TWI690038B - 半導體晶片的拾取裝置、半導體晶片的封裝裝置 - Google Patents

半導體晶片的拾取裝置、半導體晶片的封裝裝置 Download PDF

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Publication number
TWI690038B
TWI690038B TW108119920A TW108119920A TWI690038B TW I690038 B TWI690038 B TW I690038B TW 108119920 A TW108119920 A TW 108119920A TW 108119920 A TW108119920 A TW 108119920A TW I690038 B TWI690038 B TW I690038B
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TW
Taiwan
Prior art keywords
semiconductor wafer
push
adhesive sheet
negative pressure
pick
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TW108119920A
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English (en)
Chinese (zh)
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TW201935635A (zh
Inventor
志賀康一
小西宣明
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日商芝浦機械電子裝置股份有限公司
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Publication of TW201935635A publication Critical patent/TW201935635A/zh
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
TW108119920A 2017-07-26 2018-07-25 半導體晶片的拾取裝置、半導體晶片的封裝裝置 TWI690038B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-144685 2017-07-26
JP2017144685 2017-07-26
JP2018116661A JP2019029650A (ja) 2017-07-26 2018-06-20 半導体チップのピックアップ装置、半導体チップの実装装置および実装方法
JP2018-116661 2018-06-20

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TW201935635A TW201935635A (zh) 2019-09-01
TWI690038B true TWI690038B (zh) 2020-04-01

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TW108119920A TWI690038B (zh) 2017-07-26 2018-07-25 半導體晶片的拾取裝置、半導體晶片的封裝裝置
TW107125644A TWI677061B (zh) 2017-07-26 2018-07-25 半導體晶片的拾取裝置、半導體晶片的封裝裝置

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JP (2) JP2019029650A (de)
TW (2) TWI690038B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7274902B2 (ja) 2019-03-25 2023-05-17 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR102221703B1 (ko) * 2019-04-19 2021-03-02 세메스 주식회사 다이 이젝터 및 이를 포함하는 다이 픽업 장치
JP7259714B2 (ja) * 2019-11-27 2023-04-18 三菱電機株式会社 半導体製造装置
CN116156784B (zh) * 2023-04-25 2023-07-04 四川托璞勒科技有限公司 一种pcb棕化处理装置

Citations (4)

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Publication number Priority date Publication date Assignee Title
WO2008053673A1 (fr) * 2006-10-31 2008-05-08 Shibaura Mechatronics Corporation Dispositif de collecte de puce à semiconducteur
TW201029093A (en) * 2008-11-12 2010-08-01 Esec Ag Method for detaching and removing a semiconductor chip from a foil
US20100289283A1 (en) * 2006-10-18 2010-11-18 Lintec Corporation Chip Pickup Method and Chip Pickup Apparatus
TW201207922A (en) * 2010-03-31 2012-02-16 Furukawa Electric Co Ltd Method for manufacturing semiconductor device

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Publication number Priority date Publication date Assignee Title
JP3498877B2 (ja) * 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP2004152858A (ja) * 2002-10-29 2004-05-27 Renesas Technology Corp 半導体製造装置及び方法
KR20070120319A (ko) * 2006-06-19 2007-12-24 삼성전자주식회사 한 쌍의 이젝터들을 구비하는 반도체 칩의 탈착 장치 및이를 이용한 반도체 칩의 탈착 방법
JP5054949B2 (ja) * 2006-09-06 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5227117B2 (ja) * 2008-08-29 2013-07-03 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及びピックアップ方法
TW201011857A (en) * 2008-09-02 2010-03-16 Gallant Prec Machining Co Ltd Peeling off method and device
CN102472790B (zh) * 2009-08-02 2015-01-28 Qmc株式会社 拾取设备以及具有该拾取设备的发光二极管芯片分选设备
WO2013171869A1 (ja) * 2012-05-17 2013-11-21 富士機械製造株式会社 ダイ剥離装置
JP6101361B2 (ja) * 2013-10-21 2017-03-22 富士機械製造株式会社 ピックアップ装置および突き上げポット
JP5888455B1 (ja) * 2015-04-01 2016-03-22 富士ゼロックス株式会社 半導体製造装置および半導体片の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100289283A1 (en) * 2006-10-18 2010-11-18 Lintec Corporation Chip Pickup Method and Chip Pickup Apparatus
WO2008053673A1 (fr) * 2006-10-31 2008-05-08 Shibaura Mechatronics Corporation Dispositif de collecte de puce à semiconducteur
TW201029093A (en) * 2008-11-12 2010-08-01 Esec Ag Method for detaching and removing a semiconductor chip from a foil
TW201207922A (en) * 2010-03-31 2012-02-16 Furukawa Electric Co Ltd Method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JP2021064813A (ja) 2021-04-22
JP7241786B2 (ja) 2023-03-17
JP2019029650A (ja) 2019-02-21
TW201911498A (zh) 2019-03-16
TW201935635A (zh) 2019-09-01
TWI677061B (zh) 2019-11-11

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