TWI695225B - 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法 - Google Patents

感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法 Download PDF

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TWI695225B
TWI695225B TW104137814A TW104137814A TWI695225B TW I695225 B TWI695225 B TW I695225B TW 104137814 A TW104137814 A TW 104137814A TW 104137814 A TW104137814 A TW 104137814A TW I695225 B TWI695225 B TW I695225B
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TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
component
mass
compound
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TW104137814A
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English (en)
Chinese (zh)
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TW201624131A (zh
Inventor
太田絵美子
村松有紀子
沢辺賢
岡出翔太
李相哲
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日商日立化成股份有限公司
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Publication of TW201624131A publication Critical patent/TW201624131A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW104137814A 2014-11-17 2015-11-17 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法 TWI695225B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-232451 2014-11-17
JP2014232451 2014-11-17

Publications (2)

Publication Number Publication Date
TW201624131A TW201624131A (zh) 2016-07-01
TWI695225B true TWI695225B (zh) 2020-06-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW104137814A TWI695225B (zh) 2014-11-17 2015-11-17 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法

Country Status (5)

Country Link
JP (1) JP6690549B2 (ja)
KR (1) KR102595962B1 (ja)
CN (2) CN113156767A (ja)
TW (1) TWI695225B (ja)
WO (1) WO2016080375A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102230622B1 (ko) 2017-11-24 2021-03-22 주식회사 엘지화학 포토레지스트 조성물 및 이를 이용한 포토레지스트 필름
JP6870657B2 (ja) * 2018-05-17 2021-05-12 信越化学工業株式会社 感光性樹脂組成物、感光性ドライフィルム、及びパターン形成方法
JPWO2021033451A1 (ja) * 2019-08-22 2021-02-25
TWI833992B (zh) * 2019-10-15 2024-03-01 美商羅門哈斯電子材料有限公司 光致抗蝕劑組成物及圖案形成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008105552A1 (ja) * 2007-02-27 2008-09-04 Jsr Corporation 感放射線性樹脂組成物、液晶表示素子用スペーサーおよび保護膜ならびにそれらの形成方法
WO2013115262A1 (ja) * 2012-02-02 2013-08-08 日立化成株式会社 感光性樹脂組成物及びそれを用いた感光性エレメント、スペーサーの形成方法、並びに、スペーサー

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4779284B2 (ja) * 2000-06-22 2011-09-28 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2003140329A (ja) 2001-11-01 2003-05-14 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法およびプリント配線板の製造法
JP2003215790A (ja) 2002-01-25 2003-07-30 Hitachi Ltd 感放射線組成物及び電子装置の製造方法
KR101035914B1 (ko) 2004-07-30 2011-05-23 엘지디스플레이 주식회사 평판 표시 소자 및 그의 제조방법
KR101633325B1 (ko) * 2005-11-17 2016-06-24 루사이트 인터내셔널 유케이 리미티드 에틸렌성 불포화 화합물의 카르보닐화
KR101310407B1 (ko) * 2008-04-28 2013-09-23 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법, 및, 프린트 배선판의 제조방법
US20130298398A1 (en) * 2010-11-17 2013-11-14 Masahiro Miyasaka Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
US20150293443A1 (en) * 2012-11-20 2015-10-15 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
JP2015038607A (ja) * 2013-07-16 2015-02-26 三菱化学株式会社 感光性組成物、硬化物、スペーサー及び画像表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008105552A1 (ja) * 2007-02-27 2008-09-04 Jsr Corporation 感放射線性樹脂組成物、液晶表示素子用スペーサーおよび保護膜ならびにそれらの形成方法
WO2013115262A1 (ja) * 2012-02-02 2013-08-08 日立化成株式会社 感光性樹脂組成物及びそれを用いた感光性エレメント、スペーサーの形成方法、並びに、スペーサー

Also Published As

Publication number Publication date
WO2016080375A1 (ja) 2016-05-26
JP6690549B2 (ja) 2020-04-28
TW201624131A (zh) 2016-07-01
CN107077068A (zh) 2017-08-18
KR102595962B1 (ko) 2023-11-01
JPWO2016080375A1 (ja) 2017-08-24
KR20170085038A (ko) 2017-07-21
CN113156767A (zh) 2021-07-23
CN107077068B (zh) 2021-03-12

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