JP7384658B2 - Piping cleaning method - Google Patents

Description

The present invention relates to a pipe cleaning method, and particularly to a pipe cleaning method for cleaning pipes in a substrate processing apparatus.

2. Description of the Related Art In the manufacture of semiconductor devices and the like, a process of processing a substrate using a processing liquid, ie, substrate processing, is often performed. The substrate processing is, for example, a process of cleaning the substrate or a process of etching the substrate, and in the substrate processing, a processing liquid is discharged onto the substrate. In order to efficiently perform substrate processing, substrate processing is automated using a substrate processing apparatus. A substrate processing apparatus typically includes a processing liquid tank for supplying a processing liquid, a nozzle for discharging the processing liquid onto the substrate, and a supply path for supplying the processing liquid from the processing liquid tank to the nozzle. and piping including. If particles are generated in this piping, there is a possibility that the particles will adhere to the substrate during substrate processing. Excessive particle deposition is often unacceptable in substrate processing.

According to Japanese Unexamined Patent Publication No. 2015-177090, a processing liquid supply device that supplies a processing liquid to a substrate is disclosed. The processing liquid supply device includes a processing liquid tank for storing a processing liquid, a supply means for supplying the processing liquid to the substrate, a processing liquid supply path for supplying the processing liquid from the processing liquid tank to the supply means, and a processing liquid supply path for supplying the processing liquid from the processing liquid tank to the supply means. a transfer means provided in the supply path for transferring the processing liquid from the processing liquid tank to the supply means; a first valve provided in the processing liquid supply path; the first valve of the processing liquid supply path; The apparatus includes a branch pipe branched from the supply means, a second valve provided on the branch pipe, and a control means for controlling opening and closing of the first valve and the second valve. The first valve is a valve that does not close completely even in the closed state. According to these configurations, even if the first valve of the processing liquid supply path is closed by the control means when stopping the supply of processing liquid from the processing liquid tank to the supply means, the first valve is not completely closed. Therefore, particles generated due to contact between the valve body and the valve seat are suppressed. Further, when the first valve is brought into a closed state, although not completely, the processing liquid flows from the first valve at a rate of a slow leak. This slow leakage of processing liquid flows through the branch piping due to its own weight and is collected in the processing liquid tank.

Japanese Patent Application Publication No. 2015-177090

The technique described in the above publication is intended to suppress the generation of particles in the valve. However, it is usually impossible to reduce particle generation to zero. Furthermore, even if the generation of particles from the first valve can be reduced, there is naturally a concern that particles will be generated from other parts. The generated particles may be trapped in the piping. Particularly, particles are likely to be trapped at locations where equipment such as heaters, pumps, filters, and valves are attached, and at branch locations. Furthermore, if the piping is long, the amount of wrapped particles will also increase. The trapped particles are released during substrate processing, leading to particle contamination of the substrate. Therefore, it is required to implement a pipe cleaning method for removing particles trapped in the pipes as necessary.

The present invention has been made to solve the above problems, and its purpose is to provide a pipe cleaning method that can effectively wash away particles trapped in the pipes.

A first aspect includes a processing liquid tank for supplying a processing liquid, a nozzle for discharging the processing liquid onto the substrate, and a supply path for supplying the processing liquid from the processing liquid tank to the nozzle. A piping cleaning method for cleaning the piping in a substrate processing apparatus having the following: (a) flowing a liquid through the piping so as to pass through a portion to be cleaned that includes at least a portion of the supply path; and (b) exposing the part to be cleaned to the turbulent flow by generating a turbulent flow of the liquid using a turbulent flow generator attached to the piping.

A second aspect is the pipe cleaning method according to the first aspect, wherein the turbulence generator includes a flow rate controller that controls the flow rate of the liquid, and the step (b) includes (b1) the a step of causing the flow rate of the liquid to fluctuate a plurality of times by a flow rate controller, each of the multiple fluctuations in the step (b1) comprising: (b1a) decreasing the flow rate of the liquid by the flow rate controller; and (b1b) increasing the flow rate of the liquid using the flow rate controller.

A third aspect is the pipe cleaning method according to the second aspect, wherein in the step (b1), the flow rate of the liquid passing through the flow rate controller is always greater than zero.

A fourth aspect is the pipe cleaning method according to the second or third aspect, wherein in the step (b1), the plurality of fluctuations include a first fluctuation and a second fluctuation, and the plurality of fluctuations include a first fluctuation and a second fluctuation. The time between the start of the step (b1b) in the first variation and the start of the step (b1b) in the second variation is 1 second or less.

A fifth aspect is the pipe cleaning method according to any one of the second to fourth aspects, in which the step (b1) is performed for 1 minute or more.

A sixth aspect is the piping cleaning method according to any one of the first to fifth aspects, wherein the substrate processing apparatus includes a particle counter attached to the piping, and the piping cleaning method includes ( c) If the value of the particle counter is smaller than a threshold value, the method further includes the step of stopping the step (b).

A seventh aspect is the pipe cleaning method according to any one of the first to sixth aspects, wherein the substrate processing apparatus includes a holding part that holds the substrate, and a holding part that is arranged on a side of the holding part. and a liquid receiving part, and the step (a) includes the step of (a1) causing the liquid to flow out from the nozzle toward the liquid receiving part.

An eighth aspect is the pipe cleaning method according to the seventh aspect, wherein the supply path is provided with a branch, and the supply path includes an upstream path extending from the processing liquid tank to the branch; a downstream path extending from the branch to the nozzle; the piping includes a return path extending from the branch to the processing liquid tank; the upstream path and the return path allow the processing liquid to flow through the processing liquid tank; A circulation path for circulating the liquid is configured, and the pipe cleaning method includes (d) circulating the processing liquid through the circulation path while the downstream path is blocked before the step (a1). The method further includes a step.

A ninth aspect is the pipe cleaning method according to the eighth aspect, in which the turbulence generator is attached to the downstream path.

A tenth aspect is the pipe cleaning method according to any one of the first to ninth aspects, wherein the liquid is the treatment liquid.

An eleventh aspect is the piping cleaning method according to any one of the first to sixth aspects, wherein the substrate processing apparatus includes a cleaning liquid supply source that supplies a cleaning liquid for cleaning the piping as the liquid. The piping includes a cleaning liquid supply path extending from the cleaning liquid supply source to the supply path.

A twelfth aspect is the pipe cleaning method according to the eleventh aspect, wherein the supply path is provided with a branch, and the supply path includes an upstream path extending from the processing liquid tank to the branch; a downstream path extending from the branch to the nozzle; the piping includes a return path extending from the branch to the processing liquid tank; the upstream path and the return path allow the processing liquid to flow through the processing liquid tank; A circulation path for circulating the liquid is configured, and the turbulence generator is attached to the cleaning liquid supply path of the piping.

A thirteenth aspect is the pipe cleaning method according to the twelfth aspect, in which the cleaning liquid supply source is connected in parallel to the processing liquid tank.

A fourteenth aspect is the pipe cleaning method according to the twelfth aspect, wherein the cleaning liquid supply source is connected in parallel to a portion of the upstream path that is separate from the processing liquid tank, and has at least one device attached to it.

According to each of the above aspects, the portion to be cleaned of the supply path is exposed to turbulent flow by the turbulent flow generator. Thereby, particles trapped in the part to be cleaned can be washed away more effectively than in the case where liquid is simply caused to flow through the part to be cleaned.

1 is a plan view schematically showing the configuration of a substrate processing apparatus in Embodiment 1. FIG. 2 is a block diagram schematically showing the configuration of a control section included in the substrate processing apparatus of FIG. 1. FIG. FIG. 2 is a cross-sectional view schematically showing piping and related configurations of the substrate processing apparatus in FIG. 1. FIG. FIG. 2 is a plan view schematically showing the configuration inside a chamber of a processing unit included in the substrate processing apparatus of FIG. 1. FIG. 1 is a flow diagram schematically showing a pipe cleaning method in Embodiment 1. FIG. FIG. 3 is a cross-sectional view schematically showing piping and related configurations of the substrate processing apparatus in Embodiment 2. FIG. FIG. 7 is a cross-sectional view schematically showing piping and related configurations of the substrate processing apparatus in Embodiment 3. FIG. 7 is a cross-sectional view schematically showing piping and related configurations of the substrate processing apparatus in Embodiment 4. FIG. FIG. 7 is a cross-sectional view schematically showing piping of a substrate processing apparatus and configurations related thereto in Embodiment 5. FIG. FIG. 12 is a cross-sectional view schematically showing piping of a substrate processing apparatus and configurations related thereto in Embodiment 6.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in the drawings, the same or corresponding parts are given the same reference numerals and the description will not be repeated. Further, the X-axis, Y-axis, and Z-axis shown in the drawings are perpendicular to each other, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

<Embodiment 1>
FIG. 1 is a plan view schematically showing the configuration of a substrate processing apparatus 101 in this embodiment. The substrate processing apparatus 101 includes a load port LP, an indexer robot IR, a center robot CR, a control section 90, a chemical solution cabinet 10, at least one fluid box 20, and at least one processing unit 30. The processing unit 30 can perform substrate processing on the substrate WF. The shape of the substrate WF is approximately circular.

The control section 90 can control the operation of each section provided in the substrate processing apparatus 101. The carrier CT is a container that accommodates the substrate WF. The load port LP is a container holding mechanism that holds a plurality of carriers CT. The indexer robot IR can transport the substrate WF between the load port LP and the substrate platform PS. The substrate platform PS can temporarily hold the substrate WF. The central robot CR can transport the substrate WF from one of the substrate platform PS and the at least one processing unit 30 to the other one. With the above configuration, the indexer robot IR, substrate platform PS, and center robot CR function as a transport mechanism that transports the substrate WF between each of the processing units 30 and the load port LP.

The unprocessed substrate WF is taken out from the carrier CT by the indexer robot IR and delivered to the center robot CR via the substrate platform PS. The central robot CR carries this unprocessed substrate WF into the processing unit 30. The processing unit 30 performs substrate processing on the substrate WF. The processed substrate WF is taken out from the processing unit 30 by the center robot CR, passes through other processing units 30 as necessary, and then is delivered to the indexer robot IR via the substrate platform PS. The indexer robot IR carries the processed substrate WF into the carrier CT. As described above, the processing for the substrate WF is performed.

The substrate processing apparatus 101 includes a plurality of sets of processing units 30 and corresponding fluid boxes 20. In each set, the processing units 30 and the corresponding fluid boxes 20 are preferably adjacent to each other. The chemical liquid cabinet 10 supplies processing liquid to the processing unit 30 via the fluid box 20. The processing unit 30 and the fluid boxes 20 are arranged in a common outer wall (in FIG. 1, the outer wall that includes the four fluid boxes 20). In FIG. 1, the chemical solution cabinet 10 is also arranged within the outer wall, but the drug solution cabinet 10 may be arranged outside the outer wall.

FIG. 2 is a block diagram schematically showing the configuration of the control section 90 (FIG. 1). The control unit 90 may be configured by a general computer having an electric circuit. Specifically, the control unit 90 includes a CPU (Central Processing Unit) 91, a ROM (Read Only Memory) 92, a RAM (Random Access Memory) 93, a storage device 94, an input unit 96, a display unit 97, and a communication unit 98. , and a bus line 95 interconnecting them.

The ROM 92 stores basic programs. The RAM 93 is used as a work area when the CPU 91 performs predetermined processing. The storage device 94 is configured by a nonvolatile storage device such as a flash memory or a hard disk device. The input unit 96 is comprised of various switches, a touch panel, etc., and receives input setting instructions such as processing recipes from the operator. The display section 97 is composed of, for example, a liquid crystal display device, a lamp, etc., and displays various information under the control of the CPU 91. The communication unit 98 has a data communication function via a LAN (Local Area Network) or the like. A plurality of modes for controlling each device constituting the substrate processing apparatus 101 (FIG. 1) are preset in the storage device 94. When the CPU 91 executes the processing program 94P, one of the plurality of modes is selected, and each device is controlled according to the selected mode. Further, the processing program 94P may be stored in a recording medium. Using this recording medium, the processing program 94P can be installed in the control unit 90. Furthermore, some or all of the functions executed by the control unit 90 do not necessarily need to be realized by software, and may be realized by hardware such as a dedicated logic circuit.

FIG. 3 is a cross-sectional view schematically showing the piping of the substrate processing apparatus 101 and its related configuration.

The chemical solution cabinet 10 includes a case 11, a processing solution tank 12, a heater 13H, a pump 13P, a filter 13F, a drain tank 19, and a drain valve 19V. The heater 13H, the pump 13P, and the filter 13F may be collectively referred to as the fluid device 13 below. The case 11 accommodates a processing liquid tank 12, a heater 13H, a pump 13P, a filter 13F, a drain tank 19, and a drain valve 19V. The processing liquid tank 12 is for supplying the processing liquid LC, and can store the processing liquid LC.

The treatment liquid LC is usually a chemical liquid. When the substrate treatment is, for example, etching treatment on a substrate on which a silicon nitride film is formed, the treatment liquid LC contains phosphoric acid. When a resist removal process is performed as a substrate process, for example, the process liquid LC includes a mixture of sulfuric acid and hydrogen peroxide (SPM). A processing liquid LC containing phosphoric acid or SPM is an example of a processing liquid LC used at high temperatures. The temperature of the processing liquid LC supplied from the chemical liquid cabinet 10 may be maintained at a specified temperature higher than room temperature by the heater 13H. Preferably, the specified temperature is set according to the content of substrate processing. In the case of etching processing using processing liquid LC containing phosphoric acid, the specified temperature is, for example, about 175°C, and in the case of cleaning processing using processing liquid LC containing SPM, the specified temperature is, for example, about 200°C.

Drain valve 19V connects processing liquid tank 12 to drain tank 19. When the drain valve 19V is opened, the processing liquid LC in the processing liquid tank 12 flows into the drain tank 19 as a drain liquid LD.

The fluid box 20 includes a case 21, a discharge valve 22V, a flow meter 22M, a flow valve 22R, a circulation valve 23V, a flow valve 23R, and a turbulence generator 70. The case 21 accommodates a discharge valve 22V, a flow meter 22M, a flow valve 22R, a circulation valve 23V, a flow valve 23R, and a turbulence generator 70.

The processing unit 30 is for performing substrate processing on the substrate WF using the processing liquid LC. For this purpose, the processing unit 30 includes a chamber 31, a spin chuck 39 (holding section), a nozzle 32, a nozzle moving unit 34, a liquid receiving section 35, and a cup 36. Chamber 31 has a roughly box shape. The chamber 31 accommodates a spin chuck 39, a nozzle 32, a nozzle moving unit 34, a liquid receiver 35, and a cup 36.

The spin chuck 39 is a substrate holding section that holds and rotates the substrate WF. Specifically, the spin chuck 39 holds the substrate WF horizontally within the chamber 31 while rotating the substrate WF around the rotation axis A1. The spin chuck 39 includes a plurality of chuck members 110, a spin base 111, and a spin motor 112. The plurality of chuck members 110 hold the substrate WF in a horizontal posture. The spin base 111 has a substantially disk shape and supports the plurality of chuck members 110 in a horizontal position. The spin motor 112 rotates the substrate WF held by the plurality of chuck members 110 around the rotation axis A1 by rotating the spin base 111.

The nozzle 32 discharges the processing liquid LC to the substrate WF for substrate processing when the discharge valve 22V is in an open state. When the discharge valve 22V is closed, this discharge is stopped.

The cup 36 is configured to be able to surround the substrate WF held by the spin chuck 39. Thereby, the cup 36 receives the processing liquid LC discharged from the substrate WF. The cup 36 has a substantially cylindrical shape.

FIG. 4 is a plan view schematically showing the internal configuration of the processing unit 30. Hereinafter, the nozzle moving unit 34, the liquid receiving section 35, and pre-dispensing of the processing liquid LC will be described with reference to FIGS. 3 and 4.

The nozzle moving unit 34 moves the nozzle 32 horizontally by rotating around the rotation axis A2. Specifically, this rotation causes the nozzle moving unit 34 to horizontally move the nozzle 32 between the processing position L1 and the standby position L2. The processing position L1 is located above the substrate WF. In FIG. 4, the nozzle 32 located at the processing position L1 is indicated by a chain double-dashed line. The standby position L2 is located outside the spin chuck 39 and the cup 36 in the planar layout (layout in the XY plane). Further, the nozzle moving unit 34 can move the nozzle 32 not only horizontally but also vertically.

The liquid receiver 35 is located outside the spin chuck 39 and the cup 36 in a planar layout (layout in the XY plane). Specifically, the liquid receiving part 35 is arranged on the side of the spin chuck 39 and is located below the standby position L2 of the nozzle 32. The liquid receiving portion 35 receives the processing liquid LC discharged from the nozzle 32 during preliminary discharge.

Preliminary discharge is discharge of the processing liquid LC toward the liquid receiving portion 35, and is performed before discharge of the processing liquid LC toward the substrate WF. In other words, preliminary discharge is discharge of the processing liquid LC performed before substrate processing. In preparation for preliminary ejection, the nozzle moving unit 34 lowers the nozzle 32 from the standby position L2. Thereby, the tip of the nozzle 32 comes sufficiently close to the liquid receiver 35 and is preferably inserted into the internal space of the liquid receiver 35. This places the nozzle 32 in a position for preliminary ejection. Thereafter, the nozzle 32 discharges the processing liquid LC toward the liquid receiving section 35.

The chemical solution cabinet 10, the fluid box 20, and the processing unit 30 are connected to each other by piping for transporting a liquid (processing liquid LC in this embodiment). The diameter of the pipe is, for example, about 4 mm to 10 mm. The material of the piping is, for example, perfluoroalkoxyalkane (PFA).

The piping includes a supply path PP for supplying the processing liquid LC from the processing liquid tank 12 of the chemical solution cabinet 10 to the nozzle 32 of the processing unit 30. A branch B1 is provided in the supply path PP. Therefore, the supply path PP includes an upstream path PP1 extending from the processing liquid tank 12 to the branch B1, and a downstream path PP2 extending from the branch B1 to the nozzle 32. The upstream path PP1 extends from the processing liquid tank 12, passes through the fluid equipment 13, and reaches the branch B1. The downstream path PP2 reaches the nozzle 32 from the branch B1 through the discharge valve 22V, the flow meter 22M, and the flow valve 22R.

The piping includes a return path PR extending from the branch B1 to the processing liquid tank 12. The return path PR extends from the branch B1, passes through the circulation valve 23V and the flow rate valve 23R, and reaches the processing liquid tank 12. The upstream path PP1 and the return path PR constitute a circulation path for circulating the processing liquid LC via the processing liquid tank 12.

With the above configuration, when the circulation valve 23V is closed and the discharge valve 22V is opened, the processing liquid LC from the chemical solution cabinet 10 is supplied to the nozzle 32 via the supply path PP. Conversely, if the circulation valve 23V is opened and the discharge valve 22V is closed, the processing liquid LC from the chemical liquid cabinet 10 will circulate through the circulation path without being supplied to the nozzle 32.

The turbulent flow generator 70 is attached to the piping and can generate a turbulent flow of liquid toward the downstream direction of the piping. In this embodiment, the turbulence generator 70 is attached to the upstream passage PP1, and specifically, is arranged between the fluid device 13 and the branch B1.

Turbulence generator 70 may include or be a flow controller that controls the flow rate of the liquid. A flow controller is a valve that changes the flow rate of liquid through it. Turbulence can be created in the liquid by means of a valve that can produce appropriate changes in flow rate. Hereinafter, this valve will be referred to as a turbulence valve.

By opening and closing the turbulence valve multiple times, the flow rate can be varied multiple times. Each of the multiple fluctuations includes a flow rate decrease due to the turbulence valve being closed and a flow rate increase due to the turbulence valve being opened. The turbulence valve is opened and closed according to instructions from the control unit 90 (FIG. 1). It is preferable that the turbulence valve and the control unit 90 are configured so that the turbulence valve can be opened and closed at a speed of 1 Hz or more according to instructions from the control unit 90. In this case, if we define a certain variation and the next variation among the above multiple variations as the first variation and the second variation, then the start of the increase in flow rate in the first variation and the flow rate in the second variation are defined as the first variation and the second variation. The time between the start of the increase can be less than 1 second. That is, the turbulence valve can be opened and closed at a high speed of 1 Hz or higher.

It is preferable that the turbulence valve is configured so that it is not completely closed even when it is closed to the maximum extent. For that purpose, the turbulence valve itself may be configured so that it cannot be fully closed, or alternatively, the control unit 90 (FIG. 1) may perform limiter control that prohibits the turbulence valve from fully closing. .

Note that the turbulence generator 70 is not limited to a turbulence valve. Alternatively, a ceramic oscillator attached to the pipe may generate turbulence through its vibrations. Alternatively, a gas injector that injects an inert gas into the liquid flowing through the pipe may generate turbulence. Alternatively, a variable output pump may generate turbulence by varying its output.

Referring to FIG. 3, substrate processing apparatus 101 includes a particle counter 38 attached to piping. The particle counter 38 measures a value representing the number of particles contained per unit amount of the processing liquid LC in the pipe. For this purpose, a particle counter 38 is connected to branch B2 of the pipe. Preferably, branch B2 is arranged in downstream path PP2. More preferably, branch B2 is arranged between discharge valve 22V. Even more preferably, the branch B2 is arranged in a part of the downstream path PP2 inside the chamber 31, in which case the particle counter 38 is arranged inside the chamber 31, as shown in FIG. It is preferable. Preferably, the branch B2 is arranged between the nozzle 32 and the midpoint of the path between the discharge valve 22V and the nozzle 32. Although the particle counter 38 is placed inside the chamber 31 in FIG. 3, it may be placed outside the chamber 31. For example, the particle counter 38 and the branch B2 may be arranged within the case 21.

Next, a method for cleaning pipes in the substrate processing apparatus 101 will be described. The pipe cleaning method is a method of cleaning a portion to be cleaned including at least a portion of the supply path PP. The part to be cleaned is located downstream of the turbulence generator 70. In this embodiment, the portion to be cleaned includes the section of the piping from branch B1 to nozzle 32.

In step S100 (FIG. 5), the downstream passage PP2 is closed by closing the discharge valve 22V, and the return passage PR is made conductive by opening the circulation valve 23V. Thereby, the processing liquid LC in the processing liquid tank 12 is circulated through the circulation path configured by the upstream path PP1 and the return path PR.

Prior to step S200, the nozzle moving unit 34 moves the nozzle 32 to a position for preliminary ejection. Then, in step S200 (FIG. 5), the return path PR is closed by closing the circulation valve 23V, and the downstream path PP2 is made conductive by opening the discharge valve 22V. As a result, the processing liquid LC (liquid) is caused to flow through the pipe so as to pass through the cleaning section including the section from the branch B1 to the nozzle 32. Along with this step, liquid flows out from the nozzle 32 toward the liquid receiving section 35 in step S210 (FIG. 5). That is, preliminary ejection is performed.

In step S300 (FIG. 5), the turbulent flow generator 70 generates a turbulent flow of the processing liquid LC. As a result, the portion to be cleaned located downstream of the turbulent flow generator 70 is exposed to the turbulent flow. In order to implement step S300, in step S310 (FIG. 5), the flow rate of the processing liquid LC (liquid) is varied multiple times by the turbulence valve (flow rate controller) as the turbulence generator 70. . Each of these multiple fluctuations includes a set of step S311 and step S312 (FIG. 5). Specifically, in step S11, the flow rate of the processing liquid LC is decreased by closing the turbulence valve, and in step S312, the flow rate of the processing liquid LC is increased by opening the turbulence valve. Preferably, the flow rate of the processing liquid LC through the turbulence valve is always greater than zero, even when the flow rate is reduced by the closing action of the turbulence valve.

When a set of step S311 and step S312 is repeated, if a certain step S312 and the next step S312 are defined as the first and second steps S312, the flow rate increase in the first step S312 The time between the start and the start of the flow increase in the second step S312 is preferably 1 second or less. More preferably, when the operation of performing the set of steps S311 and S312 is considered as one cycle, it is preferable that the operation of multiple cycles is continued at a frequency of 1 Hz or higher.

It is preferable that step S310 is performed for one minute or more. More preferably, the above-mentioned operation at 1 Hz or more is continued for 1 minute or more.

In step S400 (FIG. 5), the control unit 90 determines whether the value of the particle counter 38 (FIG. 3) is smaller than a threshold value. If the determination result is negative (NO), step S300 is continued. If the determination result is YES, step S400 is stopped, thereby stopping pipe cleaning.

According to this embodiment, the portion to be cleaned of the supply path PP is exposed to turbulent flow by the turbulent flow generator 70. Thereby, particles trapped in the part to be cleaned can be washed away more effectively than in the case where liquid is simply caused to flow through the part to be cleaned.

The processing liquid LC in which turbulence is generated is the processing liquid LC in this embodiment. Thereby, pipe cleaning can be performed using liquid from the processing liquid tank 12 that supplies processing liquid LC for substrate processing.

The turbulence valve (flow rate controller) serving as the turbulence generator 70 repeats a set of steps of decreasing the flow rate of the liquid and increasing the flow rate of the liquid multiple times. Thereby, the period during which turbulence occurs can be ensured as long as necessary. Therefore, particles can be more effectively washed away from the area to be cleaned.

During pipe cleaning, the flow rate of liquid through the turbulence valve is preferably always greater than zero. Thereby, the turbulence valve does not require a fully closed operation, which is an operation that involves mechanical collision within the turbulence valve. Therefore, generation of new particles due to this collision can be suppressed.

Preferably, the time between the start of a flow increase by the turbulence valve and the start of the next flow increase by the turbulence valve is less than or equal to 1 second. This increases the number of times turbulence occurs per unit time. Therefore, particles can be more effectively washed away from the area to be cleaned.

The step of varying the flow rate of the liquid multiple times is preferably performed for one minute or more. This causes turbulence for more than 1 minute. Therefore, particles can be more effectively washed away from the area to be cleaned.

Generation of turbulence by the turbulence generator 70 is stopped if the value of the particle counter 38 is smaller than the threshold value. This makes it possible to avoid inefficiency caused by continuing to generate turbulence even though particles have been sufficiently removed by the turbulence. Note that the particle counter 38 may be omitted and the timing for stopping pipe cleaning may be determined without using it. For example, pipe cleaning may be stopped when a preset time has elapsed.

A process of causing the liquid to flow out from the nozzle 32 toward the liquid receiving portion 35, ie, preliminary discharge, is performed, and the turbulent flow generator 70 generates a turbulent flow of this liquid. As a result, particles washed away near the nozzle 32 are discharged to the liquid receiving portion 35 instead of to the substrate WF. Therefore, while cleaning the vicinity of the nozzle 32 of the piping, it is possible to prevent washed away particles from adhering to the substrate WF.

While the liquid is being circulated through the circulation path formed by the upstream path PP1 and the return path PR, the flow of the liquid is stopped in the downstream path PP2. During this period, if particles are newly generated in the downstream path PP2 due to some factor, the particles will be accumulated in the downstream path PP2. According to this embodiment, particles accumulated in this manner can be effectively removed.

<Embodiment 2>
FIG. 6 is a cross-sectional view schematically showing the piping and related configurations of the substrate processing apparatus 102 of this embodiment. Note that the configuration other than the portions shown in FIG. 6 is the same as that of FIG. 1 (Embodiment 1), so illustration thereof will be omitted.

In the substrate processing apparatus 102, a turbulence generator 70 is attached to the downstream path PP2. Specifically, the turbulence generator 70 is arranged between the branch B2 and the discharge valve 22V. Note that the configuration other than the above is almost the same as the configuration of the first embodiment described above, so the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.

According to this embodiment, particles in the downstream path PP2 can be effectively removed. In particular, since the turbulent flow generator 70 can be placed closer to the fluid equipment (for example, the discharge valve 22V, the flow meter 33M, or the flow valve 22R) located in the downstream path PP2, the turbulence generator 70 can be placed closer to the fluid equipment located in the downstream path PP2. particles can be effectively removed. Note that the fluid equipment to be cleaned in this way is not limited to those described above, and may be equipment such as a valve, for example.

<Embodiment 3>
FIG. 7 is a cross-sectional view schematically showing the piping and related configurations of the substrate processing apparatus 103 of this embodiment. Note that the configuration other than the portions shown in FIG. 7 is the same as that of FIG. 1 (Embodiment 1), so illustration thereof will be omitted.

In the substrate processing apparatus 103, the turbulence generator 70 is attached to the upstream path PP1 of the supply path PP, between the fluid device 13 and the branch B1. The turbulence generator 70 is preferably arranged outside the case 21 of the fluid box 20. The turbulence generator 70 may be placed outside the case 11 of the drug solution cabinet 10, as shown, or it may be placed inside the case 11. The supply path PP has a branch B3 between the turbulence generator 70 and the nozzle 32, and specifically has a branch B3 between the turbulence generator 70 and the branch B1. Drainage is possible from branch B3 via drain valve 24D. Branch B3 may be located within the case 21 of the fluid box 20.

The parts to be cleaned in the pipe cleaning method in this embodiment are from the turbulence generator 70 to the branch B3. During cleaning, the discharge valve 22V and the circulation valve 23V are closed, and the drain valve 24D is opened. Thereby, the processing liquid LC used for cleaning is discharged via the branch B3 and the drain valve 24D.

Note that the configuration other than the above is almost the same as the configuration of the first embodiment described above, so the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.

According to this embodiment, the portion of the supply path PP between the turbulence generator 70 and the branch B3 can be effectively removed. Furthermore, since the discharge valve 22V is closed during cleaning, it is possible to prevent dirty water generated by cleaning from flowing out from the nozzle 32.

Note that when the particle counter 38 (FIG. 3: Embodiment 1) is applied to this embodiment, the particle counter 38 detects the liquid in the path extending from the turbulence generator 70 via the branch B3 and the drain valve 24D. arranged to measure.

<Embodiment 4>
FIG. 8 is a cross-sectional view schematically showing the piping and related configurations of the substrate processing apparatus 104 of this embodiment. Note that the configuration other than the portions shown in FIG. 8 is the same as that of FIG. 1 (Embodiment 1), so illustration thereof will be omitted.

In the substrate processing apparatus 104, the turbulence generator 70 is attached to the upstream path PP1 of the supply path PP between the processing liquid tank 12 and the fluid equipment 13. The turbulence generator 70 is preferably arranged inside the case 11 of the chemical liquid cabinet 10. The supply path PP has a branch B4 between the fluid device 13 and the nozzle 32, and specifically, has a branch B4 between the fluid device 13 and the branch B1. The liquid can be drained from the branch B4 via the drain valve 13D.

The parts to be cleaned in the pipe cleaning method of this embodiment are from the turbulence generator 70 to the branch B4. During cleaning, the discharge valve 22V and the circulation valve 23V are closed, and the drain valve 13D is opened. Thereby, the processing liquid LC used for cleaning is discharged via the branch B4 and the drain valve 13D.

Note that the configuration other than the above is almost the same as the configuration of the first embodiment described above, so the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.

According to this embodiment, the portion of the supply path PP between the turbulence generator 70 and the branch B4 can be effectively removed. Specifically, the fluidic device 13 can be effectively cleaned. Furthermore, since the discharge valve 22V is closed during cleaning, it is possible to prevent dirty water generated by cleaning from flowing out from the nozzle 32.

Note that when the particle counter 38 (FIG. 3: Embodiment 1) is applied to this embodiment, the particle counter 38 detects the liquid in the path extending from the turbulence generator 70 via the branch B4 and the drain valve 13D. arranged to measure.

<Embodiment 5>
FIG. 9 is a cross-sectional view schematically showing the piping and related configurations of the substrate processing apparatus 105 of this embodiment. Note that the configuration other than the portions shown in FIG. 9 is the same as that in FIG. 1 (Embodiment 1), so illustration thereof will be omitted.

The substrate processing apparatus 105 has a cleaning liquid tank 16 (cleaning liquid supply source) that can store a cleaning liquid LR for cleaning piping. Thereby, the cleaning liquid tank 16 can supply the cleaning liquid LR. As the liquid in which turbulence is generated, the processing liquid LC is used in the first to fourth embodiments described above, but the cleaning liquid LR is used in this embodiment.

It is preferable that the cleaning liquid tank 16 is arranged inside the case 11 of the chemical liquid cabinet 10. Liquid can be drained from the cleaning liquid tank 16 via a drain valve 16D. Since the cleaning liquid LR in the cleaning liquid tank 16 is not used for actual substrate processing, the capacity of the cleaning liquid tank 16 may be smaller than the capacity of the processing liquid tank 12.

In this embodiment, the upstream path PP1 of the piping supply path PP has a branch B5 between the processing liquid tank 12 and the fluid device 13. The piping also includes a cleaning liquid supply path extending from the cleaning liquid tank 16 to the branch B5. The turbulence generator 70 is attached to the cleaning liquid supply path of the piping. An on-off valve 16B is provided between the turbulence generator 70 and branch B5. Further, an on-off valve 12B is provided between the processing liquid tank 12 and the branch B5. Further, the return path PR of the piping has a branch B6 between the circulation valve 23V and the processing liquid tank 12. A pipe that returns to the cleaning liquid tank 16 extends from the branch B6 via an on-off valve 16A. Further, an on-off valve 12A is provided between the branch B6 and the processing liquid tank 12.

With the above configuration, the substrate processing apparatus 105 can selectively use either the processing liquid tank 12 or the cleaning liquid tank 16 connected in parallel thereto. Specifically, by opening the on-off valve 12B and closing the on-off valve 16B, the processing liquid LC from the processing liquid tank 12 instead of the cleaning liquid LR from the cleaning liquid tank 16 is passed through the fluid device 13. The liquid may be supplied to branch B1. Conversely, by opening the on-off valve 16B and closing the on-off valve 12B, the cleaning liquid LR from the cleaning liquid tank 16 instead of the treatment liquid LC from the treatment liquid tank 12 is branched off via the fluid device 13. It can be a liquid supplied to B1. In the former case, the processing liquid LC can be returned to the processing liquid tank 12 by opening the on-off valve 12A and closing the on-off valve 16A. That is, the processing liquid LC can be circulated. In the latter case, the cleaning liquid LR can be returned to the cleaning liquid tank 16 by opening the on-off valve 16A and closing the on-off valve 12A. That is, the cleaning liquid LR can be circulated.

The part to be cleaned in the pipe cleaning method of this embodiment is the part of the pipe that extends from the turbulence generator 70 to the cleaning liquid tank 16 via the branch B1, and this part is the part to which the fluidic device 13 is attached. including. During cleaning using the turbulence generator 70, the cleaning liquid tank 16 is used instead of the processing liquid tank 12. Therefore, in this embodiment, the cleaning liquid LR is used while being circulated as the liquid in which turbulence is generated. The cleaning liquid LR contaminated by being used for cleaning may be discharged via the drain valve 16D, if necessary.

Note that the configuration other than the above is almost the same as the configuration of the first embodiment described above, so the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.

According to this embodiment, the substrate processing apparatus 105 has a cleaning liquid tank 16. Thereby, instead of supplying the liquid to the part to be cleaned by circulating the treatment liquid LC via the treatment liquid tank 12, pipe cleaning can be performed by supplying the cleaning liquid LR from the cleaning liquid tank 16. Therefore, contamination of the processing liquid tank 12 due to particles washed away during pipe cleaning flowing into the processing liquid tank 12 can be avoided. Specifically, by closing the on-off valve 12A, it is possible to prevent contaminated liquid from flowing into the processing liquid tank 12. Therefore, when the substrate is processed using the processing liquid LC from the processing liquid tank 12, particle contamination of the substrate can be suppressed.

The turbulence generator 70 is attached not to the supply path PP of the piping but to the cleaning liquid supply path of the piping (the piping between the cleaning liquid tank 16 and the branch B5 of the supply path PP). Thereby, when the substrate processing apparatus 105 is performing normal substrate processing instead of substrate cleaning, the processing liquid LC can be prevented from passing through the turbulence generator 70.

Note that when the particle counter 38 (FIG. 3: Embodiment 1) is applied to this embodiment, the particle counter 38 operates from the turbulence generator 70 to branch B5, branch B1, branch B6, and on-off valve 16A. is arranged to measure the liquid in its path to the cleaning liquid tank 16 via the cleaning liquid tank 16 .

<Embodiment 6>
FIG. 10 is a cross-sectional view schematically showing the piping and related configurations of the substrate processing apparatus 106 of this embodiment. Note that the configuration other than the portions shown in FIG. 10 is the same as that in FIG. 1 (Embodiment 1), so illustration thereof will be omitted.

In this embodiment, the upstream path PP1 of the piping supply path PP has a branch B7 between the fluid device 13 and the branch B1. Preferably, the branch B7 is arranged in the case 11 of the drug solution cabinet 10. Further, in this embodiment, a pipe is provided for causing liquid to flow into the cleaning liquid tank 16 from the branch B7, and the opening/closing valve 16A is attached to this pipe. The upstream path PP1 of the supply path PP has an on-off valve 13V between the branch B7 and the branch B1.

The upstream path PP1 has a portion between the branch B5 and the branch B7 as a portion to be cleaned. Since the cleaning liquid tank 16 is arranged upstream of the part, the part does not include the cleaning liquid tank 16. In other words, the part is removed from the cleaning liquid tank 16. Further, a cleaning liquid tank 16 is connected in parallel to this portion. Specifically, the cleaning liquid tank 16 is connected to supply the cleaning liquid LR to the branch B5 and to recover the cleaning liquid LR from the branch B7. Further, at least one fluid device 13 is attached to the above portion, and specifically, a heater 13H, a pump 13P, and a filter 13F are attached.

With the above configuration, it is possible to selectively use either the processing liquid tank 12 or the cleaning liquid tank 16 connected in series thereto. Specifically, by opening the on-off valve 12B and closing the on-off valve 16B, the processing liquid LC from the processing liquid tank 12 instead of the cleaning liquid LR from the cleaning liquid tank 16 is passed through the fluid device 13. The liquid may be supplied to branch B1. Conversely, by opening the on-off valve 16B and closing the on-off valve 12B, the cleaning liquid LR from the cleaning liquid tank 16 instead of the treatment liquid LC from the treatment liquid tank 12 is branched off via the fluid device 13. It can be a liquid supplied to B1. In the former case, the processing liquid LC can be returned to the processing liquid tank 12 by opening the on-off valve 12A and closing the on-off valve 16A. That is, the processing liquid LC can be circulated. In the latter case, the cleaning liquid LR can be returned to the cleaning liquid tank 16 by opening the on-off valve 16A and closing the on-off valve 12A. That is, the cleaning liquid LR can be circulated.

According to this embodiment, the cleaning liquid tank 16 is connected in parallel to a portion of the upstream path PP1 between the branch B5 and the branch B7, and the fluid device 13 is attached to the portion. Thereby, the cleaning liquid LR can be circulated through the fluid device 13, and the circulation path at this time is shorter than that in the fifth embodiment described above. Therefore, the efficiency of washing away particles trapped in the fluid device 13 can be increased.

In addition, when the particle counter 38 (FIG. 3: Embodiment 1) is applied to this embodiment, the particle counter 38 receives air from the turbulence generator 70 via the branch B5, the branch B7, and the on-off valve 16A. It is arranged to measure the liquid in its path to the cleaning liquid tank 16.

Although this invention has been described in detail, the above description is illustrative in all aspects, and the invention is not limited thereto. It is understood that countless variations not illustrated can be envisaged without departing from the scope of the invention. The configurations described in each of the above embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

10: Chemical liquid cabinet 11: Case 12: Processing liquid tank 13: Fluid equipment 16: Cleaning liquid tank (cleaning liquid supply source)
19: Drain tank 20: Fluid box 21: Case 22V: Discharge valve 23V: Circulation valve 30: Processing unit 31: Chamber 32: Nozzle 35: Liquid receiver 38: Particle counter 70: Turbulence generator 90: Control unit 101~ 106: Substrate processing device B1 to B7: Branch L1: Processing position L2: Standby position LC: Processing liquid (liquid)
LR: Cleaning liquid (liquid)
PP: Supply path PP1: Upstream path PP2: Downstream path PR: Return path WF: Board

Claims (8)

A processing liquid tank for supplying a processing liquid, a nozzle for discharging the processing liquid to the substrate, and piping including a supply path for supplying the processing liquid from the processing liquid tank to the nozzle. A piping cleaning method for cleaning the piping in a substrate processing apparatus, the method comprising:
(a) flowing a liquid through the piping so as to pass through a portion to be cleaned that includes at least a portion of the supply path;
(b) exposing the part to be cleaned to the turbulent flow by generating a turbulent flow of the liquid with a turbulent flow generator attached to the piping;
Equipped with
The substrate processing apparatus has a cleaning liquid supply source that supplies a cleaning liquid for cleaning the piping as the liquid,
The piping includes a cleaning liquid supply path extending from the cleaning liquid supply source to the supply path,
The supply path is provided with a branch, the supply path includes an upstream path extending from the processing liquid tank to the branch, and a downstream path extending from the branch to the nozzle,
The piping includes a return path extending from the branch to the processing liquid tank, and the upstream path and the return path constitute a circulation path for circulating the processing liquid via the processing liquid tank. ,
The turbulence generator is attached to the cleaning liquid supply path of the piping,
In the pipe cleaning method, the cleaning liquid supply source is connected in parallel to the processing liquid tank . A processing liquid tank for supplying a processing liquid, a nozzle for discharging the processing liquid to the substrate, and piping including a supply path for supplying the processing liquid from the processing liquid tank to the nozzle. A piping cleaning method for cleaning the piping in a substrate processing apparatus, the method comprising:
(a) flowing a liquid through the piping so as to pass through a portion to be cleaned that includes at least a portion of the supply path;
(b) exposing the part to be cleaned to the turbulent flow by generating a turbulent flow of the liquid with a turbulent flow generator attached to the piping;
Equipped with
The substrate processing apparatus has a cleaning liquid supply source that supplies a cleaning liquid for cleaning the piping as the liquid,
The piping includes a cleaning liquid supply path extending from the cleaning liquid supply source to the supply path,
The supply path is provided with a branch, the supply path includes an upstream path extending from the processing liquid tank to the branch, and a downstream path extending from the branch to the nozzle,
The piping includes a return path extending from the branch to the processing liquid tank, and the upstream path and the return path constitute a circulation path for circulating the processing liquid via the processing liquid tank. ,
The turbulence generator is attached to the cleaning liquid supply path of the piping,
The cleaning liquid supply source is connected in parallel to a portion of the upstream passage away from the processing liquid tank, and at least one device is attached to the portion. The pipe cleaning method according to claim 1 or 2 ,
The turbulence generator includes a flow controller that controls the flow rate of the liquid,
The step (b) includes:
(b1) The flow rate controller includes a step of causing the flow rate of the liquid to fluctuate a plurality of times, and each of the multiple fluctuations in the step (b1) includes:
(b1a) reducing the flow rate of the liquid by the flow rate controller;
(b1b) increasing the flow rate of the liquid by the flow rate controller;
Pipe cleaning methods, including: The pipe cleaning method according to claim 3 ,
In the step (b1), the flow rate of the liquid passing through the flow rate controller is always greater than zero. The pipe cleaning method according to claim 3 or 4 ,
In the step (b1), the plurality of fluctuations includes a first fluctuation and a second fluctuation, and the start of the step (b1b) in the first fluctuation and the start of the step (b1b) in the second fluctuation. ) A pipe cleaning method in which the time between the start of The pipe cleaning method according to any one of claims 3 to 5 ,
A pipe cleaning method, wherein the step (b1) is performed for 1 minute or more. The pipe cleaning method according to any one of claims 1 to 6 ,
The substrate processing apparatus includes a particle counter attached to the piping,
The pipe cleaning method is
(c) A pipe cleaning method further comprising the step of stopping the step (b) if the value of the particle counter is smaller than a threshold value. The pipe cleaning method according to any one of claims 1 to 7 ,
The substrate processing apparatus includes a holding part that holds the substrate, and a liquid receiving part arranged on a side of the holding part,
The step (a) includes:
(a1) A pipe cleaning method including the step of causing the liquid to flow out from the nozzle toward the liquid receiving section.

Images