JP6690157B2 - カメラモジュール、およびカメラモジュールの製造方法、撮像装置、並びに電子機器 - Google Patents

カメラモジュール、およびカメラモジュールの製造方法、撮像装置、並びに電子機器 Download PDF

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JP6690157B2
JP6690157B2 JP2015177857A JP2015177857A JP6690157B2 JP 6690157 B2 JP6690157 B2 JP 6690157B2 JP 2015177857 A JP2015177857 A JP 2015177857A JP 2015177857 A JP2015177857 A JP 2015177857A JP 6690157 B2 JP6690157 B2 JP 6690157B2
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Japan
Prior art keywords
frame
rigid flex
camera module
resin
joint
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Active
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JP2015177857A
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English (en)
Japanese (ja)
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JP2016111676A5 (enExample
JP2016111676A (ja
Inventor
英一郎 土橋
英一郎 土橋
貴博 若林
貴博 若林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to TW104132437A priority Critical patent/TWI684362B/zh
Priority to US15/527,780 priority patent/US10181446B2/en
Priority to CN201580062574.4A priority patent/CN107112331B/zh
Priority to PCT/JP2015/082001 priority patent/WO2016084632A1/ja
Priority to KR1020177013262A priority patent/KR20170088344A/ko
Publication of JP2016111676A publication Critical patent/JP2016111676A/ja
Publication of JP2016111676A5 publication Critical patent/JP2016111676A5/ja
Application granted granted Critical
Publication of JP6690157B2 publication Critical patent/JP6690157B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/16—Optical objectives specially designed for the purposes specified below for use in conjunction with image converters or intensifiers, or for use with projectors, e.g. objectives for projection TV
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Electromagnetism (AREA)
JP2015177857A 2014-11-27 2015-09-09 カメラモジュール、およびカメラモジュールの製造方法、撮像装置、並びに電子機器 Active JP6690157B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW104132437A TWI684362B (zh) 2014-11-27 2015-10-01 相機模組、相機模組之製造方法、攝像裝置及電子機器
US15/527,780 US10181446B2 (en) 2014-11-27 2015-11-13 Camera module, imaging apparatus, and electronic instrument
CN201580062574.4A CN107112331B (zh) 2014-11-27 2015-11-13 相机模块、用于制造相机模块的方法、成像设备以及电子仪器
PCT/JP2015/082001 WO2016084632A1 (ja) 2014-11-27 2015-11-13 カメラモジュール、およびカメラモジュールの製造方法、撮像装置、並びに電子機器
KR1020177013262A KR20170088344A (ko) 2014-11-27 2015-11-13 카메라 모듈, 및 카메라 모듈의 제조 방법, 촬상 장치, 및 전자 기기

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014240054 2014-11-27
JP2014240054 2014-11-27

Publications (3)

Publication Number Publication Date
JP2016111676A JP2016111676A (ja) 2016-06-20
JP2016111676A5 JP2016111676A5 (enExample) 2018-10-11
JP6690157B2 true JP6690157B2 (ja) 2020-04-28

Family

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Family Applications (1)

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JP2015177857A Active JP6690157B2 (ja) 2014-11-27 2015-09-09 カメラモジュール、およびカメラモジュールの製造方法、撮像装置、並びに電子機器

Country Status (5)

Country Link
US (1) US10181446B2 (enExample)
JP (1) JP6690157B2 (enExample)
KR (1) KR20170088344A (enExample)
CN (1) CN107112331B (enExample)
TW (1) TWI684362B (enExample)

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CN108353121B (zh) 2015-11-06 2020-11-03 Lg伊诺特有限公司 相机模组
US10197890B2 (en) * 2016-02-18 2019-02-05 Ningbo Sunny Opotech Co., Ltd. Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
KR102545725B1 (ko) * 2016-07-29 2023-06-20 엘지이노텍 주식회사 카메라 모듈
CN109716747B (zh) * 2016-07-29 2022-10-28 Lg伊诺特有限公司 摄像机模块
KR102556515B1 (ko) * 2016-08-11 2023-07-17 엘지이노텍 주식회사 카메라 모듈 및 그 조립방법
TWI746620B (zh) 2016-09-23 2021-11-21 日商索尼半導體解決方案公司 相機模組、製造方法及電子機器
CN110572537A (zh) * 2018-06-05 2019-12-13 三赢科技（深圳）有限公司 影像模组
CN111123457B (zh) * 2018-10-31 2022-06-24 三赢科技（深圳）有限公司 底座及相机模组
US10880462B2 (en) * 2019-01-30 2020-12-29 Audio Technology Switzerland S.A. Miniature video recorder
DE102019103290A1 (de) * 2019-02-11 2020-08-13 Olympus Winter & Ibe Gmbh Autoklavierfähige Elektronik für ein Endoskop, Verfahren zum Herstellen einer autoklavierfähigen Elektronik und Endoskop
JP2020150207A (ja) 2019-03-15 2020-09-17 キヤノン株式会社 電子部品およびその製造方法、機器
KR102279920B1 (ko) 2020-02-10 2021-07-22 삼성전기주식회사 카메라 모듈
CN113766095B (zh) * 2020-06-04 2023-08-15 三赢科技（深圳）有限公司 相机模组及电子装置
CN213522042U (zh) * 2020-09-21 2021-06-22 晋城三赢精密电子有限公司 摄像装置及电子设备
CN115225804B (zh) * 2021-09-23 2024-01-16 新思考电机有限公司 图像传感器驱动装置、照相机装置及电子设备

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EP0630056B1 (en) * 1993-05-28 1998-02-18 Toshiba Ave Co., Ltd Use of anisotropically conductive film for connecting leads of wiring board with electrode pads of photoelectric converting device and mounting method of the device
JP3207319B2 (ja) * 1993-05-28 2001-09-10 株式会社東芝 光電変換装置及びその製造方法
WO2001065839A1 (en) * 2000-03-02 2001-09-07 Olympus Optical Co., Ltd. Small-sized image pickup module
JP2001358997A (ja) * 2000-06-12 2001-12-26 Mitsubishi Electric Corp 半導体装置
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JP2003298888A (ja) * 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
JP2005072978A (ja) * 2003-08-25 2005-03-17 Renesas Technology Corp 固体撮像装置およびその製造方法
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
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US7656452B2 (en) * 2003-07-08 2010-02-02 Konica Minolta Opto, Inc. Imaging device, portable terminal using the same, and image device producing method
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Also Published As

Publication number Publication date
CN107112331A (zh) 2017-08-29
KR20170088344A (ko) 2017-08-01
US20170330847A1 (en) 2017-11-16
CN107112331B (zh) 2021-05-14
US10181446B2 (en) 2019-01-15
TWI684362B (zh) 2020-02-01
TW201620285A (zh) 2016-06-01
JP2016111676A (ja) 2016-06-20

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