TWI684362B - 相機模組、相機模組之製造方法、攝像裝置及電子機器 - Google Patents

相機模組、相機模組之製造方法、攝像裝置及電子機器 Download PDF

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Publication number
TWI684362B
TWI684362B TW104132437A TW104132437A TWI684362B TW I684362 B TWI684362 B TW I684362B TW 104132437 A TW104132437 A TW 104132437A TW 104132437 A TW104132437 A TW 104132437A TW I684362 B TWI684362 B TW I684362B
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TW
Taiwan
Prior art keywords
frame
flexible substrate
rigid
camera module
resin
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TW104132437A
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English (en)
Chinese (zh)
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TW201620285A (zh
Inventor
土橋英一郎
若林貴博
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日商新力股份有限公司
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Publication of TW201620285A publication Critical patent/TW201620285A/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/16—Optical objectives specially designed for the purposes specified below for use in conjunction with image converters or intensifiers, or for use with projectors, e.g. objectives for projection TV
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Electromagnetism (AREA)
TW104132437A 2014-11-27 2015-10-01 相機模組、相機模組之製造方法、攝像裝置及電子機器 TWI684362B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014240054 2014-11-27
JP2014-240054 2014-11-27
JP2015-177857 2015-09-09
JP2015177857A JP6690157B2 (ja) 2014-11-27 2015-09-09 カメラモジュール、およびカメラモジュールの製造方法、撮像装置、並びに電子機器

Publications (2)

Publication Number Publication Date
TW201620285A TW201620285A (zh) 2016-06-01
TWI684362B true TWI684362B (zh) 2020-02-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW104132437A TWI684362B (zh) 2014-11-27 2015-10-01 相機模組、相機模組之製造方法、攝像裝置及電子機器

Country Status (5)

Country Link
US (1) US10181446B2 (enExample)
JP (1) JP6690157B2 (enExample)
KR (1) KR20170088344A (enExample)
CN (1) CN107112331B (enExample)
TW (1) TWI684362B (enExample)

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CN112255862B (zh) 2015-11-06 2021-10-01 Lg伊诺特有限公司 相机模组
KR102134529B1 (ko) * 2016-02-18 2020-07-15 닝보 써니 오포테크 코., 엘티디. 어레이 이미징 모듈 및 성형된 감광성 어셈블리, 회로 보드 어셈블리 및 전자 장치용 그 제조 방법
WO2018021722A1 (ko) * 2016-07-29 2018-02-01 엘지이노텍(주) 카메라 모듈 및 그 조립방법
KR102545725B1 (ko) * 2016-07-29 2023-06-20 엘지이노텍 주식회사 카메라 모듈
KR102556515B1 (ko) * 2016-08-11 2023-07-17 엘지이노텍 주식회사 카메라 모듈 및 그 조립방법
TWI746620B (zh) 2016-09-23 2021-11-21 日商索尼半導體解決方案公司 相機模組、製造方法及電子機器
CN110572537A (zh) * 2018-06-05 2019-12-13 三赢科技（深圳）有限公司 影像模组
CN111123457B (zh) * 2018-10-31 2022-06-24 三赢科技（深圳）有限公司 底座及相机模组
US10880462B2 (en) * 2019-01-30 2020-12-29 Audio Technology Switzerland S.A. Miniature video recorder
DE102019103290A1 (de) * 2019-02-11 2020-08-13 Olympus Winter & Ibe Gmbh Autoklavierfähige Elektronik für ein Endoskop, Verfahren zum Herstellen einer autoklavierfähigen Elektronik und Endoskop
JP2020150207A (ja) 2019-03-15 2020-09-17 キヤノン株式会社 電子部品およびその製造方法、機器
KR102279920B1 (ko) * 2020-02-10 2021-07-22 삼성전기주식회사 카메라 모듈
CN113766095B (zh) * 2020-06-04 2023-08-15 三赢科技（深圳）有限公司 相机模组及电子装置
CN213522042U (zh) * 2020-09-21 2021-06-22 晋城三赢精密电子有限公司 摄像装置及电子设备
CN115225804B (zh) * 2021-09-23 2024-01-16 新思考电机有限公司 图像传感器驱动装置、照相机装置及电子设备
TWI865208B (zh) 2023-11-30 2024-12-01 同欣電子工業股份有限公司 光學封裝結構及其光學晶片

Citations (3)

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US5506401A (en) * 1993-05-28 1996-04-09 Kabushiki Kaisha Toshiba Photoelectric converting device mounting apparatus with anisotropically conductive film for connecting leads of wiring board and electrode pads of photoelectric converting device and fabrication method thereof
TW200509380A (en) * 2003-08-25 2005-03-01 Renesas Tech Corp Solid state imaging device and its manufacturing method
US20060146170A1 (en) * 2003-07-08 2006-07-06 Masashi Saito Imaging device, portable terminal using the same, and image device producing method

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JP3207319B2 (ja) * 1993-05-28 2001-09-10 株式会社東芝 光電変換装置及びその製造方法
KR20030004353A (ko) * 2000-03-02 2003-01-14 올림파스 고가꾸 고교 가부시키가이샤 소형 촬상모듈
JP2001358997A (ja) * 2000-06-12 2001-12-26 Mitsubishi Electric Corp 半導体装置
JP4405062B2 (ja) * 2000-06-16 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置
JP2003298888A (ja) * 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
KR100539234B1 (ko) * 2003-06-11 2005-12-27 삼성전자주식회사 투명 고분자 소재를 적용한 씨모스형 이미지 센서 모듈 및그 제조방법
JP4852349B2 (ja) 2006-06-13 2012-01-11 新光電気工業株式会社 半導体装置および半導体装置の製造方法
JP2008312104A (ja) * 2007-06-18 2008-12-25 Panasonic Corp 固体撮像装置およびその製造方法
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KR20090128374A (ko) * 2007-04-13 2009-12-15 파나소닉 주식회사 고체촬상 장치 및 그 제조 방법
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Patent Citations (3)

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US5506401A (en) * 1993-05-28 1996-04-09 Kabushiki Kaisha Toshiba Photoelectric converting device mounting apparatus with anisotropically conductive film for connecting leads of wiring board and electrode pads of photoelectric converting device and fabrication method thereof
US20060146170A1 (en) * 2003-07-08 2006-07-06 Masashi Saito Imaging device, portable terminal using the same, and image device producing method
TW200509380A (en) * 2003-08-25 2005-03-01 Renesas Tech Corp Solid state imaging device and its manufacturing method

Also Published As

Publication number Publication date
US20170330847A1 (en) 2017-11-16
JP6690157B2 (ja) 2020-04-28
JP2016111676A (ja) 2016-06-20
TW201620285A (zh) 2016-06-01
US10181446B2 (en) 2019-01-15
CN107112331A (zh) 2017-08-29
KR20170088344A (ko) 2017-08-01
CN107112331B (zh) 2021-05-14

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