TWI694473B - 連接體之檢查方法、連接體、導電性粒子及異向性導電接著劑 - Google Patents

連接體之檢查方法、連接體、導電性粒子及異向性導電接著劑 Download PDF

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Publication number
TWI694473B
TWI694473B TW104141229A TW104141229A TWI694473B TW I694473 B TWI694473 B TW I694473B TW 104141229 A TW104141229 A TW 104141229A TW 104141229 A TW104141229 A TW 104141229A TW I694473 B TWI694473 B TW I694473B
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TW
Taiwan
Prior art keywords
resin core
resin
conductive particles
connection terminal
conductive
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TW104141229A
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English (en)
Chinese (zh)
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TW201628024A (zh
Inventor
荒木雄太
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日商迪睿合股份有限公司
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Publication of TW201628024A publication Critical patent/TW201628024A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Liquid Crystal (AREA)
TW104141229A 2014-12-10 2015-12-09 連接體之檢查方法、連接體、導電性粒子及異向性導電接著劑 TWI694473B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014250384A JP6457255B2 (ja) 2014-12-10 2014-12-10 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法
JPJP2014-250384 2014-12-10

Publications (2)

Publication Number Publication Date
TW201628024A TW201628024A (zh) 2016-08-01
TWI694473B true TWI694473B (zh) 2020-05-21

Family

ID=56107438

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104141229A TWI694473B (zh) 2014-12-10 2015-12-09 連接體之檢查方法、連接體、導電性粒子及異向性導電接著劑

Country Status (5)

Country Link
JP (1) JP6457255B2 (enrdf_load_stackoverflow)
KR (1) KR101908876B1 (enrdf_load_stackoverflow)
CN (1) CN107005012B (enrdf_load_stackoverflow)
TW (1) TWI694473B (enrdf_load_stackoverflow)
WO (1) WO2016093261A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6766558B2 (ja) * 2016-09-29 2020-10-14 セイコーエプソン株式会社 ヘッドユニット
JP2023072774A (ja) * 2021-11-15 2023-05-25 株式会社ケムソル 異方性導電フィルム並びにそれを用いた接合方法及び接合体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536306A (ja) * 1991-07-26 1993-02-12 Sekisui Fine Chem Kk 導電性微粒子、電極接続構造体及びその製造方法
JP2006054109A (ja) * 2004-08-12 2006-02-23 Seiko Instruments Inc 異方性導電膜及びそれを用いた表示装置、並びに、表示装置の検査方法及び検査装置
CN102160125A (zh) * 2008-09-19 2011-08-17 株式会社日本触媒 导电性微粒以及使用了该导电性微粒的各向异性导电材料
WO2014009552A2 (en) * 2012-07-13 2014-01-16 Conpart As Improvements in conductive adhesives

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1240527A (zh) * 1996-10-15 2000-01-05 西门子公司 带接点区的芯片卡以及制造这种芯片卡的方法
KR20010098662A (ko) * 2000-04-17 2001-11-08 가마이 고로 터치식 액정 표시 장치 및 입력 검출 방법
JP2005026577A (ja) 2003-07-04 2005-01-27 Matsushita Electric Ind Co Ltd 電子部品の実装方法
KR100720895B1 (ko) * 2005-07-05 2007-05-22 제일모직주식회사 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물
KR20070096572A (ko) * 2006-03-27 2007-10-02 삼성전자주식회사 표시 장치
JP5833809B2 (ja) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 異方性導電フィルム、接合体及び接続方法
JP4968414B2 (ja) * 2010-07-05 2012-07-04 Ｄｉｃ株式会社 透明導電層付き基体及びその製造方法、並びにタッチパネル用透明導電膜積層体、タッチパネル
KR101477237B1 (ko) 2012-12-27 2014-12-29 제일모직 주식회사 레이저를 이용한 접속 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536306A (ja) * 1991-07-26 1993-02-12 Sekisui Fine Chem Kk 導電性微粒子、電極接続構造体及びその製造方法
JP2006054109A (ja) * 2004-08-12 2006-02-23 Seiko Instruments Inc 異方性導電膜及びそれを用いた表示装置、並びに、表示装置の検査方法及び検査装置
CN102160125A (zh) * 2008-09-19 2011-08-17 株式会社日本触媒 导电性微粒以及使用了该导电性微粒的各向异性导电材料
WO2014009552A2 (en) * 2012-07-13 2014-01-16 Conpart As Improvements in conductive adhesives

Also Published As

Publication number Publication date
KR20170077181A (ko) 2017-07-05
JP2016115399A (ja) 2016-06-23
TW201628024A (zh) 2016-08-01
JP6457255B2 (ja) 2019-01-23
WO2016093261A1 (ja) 2016-06-16
CN107005012A (zh) 2017-08-01
KR101908876B1 (ko) 2018-10-16
CN107005012B (zh) 2019-06-18

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