TWI692385B - 化學機械硏磨所用的方法、系統與硏磨墊 - Google Patents

化學機械硏磨所用的方法、系統與硏磨墊 Download PDF

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Publication number
TWI692385B
TWI692385B TW104122052A TW104122052A TWI692385B TW I692385 B TWI692385 B TW I692385B TW 104122052 A TW104122052 A TW 104122052A TW 104122052 A TW104122052 A TW 104122052A TW I692385 B TWI692385 B TW I692385B
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TW
Taiwan
Prior art keywords
polishing pad
substrate
polishing
support
pad
Prior art date
Application number
TW104122052A
Other languages
English (en)
Chinese (zh)
Other versions
TW201609313A (zh
Inventor
陳志宏
巴特菲爾德保羅Ｄ
古魯薩米傑
馮傑森哲謙
張壽松
章及明
劉艾瑞克
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/334,608 external-priority patent/US10076817B2/en
Priority claimed from US14/464,633 external-priority patent/US10207389B2/en
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201609313A publication Critical patent/TW201609313A/zh
Application granted granted Critical
Publication of TWI692385B publication Critical patent/TWI692385B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104122052A 2014-07-17 2015-07-07 化學機械硏磨所用的方法、系統與硏磨墊 TWI692385B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US14/334,608 2014-07-17
US14/334,608 US10076817B2 (en) 2014-07-17 2014-07-17 Orbital polishing with small pad
US201462039840P 2014-08-20 2014-08-20
US14/464,633 2014-08-20
US14/464,633 US10207389B2 (en) 2014-07-17 2014-08-20 Polishing pad configuration and chemical mechanical polishing system
US62/039,840 2014-08-20

Publications (2)

Publication Number Publication Date
TW201609313A TW201609313A (zh) 2016-03-16
TWI692385B true TWI692385B (zh) 2020-05-01

Family

ID=55078940

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104122052A TWI692385B (zh) 2014-07-17 2015-07-07 化學機械硏磨所用的方法、系統與硏磨墊

Country Status (5)

Country Link
JP (2) JP2017522733A (ko)
KR (1) KR102399064B1 (ko)
CN (2) CN106463383B (ko)
TW (1) TWI692385B (ko)
WO (1) WO2016010866A1 (ko)

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CN107253131A (zh) * 2017-07-31 2017-10-17 深圳市汉匠自动化科技有限公司 一种3d屏幕研磨机
KR20190014307A (ko) * 2017-08-02 2019-02-12 새솔다이아몬드공업 주식회사 에지부분이 라운드된 연마패드 드레서 및 그 연마장치
JP6986930B2 (ja) * 2017-11-07 2021-12-22 株式会社荏原製作所 基板研磨装置および研磨方法
CN208584374U (zh) * 2018-02-26 2019-03-08 凯斯科技股份有限公司 基板处理装置
KR102564114B1 (ko) * 2018-05-16 2023-08-07 주식회사 케이씨텍 기판 처리 장치
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KR20210100702A (ko) * 2018-12-20 2021-08-17 도쿄엘렉트론가부시키가이샤 기판 처리 장치
CN112171504B (zh) * 2020-09-30 2021-08-10 车艾建 一种晶圆蚀刻背面研磨机
USD1027345S1 (en) 2022-06-03 2024-05-14 Entegris, Inc. Polyvinyl alcohol pad
WO2023235574A1 (en) * 2022-06-03 2023-12-07 Entegris, Inc. Devices for cleaning substrates and related methods
USD1022364S1 (en) 2022-06-03 2024-04-09 Entegris, Inc. Polyvinyl alcohol pad

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TWI299015B (en) * 2004-06-04 2008-07-21 Samsung Electronics Co Ltd Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones

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Publication number Priority date Publication date Assignee Title
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Also Published As

Publication number Publication date
CN106463383B (zh) 2020-10-16
JP6955592B2 (ja) 2021-10-27
JP2020092276A (ja) 2020-06-11
CN112123196A (zh) 2020-12-25
CN112123196B (zh) 2023-05-30
TW201609313A (zh) 2016-03-16
KR102399064B1 (ko) 2022-05-16
JP2017522733A (ja) 2017-08-10
KR20170032325A (ko) 2017-03-22
WO2016010866A1 (en) 2016-01-21
CN106463383A (zh) 2017-02-22

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