TWI682433B - 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法 - Google Patents

曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法 Download PDF

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Publication number
TWI682433B
TWI682433B TW106135709A TW106135709A TWI682433B TW I682433 B TWI682433 B TW I682433B TW 106135709 A TW106135709 A TW 106135709A TW 106135709 A TW106135709 A TW 106135709A TW I682433 B TWI682433 B TW I682433B
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Taiwan
Prior art keywords
substrate
exposure
processing chamber
mode
light source
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TW106135709A
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English (en)
Chinese (zh)
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TW201842543A (zh
Inventor
松尾友宏
福本靖博
大木孝文
淺井正也
春本將彥
田中裕二
中山知佐世
金山幸司
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日商斯庫林集團股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW106135709A 2017-03-01 2017-10-18 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法 TWI682433B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-038237 2017-03-01
JP2017038237A JP6872385B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法

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TW201842543A TW201842543A (zh) 2018-12-01
TWI682433B true TWI682433B (zh) 2020-01-11

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TW106135709A TWI682433B (zh) 2017-03-01 2017-10-18 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法

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JP (1) JP6872385B2 (enExample)
TW (1) TWI682433B (enExample)
WO (1) WO2018159006A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6985803B2 (ja) * 2017-03-01 2021-12-22 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法
CN120469170A (zh) 2019-09-19 2025-08-12 株式会社斯库林集团 曝光装置
WO2025110042A1 (ja) * 2023-11-22 2025-05-30 東京エレクトロン株式会社 処理装置及び処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091207A (ja) * 1998-09-14 2000-03-31 Nikon Corp 投影露光装置及び投影光学系の洗浄方法
JP2002164267A (ja) * 2000-11-22 2002-06-07 Nikon Corp 露光装置及びデバイスの製造方法
JP2015126044A (ja) * 2013-12-26 2015-07-06 ウシオ電機株式会社 真空紫外光照射処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284224A (ja) * 2000-03-30 2001-10-12 Nikon Corp 露光装置及び露光方法
JP2003115433A (ja) * 2001-10-02 2003-04-18 Nikon Corp 露光方法及び露光装置
JP4677833B2 (ja) * 2004-06-21 2011-04-27 株式会社ニコン 露光装置、及びその部材の洗浄方法、露光装置のメンテナンス方法、メンテナンス機器、並びにデバイス製造方法
JP6543064B2 (ja) * 2015-03-25 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091207A (ja) * 1998-09-14 2000-03-31 Nikon Corp 投影露光装置及び投影光学系の洗浄方法
JP2002164267A (ja) * 2000-11-22 2002-06-07 Nikon Corp 露光装置及びデバイスの製造方法
JP2015126044A (ja) * 2013-12-26 2015-07-06 ウシオ電機株式会社 真空紫外光照射処理装置

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JP6872385B2 (ja) 2021-05-19
TW201842543A (zh) 2018-12-01
JP2018146617A (ja) 2018-09-20
WO2018159006A1 (ja) 2018-09-07

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