JP2020003518A - 導光装置及びレーザ加工装置 - Google Patents
導光装置及びレーザ加工装置 Download PDFInfo
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- JP2020003518A JP2020003518A JP2018119598A JP2018119598A JP2020003518A JP 2020003518 A JP2020003518 A JP 2020003518A JP 2018119598 A JP2018119598 A JP 2018119598A JP 2018119598 A JP2018119598 A JP 2018119598A JP 2020003518 A JP2020003518 A JP 2020003518A
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- 238000003754 machining Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 claims abstract description 57
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 230000032258 transport Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
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- 230000010355 oscillation Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/02—Catoptric systems, e.g. image erecting and reversing system
- G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/121—Mechanical drive devices for polygonal mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/125—Details of the optical system between the polygonal mirror and the image plane
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/129—Systems in which the scanning light beam is repeatedly reflected from the polygonal mirror
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
- G02B7/1821—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors for rotating or oscillating mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/125—Details of the optical system between the polygonal mirror and the image plane
- G02B26/126—Details of the optical system between the polygonal mirror and the image plane including curved mirrors
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Paper (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Radiation-Therapy Devices (AREA)
Abstract
Description
12 レーザ発生器(光源)
13 導光装置
20 第1導光部
30 ポリゴンミラー
31 回転軸
32 支持体
33 反射部
40 第2導光部
60 調整部
100 ワーク(被照射物)
Claims (5)
- 光源から照射された光を反射して導く第1導光部と、
回転可能に構成されており、回転軸方向で見たときに正多角形状の反射面が構成されるように配置された複数の反射部を有しており、前記第1導光部により導かれた光を回転しながら当該反射部で反射するポリゴンミラーと、
前記ポリゴンミラーの前記反射部で反射された光を反射して、当該反射部毎にそれぞれ光が被照射物に照射されるように光を導く第2導光部と、
前記第1導光部に含まれる光学部品の位置及び向きの少なくとも一方を変化させることで、前記ポリゴンミラーに入射される光の光軸の前記回転軸方向における位置を調整する調整部と、
を備え、
前記ポリゴンミラーの前記反射部は、入射した光の光軸を前記回転軸方向にオフセットして反射するように構成されており、
前記ポリゴンミラーに入射される光の光軸の前記回転軸方向における位置を前記調整部が調整することで、前記被照射物に照射される光の線幅方向の位置を変化させ、前記被照射物に照射される光の線幅方向の位置を変化させながら光を照射することを特徴とする導光装置。 - 請求項1に記載の導光装置であって、
前記調整部は、前記ポリゴンミラーに入射される光の光軸の前記回転軸方向における位置を、予め設定された値に基づいて変化させることを特徴とする導光装置。 - 請求項1又は2に記載の導光装置であって、
前記調整部は、前記ポリゴンミラーに入射される光の光軸の前記回転軸方向における位置を周期的に変化させることを特徴とする導光装置。 - 請求項1から3までの何れか一項に記載の導光装置と、
レーザ光を発生させる前記光源と、
を備えることを特徴とするレーザ加工装置。 - 請求項4に記載のレーザ加工装置であって、
前記被照射物は板状であり、
前記被照射物には、照射領域が線幅方向で重なるようにレーザ光が複数回照射され、
前記被照射物の加工溝の深さに応じて、前記レーザ光の焦点位置を前記被照射物の照射位置に相対的に近づけることを特徴とするレーザ加工装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018119598A JP7136602B2 (ja) | 2018-06-25 | 2018-06-25 | 導光装置及びレーザ加工装置 |
IL279540A IL279540B2 (en) | 2018-06-25 | 2019-06-19 | Light guiding device and laser processing device |
KR1020207035833A KR102497109B1 (ko) | 2018-06-25 | 2019-06-19 | 도광 장치 및 레이저 가공 장치 |
EP19824873.4A EP3812825B1 (en) | 2018-06-25 | 2019-06-19 | Lightguide device and laser processing device |
RU2021101098A RU2754523C1 (ru) | 2018-06-25 | 2019-06-19 | Световодное устройство и устройство лазерной обработки |
US17/250,247 US20210260692A1 (en) | 2018-06-25 | 2019-06-19 | Lightguide device and laser processing device |
CN201980042831.6A CN112352187B (zh) | 2018-06-25 | 2019-06-19 | 导光装置及激光加工装置 |
PCT/JP2019/024303 WO2020004178A1 (ja) | 2018-06-25 | 2019-06-19 | 導光装置及びレーザ加工装置 |
TW108121909A TWI698661B (zh) | 2018-06-25 | 2019-06-24 | 導光裝置以及雷射加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018119598A JP7136602B2 (ja) | 2018-06-25 | 2018-06-25 | 導光装置及びレーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
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JP2020003518A true JP2020003518A (ja) | 2020-01-09 |
JP7136602B2 JP7136602B2 (ja) | 2022-09-13 |
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JP2018119598A Active JP7136602B2 (ja) | 2018-06-25 | 2018-06-25 | 導光装置及びレーザ加工装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20210260692A1 (ja) |
EP (1) | EP3812825B1 (ja) |
JP (1) | JP7136602B2 (ja) |
KR (1) | KR102497109B1 (ja) |
CN (1) | CN112352187B (ja) |
IL (1) | IL279540B2 (ja) |
RU (1) | RU2754523C1 (ja) |
TW (1) | TWI698661B (ja) |
WO (1) | WO2020004178A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022145423A (ja) * | 2021-03-19 | 2022-10-04 | 株式会社東京精密 | ウエハエッジ部の改質装置及び改質方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113634873B (zh) * | 2021-08-31 | 2023-07-07 | 西安交通大学 | 基于干涉测量的激光加工后壁组合防护方法及系统 |
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-
2018
- 2018-06-25 JP JP2018119598A patent/JP7136602B2/ja active Active
-
2019
- 2019-06-19 KR KR1020207035833A patent/KR102497109B1/ko active IP Right Grant
- 2019-06-19 US US17/250,247 patent/US20210260692A1/en active Pending
- 2019-06-19 EP EP19824873.4A patent/EP3812825B1/en active Active
- 2019-06-19 WO PCT/JP2019/024303 patent/WO2020004178A1/ja unknown
- 2019-06-19 IL IL279540A patent/IL279540B2/en unknown
- 2019-06-19 CN CN201980042831.6A patent/CN112352187B/zh active Active
- 2019-06-19 RU RU2021101098A patent/RU2754523C1/ru active
- 2019-06-24 TW TW108121909A patent/TWI698661B/zh active
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JPS6424217A (en) * | 1987-07-20 | 1989-01-26 | Canon Kk | Scanning optical system |
US6144397A (en) * | 1996-12-03 | 2000-11-07 | Komatsu Limited | Laser marking method and an apparatus thereof |
JPH11149052A (ja) * | 1997-11-17 | 1999-06-02 | Matsushita Electric Ind Co Ltd | 走査装置 |
JP2004093680A (ja) * | 2002-08-29 | 2004-03-25 | Furukawa Electric Co Ltd:The | 光ビームスキャン装置および光部品 |
CN103119512A (zh) * | 2008-11-02 | 2013-05-22 | 大卫·乔姆 | 近眼式显示系统和装置 |
WO2012120892A1 (ja) * | 2011-03-08 | 2012-09-13 | 川崎重工業株式会社 | 光走査装置及びレーザ加工装置 |
JP2013116488A (ja) * | 2011-12-04 | 2013-06-13 | Kiyoyuki Kondo | ビーム加工装置及びそれを用いた基板の加工方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022145423A (ja) * | 2021-03-19 | 2022-10-04 | 株式会社東京精密 | ウエハエッジ部の改質装置及び改質方法 |
JP7221345B2 (ja) | 2021-03-19 | 2023-02-13 | 株式会社東京精密 | ウエハエッジ部の改質装置及び改質方法 |
Also Published As
Publication number | Publication date |
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IL279540B1 (en) | 2023-05-01 |
IL279540B2 (en) | 2023-09-01 |
TW202014755A (zh) | 2020-04-16 |
EP3812825A1 (en) | 2021-04-28 |
TWI698661B (zh) | 2020-07-11 |
KR102497109B1 (ko) | 2023-02-07 |
RU2754523C1 (ru) | 2021-09-02 |
EP3812825B1 (en) | 2023-08-02 |
US20210260692A1 (en) | 2021-08-26 |
CN112352187B (zh) | 2022-09-16 |
JP7136602B2 (ja) | 2022-09-13 |
KR20210008094A (ko) | 2021-01-20 |
EP3812825A4 (en) | 2022-04-27 |
WO2020004178A1 (ja) | 2020-01-02 |
IL279540A (en) | 2021-01-31 |
CN112352187A (zh) | 2021-02-09 |
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