TWI682433B - Exposure device, substrate processing apparatus, exposure method for substrate and substrate processing method - Google Patents

Abstract

An exposure device is to switch the operation mode of the exposure device with the exposure mode and the maintenance mode. In the exposure mode, the atmosphere inside the casing is exhausted from the suction device so that the oxygen concentration inside the casing becomes a lower exposure concentration than the oxygen concentration in the atmosphere. In this state, the substrate is exposed by irradiating vacuum ultraviolet rays from the light source to the substrate inside the housing. In the maintenance mode, in a state where the oxygen concentration inside the frame is higher than that in the exposure mode, ozone is generated by irradiating vacuum ultraviolet rays to the atmosphere inside the frame from the light source section.

Description

Exposure device, substrate processing device, substrate exposure method, and substrate processing method

The invention relates to an exposure device, a substrate processing device, a substrate exposure method, and a substrate processing method that perform exposure processing on a substrate.

In recent years, in order to miniaturize the pattern formed on the substrate, a photolithography technology using directed self assembly (DSA: Directed Self Assembly) of block copolymers has been continuously developed. In such a photolithography technique, after a block copolymer-coated substrate is subjected to a heat treatment, one surface of the substrate is exposed, thereby modifying the block copolymer. In this process, it is required to accurately adjust the exposure amount of the substrate.

Patent Literature 1 describes an exposure apparatus that performs exposure processing on a film (DSA film) containing an orientation self-assembly material on a substrate. The exposure device has a light emitting portion capable of emitting vacuum ultraviolet rays in a cross-sectional band shape, and is configured to be movable from the front position toward the rear position of the light emitting portion so that the substrate traverses the path of the vacuum ultraviolet rays from the light emitting portion. Before the exposure process, the illuminance of the vacuum ultraviolet rays is detected in advance by the illuminance sensor, and the moving speed of the substrate is calculated based on the detected illuminance so that the vacuum ultraviolet rays of the desired exposure amount can be irradiated. During the exposure process, the DSA film on the substrate can be irradiated with vacuum ultraviolet rays of a desired exposure amount by the substrate moving at the calculated moving speed.

[Prior Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2016-183990.

The light emitting part of the exposure device is provided with a glass plate that penetrates vacuum ultraviolet rays. When the exposure device is used for a long period of time, the foreign material composed of the organic material generated by the exposure process will adhere to the glass plate of the light emitting portion. In this case, since the glass plate becomes blurred or turbid, the light transmittance of the glass plate is reduced, and the light transmittance becomes partially non-uniform. Therefore, the efficiency and accuracy of the exposure process will decrease. On the other hand, when the maintenance operator frequently removes foreign objects that have adhered to the glass plate, the burden on the maintenance operator becomes greater. In addition, since the maintenance operation requires a long time, the operation stop time of the exposure device is prolonged, and the operation efficiency is reduced.

An object of the present invention is to provide an exposure apparatus, a substrate processing apparatus, an exposure method, and a substrate processing method that can maintain the efficiency and accuracy of exposure processing for a long period of time while reducing the burden on maintenance operators.

(1) An exposure apparatus of one aspect of the present invention is used to expose a substrate, and is provided with: a switching section to switch the operation mode of the exposure apparatus in an exposure mode and a maintenance mode; a processing chamber is provided for light transmission The window member is installed and houses the substrate to be processed in the exposure mode; the light source part is arranged to emit vacuum ultraviolet rays to the inside of the processing chamber through the window member; the exhaust part is used to exhaust the atmosphere inside the processing chamber; the first exhaust The control unit controls the exhaust unit in the exposure mode so that the oxygen concentration inside the processing chamber becomes a first concentration lower than the oxygen concentration in the atmosphere; the first projection control unit controls the process in the exposure mode When the oxygen concentration in the chamber is at the first concentration, the light source section is controlled by exposing the substrate to vacuum ultraviolet radiation to expose the substrate; and the second projection control section is in maintenance mode to process In a state where the oxygen concentration inside the chamber is a second concentration higher than the first concentration, ozone is generated by controlling the light source section to irradiate the vacuum ultraviolet ray to the atmosphere inside the processing chamber.

In this exposure apparatus, the operation mode is switched between the exposure mode and the maintenance mode. In the exposure mode, the substrate to be processed is housed inside the processing chamber where the translucent window member is mounted. The atmosphere inside the processing chamber is exhausted by the exhaust section so that the oxygen concentration inside the processing chamber becomes the first concentration lower than the oxygen concentration in the atmosphere. In this state, the substrate is exposed by irradiating vacuum ultraviolet rays to the substrate inside the processing chamber from the light source through the window member. In the maintenance mode, in a state where the oxygen concentration inside the processing chamber is a second concentration higher than the first concentration, by irradiating vacuum ultraviolet rays from the light source section through the window member to the atmosphere inside the processing chamber, the inside of the processing chamber Ozone is produced.

Since the substrate is exposed in the exposure mode, foreign substances composed of organic materials gradually adhere to the part of the window member that has been installed in the processing chamber. Even in such a case, according to the above-described configuration, the foreign matter that has adhered to the window member can be decomposed or removed by the ozone generated in the treatment chamber in the maintenance mode. Therefore, the maintenance operator does not need to frequently remove foreign matter from the window member. This reduces the burden on maintenance operators.

In addition, since the time required for maintenance operations can be shortened, the operation stop time of the exposure device is minimized. In this way, the operating efficiency of the exposure device can be improved. Moreover, since the window member is prevented from being blurred and clouded due to foreign matter, and the penetration of the window member is maintained at a high state, even when the exposure device has been used for a long period of time, It can prevent the efficiency and accuracy of the exposure process from decreasing. As a result of these, the efficiency and accuracy of the exposure process can be maintained for a long period of time while reducing the burden on the maintenance operator.

(2) The exposure device may further include: a second exhaust control unit, which controls the exhaust unit to discharge ozone generated inside the processing chamber in the maintenance mode. In this case, after the foreign matter that has adhered to the window member is removed, the ozone remaining inside the processing chamber can be easily discharged.

(3) The second concentration may also be the oxygen concentration in the atmosphere. In this case, the state of the second concentration higher than the first concentration can be easily realized in the maintenance mode.

(4) The first concentration may be an oxygen concentration that does not generate ozone according to the vacuum ultraviolet rays emitted by the light source. In this case, the substrate can be irradiated without attenuating vacuum ultraviolet rays in the exposure mode. Thereby, the efficiency of the exposure device can be improved.

(5) The exposure device may further include: a gas supply unit, which supplies an inert gas to the inside of the processing chamber in the exposure mode. In this case, the oxygen concentration inside the processing chamber in the exposure mode can be easily and sufficiently reduced.

(6) The light source unit may be configured to emit vacuum ultraviolet rays having a planar cross section. In this case, vacuum ultraviolet rays can be emitted in a wide range. Therefore, the exposure process of the substrate can be ended in a short time in the exposure mode. In addition, since a sufficient amount of ozone can be easily generated in the maintenance mode, the decomposition or removal of foreign matter that has adhered to the window member can be ended in a short time.

(7) The area of the vacuum ultraviolet rays emitted by the light source may be larger than the area of the substrate. In this case, since the entire exposure of the substrate can be performed in the exposure mode, the exposure processing of the substrate can be completed in a shorter time. In addition, in the maintenance mode, the decomposition or removal of foreign matter that has adhered to the window member can be ended in a shorter time.

(8) A substrate processing apparatus according to another aspect of the present invention includes: a coating processing section that forms a film on a substrate by applying a processing liquid to the substrate; a heat treatment section that applies a substrate formed with a film through the coating processing section Heat treatment; the exposure apparatus of one aspect of the present invention exposes the substrate heat-treated by the heat treatment section in the exposure mode; and the development processing section supplies the substrate exposed by the exposure apparatus with a solvent The film of the substrate is developed.

In this substrate processing apparatus, it is possible to apply a processing liquid to the substrate via the coating processing section, thereby forming a film on the substrate. The substrate formed with the film through the coating treatment section can be subjected to heat treatment by the heat treatment section. The substrate heat-treated by the heat treatment section can be exposed in the exposure mode by the above-mentioned exposure device. The development processing section supplies a solvent to the substrate exposed by the exposure device, thereby developing the film of the substrate.

In the exposure apparatus, since the substrate is exposed in the exposure mode, foreign substances composed of organic materials will slowly adhere to the part of the window member that has been installed in the processing chamber. Even in this case, the foreign matter that has adhered to the window member can be decomposed or removed by the ozone generated inside the processing chamber in the above-mentioned maintenance mode. With this, the efficiency and accuracy of the substrate processing by the substrate processing apparatus can be maintained for a long period of time while reducing the burden on the maintenance operator.

(9) The treatment liquid may also contain directional self-assembly materials. In this case, by heat-treating the substrate that has been coated with the treatment liquid containing the oriented self-assembly material, microphase separation can be generated on one surface of the substrate. In addition, it is possible to expose and develop a substrate in which patterns of two types of polymers are formed by microphase separation. By this, one of the two types of polymers can be removed and a fine pattern can be formed.

(10) In another aspect of the present invention, the substrate exposure method uses an exposure device to expose the substrate, and includes the steps of switching the operation mode of the exposure device between the exposure mode and the maintenance mode; in the exposure mode, processing The step of accommodating the target substrate in the interior of the processing chamber where the translucent window member is installed; In the exposure mode, the atmosphere inside the processing chamber is exhausted by the exhaust section so that the oxygen concentration inside the processing chamber becomes lower than that in the atmosphere The step of the first concentration with a lower oxygen concentration; in the exposure mode, in a state where the oxygen concentration inside the processing chamber is the first concentration, exposure is performed by irradiating vacuum ultraviolet rays from the light source section through the window member to the substrate inside the processing chamber The steps of the substrate; and in the maintenance mode, by irradiating vacuum ultraviolet rays to the atmosphere inside the processing chamber from the light source through the window member in a state where the oxygen concentration inside the processing chamber is at a second concentration higher than the first concentration Steps to generate ozone.

According to this exposure method, since the substrate is exposed in the exposure mode, the foreign material composed of the organic material slowly adheres to the part of the window member that has been installed in the processing chamber. Even in this case, the foreign matter that has adhered to the window member can be decomposed or removed by the ozone generated in the treatment chamber in the maintenance mode. With this, the efficiency and accuracy of the exposure process can be maintained for a long time while reducing the burden on the maintenance operator.

(11) A still further aspect of the substrate processing method of the present invention includes the steps of: applying a processing liquid to the substrate by the coating processing section, thereby forming a film on the substrate; forming the film through the coating processing section by the heat treatment section The step of applying heat treatment to the substrate of the film; in another aspect of the invention, the exposure method is to expose the substrate heat-treated by the heat treatment section by an exposure device in the exposure mode; The step of supplying a solvent to the substrate after exposure by the exposure device to develop the film of the substrate.

According to this substrate processing method, since the substrate is exposed in the exposure mode of the exposure device, the foreign matter composed of the organic material slowly adheres to the part of the window member that has been installed in the processing chamber. Even in this case, the foreign matter that has adhered to the window member can be decomposed or removed by the ozone generated in the processing chamber in the maintenance mode of the exposure device. With this, the efficiency and accuracy of substrate processing can be maintained for a long period of time while reducing the burden on the maintenance operator.

According to the present invention, the efficiency and accuracy of the exposure process can be maintained for a long period of time while reducing the burden on the maintenance operator.

1‧‧‧Occlusion control department

2‧‧‧ Lifting Control Department

3‧‧‧Exhaust Control Department

4‧‧‧Gas supply control department

5‧‧‧Concentration acquisition department

6‧‧‧Concentration Comparison Department

7‧‧‧ Illumination Acquisition Department

8‧‧‧Exposure calculation unit

9‧‧‧Exposure Comparison Department

10‧‧‧Projection Control Department

11‧‧‧ Switching Department

100‧‧‧Exposure device

110‧‧‧Control Department

120‧‧‧Processing room

121‧‧‧Frame

121a‧‧‧Transport opening

121b, 141a‧‧‧ opening

122‧‧‧ring member

123‧‧‧Coated member

130‧‧‧Occlusion Department

131‧‧‧stop door

131a, s1, s2, s3

132、152‧‧‧Connecting member

133, 153‧‧‧ drive device

133a, 133b, 153a, 153b ‧‧‧ position sensor

140‧‧‧Delivery Department

141‧‧‧support plate

142‧‧‧Support pin

150‧‧‧ Lifting Department

151‧‧‧ Placement board

151a‧‧‧Through hole

160‧‧‧Projection Department

161‧‧‧Housing

162‧‧‧Transparent board

163‧‧‧Light Source Department

164‧‧‧Power supply device

170‧‧‧ Replacement Department

171p, 172p, 173p‧‧‧ piping

171v, 172v, 173v

173‧‧‧Suction device

173a, 173b ‧‧‧ Manifold

180‧‧‧Measurement Department

181‧‧‧Oxygen concentration meter

182‧‧‧Ozone concentration meter

183‧‧‧illuminance meter

200‧‧‧Substrate processing device

210‧‧‧Control device

220‧‧‧Handling device

230‧‧‧heat treatment device

240‧‧‧Coating device

250‧‧‧Developing device

L1‧‧‧Base layer

L2‧‧‧Guide pattern

L3‧‧‧DSA film

LV‧‧‧ Certain value

p1, p2, p3 ‧‧‧ port

Q1, Q2‧‧‧‧pattern

W‧‧‧Substrate

FIG. 1 is a schematic cross-sectional view showing the configuration of an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a functional block diagram showing the configuration of the control unit of FIG.

FIG. 3 is a schematic diagram for explaining the operation of the exposure device in the exposure mode.

4 is a schematic diagram for explaining the operation of the exposure device in the exposure mode.

5 is a schematic diagram for explaining the operation of the exposure device in the exposure mode.

6 is a schematic diagram for explaining the operation of the exposure device in the exposure mode.

7 is a flowchart showing an example of exposure processing performed by the control unit of FIG. 2 in the exposure mode.

8 is a flowchart showing an example of exposure processing performed by the control unit of FIG. 2 in the exposure mode.

9 is a flowchart showing an example of maintenance processing performed by the control unit of FIG. 2 in the maintenance mode.

10 is a schematic block diagram showing the overall configuration of a substrate processing apparatus equipped with the exposure apparatus of FIG. 1.

(A) to (d) in FIG. 11 are schematic diagrams showing an example of substrate processing performed by the substrate processing apparatus of FIG. 10.

Hereinafter, an exposure apparatus, substrate processing apparatus, exposure method, and substrate processing method according to an embodiment of the present invention will be described using drawings. In the following description, the substrate refers to a substrate for FPD (Flat Panel Display), a substrate for optical discs such as a semiconductor substrate, a liquid crystal display device, an organic EL (Electro Luminescence) display device, etc. , Substrates for magnetic discs, substrates for magneto-optical discs, substrates for photomasks, substrates for solar cells, etc.

(1) Composition of exposure device

FIG. 1 is a schematic cross-sectional view showing the configuration of an exposure apparatus according to an embodiment of the present invention. As shown in FIG. 1, the exposure apparatus 100 includes a control unit 110, a processing chamber 120, an occlusion unit 130, a delivery unit 140, a lifting unit 150, a light projecting unit 160, a replacement unit 170, and a measuring unit 180. The control unit 110 acquires the measured value from the measurement unit 180, and controls the operations of the blocking unit 130, the elevating unit 150, the light projecting unit 160, and the replacement unit 170. The functional description of the control unit 110 will be described later.

The processing chamber 120 includes a frame 121 having an upper opening and an internal space, a ring-shaped member 122, and a covering member 123. A transport opening 121 a for transporting the substrate W to be processed between the inside and the outside of the housing 121 is formed on the side surface of the housing 121. In addition, in this embodiment, a film (hereinafter, referred to as a DSA film) containing an oriented self-assembly material is formed on the substrate W to be processed. In addition, an opening 121b through which a coupling member 152 of the elevating portion 150 described later is formed is formed on the bottom surface of the frame 121.

When the housing 161 of the light projection unit 160 described later is disposed on the upper portion of the frame 121 through the ring member 122, the upper opening of the frame 121 can be closed. Sealing members s1 and s2 are respectively installed between the casing 121 and the ring member 122 and between the ring member 122 and the housing 161. In addition, a covering member 123 is attached between the housing 121 and the housing 161 so as to cover the outer peripheral surface of the ring-shaped member 122.

The blocking portion 130 includes a shutter 131, a rod-shaped connecting member 132, and a driving device 133. The connecting member 132 connects the shutter 131 and the driving device 133. The driving device 133 is, for example, a stepping motor. The driving device 133 moves the shutter 131 between the opening position where the shutter 131 opens the conveyance opening 121a and the closing position where the shutter 131 closes the conveyance opening 121a.

A sealing member 131a is attached to the shutter 131. In the state where the shutter 131 is located at the closed position, the inside of the frame body 121 is sealed by the sealing member 131 a being in close contact with the portion surrounding the conveyance opening 121 a in the frame body 121.

In addition, in order to prevent the friction between the sealing member 131a and the frame 121, the driving device 133 moves the shutter 131 between the open position and the closed position, and the shutter 131 faces the up-down direction in a state away from the casing 121 mobile. The drive device 133 is provided with position sensors 133a and 133b that detect the upper limit position and the lower limit position of the shutter 131, respectively. The position sensors 133a and 133b provide the detection result to the control unit 110.

The delivery section 140 includes, for example, a circular plate-shaped support plate 141 and a plurality of (three in this example) support pins 142. The support plate 141 is arranged inside the housing 121 in a horizontal posture. An opening portion 141a through which a coupling member 152 of the elevating portion 150 described later passes is formed in the central portion of the support plate 141. The plurality of support pins 142 extend upward from the upper surface of the support plate 141 so as to surround the opening 141a. A substrate W to be processed can be placed on the upper end of the plurality of support pins 142.

The lifting section 150 includes a flat plate-shaped mounting plate 151, a rod-shaped connecting member 152, and a driving device 153. The placing plate 151 is arranged above the support plate 141 of the delivery section 140 in a horizontal posture inside the housing 121. The mounting plate 151 is formed with a plurality of through holes 151a corresponding to the plurality of support pins 142 of the support plate 141, respectively.

The connecting member 152 is arranged so as to extend vertically through the opening 121 b of the frame 121 and the opening 141 a of the support plate 141, and the driving device 153 is arranged below the frame 121. The connecting member 152 connects the mounting plate 151 and the driving device 153. Between the outer circumferential surface of the coupling member 152 and the inner circumferential surface of the opening 121b, a sealing member s3 that can slide the coupling member 152 in the up-down direction is arranged.

The driving device 153 is, for example, a stepping motor to place the mounting plate 151 at a processing position higher than the upper end of the plurality of support pins 142 and a standby position lower than the upper end of the plurality of support pins 142 Move up and down. In the state where the placing plate 151 is in the standby position, the plurality of support pins 142 can be inserted into the plurality of through holes 151a, respectively. The driving device 153 is installed with position sensors 153a and 153b that detect the upper limit position and the lower limit position of the mounting plate 151, respectively. The position sensors 153a and 153b provide the detection result to the control unit 110.

The light projection unit 160 includes a housing 161 having a lower opening and an internal space, a light-transmitting plate 162, a planar light source unit 163, and a power supply device 164. In this embodiment, the light-transmitting plate 162 is a quartz glass plate. As the material of the light-transmitting plate 162, other materials that penetrate the vacuum ultraviolet rays described below can also be used. As described above, the housing 161 is arranged on the upper portion of the casing 121 so as to close the opening of the upper portion of the casing 121. The light-transmitting plate 162 is attached to the housing 161 so as to close the lower opening of the housing 161. The internal space of the frame 121 and the internal space of the housing 161 are partitioned into optical access by the light-transmitting plate 162.

The light source unit 163 and the power supply device 164 are housed inside the housing 161. In this embodiment, the light source section 163 is configured by horizontally arranging a plurality of rod-shaped light sources at predetermined intervals, and the plurality of rod-shaped light sources emit vacuum ultraviolet rays having a wavelength of about 120 nm to about 230 nm. Each light source may be, for example, a xenon excimer lamp, or other excimer lamp or deuterium lamp. The light source unit 163 emits vacuum ultraviolet rays having a substantially uniform light quantity distribution into the housing 121 through the light-transmitting plate 162. The area of the emission surface of the vacuum ultraviolet rays in the light source section 163 is larger than the area of the surface of the substrate W to be processed only. The power supply device 164 supplies power to the light source unit 163.

The replacement unit 170 includes pipes 171p, 172p, 173p, valves 171v, 172v, and a suction device 173. The pipes 171p and 172p are connected between the gas supply port of the casing 121 and the supply source of the inert gas. In this embodiment, the inert gas is nitrogen, for example. Valves 171v and 172v are inserted into the piping 171p and 172p.

Inert gas is supplied from the side of the support plate 141 toward the inside of the housing 121 through the piping 171p. Inert gas is supplied into the housing 121 from below the support plate 141 through the piping 172p. The flow rate of inert gas is adjusted by valves 171v, 172v. In this embodiment, nitrogen gas is used as an inert gas.

The piping 173p is divided into a manifold 173a and a manifold 173b. The manifold 173a is connected to the exhaust port of the frame 121, and the end of the manifold 173b is disposed between the frame 121 and the shutter 131. The suction device 173 is inserted into the piping 173p. A valve 173v is inserted into the manifold 173b. The suction device 173 is, for example, an ejector. The piping 173p is connected to the exhaust equipment. The suction device 173 exhausts the atmosphere inside the housing 121 through the manifold 173a and the piping 173p. In addition, the suction device 173 discharges the atmosphere between the housing 121 and the shutter 131 through the manifold 173b and the piping 173p together with dust and the like generated by the movement of the shutter 131. The gas system discharged by the suction device 173 is harmless by the exhaust equipment.

The measurement unit 180 includes an oxygen concentration meter 181, an ozone concentration meter 182, and an illuminance meter 183. The oxygen concentration meter 181, the ozone concentration meter 182, and the illuminance meter 183 are connected to the control unit 110 through the connection ports p1, p2, and p3 provided in the housing 121, respectively. The oxygen concentration meter 181 is, for example, a Galvanic battery type oxygen sensor or a zirconia type oxygen sensor to measure the oxygen concentration inside the frame 121. The ozone concentration meter 182 measures the ozone concentration inside the housing 121.

The illuminance meter 183 includes a light receiving element such as a photo diode, and measures the illuminance of vacuum ultraviolet rays irradiated from the light source section 163 on the light receiving surface of the light receiving element. Here, the illuminance refers to the power of vacuum ultraviolet rays irradiated to each unit area of the light receiving surface. The unit of illuminance is represented by "W/m ² ", for example.

(2) Action mode

The exposure apparatus 100 selectively operates in an exposure mode in which an exposure process of the substrate W is performed, and a maintenance mode in which a maintenance process of the light-transmitting plate 162 of the light projection unit 160 is performed. In the exposure mode, exposure processing is performed by irradiating the substrate W with vacuum ultraviolet rays from the light source section 163.

However, when the oxygen concentration inside the frame 121 is high, oxygen molecules absorb vacuum ultraviolet rays and separate into oxygen atoms, and the separated oxygen atoms are re-bonded with other oxygen molecules to generate ozone. In this case, the vacuum ultraviolet rays reaching the substrate W are attenuated. Compared with the attenuation of ultraviolet rays with wavelengths longer than about 230 nm, the attenuation of vacuum ultraviolet rays is greater. Therefore, during the exposure process, the atmosphere inside the housing 121 is replaced with an inert gas by the replacement unit 170. As a result, the oxygen concentration inside the housing 121 is reduced.

When the oxygen concentration measured by the oxygen concentration meter 181 has decreased to a predetermined concentration (hereinafter, referred to as exposure concentration) lower than the oxygen concentration in the atmosphere, the substrate W is irradiated with vacuum from the light source unit 163 Ultraviolet rays. Here, the oxygen concentration in the atmosphere refers to the oxygen concentration in the atmosphere in the state where the composition adjustment is not performed, for example, the oxygen concentration in the air in the standard state. The exposure density is preferably an oxygen concentration (for example, 1%) that does not generate ozone according to the vacuum ultraviolet rays emitted from the light source 163.

When the exposure amount of the vacuum ultraviolet rays irradiated on the substrate W has reached the predetermined set exposure amount, the irradiation of the vacuum ultraviolet rays is stopped, and the exposure process is ended. Here, the exposure amount refers to the energy of vacuum ultraviolet rays irradiated to each unit area of the surface to be processed of the substrate W during the exposure process. The unit of exposure is represented by "J/m ² ", for example. Therefore, the exposure amount of vacuum ultraviolet rays can be obtained by accumulating the illuminance of vacuum ultraviolet rays measured by the illuminance meter 183.

When the substrate W is exposed to light, a foreign substance made of an organic material is generated from the substrate W, and slowly adheres to the light-transmitting plate 162 of the light-transmitting portion 160. Therefore, when the exposure apparatus 100 has been used for a long period of time, the light transmittance of the light-transmitting plate 162 decreases due to the blurring or turbidity of the light-transmitting plate 162, and the light transmittance may become partially non-uniform. Therefore, in the maintenance mode, a maintenance process is performed to remove foreign matter that has adhered to the light-transmitting plate 162.

Specifically, in the maintenance mode, the vacuum ultraviolet rays are emitted from the light source 163 in a state where the oxygen concentration inside the housing 121 is higher than the exposure concentration. In this case, ozone is generated inside the casing 121. Thereby, the foreign substances that have adhered to the light-transmitting plate 162 can be washed, decomposed, or removed by the generated ozone. After that, ozone is discharged through the suction device 173, and the maintenance process is ended. The oxygen concentration inside the frame 121 in the maintenance mode may also be the oxygen concentration in the atmosphere.

(3) Control Department

FIG. 2 is a functional block diagram showing the configuration of the control unit 110 of FIG. As shown in FIG. 2, the control unit 110 includes an occlusion control unit 1, a lift control unit 2, an exhaust control unit 3, an air supply control unit 4, a concentration acquisition unit 5, a concentration comparison unit 6, an illumination degree acquisition unit 7, an exposure The amount calculation unit 8, the exposure amount comparison unit 9, the light projection control unit 10 and the switching unit 11.

The control unit 110 is composed of, for example, a CPU (Central Processing Unit; central processing unit (that is, central processing unit)) and a memory. A control program is pre-stored in the memory of the control unit 110. The functions of each part of the control part 110 can be realized by the CPU of the control part 110 executing the control program stored in the memory.

The blocking control unit 1 controls the driving device 133 to move the shutter 131 between the blocking position and the opening position based on the detection results of the position sensors 133a and 133b in FIG. 1. The elevating control unit 2 controls the driving device 153 based on the detection results of the position sensors 153a and 153b in FIG. 1 to move the placing plate 151 between the standby position and the processing position.

The exhaust control unit 3 controls the suction device 173 and the valve 173v to exhaust the atmosphere inside the frame 121 of FIG. 1 and the atmosphere between the frame 121 and the shutter 131. The gas supply control unit 4 controls the valves 171v and 172v of FIG. 1 to supply inert gas.

The concentration obtaining unit 5 obtains the value of the oxygen concentration measured by the oxygen concentration meter 181 of FIG. 1. The concentration comparison unit 6 compares the oxygen concentration and the exposure concentration measured by the concentration acquisition unit 5.

The illuminance obtaining unit 7 obtains the value of the illuminance of the vacuum ultraviolet rays measured by the illuminance meter 183 of FIG. 1. The exposure amount calculation unit 8 calculates the exposure amount of the vacuum ultraviolet rays irradiated on the substrate W based on the illumination degree of the vacuum ultraviolet rays acquired by the illumination degree acquisition unit 7 and the emission time of the vacuum ultraviolet rays from the light source unit 163 of FIG. 1 . The exposure amount comparison unit 9 compares the exposure amount calculated by the exposure amount calculation unit 8 with a predetermined set exposure amount.

The light projection control unit 10 controls the power supply device 164 based on the comparison result by the concentration comparison unit 6 and the comparison result by the exposure amount comparison unit 9 so that the light source unit 163 of FIG. 1 emits vacuum ultraviolet rays. In addition, the light projection control unit 10 controls the power supply device 164 so that the light source unit 163 emits vacuum ultraviolet rays only at a predetermined time (hereinafter, referred to as washing time) at a predetermined time. Furthermore, the light projection control unit 10 supplies the control time of the power supply device 164 to the exposure amount calculation unit 8 as the emission time of the vacuum ultraviolet rays from the light source unit 163.

The switching unit 11 switches the operation mode of the exposure apparatus 100 between the exposure mode and the maintenance mode. Specifically, the switching unit 11 switches the operation mode so that the exposure apparatus 100 operates in the maintenance mode while not operating in the exposure mode. Each unit of the control unit 110 operates in the operation mode switched by the switching unit 11. The details of the operation of each part of the control unit 110 in the exposure mode and the maintenance mode will be described later.

The switching unit 11 may switch the operation mode from the exposure mode to the maintenance mode when the predetermined number of substrates W are exposed in the exposure mode or when a predetermined time has passed in the exposure mode. In addition, the switching unit 11 may switch the operation mode from the maintenance mode to the exposure mode when the maintenance process has been completed in the maintenance mode.

(4) Exposure processing

3 to 6 are schematic diagrams for explaining the operation of the exposure apparatus 100 in the exposure mode. In FIGS. 3 to 6, in order to easily recognize the structure inside the casing 121 and the inside of the casing 161, illustration of some constituent elements is omitted, and the outlines of the casing 121 and the casing 161 are displayed with a dotted line. 7 and 8 are flowcharts showing an example of exposure processing performed by the control unit 110 of FIG. 2 in the exposure mode. Hereinafter, the exposure process by the control unit 110 will be described with reference to FIGS. 3 to 6.

As shown in FIG. 3, in the initial state of the exposure process, the shutter 131 is located at the closed position, and the placement plate 151 is located at the standby position. In addition, the oxygen concentration inside the casing 121 is measured normally or periodically by the oxygen concentration meter 181, and is obtained by the concentration obtaining unit 5. At this time, the oxygen concentration inside the housing 121 measured by the oxygen concentration meter 181 is equal to the oxygen concentration in the atmosphere.

First, as shown in FIG. 4, the blocking control unit 1 moves the shutter 131 to the open position (step S1). With this, the substrate W to be processed can be placed on the upper end of the plurality of support pins 142 through the transport opening 121a. In this example, the substrate W is placed on the upper end of the plurality of support pins 142 by the transfer device 220 of FIG. 10 described later.

Next, the lift control unit 2 determines whether the substrate W has been placed on the upper end of the plurality of support pins 142 (step S2). When the substrate W is not placed, the lift control unit 2 stands by until the substrate W is placed on the upper end of the plurality of support pins 142. When the substrate W is placed, as shown in FIG. 5, the lift control unit 2 moves the shutter 131 to the closed position (step S3 ).

Next, the exhaust control unit 3 exhausts the atmosphere inside the housing 121 by the suction device 173 of FIG. 1 (step S4). In addition, the gas supply control unit 4 supplies the inert gas to the inside of the housing 121 through the pipes 171p and 172p of FIG. 1 (step S5). The processing of steps S4 and S5 may be started regardless of which one is started first, or may be started at the same time. Thereafter, as shown in FIG. 6, the elevating control unit 2 moves the placing plate 151 to the processing position (step S6). Thereby, the substrate W can be delivered from the plurality of support pins 142 to the mounting plate 151 and is adjacent to the light-transmitting plate 162.

Here, the density comparison unit 6 determines whether or not the oxygen concentration inside the casing 121 has decreased to the exposure density (step S7). When the oxygen concentration has not decreased to the exposure concentration, the concentration comparison unit 6 stands by until the oxygen concentration decreases to the exposure concentration. When the oxygen concentration has decreased to the exposure concentration, the light projection control unit 10 emits vacuum ultraviolet rays through the light source unit 163 (step S8). As a result, the vacuum ultraviolet rays are irradiated from the light source portion 163 through the light-transmitting plate 162 to the substrate W, and the DSA film formed on the surface to be processed is exposed.

In addition, the illuminance obtaining unit 7 causes the illuminance meter 183 to start the measurement of the illuminance of vacuum ultraviolet rays, and obtains the measured illuminance from the illuminance meter 183 (step S9). The processes of steps S8 and S9 are started almost simultaneously. The exposure amount calculation unit 8 calculates the exposure amount of the vacuum ultraviolet rays irradiated on the substrate W by integrating the illuminance of the vacuum ultraviolet rays acquired by the illumination degree acquisition unit 7 (step S10).

Next, the exposure amount comparison unit 9 determines whether the exposure amount calculated by the exposure amount calculation unit 8 has reached the set exposure amount (step S11). When the exposure amount does not reach the set exposure amount, the exposure amount comparison unit 9 stands by until the exposure amount reaches the set exposure amount. When the exposure amount has reached the set exposure amount, the light projection control unit 10 stops the emission of vacuum ultraviolet rays from the light source unit 163 (step S12). In addition, the illuminance acquisition unit 7 stops the measurement of the illuminance by the illuminance meter 183 (step S13).

Next, as shown in FIG. 5, the elevating control unit 2 moves the placing plate 151 to the standby position (step S14). Thereby, the substrate W can be delivered from the mounting plate 151 to the plurality of support pins 142. Next, the exhaust control unit 3 stops the exhaust of the atmosphere inside the housing 121 by the suction device 173 (step S15). In addition, the gas supply control unit 4 stops the supply of inert gas from the pipes 171p and 172p to the inside of the housing 121 (step S16). The processing of steps S14 to S16 can be started no matter which one is started first, or can be started at the same time.

Thereafter, as shown in FIG. 4, the blocking control unit 1 moves the shutter 131 to the open position (step S17). Thereby, the exposed substrate W can be recovered from the plurality of support pins 142 through the transport opening 121a. In this example, the substrate W is recovered from the plurality of support pins 142 by the transfer device 220 of FIG. 10 described later.

Next, the occlusion control unit 1 determines whether the substrate W has been recovered from the plurality of support pins 142 (step S18). When the substrate W is not recovered, the blocking control unit 1 stands by until the substrate W is recovered from the plurality of support pins 142. When the substrate W has been recovered, as shown in FIG. 3, the blocking control unit 1 moves the shutter 131 to the blocking position (step S19), and ends the exposure process. By repeating the above-mentioned operations, a plurality of substrates W can be sequentially exposed.

(5) Maintenance mode

9 is a flowchart showing an example of maintenance processing performed by the control unit 110 of FIG. 2. Hereinafter, the maintenance process by the control unit 110 will be described with reference to FIGS. 3 and 9. As shown in FIG. 3, in the initial state of the maintenance process, the shutter 131 is located at the closed position, and the placement plate 151 is located at the standby position. In addition, the oxygen concentration inside the casing 121 is measured normally or periodically by the oxygen concentration meter 181, and is obtained by the concentration obtaining unit 5. At this time, it was measured by the oxygen concentration meter 181. The oxygen concentration inside the casing 121 is equal to the oxygen concentration in the atmosphere.

First, the light projection control unit 10 emits vacuum ultraviolet rays through the light source unit 163 (step S21). In this case, the vacuum ultraviolet rays are irradiated from the light source part 163 through the light-transmitting plate 162 to the oxygen molecules inside the frame 121, and ozone is generated inside the frame 121. Thereby, the foreign matter that has adhered to the light-transmitting plate 162 can be washed, decomposed, or removed by the generated ozone. Furthermore, in step S21, the mounting plate 151 may also be moved to the processing position, and the vacuum ultraviolet rays may be emitted in a state of being adjacent to the light-transmitting plate 162. In this case, foreign objects can be efficiently washed, decomposed or removed in a narrow space.

Next, the light projection control unit 10 determines whether the washing time has elapsed (step S22). When the washing time has not elapsed, the light projection control unit 10 stands by until the washing time elapses. When the washing time has elapsed, the light projection control unit 10 stops the emission of vacuum ultraviolet rays from the light source unit 163 (step S23).

Next, the exhaust control unit 3 exhausts the atmosphere inside the housing 121 by the suction device 173 of FIG. 1 (step S24). In addition, the air supply control unit 4 supplies inert gas into the housing 121 from the pipes 171p and 172p of FIG. 1 (step S25). The processing of steps S24 and 25 can be started irrespective of which one is started first, or can be started at the same time. Thereby, the ozone generated inside the frame 121 can be discharged through the suction device 173, and the ozone can be prevented from diffusing to the periphery of the exposure device 100. Thereafter, the blocking control unit 1 moves the shutter 131 to the open position (step S26). As a result, outside air is introduced into the inside of the casing 21, and the oxygen concentration inside the casing 121 increases.

Here, the concentration comparison unit 6 determines whether the oxygen concentration inside the casing 121 has increased to a predetermined value or more (step S27). When the oxygen concentration does not increase to a predetermined value or more, the concentration comparison unit 6 stands by until the oxygen concentration increases to a predetermined value or more. When the oxygen concentration has increased to a predetermined value or more, the exhaust control unit 3 stops the exhaust of the atmosphere inside the housing 121 by the suction device 173 (step S28). In addition, the gas supply control unit 4 stops the supply of inert gas from the pipes 171p and 172p to the inside of the housing 121 (step S29). The processing of steps S28 and S29 may be started regardless of which one is started first, or may be started at the same time. Finally, the blocking control unit 1 moves the shutter 131 to the blocking position (step S30), and ends the maintenance process.

(6) Substrate processing device

FIG. 10 is a schematic block diagram showing the overall configuration of the substrate processing apparatus provided with the exposure apparatus 100 of FIG. 1. In the substrate processing apparatus 200 described below, a process using directed self-assembly (DSA) of block copolymers is performed. Specifically, a processing liquid containing an oriented self-assembly material is coated on the surface to be processed of the substrate W. After that, two types of polymer patterns are formed on the processed surface of the substrate W by micro-phase separation generated by the directional self-assembly material. One of the two types of polymers is removed by a solvent.

The treatment liquid containing the directed self-assembly material is called DSA liquid. In addition, a process of removing one of the two types of polymer patterns formed on the surface to be processed of the substrate W by microphase separation is called a development process, and a solvent used for the development process is called a developer.

As shown in FIG. 10, the substrate processing apparatus 200 includes a control device 210, a conveying device 220, a heat treatment device 230, a coating device 240, and a developing device 250 in addition to the exposure device 100. The control device 210 includes, for example, a CPU and a memory, or a microcomputer to control the operations of the transport device 220, the heat treatment device 230, the coating device 240, and the developing device 250. In addition, the control device 210 provides the control unit 110 with instructions for controlling the operations of the blocking unit 130, the elevating unit 150, the light projecting unit 160, and the replacement unit 170 of the exposure apparatus 100 of FIG.

The conveying device 220 conveys the substrate W between the exposure device 100, the heat treatment device 230, the coating device 240, and the developing device 250 while holding the substrate W to be processed. The heat treatment device 230 performs the heat treatment of the substrate W before and after the coating process by the coating device 240 and the development process by the developing device 250.

The coating device 240 performs the coating process of the film by supplying DSA liquid to the processed surface of the substrate W. In this embodiment, as the DSA liquid, a block copolymer composed of two types of polymers is used. Examples of the combination of the two types of polymers include polystyrene-polymethyl methacrylate (PS-PMMA) and polystyrene-polydimethylsiloxane (PS). -PDMS), polystyrene-poly(ferrocenyl dimethylsilane): PS-PFS), polystyrene-polyethylene oxide (PS-PEO), polybenzene Polyvinylpyrrolidone (polyvinylpyrrolidone: PS-PVP), polystyrene-polyhydroxystyrene (polyhydroxystyrene: PS-PHOST), and polymethyl methacrylate-polymethyl acrylate polyhedron polysiloxane (polymethyl methacrylate-polymethacrylate polyhedral oligomeric silsesquioxane: PMMA-PMAPOSS) etc.

The developing device 250 performs the developing process of the film by supplying the developing solution to the processed surface of the substrate W. Examples of the solvent of the developing solution include toluene, heptane, acetone, propylene glycol monomethyl ether acetate (PGMEA), and propylene glycol monomethyl ether: PGME. ), cyclohexanone, acetic acid, tetrahydrofuran, isopropyl alcohol (IPA) or tetramethyl ammonium hydroxide (TMAH), etc.

FIG. 11 is a schematic diagram showing an example of the processing of the substrate W by the substrate processing apparatus 200 of FIG. 10. In FIG. 11, the state of the substrate W that changes each time the process is performed is shown in a cross-sectional view. In this example, as the initial state before the substrate W is carried into the substrate processing apparatus 200, as shown in FIG. 11(a), the base layer L1 is formed so as to cover the processed surface of the substrate W, and the base layer A guide pattern L2 composed of, for example, photoresist is formed on L1. Hereinafter, the operation of the substrate processing apparatus 200 will be described using FIGS. 10 and 11.

The transfer device 220 transfers the substrate W to be processed to the heat treatment device 230 and the coating device 240 in this order. In this case, in the heat treatment device 230, the temperature of the substrate W is adjusted to a temperature already suitable for the formation of the DSA film L3. In addition, in the coating device 240, a DSA solution is supplied to the surface of the substrate W to be processed, and coating processing is performed. As a result, as shown in FIG. 11( b ), a DSA film L3 composed of two types of polymers is formed in the region on the base layer L1 where the guide pattern L2 is not formed.

Next, the transfer device 220 transfers the substrate W on which the DSA film L3 is formed to the heat treatment device 230 and the exposure device 100 in this order. In this case, in the heat treatment device 230, by performing the heat treatment of the substrate W, micro-phase separation occurs in the DSA film L3. Thereby, as shown in (c) of FIG. 11, a pattern Q1 composed of one polymer and a pattern Q2 composed of the other polymer are formed. In this example, the linear pattern Q1 and the linear pattern Q2 are aligned so as to follow the guide pattern L2.

Thereafter, in the heat treatment apparatus 230, the substrate W is cooled. In addition, in the exposure apparatus 100, the entire DSA film L3 after the micro-phase separation is irradiated with vacuum ultraviolet rays for modifying the DSA film L3, and an exposure process is performed. Thereby, the bond between one polymer and the other polymer can be cut, and the pattern Q1 and the pattern Q2 can be separated.

Next, the conveying device 220 conveys the substrate W after the exposure processing by the exposure device 100 to the heat treatment device 230 and the developing device 250 in order. In this case, in the heat treatment device 230, the substrate W is cooled. In addition, in the developing device 250, a developing solution is supplied to the DSA film L3 on the substrate W, and a development process is performed. With this, as shown in (d) of FIG. 11, the pattern Q1 is removed, and finally the pattern Q2 remains on the substrate W. Finally, the conveying device 220 collects the development-processed substrate W from the developing device 250.

(7) Efficacy

In the exposure apparatus 100 of the present invention, the operation mode can be switched between the exposure mode and the maintenance mode. Since the substrate W is exposed in the exposure mode, foreign substances composed of organic materials gradually adhere to the portion of the light-transmitting plate 162 that is in contact with the processing chamber 120. Even in such a case, the foreign matter that has adhered to the light-transmitting plate 162 can be decomposed or removed by the ozone generated inside the processing chamber 120 in the maintenance mode. Therefore, the maintenance operator does not need to frequently remove foreign matter from the light-transmitting plate 162. Thereby reducing the burden on maintenance operators.

In addition, since the time required for maintenance operations can be shortened, the operation stop time of the exposure apparatus 100 is minimized. Thereby, the operation efficiency of the exposure device 100 can be improved. Moreover, since the blurring and turbidity of the light-transmitting plate 162 due to foreign matter can be prevented, and the transparency of the light-transmitting plate 162 can be maintained at a high state, even if the exposure apparatus 100 has been used for a long period of time Under the circumstances, it is still possible to prevent the efficiency and accuracy of the exposure process from decreasing. As a result of these, the efficiency and accuracy of the exposure process can be maintained for a long period of time while reducing the burden on the maintenance operator.

(8) Other embodiments

(a) In the above embodiment, although the DSA liquid is used as the treatment liquid, the present invention is not limited to this. Other treatment fluids different from DSA fluids can also be used.

(b) In the above embodiment, although the exit surface of the vacuum ultraviolet rays is larger than the surface to be processed of the substrate W, and the substrate W is fully exposed, the present invention is not limited to this. The exit surface of the vacuum ultraviolet rays may be smaller than the surface to be treated of the substrate W, or it may emit vacuum ultraviolet rays that do not have a planar cross section but have a linear cross section. In this case, the entire surface of the substrate W to be treated can be irradiated with vacuum ultraviolet rays by relatively moving the exit surface of the vacuum ultraviolet rays and the surface to be treated of the substrate W.

(c) In the above embodiment, although the inert gas is supplied to the inside of the housing 121 during the exposure process, the present invention is not limited to this. In the case where the oxygen concentration inside the housing 121 can be sufficiently reduced during the exposure process, the inert gas may not be supplied into the housing 121.

(d) In the above embodiment, although the oxygen concentration inside the casing 121 in the maintenance mode is the oxygen concentration in the atmosphere, the present invention is not limited to this. The oxygen concentration inside the frame 121 in the maintenance mode may be higher or lower than the oxygen concentration in the atmosphere.

(9) Correspondence between each component of the request item and each part of the embodiment

Hereinafter, although an example of correspondence between each component of the request item and each component of the embodiment is described, the present invention is not limited to the following examples.

In the above embodiment, the substrate W is an example of a substrate, the exposure apparatus 100 is an example of an exposure apparatus, the light-transmitting plate 162 is an example of a window member, the processing chamber 120 is an example of a processing chamber, and the light source section 163 is an example of a light source section. The suction device 173 is an example of an exhaust unit, the exhaust control unit 3 is an example of a first exhaust control unit and a second exhaust control unit, and the light projection control unit 10 is a first light projection control unit and a second light projection As an example of the control unit, the pipes 171p and 172p are examples of the air supply unit. The coating device 240 is an example of a coating processing part, the heat treatment device 230 is an example of a heat treatment part, the developing device 250 is an example of a development processing part, and the substrate processing device 200 is an example of a substrate processing device.

As each constituent element of the request item, other various constituent elements having the configuration or function described in the request item can also be used.

100‧‧‧Exposure device

110‧‧‧Control Department

120‧‧‧Processing room

121‧‧‧Frame

121a‧‧‧Transport opening

121b, 141a‧‧‧ opening

122‧‧‧ring member

123‧‧‧Coated member

130‧‧‧Occlusion Department

131‧‧‧stop door

131a, s1, s2, s3

132、152‧‧‧Connecting member

133, 153‧‧‧ drive device

133a, 133b, 153a, 153b ‧‧‧ position sensor

140‧‧‧Delivery Department

141‧‧‧support plate

142‧‧‧Support pin

150‧‧‧ Lifting Department

151‧‧‧ Placement board

151a‧‧‧Through hole

160‧‧‧Projection Department

161‧‧‧Housing

162‧‧‧Transparent board

163‧‧‧Light Source Department

164‧‧‧Power supply device

170‧‧‧ Replacement Department

171p, 172p, 173p‧‧‧ piping

171v, 172v, 173v

173‧‧‧Suction device

173a, 173b ‧‧‧ Manifold

180‧‧‧Measurement Department

181‧‧‧Oxygen concentration meter

182‧‧‧Ozone concentration meter

183‧‧‧illuminance meter

p1, p2, p3 ‧‧‧ port

W‧‧‧Substrate

Claims (11)

An exposure device is used to expose a substrate, and is provided with: a switching part to switch the operation mode of the exposure device in an exposure mode and a maintenance mode; a processing chamber is provided for installing a transparent window member, and The substrate to receive the processing object in the exposure mode; the light source part is arranged to emit vacuum ultraviolet rays to the inside of the processing chamber through the window member; the mounting part is used to mount the substrate and is arranged on the light source part in the processing chamber Lower part; exhaust part for exhausting the atmosphere inside the processing chamber; the first exhaust control part, in the exposure mode, controls the exhaust part so that the oxygen concentration in the processing chamber becomes lower than that in the atmosphere The first concentration with a lower concentration; the first projection control unit is in the exposure mode, with the oxygen concentration inside the processing chamber being the first concentration, by the substrate inside the processing chamber The light source unit is controlled by irradiating vacuum ultraviolet rays to expose the substrate; the second light projection control unit is in a state where the oxygen concentration inside the processing chamber is a second concentration higher than the first concentration in the maintenance mode , Controlling the light source section in such a way that ozone is generated by irradiating vacuum ultraviolet rays to the atmosphere inside the treatment chamber; and The lift control unit controls the placement part to move the placement part to the first position when the substrate is delivered between the processing chamber and the outside, and in the exposure mode, the substrate is irradiated with vacuum from the light source part In the case of ultraviolet rays, the placement part is controlled to move the placement part to the second position above the first position, and in the maintenance mode, the vacuum light is irradiated to the atmosphere inside the processing chamber from the light source part. The mounting portion moves the mounting portion to the second position. The exposure apparatus according to claim 1, further comprising: a second exhaust control unit that controls the exhaust unit to discharge ozone generated inside the processing chamber in the maintenance mode. The exposure apparatus according to claim 1 or 2, wherein the second concentration is an oxygen concentration in the atmosphere. The exposure apparatus according to claim 1 or 2, wherein the first concentration is an oxygen concentration that does not generate ozone according to vacuum ultraviolet rays emitted from the light source section. The exposure apparatus according to claim 1 or 2, further comprising: a gas supply unit which supplies an inert gas to the inside of the processing chamber in the exposure mode. The exposure apparatus according to claim 1 or 2, wherein the light source section is configured to emit vacuum ultraviolet rays having a planar cross section. The exposure apparatus according to claim 6, wherein the area of the vacuum ultraviolet rays emitted by the light source section is larger than the area of the substrate. A substrate processing apparatus comprising: a coating processing section that forms a film on a substrate by applying a processing liquid to the substrate; a heat treatment section that applies heat treatment to a substrate formed with a film through the coating processing section; claim 1 or 2 The exposure apparatus described is to expose the substrate heat-treated by the heat treatment section in the exposure mode; and the development processing section is to develop the film of the substrate by supplying a solvent to the substrate exposed by the exposure apparatus . The substrate processing apparatus according to claim 8, wherein the processing liquid contains a directional self-assembly material. A substrate exposure method that uses an exposure device to expose a substrate, and includes: a step of switching the operation mode of the aforementioned exposure device in an exposure mode and a maintenance mode; when the substrate is carried into a processing chamber in which a translucent window member is installed The step of moving the placing portion provided below the light source portion to the first position; the step of storing the substrate to be processed in the processing chamber in the exposure mode; In the aforementioned exposure mode, the step of discharging the atmosphere inside the processing chamber by the exhaust section so that the oxygen concentration inside the processing chamber becomes a first concentration lower than the oxygen concentration in the atmosphere; in the aforementioned exposure mode, In the state where the oxygen concentration inside the processing chamber is the first concentration, a step of exposing the substrate by irradiating vacuum ultraviolet rays to the substrate inside the processing chamber through the window member from the light source section; in the exposure mode, in The step of moving the mounting part to a second position above the first position when irradiating vacuum ultraviolet rays from the light source part to the substrate; moving the mounting part to the first position when the substrate is carried out from the processing chamber In the maintenance mode, in a state where the oxygen concentration inside the processing chamber is a second concentration higher than the first concentration, the atmosphere inside the processing chamber is passed from the light source section through the window member A step of irradiating vacuum ultraviolet rays to generate ozone; and a step of moving the placement section to the second position when irradiating vacuum ultraviolet rays from the light source section to the atmosphere inside the processing chamber in the maintenance mode. A substrate processing method including: a step of applying a processing liquid to a substrate by a coating processing portion, thereby forming a film on the substrate; A step of applying a heat treatment to the substrate formed with the film through the coating treatment section by the heat treatment section; the substrate exposure method described in claim 10 is a heat treatment performed by the exposure apparatus by the exposure device in the exposure mode The substrate is exposed to light; and a step of developing a film of the substrate by supplying a solvent to the substrate exposed by the exposure device by a development processing section.

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