.3 MPa for only alkaline cleaning (comparative example). The pressure during normal water flow is 0.3 MPa. The number of fine particles was measured using an online fine particle monitor (UDI-20: manufactured by Particle Measuring Systems) installed in the return pipe R2.
[結果] [result]
將使用添加有鹼的超純水來進行連續高壓洗淨的情況下(實 施例2)的微粒子數與洗淨後經過時間的關係示於圖3中,將僅利用添加有鹼的超純水進行洗淨的情況下(比較例)的微粒子數與洗淨後經過時間的關係示於圖4中。根據本結果可知,若使用添加有鹼的超純水進行連續高壓洗淨,則20nm以上的微粒子數經過30小時後穩定。藉此可知,若於連續高壓洗淨中組合鹼洗淨,則洗淨時間縮短。 In the case of continuous high-pressure washing with ultrapure water added with alkali (actual The relationship between the number of fine particles and the elapsed time after washing in Example 2) is shown in Fig. 3. The number of fine particles and the elapsed time after washing in the case of washing with only alkali-added ultrapure water (comparative example) The relationship is shown in Figure 4. From this result, it can be seen that if continuous high-pressure washing is performed using ultrapure water added with alkali, the number of fine particles of 20 nm or more stabilizes after 30 hours. From this, it can be seen that if alkaline washing is combined with continuous high-pressure washing, the washing time is shortened.
如以上所說明,依據本發明的超純水製造系統的洗淨方法,藉由高壓供給超純水,能夠將附著於超純水製造系統內、特別是配管的內壁等上的微粒子有效率地剝離、去除,因此可在短時間內進行洗淨作業。另外,於利用添加有鹼的超純水進行高壓洗淨步驟的情況下,除了藉由高壓供給超純水而帶來的物理洗淨效果以外,還添加由鹼帶來的化學洗淨效果,因此能夠更有效地進行超純水製造系統內洗淨。 As explained above, according to the cleaning method of the ultrapure water production system of the present invention, by supplying ultrapure water at high pressure, it is possible to efficiently remove the particles attached to the ultrapure water production system, especially the inner wall of the pipe, etc. The ground is peeled and removed, so it can be cleaned in a short time. In addition, in the case of the high-pressure cleaning step using ultrapure water added with alkali, in addition to the physical cleaning effect brought by the high-pressure supply of ultrapure water, a chemical cleaning effect by alkali is also added. Therefore, cleaning in the ultrapure water production system can be performed more effectively.
本發明作為如下方法而有用:於新啟動超純水製造系統的情況、或停止運轉一定期間後再啟動的情況下,用以去除系統內所混入或產生的雜質,將系統洗淨至使用點的超純水滿足要求水質為止。 The present invention is useful as a method for removing impurities mixed or generated in the system when the ultrapure water production system is newly started or when it is restarted after stopping the operation for a certain period of time to clean the system to the point of use The ultrapure water meets the required water quality.
1‧‧‧超純水製造系統 1‧‧‧Ultra pure water manufacturing system
2‧‧‧預處理系統 2‧‧‧Pretreatment system
3‧‧‧一次純水系統 3‧‧‧Pure water system
4‧‧‧二次純水系統(子系統) 4‧‧‧Secondary pure water system (subsystem)
41‧‧‧子儲槽 41‧‧‧Sub-tank
42‧‧‧熱交換器 42‧‧‧Heat exchanger
43‧‧‧紫外線氧化裝置(UV裝置) 43‧‧‧Ultraviolet oxidation device (UV device)
44‧‧‧觸媒式氧化性物質分解裝置 44‧‧‧Catalyst-type oxidizing substance decomposition device
45‧‧‧除氣裝置 45‧‧‧Degassing device
46‧‧‧混合床式離子交換裝置 46‧‧‧Mixed bed ion exchange device
47‧‧‧超濾膜裝置(UF裝置) 47‧‧‧Ultrafiltration membrane device (UF device)
5‧‧‧使用點 5‧‧‧Use point
L1、L2、L31~L36、L4‧‧‧送水配管 L1, L2, L31~L36, L4‧‧‧Water supply pipe
R1、R2‧‧‧返送配管 R1, R2‧‧‧Return piping
P‧‧‧泵 P‧‧‧Pump
W‧‧‧原水 W‧‧‧raw water
Claims (5)
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JP2016031373A JP6107987B1 (en) | 2016-02-22 | 2016-02-22 | Cleaning method of ultrapure water production system |
JP2016-031373 | 2016-02-22 |
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KR (1) | KR20180115692A (en) |
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- 2016-09-09 WO PCT/JP2016/076556 patent/WO2017145419A1/en active Application Filing
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TW201729914A (en) | 2017-09-01 |
WO2017145419A1 (en) | 2017-08-31 |
KR20180115692A (en) | 2018-10-23 |
JP6107987B1 (en) | 2017-04-05 |
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