TWI698661B - 導光裝置以及雷射加工裝置 - Google Patents

導光裝置以及雷射加工裝置 Download PDF

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Publication number
TWI698661B
TWI698661B TW108121909A TW108121909A TWI698661B TW I698661 B TWI698661 B TW I698661B TW 108121909 A TW108121909 A TW 108121909A TW 108121909 A TW108121909 A TW 108121909A TW I698661 B TWI698661 B TW I698661B
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TW
Taiwan
Prior art keywords
light
irradiated
polygon mirror
light guide
laser
Prior art date
Application number
TW108121909A
Other languages
English (en)
Chinese (zh)
Other versions
TW202014755A (zh
Inventor
中澤睦裕
大串修己
Original Assignee
日商川崎重工業股份有限公司
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Publication of TW202014755A publication Critical patent/TW202014755A/zh
Application granted granted Critical
Publication of TWI698661B publication Critical patent/TWI698661B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/02—Catoptric systems, e.g. image erecting and reversing system
    • G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/121—Mechanical drive devices for polygonal mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/125—Details of the optical system between the polygonal mirror and the image plane
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/129—Systems in which the scanning light beam is repeatedly reflected from the polygonal mirror
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • G02B7/1821—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors for rotating or oscillating mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/125—Details of the optical system between the polygonal mirror and the image plane
    • G02B26/126—Details of the optical system between the polygonal mirror and the image plane including curved mirrors

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Paper (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Radiation-Therapy Devices (AREA)
TW108121909A 2018-06-25 2019-06-24 導光裝置以及雷射加工裝置 TWI698661B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018119598A JP7136602B2 (ja) 2018-06-25 2018-06-25 導光装置及びレーザ加工装置
JP2018-119598 2018-06-25

Publications (2)

Publication Number Publication Date
TW202014755A TW202014755A (zh) 2020-04-16
TWI698661B true TWI698661B (zh) 2020-07-11

Family

ID=68985029

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108121909A TWI698661B (zh) 2018-06-25 2019-06-24 導光裝置以及雷射加工裝置

Country Status (9)

Country Link
US (1) US20210260692A1 (ja)
EP (1) EP3812825B1 (ja)
JP (1) JP7136602B2 (ja)
KR (1) KR102497109B1 (ja)
CN (1) CN112352187B (ja)
IL (1) IL279540B2 (ja)
RU (1) RU2754523C1 (ja)
TW (1) TWI698661B (ja)
WO (1) WO2020004178A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7221345B2 (ja) * 2021-03-19 2023-02-13 株式会社東京精密 ウエハエッジ部の改質装置及び改質方法
CN113634873B (zh) * 2021-08-31 2023-07-07 西安交通大学 基于干涉测量的激光加工后壁组合防护方法及系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6424217A (en) * 1987-07-20 1989-01-26 Canon Kk Scanning optical system
JPH11149052A (ja) * 1997-11-17 1999-06-02 Matsushita Electric Ind Co Ltd 走査装置
TWI250910B (en) * 2004-03-05 2006-03-11 Olympus Corp Apparatus for laser machining
JP2013116488A (ja) * 2011-12-04 2013-06-13 Kiyoyuki Kondo ビーム加工装置及びそれを用いた基板の加工方法
TWI620038B (zh) * 2017-01-11 2018-04-01 財團法人工業技術研究院 曝光方法和系統以及雷射直接成像系統
JP6424217B2 (ja) 2013-06-26 2018-11-14 ベクトン・ディッキンソン・ロワ・ジャーマニー・ゲーエムベーハー 自動保存システムから医薬品パックを順次供給する排出／投入ステーションを用いて、複数の受承用コンパートメントを有する輸送ボックスを確実に充填するための方法、及び上記方法のための排出／投入ステーション

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS541629B2 (ja) 1973-08-31 1979-01-26
US4160894A (en) * 1975-05-14 1979-07-10 Winkler & Dunnebier Maschinenfabrik Und Eisengiesserei Kg Method and apparatus for the focal form cutting of a moving web of material by a laser beam
US5041831A (en) * 1988-04-26 1991-08-20 Hewlett-Packard Company Indirect D/A converter
JPH0328818A (ja) * 1988-12-29 1991-02-07 Ricoh Co Ltd 走査光学装置
JP3140558B2 (ja) 1992-04-28 2001-03-05 旭光学工業株式会社 レーザ光の光軸補正装置
JPH10166167A (ja) * 1996-12-03 1998-06-23 Komatsu Ltd レーザマーキング方法及び装置
JP4177051B2 (ja) * 2002-08-29 2008-11-05 古河電気工業株式会社 可変光減衰器及び光部品
EP2486450B1 (en) * 2008-11-02 2021-05-19 David Chaum Near to eye display system and appliance
JP5518612B2 (ja) 2010-07-20 2014-06-11 株式会社ディスコ 光学装置およびこれを備えるレーザー加工装置
TWI453461B (zh) * 2011-03-08 2014-09-21 Kawasaki Heavy Ind Ltd Optical scanning devices and laser processing devices
JP5997522B2 (ja) * 2012-07-06 2016-09-28 川崎重工業株式会社 光走査装置及びレーザ加工装置
JP6877951B2 (ja) * 2016-10-21 2021-05-26 川崎重工業株式会社 光照射装置及び光読取装置
JP6785636B2 (ja) * 2016-12-09 2020-11-18 川崎重工業株式会社 ポリゴンミラー回転装置
WO2018175193A2 (en) * 2017-03-22 2018-09-27 Corning Incorporated Methods of separating a glass web

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6424217A (en) * 1987-07-20 1989-01-26 Canon Kk Scanning optical system
JPH11149052A (ja) * 1997-11-17 1999-06-02 Matsushita Electric Ind Co Ltd 走査装置
TWI250910B (en) * 2004-03-05 2006-03-11 Olympus Corp Apparatus for laser machining
JP2013116488A (ja) * 2011-12-04 2013-06-13 Kiyoyuki Kondo ビーム加工装置及びそれを用いた基板の加工方法
JP6424217B2 (ja) 2013-06-26 2018-11-14 ベクトン・ディッキンソン・ロワ・ジャーマニー・ゲーエムベーハー 自動保存システムから医薬品パックを順次供給する排出／投入ステーションを用いて、複数の受承用コンパートメントを有する輸送ボックスを確実に充填するための方法、及び上記方法のための排出／投入ステーション
TWI620038B (zh) * 2017-01-11 2018-04-01 財團法人工業技術研究院 曝光方法和系統以及雷射直接成像系統

Also Published As

Publication number Publication date
IL279540B1 (en) 2023-05-01
US20210260692A1 (en) 2021-08-26
KR20210008094A (ko) 2021-01-20
EP3812825B1 (en) 2023-08-02
EP3812825A1 (en) 2021-04-28
JP7136602B2 (ja) 2022-09-13
TW202014755A (zh) 2020-04-16
JP2020003518A (ja) 2020-01-09
CN112352187A (zh) 2021-02-09
CN112352187B (zh) 2022-09-16
IL279540B2 (en) 2023-09-01
KR102497109B1 (ko) 2023-02-07
RU2754523C1 (ru) 2021-09-02
EP3812825A4 (en) 2022-04-27
IL279540A (en) 2021-01-31
WO2020004178A1 (ja) 2020-01-02

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