CN113156767A - 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法 - Google Patents
感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法 Download PDFInfo
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- CN113156767A CN113156767A CN202110189882.0A CN202110189882A CN113156767A CN 113156767 A CN113156767 A CN 113156767A CN 202110189882 A CN202110189882 A CN 202110189882A CN 113156767 A CN113156767 A CN 113156767A
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
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| CN201580060667.3A Active CN107077068B (zh) | 2014-11-17 | 2015-11-17 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法 |
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| KR102230622B1 (ko) | 2017-11-24 | 2021-03-22 | 주식회사 엘지화학 | 포토레지스트 조성물 및 이를 이용한 포토레지스트 필름 |
| JP6870657B2 (ja) * | 2018-05-17 | 2021-05-12 | 信越化学工業株式会社 | 感光性樹脂組成物、感光性ドライフィルム、及びパターン形成方法 |
| WO2021033451A1 (ja) * | 2019-08-22 | 2021-02-25 | 富士フイルム株式会社 | 感光性転写部材、回路配線の製造方法、タッチパネルの製造方法 |
| TWI833992B (zh) * | 2019-10-15 | 2024-03-01 | 美商羅門哈斯電子材料有限公司 | 光致抗蝕劑組成物及圖案形成方法 |
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| CN1437716A (zh) * | 2000-06-22 | 2003-08-20 | 日立化成工业株式会社 | 感光性树脂组合物、使用它的感光性元件、光刻胶图案的制造方法及印刷电路板的制造方法 |
| CN101622577A (zh) * | 2007-02-27 | 2010-01-06 | Jsr株式会社 | 放射线敏感性树脂组合物、液晶显示元件用隔离物和保护膜以及它们的形成方法 |
| CN103221887A (zh) * | 2010-11-17 | 2013-07-24 | 日立化成株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷布线板的制造方法 |
| CN103792788A (zh) * | 2008-04-28 | 2014-05-14 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图形的形成方法及印刷电路板的制造方法 |
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| JP2003140329A (ja) | 2001-11-01 | 2003-05-14 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法およびプリント配線板の製造法 |
| JP2003215790A (ja) | 2002-01-25 | 2003-07-30 | Hitachi Ltd | 感放射線組成物及び電子装置の製造方法 |
| KR101035914B1 (ko) | 2004-07-30 | 2011-05-23 | 엘지디스플레이 주식회사 | 평판 표시 소자 및 그의 제조방법 |
| KR101633325B1 (ko) * | 2005-11-17 | 2016-06-24 | 루사이트 인터내셔널 유케이 리미티드 | 에틸렌성 불포화 화합물의 카르보닐화 |
| WO2013115262A1 (ja) * | 2012-02-02 | 2013-08-08 | 日立化成株式会社 | 感光性樹脂組成物及びそれを用いた感光性エレメント、スペーサーの形成方法、並びに、スペーサー |
| US20150293443A1 (en) * | 2012-11-20 | 2015-10-15 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
| JP2015038607A (ja) * | 2013-07-16 | 2015-02-26 | 三菱化学株式会社 | 感光性組成物、硬化物、スペーサー及び画像表示装置 |
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| CN1437716A (zh) * | 2000-06-22 | 2003-08-20 | 日立化成工业株式会社 | 感光性树脂组合物、使用它的感光性元件、光刻胶图案的制造方法及印刷电路板的制造方法 |
| CN101622577A (zh) * | 2007-02-27 | 2010-01-06 | Jsr株式会社 | 放射线敏感性树脂组合物、液晶显示元件用隔离物和保护膜以及它们的形成方法 |
| CN103792788A (zh) * | 2008-04-28 | 2014-05-14 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图形的形成方法及印刷电路板的制造方法 |
| CN103221887A (zh) * | 2010-11-17 | 2013-07-24 | 日立化成株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷布线板的制造方法 |
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| JP6690549B2 (ja) | 2020-04-28 |
| TW201624131A (zh) | 2016-07-01 |
| KR102595962B1 (ko) | 2023-11-01 |
| JPWO2016080375A1 (ja) | 2017-08-24 |
| CN107077068A (zh) | 2017-08-18 |
| CN107077068B (zh) | 2021-03-12 |
| TWI695225B (zh) | 2020-06-01 |
| KR20170085038A (ko) | 2017-07-21 |
| WO2016080375A1 (ja) | 2016-05-26 |
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