JP6894281B2 - Exposure equipment, substrate processing equipment, substrate exposure method and substrate processing method - Google Patents

Description

The present invention relates to an exposure apparatus for exposing a substrate, a substrate processing apparatus, an exposure method for a substrate, and a substrate processing method.

In recent years, in order to miniaturize the pattern formed on a substrate, the development of a photolithography technique using the directed self assembly (DSA) of a block copolymer has been promoted. In such a photolithography technique, the block polymer is modified by exposing one surface of the substrate after heat treatment is applied to the substrate coated with the block polymer. In this process, it is required to accurately adjust the exposure amount of the substrate.

Patent Document 1 describes an exposure apparatus that performs an exposure process on a film (DSA film) containing an inductive self-assembling material on a substrate. The exposure apparatus has a light emitting portion capable of emitting vacuum ultraviolet rays having a strip-shaped cross section, and is configured to be movable from a front position to a rear position of the light emitting portion so that the substrate crosses the path of the vacuum ultraviolet rays from the light emitting portion. To. Before the exposure process, the illuminance of the vacuum ultraviolet rays is detected in advance by the illuminance sensor, and the moving speed of the substrate is calculated based on the detected illuminance so that the vacuum ultraviolet rays of a desired exposure amount are irradiated. During the exposure process, the substrate moves at the calculated moving speed, so that the DSA film on the substrate is irradiated with a desired exposure amount of vacuum ultraviolet rays.

Japanese Unexamined Patent Publication No. 2016-183990

In the exposure process, the substrate is heated by irradiating the substrate with vacuum ultraviolet rays, and the temperature of the substrate rises. When the substrate having a high temperature is carried out from the exposure apparatus by the holding portion of the conveying device, the temperature of the holding portion of the conveying device rises. In this case, the temperature of the other substrate conveyed by the holding portion of the exposure apparatus also rises. Fluctuations in the temperature of the substrate affect the uniformity of substrate processing. Therefore, after the temperature of the substrate drops to a predetermined temperature (for example, 50 degrees) or less in the exposure apparatus, the substrate is carried out from the exposure apparatus. However, since it takes time for the temperature of the substrate to drop to a predetermined temperature or lower, the efficiency of the exposure process of the substrate is lowered.

An object of the present invention is to provide an exposure apparatus, a substrate processing apparatus, an exposure method, and a substrate processing method capable of improving the efficiency of exposure processing of a substrate.

(1) The exposure apparatus according to the first invention has a processing chamber for accommodating a substrate, a mounting portion on which the substrate is placed in the processing chamber, an exhaust portion for exhausting the atmosphere in the processing chamber, and vacuum ultraviolet rays. The light source unit that emits light and the mounting unit are in the first position in the processing chamber when the substrate is carried in and out of the processing room, and when the light source unit irradiates the substrate with vacuum ultraviolet rays. The drive unit that moves the mounting unit to the first position and the second position and the mounting unit are at least so that the mounting unit is in the second position closer to the light source unit than the first position. A cooling unit that cools the mounting unit when it is in the first position and does not cool the mounting unit when it is in the second position, a contact member that contacts the mounting unit in the first position, and a contact member. A plurality of support members extending upward from the light source are provided, the plurality of support members support the substrate when the mounting portion is in the first position, and a cooling portion is provided on the contact member so as to cool the contact member. is, the driving unit, Ru a placing part after the emission of vacuum ultraviolet rays by the light source unit is started to move from the first position to the second position.

In this exposure apparatus, the substrate is housed in the processing chamber. The drive unit moves the mounting portion to the first position so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber. The cooling section cools the mounting section when the mounting section is in at least the first position. In the processing chamber, the substrate is placed on the mounting portion. Vacuum ultraviolet rays are emitted by the light source unit. When the light source unit irradiates the substrate with vacuum ultraviolet rays, the mounting unit is moved to the second position by the driving unit so that the mounting unit is in the second position closer to the light source unit than the first position. To. The drive unit moves the mounting unit to the first position so that the mounting unit is in the first position in the processing chamber when the substrate is carried out of the processing room.

According to this configuration, when the light source unit irradiates the substrate with vacuum ultraviolet rays, the substrate is placed close to the light source unit in a state of being mounted on the mounting unit. Here, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate.

Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.

Further, the exposure apparatus further includes a contact member that comes into contact with the mounting portion at the first position, and the cooling portion is provided on the contact member so as to cool the contact member. In this case, the mounting portion is cooled by the cooling portion via the contact member by coming into contact with the contact member at the first position. Therefore, it is not necessary to provide the cooling unit in the mounting unit, and it is not necessary to connect the driving device for driving the cooling unit to the cooling unit provided in the mounting unit. This makes it possible to simplify the configuration for moving the mounting portion between the first position and the second position.
Further, the drive unit moves the mounting unit from the first position to the second position after the emission of the vacuum ultraviolet rays by the light source unit is started. In this case, the time point at which the mounting portion moves from the first position to the second position is later than the time point at which the light source unit starts emitting the vacuum ultraviolet rays. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.
(2) The drive unit may move the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped. In this case, the time point at which the mounting portion moves from the second position to the first position is before the time point at which the emission of the vacuum ultraviolet rays by the light source unit is stopped. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.
(3) The exposure apparatus according to the second invention emits a processing chamber for accommodating a substrate, a mounting portion on which the substrate is placed in the processing chamber, an exhaust portion for exhausting the atmosphere in the processing chamber, and vacuum ultraviolet rays. The light source unit that emits light and the mounting unit are in the first position in the processing chamber when the substrate is carried in and out of the processing room, and when the light source unit irradiates the substrate with vacuum ultraviolet rays. The drive unit that moves the mounting unit to the first position and the second position, and the mounting unit are at least so that the mounting unit is in the second position closer to the light source unit than the first position. A cooling unit that cools the mounting unit when it is in the first position and does not cool the mounting unit when it is in the second position, a contact member that contacts the mounting unit in the first position, and a contact member. A plurality of support members extending upward from the light source are provided, the plurality of support members support the substrate when the mounting portion is in the first position, and a cooling portion is provided on the contact member so as to cool the contact member. The drive unit moves the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped.
According to this configuration, when the light source unit irradiates the substrate with vacuum ultraviolet rays, the substrate is placed close to the light source unit in a state of being mounted on the mounting unit. Here, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate.
Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.
Further, the exposure apparatus further includes a contact member that comes into contact with the mounting portion at the first position, and the cooling portion is provided on the contact member so as to cool the contact member. In this case, the mounting portion is cooled by the cooling portion via the contact member by coming into contact with the contact member at the first position. Therefore, it is not necessary to provide the cooling unit in the mounting unit, and it is not necessary to connect the driving device for driving the cooling unit to the cooling unit provided in the mounting unit. This makes it possible to simplify the configuration for moving the mounting portion between the first position and the second position.
Further, the drive unit moves the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped. In this case, the time point at which the mounting portion moves from the second position to the first position is before the time point at which the emission of the vacuum ultraviolet rays by the light source unit is stopped. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.

( 4 ) The mounting portion may have a lower surface, and the contact member may have a contact surface that comes into contact with the lower surface of the mounting portion when the mounting portion is cooled. In this case, heat is transferred from the mounting portion to the contact member over a wide range. As a result, the mounting portion can be efficiently cooled.

( 5 ) The light source unit is arranged above the mounting unit, emits vacuum ultraviolet rays downward, the second position is below the light source unit, and the first position is below the second position. The drive unit may move the mounting unit up and down between the first position and the second position. In this case, by lowering the mounting portion to the first position, the substrate can be easily carried into the processing chamber or the substrate can be easily carried out of the processing chamber without interfering with the light source portion. it can. Further, by raising the mounting portion to the second position while the substrate is mounted, the substrate and the light source portion can be easily brought close to each other.

( 6 ) The cooling unit may be arranged below the mounting unit and may come into contact with the mounting unit when the mounting unit is in the first position. In this case, by lowering the mounting portion to the first position, the mounting portion can be brought into contact with the cooling portion to be easily cooled.

( 7 ) The upper ends of the plurality of support members are higher than the first position and lower than the second position, and the mounting portion has a plurality of through holes through which the plurality of support members can pass, and the plurality of supports. The member may penetrate a plurality of through holes in the mounting portion when the mounting portion is in the first position.

In this case, the plurality of support members can support the substrate carried into the processing chamber at the upper end higher than the first position and lower than the second position. Therefore, the substrate can be easily mounted on the mounting portion by raising the mounting portion from the first position. Further, the substrate can be supported by the upper ends of the plurality of support members by lowering the mounting portion from the second position. As a result, the substrate can be easily carried out of the processing chamber from the upper ends of the plurality of support members.

( 8 ) The exposure apparatus according to the third invention emits a processing chamber for accommodating a substrate, a mounting portion on which the substrate is placed in the processing chamber, an exhaust portion for exhausting the atmosphere in the processing chamber, and vacuum ultraviolet rays. The light source unit that emits light and the mounting unit are in the first position in the processing chamber when the substrate is carried in and out of the processing room, and when the light source unit irradiates the substrate with vacuum ultraviolet rays. The drive unit that moves the mounting unit to the first position and the second position and the mounting unit are cooled so that the mounting unit is in the second position closer to the light source unit than the first position. A cooling unit provided in the mounting portion, a contact member that contacts the mounting portion at the first position, and a plurality of support members extending upward from the contact member are provided, and the plurality of support members are mounted. part is to support the substrate when in the first position, the drive unit Before moving the placing section after the emission of vacuum ultraviolet rays by the light source unit is started from the first position to the second position.
In this exposure apparatus, the substrate is housed in the processing chamber. The drive unit moves the mounting portion to the first position so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber. In the processing chamber, the substrate is placed on the mounting portion. Vacuum ultraviolet rays are emitted by the light source unit. When the light source unit irradiates the substrate with vacuum ultraviolet rays, the mounting unit is moved to the second position by the driving unit so that the mounting unit is in the second position closer to the light source unit than the first position. To. The drive unit moves the mounting unit to the first position so that the mounting unit is in the first position in the processing chamber when the substrate is carried out of the processing room.
According to this configuration, when the light source unit irradiates the substrate with vacuum ultraviolet rays, the substrate is placed close to the light source unit in a state of being mounted on the mounting unit. Here, the mounting portion can be constantly cooled by the cooling portion. Therefore, even when the substrate is irradiated with vacuum ultraviolet rays by the light source unit, the temperature of the substrate does not rise above a predetermined temperature. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. As a result, the mounting portion can be cooled more efficiently. Further, it is not necessary to separately secure a time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.

Furthermore, the drive unit, Ru a placing part after the emission of vacuum ultraviolet rays by the light source unit is started to move from the first position to the second position. In this case, the time point at which the mounting portion moves from the first position to the second position is later than the time point at which the light source unit starts emitting the vacuum ultraviolet rays. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.

( 9 ) The driving unit may move the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped. In this case, the time point at which the mounting portion moves from the second position to the first position is before the time point at which the emission of the vacuum ultraviolet rays by the light source unit is stopped. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.
(10) The exposure apparatus according to the fourth invention has a processing chamber for accommodating a substrate, a mounting portion on which the substrate is placed in the processing chamber, an exhaust portion for exhausting the atmosphere in the processing chamber, and vacuum ultraviolet rays. The light source unit that emits light and the mounting unit are in the first position in the processing chamber when the substrate is carried in and out of the processing room, and when the light source unit irradiates the substrate with vacuum ultraviolet rays. The drive unit that moves the mounting unit to the first position and the second position and the mounting unit are cooled so that the mounting unit is in the second position closer to the light source unit than the first position. A cooling unit provided in the mounting portion, a contact member that contacts the mounting portion at the first position, and a plurality of support members extending upward from the contact member are provided, and the plurality of support members are mounted. The substrate is supported when the unit is in the first position, and the drive unit moves the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped.
In this exposure apparatus, the substrate is housed in the processing chamber. The drive unit moves the mounting portion to the first position so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber. In the processing chamber, the substrate is placed on the mounting portion. Vacuum ultraviolet rays are emitted by the light source unit. When the light source unit irradiates the substrate with vacuum ultraviolet rays, the mounting unit is moved to the second position by the driving unit so that the mounting unit is in the second position closer to the light source unit than the first position. To. The drive unit moves the mounting unit to the first position so that the mounting unit is in the first position in the processing chamber when the substrate is carried out of the processing room.
According to this configuration, when the light source unit irradiates the substrate with vacuum ultraviolet rays, the substrate is placed close to the light source unit in a state of being mounted on the mounting unit. Here, the mounting portion can be constantly cooled by the cooling portion. Therefore, even when the substrate is irradiated with vacuum ultraviolet rays by the light source unit, the temperature of the substrate does not rise above a predetermined temperature. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. As a result, the mounting portion can be cooled more efficiently. Further, it is not necessary to separately secure a time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.
Further, the drive unit moves the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped. In this case, the time point at which the mounting portion moves from the second position to the first position is before the time point at which the emission of the vacuum ultraviolet rays by the light source unit is stopped. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.

( 11 ) The light source unit may be configured to emit vacuum ultraviolet rays having a planar cross section. In this case, vacuum ultraviolet rays are emitted over a wide range. Therefore, the exposure of the substrate is completed in a shorter time. Thereby, the efficiency of the exposure processing of the substrate can be further improved.

( 12 ) The area of the vacuum ultraviolet rays emitted by the light source unit may be larger than the area of the substrate. In this case, since the entire surface of the substrate can be exposed, the exposure of the substrate is completed in a shorter time. Thereby, the efficiency of the exposure processing of the substrate can be further improved.

( 13 ) The substrate processing apparatus according to the fifth invention includes a coating processing unit that forms a film on the substrate by applying a processing liquid to the substrate, and a heat treatment unit that heat-treats the substrate on which the film is formed by the coating processing unit. The exposure apparatus according to any one of the first to fourth inventions that exposes the substrate heat-treated by the heat treatment unit, and the development processing unit that develops the film of the substrate by supplying a solvent to the substrate exposed by the exposure apparatus. And.

In this substrate processing apparatus, a film is formed on the substrate by applying the processing liquid to the substrate by the coating processing unit. The substrate on which the film is formed by the coating treatment section is heat-treated by the heat treatment section. The substrate heat-treated by the heat-treated section is exposed by the above-mentioned exposure apparatus. The film of the substrate is developed by supplying a solvent to the substrate exposed by the exposure apparatus by the developing processing unit.

In the exposure apparatus, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate.

Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.

( 14 ) The treatment liquid may contain an inducible self-assembling material. In this case, the substrate coated with the treatment liquid containing the inductive self-assembling material is heat-treated, so that microphase separation occurs on one surface of the substrate. In addition, a substrate on which two types of polymer patterns are formed by microphase separation is exposed and developed. As a result, one of the two types of polymers can be removed to form a finely divided pattern.

( 15 ) The exposure method according to the sixth invention is a step of accommodating the substrate in the processing chamber and driving the mounting portion so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber. The mounting portion is cooled by a step of moving the mounting portion to the first position by the portion and a cooling portion provided on the contact member so as to cool the contact member when the mounting portion is at least in the first position. A step of supporting the substrate by a plurality of support members extending upward from the contact member when the mounting portion is in the first position, and a step of mounting the substrate on the mounting portion in the processing chamber. The step of exhausting the atmosphere in the processing room, the step of emitting vacuum ultraviolet rays by the light source unit without cooling the mounting unit by the cooling unit, and the step of emitting vacuum ultraviolet rays by the light source unit, and mounting after the light source unit starts irradiating the substrate with vacuum ultraviolet rays. A step of moving the mounting portion to the second position by the drive unit so that the unit is in the second position closer to the light source unit than the first position from the first position, and carrying out the substrate to the outside of the processing room. In this case, the step of moving the mounting portion to the first position by the driving unit is included so that the mounting portion is in the first position in the processing chamber.

According to this exposure method, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.
Further, the drive unit moves the mounting unit from the first position to the second position after the emission of the vacuum ultraviolet rays by the light source unit is started. In this case, the time point at which the mounting portion moves from the first position to the second position is later than the time point at which the light source unit starts emitting the vacuum ultraviolet rays. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.
(16) The exposure method according to the seventh invention is driven so that the step of accommodating the substrate in the processing chamber and the mounting portion are in the first position in the processing chamber when the substrate is carried into the processing chamber. The mounting portion is cooled by a step of moving the mounting portion to the first position by the portion and a cooling portion provided on the contact member so as to cool the contact member when the mounting portion is at least in the first position. A step of supporting the substrate by a plurality of support members extending upward from the contact member when the mounting portion is in the first position, and a step of mounting the substrate on the mounting portion in the processing chamber. The step of exhausting the atmosphere in the processing room, the step of emitting vacuum ultraviolet rays by the light source unit without cooling the mounting unit by the cooling unit, and the step of emitting vacuum ultraviolet rays by the light source unit, and the mounting unit when the light source unit irradiates the substrate with vacuum ultraviolet rays The step of moving the mounting part to the second position by the driving part so that it is in the second position closer to the light source part than the position of 1, and the vacuum by the light source part when the substrate is carried out of the processing room. It includes a step of moving the mounting unit from the second position to the first position by the driving unit so that the mounting unit is in the first position in the processing chamber before the emission of the ultraviolet rays is stopped.
According to this exposure method, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.
Further, the drive unit moves the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped. In this case, the time point at which the mounting portion moves from the second position to the first position is before the time point at which the emission of the vacuum ultraviolet rays by the light source unit is stopped. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.
( 17 ) The exposure method according to the eighth invention is driven so that the step of accommodating the substrate in the processing chamber and the mounting portion are in the first position in the processing chamber when the substrate is carried into the processing chamber. A step of moving the mounting portion to the first position by the portion, a step of cooling the mounting portion by the cooling portion provided in the mounting portion, and an upper part from the contact member when the mounting portion is in the first position. A step of supporting the substrate by a plurality of support members extending to, a step of mounting the substrate on the mounting portion in the processing chamber, a step of exhausting the atmosphere in the processing chamber, and a step of cooling the mounting portion by the cooling unit. At the same time, the step of emitting vacuum ultraviolet rays by the light source unit and the second position where the mounting unit is closer to the light source unit than the first position from the first position after the irradiation of the substrate with the vacuum ultraviolet rays by the light source unit is started. The step of moving the mounting part to the second position by the drive unit, and the mounting part being in the first position in the processing chamber when the substrate is carried out of the processing chamber. It includes a step of moving the mounting unit to the first position by the driving unit.
According to this exposure method, when the light source unit irradiates the substrate with vacuum ultraviolet rays, the substrate is placed close to the light source unit in a state of being mounted on the mounting unit. Here, the mounting portion can be constantly cooled by the cooling portion. Therefore, even when the substrate is irradiated with vacuum ultraviolet rays by the light source unit, the temperature of the substrate does not rise above a predetermined temperature. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. As a result, the mounting portion can be cooled more efficiently. Further, it is not necessary to separately secure a time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.
Further, the drive unit moves the mounting unit from the first position to the second position after the emission of the vacuum ultraviolet rays by the light source unit is started. In this case, the time point at which the mounting portion moves from the first position to the second position is later than the time point at which the light source unit starts emitting the vacuum ultraviolet rays. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.
(18) The exposure method according to the ninth invention is a step of accommodating the substrate in the processing chamber and driving the mounting portion so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber. A step of moving the mounting portion to the first position by the portion, a step of cooling the mounting portion by the cooling portion provided in the mounting portion, and an upper part from the contact member when the mounting portion is in the first position. A step of supporting the substrate by a plurality of support members extending to, a step of mounting the substrate on the mounting portion in the processing chamber, a step of exhausting the atmosphere in the processing chamber, and a step of cooling the mounting portion by the cooling unit. At the same time, it is driven so that the mounting portion is located at a second position closer to the light source unit than the first position when the light source unit emits vacuum ultraviolet rays and when the light source unit irradiates the substrate with the vacuum ultraviolet rays. In the step of moving the mounting portion to the second position by the unit and when the substrate is carried out of the processing chamber, the mounting portion is the first in the processing chamber before the emission of the vacuum ultraviolet rays by the light source unit is stopped. It includes a step of moving the mounting portion from the second position to the first position by the drive unit so that it is in the position.
According to this exposure method, when the light source unit irradiates the substrate with vacuum ultraviolet rays, the substrate is placed close to the light source unit in a state of being mounted on the mounting unit. Here, the mounting portion can be constantly cooled by the cooling portion. Therefore, even when the substrate is irradiated with vacuum ultraviolet rays by the light source unit, the temperature of the substrate does not rise above a predetermined temperature. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. As a result, the mounting portion can be cooled more efficiently. Further, it is not necessary to separately secure a time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.
Further, the drive unit moves the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped. In this case, the time point at which the mounting portion moves from the second position to the first position is before the time point at which the emission of the vacuum ultraviolet rays by the light source unit is stopped. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.

( 19 ) The substrate processing method according to the tenth invention includes a step of forming a film on the substrate by applying a treatment liquid to the surface to be treated of the substrate by the coating processing section, and a substrate on which the film is formed by the coating processing section. and a step of heat treating the heat-treated portion, and the exposure method according to the sixth to ninth invention of any one of the exposure by the exposure device substrate that has been heat-treated by the heat treatment unit, the target surface of the substrate exposed by the exposure device It includes a step of developing a film of a substrate by supplying a solvent by a development processing unit.

According to this substrate processing method, the substrate after the film is formed and before the development is exposed to vacuum ultraviolet rays. In the exposure method, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.

According to the present invention, the efficiency of the exposure processing of the substrate can be improved.

It is a schematic cross-sectional view which shows the structure of the exposure apparatus which concerns on embodiment of this invention. It is a top view which shows the support plate of the delivery part. It is a functional block diagram which shows the structure of the control part of FIG. It is a schematic diagram for demonstrating the operation of an exposure apparatus. It is a schematic diagram for demonstrating the operation of an exposure apparatus. It is a schematic diagram for demonstrating the operation of an exposure apparatus. It is a schematic diagram for demonstrating the operation of an exposure apparatus. It is a flowchart which shows an example of the exposure processing performed by the control unit of FIG. It is a flowchart which shows an example of the exposure processing performed by the control unit of FIG. It is a schematic block diagram which shows the whole structure of the substrate processing apparatus provided with the exposure apparatus of FIG. It is a schematic diagram which shows an example of the processing of a substrate by the substrate processing apparatus of FIG. It is a top view which shows the support plate in another embodiment.

(1) Configuration of Exposure Device The exposure device, substrate processing apparatus, exposure method, and substrate processing method according to the embodiment of the present invention will be described below with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a liquid crystal display device substrate, a plasma display substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, or the like.

FIG. 1 is a schematic cross-sectional view showing a configuration of an exposure apparatus according to an embodiment of the present invention. As shown in FIG. 1, the exposure apparatus 100 includes a control unit 110, a processing chamber 120, a closing unit 130, a delivery unit 140, an elevating unit 150, a light emitting unit 160, a replacement unit 170, and a measuring unit 180. The control unit 110 acquires the measured value from the measurement unit 180 and controls the operations of the closing unit 130, the elevating unit 150, the light projecting unit 160, and the replacement unit 170. The function of the control unit 110 will be described later.

The processing chamber 120 includes a housing 121 having an upper opening and an internal space, an annular member 122 and a covering member 123. On the side surface of the housing 121, a transport opening 121a for transporting the substrate W to be processed is formed between the inside and the outside of the housing 121. In the present embodiment, a film containing an inductive self-assembling material (hereinafter, referred to as a DSA (Directed Self Assembly) film) is formed on the substrate W to be processed. Further, on the bottom surface of the housing 121, an opening 121b through which the connecting member 152 of the elevating portion 150, which will be described later, passes is formed.

By arranging the housing 161 of the light projecting unit 160, which will be described later, on the upper part of the housing 121 via the annular member 122, the upper opening of the housing 121 is closed. Seal members s1 and s2 are attached between the housing 121 and the annular member 122, and between the annular member 122 and the housing 161, respectively. Further, a covering member 123 is attached between the housing 121 and the housing 161 so as to cover the outer peripheral surface of the annular member 122.

The closing portion 130 includes a shutter 131, a rod-shaped connecting member 132, and a driving device 133. The connecting member 132 connects the shutter 131 and the driving device 133. The drive device 133 is, for example, a stepping motor. The drive device 133 moves the shutter 131 between an open position where the shutter 131 opens the transport opening 121a and a closed position where the shutter 131 closes the transport opening 121a.

A seal member 131a is attached to the shutter 131. When the shutter 131 is in the closed position, the inside of the housing 121 is sealed by the sealing member 131a coming into close contact with the portion surrounding the transport opening 121a in the housing 121. In order to prevent friction between the seal member 131a and the housing 121, the drive device 133 separated the shutter 131 from the housing 121 when moving the shutter 131 between the open position and the closed position. Move it up and down in the state.

Position sensors 133a and 133b that detect the upper limit position and the lower limit position of the shutter 131 are attached to the drive device 133, respectively. The position sensors 133a and 133b give the detection result to the control unit 110. In the present embodiment, the drive device 133 and the drive device 153 described later are provided outside the processing chamber 120. Therefore, even when dust is generated by driving the drive devices 133 and 153, it is possible to prevent the dust from directly entering the housing 121.

The delivery unit 140 includes, for example, a disk-shaped support plate 141, a plurality of (three in this example) support pins 142, and a cooling unit 143. The support plate 141 is arranged in the housing 121 in a horizontal posture. An opening 141a through which the connecting member 152 of the elevating portion 150, which will be described later, passes is formed in the central portion of the support plate 141. The plurality of support pins 142 extend upward from the upper surface of the support plate 141 so as to surround the opening 141a. The substrate W to be processed can be placed on the upper ends 142a of the plurality of support pins 142.

FIG. 2 is a plan view showing the support plate 141 of the delivery portion 140. As shown in FIG. 2, the cooling unit 143 includes a cooling pipe 143a and a medium supply source 143b. The cooling pipe 143a is provided so as to orbit the inside of the support plate 141 while meandering in a state of being in contact with the support plate 141. Both ends of the cooling pipe 143a are connected to the medium supply source 143b. The medium supply source 143b supplies the cooling medium into the cooling pipe 143a from one end of the cooling pipe 143a, and collects the cooling medium from the other end of the cooling pipe 143a. As a result, the cooling medium is circulated in the cooling pipe 143a, and the support plate 141 is cooled.

In the present embodiment, the medium supply source 143b is a constant temperature water circulation device and supplies constant temperature pure water as a cooling medium, but the present invention is not limited thereto. The medium supply source 143b is a cooling water circulation device, and cooled pure water may be supplied as a cooling medium. Further, the cooling pipe 143a is provided in the support plate 141, but the present invention is not limited to this. The cooling pipe 143a may be provided outside the support plate 141 in a state of being in contact with the lower surface of the support plate 141, for example.

The elevating portion 150 of FIG. 1 includes a flat plate-shaped mounting plate 151, a rod-shaped connecting member 152, and a driving device 153. The mounting plate 151 is arranged in the housing 121 in a horizontal posture above the support plate 141 of the delivery portion 140. The mounting plate 151 is formed with a plurality of through holes 151a corresponding to the plurality of support pins 142 of the support plate 141.

The connecting member 152 is arranged so as to extend vertically through the opening 121b of the housing 121 and the opening 141a of the support plate 141, and the drive device 153 is arranged below the housing 121. The connecting member 152 connects the mounting plate 151 and the driving device 153. A seal member s3 is arranged between the outer peripheral surface of the connecting member 152 and the inner peripheral surface of the opening 121b so that the connecting member 152 can slide in the vertical direction.

The drive device 153 is, for example, a stepping motor, in which a mounting plate 151 is placed between a processing position above the upper ends 142a of the plurality of support pins 142 and a standby position below the upper ends 142a of the plurality of support pins 142. Move it up and down. Position sensors 153a and 153b that detect the upper limit position and the lower limit position of the mounting plate 151 are attached to the drive device 153, respectively. The position sensors 153a and 153b give the detection result to the control unit 110.

In the state where the mounting plate 151 is in the standby position, a plurality of support pins 142 are inserted into the plurality of through holes 151a, respectively, and the lower surface 151b of the mounting plate 151 and the upper surface (contact surface) 141b of the support plate 141 come into contact with each other. To do. As a result, the mounting plate 151 is cooled by the cooling unit 143 via the support plate 141.

The light projecting unit 160 includes a housing 161 having a lower opening and an internal space, a light transmitting plate 162, a planar light source unit 163, and a power supply device 164. In the present embodiment, the translucent plate 162 is a quartz glass plate. As the material of the light transmitting plate 162, another material that transmits vacuum ultraviolet rays, which will be described later, may be used. As described above, the housing 161 is arranged on the upper part of the housing 121 so as to close the upper opening of the housing 121. The translucent plate 162 is attached to the housing 161 so as to close the lower opening of the housing 161. The internal space of the housing 121 and the internal space of the housing 161 are optically accessiblely separated by a translucent plate 162.

The light source unit 163 and the power supply device 164 are housed in the housing 161. In the present embodiment, the light source unit 163 is configured by horizontally arranging a plurality of rod-shaped light sources that emit vacuum ultraviolet rays having a wavelength of about 120 nm or more and about 230 nm or less at predetermined intervals. Each light source may be, for example, a xenon excimer lamp, another excimer lamp, a deuterium lamp, or the like. The light source unit 163 emits vacuum ultraviolet rays having a substantially uniform light amount distribution in the housing 121 through the light transmitting plate 162. The area of the emission surface of the vacuum ultraviolet rays in the light source unit 163 is larger than the area of the surface to be processed of the substrate W. The power supply device 164 supplies electric power to the light source unit 163.

The replacement unit 170 includes pipes 171p, 172p, 173p, valves 171v, 172v and a suction device 173. The pipes 171p and 172p are connected between the air supply port of the housing 121 and the inert gas supply source. In this embodiment, the inert gas is, for example, nitrogen gas. Valves 171v and 172v are inserted in the pipes 171p and 172p. An inert gas is supplied into the housing 121 from the side of the support plate 141 through the pipe 171p. An inert gas is supplied into the housing 121 from below the support plate 141 through the pipe 172p. The flow rate of the inert gas is adjusted by valves 171v and 172v. In this embodiment, nitrogen gas is used as the inert gas.

The pipe 173p branches into a branch pipe 173a and a branch pipe 173b. The branch pipe 173a is connected to the exhaust port of the housing 121, and the end portion of the branch pipe 173b is arranged between the housing 121 and the shutter 131. A suction device 173 is inserted in the pipe 173p. A valve 173v is inserted in the branch pipe 173b. The suction device 173 is, for example, an ejector. The pipe 173p is connected to the exhaust equipment.

The suction device 173 discharges the atmosphere inside the housing 121 through the branch pipe 173a and the pipe 173p. Further, the suction device 173 discharges the atmosphere between the housing 121 and the shutter 131 through the branch pipe 173b and the pipe 173p together with dust and the like generated by the movement of the shutter 131. The gas discharged by the suction device 173 is detoxified by the exhaust equipment.

The measuring unit 180 includes an oxygen concentration meter 181 and an ozone concentration meter 182 and an illuminance meter 183. The oxygen concentration meter 181 and the ozone concentration meter 182 and the illuminance meter 183 are connected to the control unit 110 through the connection ports p1, p2 and p3 provided in the housing 121, respectively. The oxygen concentration meter 181 is, for example, a galvanic cell type oxygen sensor or a zirconia type oxygen sensor, and measures the oxygen concentration in the housing 121.

The ozone concentration meter 182 measures the ozone concentration in the housing 121. The illuminometer 183 includes a light receiving element such as a photodiode, and measures the illuminance of vacuum ultraviolet rays from the light source unit 163 that irradiates the light receiving surface of the light receiving element. Here, the illuminance is the power of the vacuum ultraviolet rays emitted per unit area of the light receiving surface. The unit of illuminance is represented by, for example, "W / m ^2".

(2) Schematic operation of the exposure apparatus In the exposure apparatus 100, the exposure process is performed by irradiating the substrate W with vacuum ultraviolet rays from the light source unit 163. However, when the oxygen concentration in the housing 121 is high, the oxygen molecules absorb the vacuum ultraviolet rays and separate into oxygen atoms, and the separated oxygen atoms recombine with other oxygen molecules to generate ozone. In this case, the vacuum ultraviolet rays reaching the substrate W are attenuated. The attenuation of vacuum ultraviolet light is greater than the attenuation of ultraviolet light having wavelengths longer than about 230 nm.

Therefore, in the exposure process, the atmosphere inside the housing 121 is replaced with an inert gas by the replacement unit 170. As a result, the oxygen concentration in the housing 121 is reduced. When the oxygen concentration measured by the oxygen concentration meter 181 is reduced to a predetermined concentration, the light source unit 163 irradiates the substrate W with vacuum ultraviolet rays. Here, the predetermined concentration is preferably an oxygen concentration (for example, 1%) in which ozone is not generated by the vacuum ultraviolet rays emitted by the light source unit 163.

When the exposure amount of the vacuum ultraviolet rays applied to the substrate W reaches a predetermined set exposure amount, the irradiation of the vacuum ultraviolet rays is stopped and the exposure process is completed. Here, the exposure amount is the energy of vacuum ultraviolet rays irradiated per unit area of the surface to be processed of the substrate W during the exposure process. The unit of the exposure amount is represented by, for example, "J / m ^2". Therefore, the exposure amount of the vacuum ultraviolet rays is acquired by integrating the illuminance of the vacuum ultraviolet rays measured by the illuminance meter 183.

In the above exposure process, the substrate W is heated by irradiating the substrate W with vacuum ultraviolet rays. In this case, if the temperature of the substrate W rises above a predetermined temperature (for example, 50 degrees), the substrate W cannot be carried out from the exposure apparatus and waits until the temperature of the substrate W drops below the predetermined temperature. There is a need. Therefore, the efficiency of the exposure process of the substrate W is lowered.

In the present embodiment, the mounting plate 151 is moved to the standby position before the exposure process and is cooled in advance by coming into contact with the support plate 141. At the time of the exposure process, the substrate W is placed on the mounting plate 151. After that, the mounting plate 151 is moved to the processing position, and the substrate W is irradiated with vacuum ultraviolet rays in a state where the substrate W is close to the light source unit 163. In this case, since the substrate W is mounted on the cooled mounting plate 151, it is possible to prevent the temperature of the substrate W from rising above a predetermined temperature. This prevents the efficiency of the exposure process of the substrate W from decreasing.

(3) Control unit FIG. 3 is a functional block diagram showing the configuration of the control unit 110 of FIG. As shown in FIG. 3, the control unit 110 includes a blockage control unit 1, an elevating control unit 2, an exhaust control unit 3, an air supply control unit 4, a density acquisition unit 5, a density comparison unit 6, an illuminance acquisition unit 7, and an exposure amount. It includes a calculation unit 8, an exposure amount comparison unit 9, and a light projection control unit 10.

The control unit 110 is composed of, for example, a CPU (Central Processing Unit) and a memory. The control program is stored in advance in the memory of the control unit 110. When the CPU of the control unit 110 executes the control program stored in the memory, the functions of each unit of the control unit 110 are realized.

The blockage control unit 1 controls the drive device 133 so that the shutter 131 moves between the closed position and the open position based on the detection results of the position sensors 133a and 133b in FIG. The elevating control unit 2 controls the drive device 153 so that the mounting plate 151 moves between the standby position and the processing position based on the detection results of the position sensors 153a and 153b in FIG.

The exhaust control unit 3 controls the suction device 173 and the valve 173v so as to exhaust the atmosphere inside the housing 121 and the atmosphere between the housing 121 and the shutter 131 in FIG. The air supply control unit 4 controls the valves 171v and 172v of FIG. 1 so as to supply the inert gas into the housing 121.

The concentration acquisition unit 5 acquires the value of the oxygen concentration measured by the oxygen concentration meter 181 of FIG. The concentration comparison unit 6 compares the oxygen concentration measured by the concentration acquisition unit 5 with a predetermined concentration.

The illuminance acquisition unit 7 acquires the value of the illuminance of the vacuum ultraviolet rays measured by the illuminance meter 183 of FIG. The exposure amount calculation unit 8 determines the vacuum ultraviolet rays to be applied to the substrate W based on the illuminance of the vacuum ultraviolet rays acquired by the illuminance acquisition unit 7 and the irradiation time of the vacuum ultraviolet rays from the light source unit 163 of FIG. 1 to the substrate W. Calculate the exposure amount. The exposure amount comparison unit 9 compares the exposure amount calculated by the exposure amount calculation unit 8 with a predetermined set exposure amount.

The light projection control unit 10 controls the supply of electric power from the power supply device 164 of FIG. 1 to the light source unit 163 so that the light source unit 163 emits vacuum ultraviolet rays based on the comparison result by the density comparison unit 6. Further, the light projection control unit 10 controls the power supply device 164 so that the light source unit 163 stops emitting the vacuum ultraviolet rays based on the comparison result by the exposure amount comparison unit 9.

(4) Exposure Processing FIGS. 4 to 7 are schematic views for explaining the operation of the exposure apparatus 100. In FIGS. 4 to 7, in order to facilitate understanding of the configurations inside the housing 121 and the housing 161, some of the components are omitted, and the outlines of the housing 121 and the housing 161 are one point. It is indicated by a chain line. 8 and 9 are flowcharts showing an example of the exposure process performed by the control unit 110 of FIG. Hereinafter, the exposure process by the control unit 110 will be described with reference to FIGS. 4 to 7.

As shown in FIG. 4, in the initial state of the exposure process, the shutter 131 is in the closed position and the mounting plate 151 is in the standby position. Therefore, the lower surface 151b of the mounting plate 151 and the upper surface 141b of the support plate 141 come into contact with each other. As a result, the mounting plate 151 is pre-cooled by the cooling pipe 143a via the support plate 141. Further, the oxygen concentration in the housing 121 is constantly or periodically measured by the oxygen concentration meter 181 and acquired by the concentration acquisition unit 5. At this point, the oxygen concentration in the housing 121 measured by the oxygen concentration meter 181 is equal to the oxygen concentration in the atmosphere.

First, the blockage control unit 1 moves the shutter 131 to the open position as shown in FIG. 5 (step S1). As a result, the substrate W to be processed can be placed on the upper ends 142a of the plurality of support pins 142 through the transport opening 121a. In this example, the substrate W is placed on the upper ends 142a of the plurality of support pins 142 by the transport device 220 of FIG. 10 described later.

Next, the elevating control unit 2 determines whether or not the substrate W is placed on the upper ends 142a of the plurality of support pins 142 (step S2). When the substrate W is not mounted, the elevating control unit 2 waits until the substrate W is mounted on the upper ends 142a of the plurality of support pins 142. When the substrate W is placed, the elevating control unit 2 moves the shutter 131 to the closed position as shown in FIG. 6 (step S3).

Subsequently, the exhaust control unit 3 discharges the atmosphere inside the housing 121 by the suction device 173 of FIG. 1 (step S4). Further, the air supply control unit 4 supplies the inert gas into the housing 121 through the pipes 171p and 172p of FIG. 1 (step S5). The processes of steps S4 and S5 may be started first or at the same time.

After that, the concentration comparison unit 6 determines whether or not the oxygen concentration in the housing 121 has dropped to a predetermined concentration (step S6). When the oxygen concentration has not decreased to a predetermined concentration, the concentration comparison unit 6 waits until the oxygen concentration decreases to a predetermined concentration. When the oxygen concentration drops to a predetermined concentration, the light projection control unit 10 emits vacuum ultraviolet rays by the light source unit 163 (step S7).

Next, the elevating control unit 2 moves the mounting plate 151 to the processing position as shown in FIG. 7 (step S8). As a result, the substrate W is transferred from the plurality of support pins 142 to the mounting plate 151. In this case, the substrate W is brought close to the translucent plate 162 while being cooled by the mounting plate 151. In this state, the substrate W is irradiated with vacuum ultraviolet rays from the light source unit 163 through the light transmitting plate 162, and the DSA film formed on the surface to be treated is exposed.

Here, the illuminance acquisition unit 7 causes the illuminance meter 183 to start measuring the illuminance of the vacuum ultraviolet rays, and acquires the measured illuminance from the illuminance meter 183 (step S9). The exposure amount calculation unit 8 calculates the exposure amount of the vacuum ultraviolet rays applied to the substrate W by integrating the illuminance of the vacuum ultraviolet rays acquired by the illuminance acquisition unit 7 (step S10).

Subsequently, the exposure amount comparison unit 9 determines whether or not the exposure amount calculated by the exposure amount calculation unit 8 has reached the set exposure amount (step S11). When the exposure amount has not reached the set exposure amount, the exposure amount comparison unit 9 waits until the exposure amount reaches the set exposure amount.

When the exposure amount reaches the set exposure amount, the elevating control unit 2 moves the mounting plate 151 to the standby position as shown in FIG. 6 (step S12). As a result, the substrate W is transferred from the mounting plate 151 to the plurality of support pins 142. Further, the lower surface 151b of the mounting plate 151 and the upper surface 141b of the support plate 141 come into contact with each other. As a result, the mounting plate 151 is pre-cooled by the cooling pipe 143a in preparation for the exposure processing of the substrate W that is then carried into the exposure apparatus 100.

Next, the light projection control unit 10 stops the emission of the vacuum ultraviolet rays from the light source unit 163 (step S13). Further, the illuminance acquisition unit 7 stops the measurement of the illuminance by the illuminance meter 183 (step S14). Subsequently, the exhaust control unit 3 stops the exhaust of the atmosphere in the housing 121 by the suction device 173 (step S15). Further, the air supply control unit 4 stops the supply of the inert gas from the pipes 171p and 172p into the housing 121 (step S16). The processes of steps S13 to S16 may be started first or at the same time.

After that, the blockage control unit 1 moves the shutter 131 to the open position as shown in FIG. 5 (step S17). As a result, the exposed substrate W can be carried out from the plurality of support pins 142 to the outside of the housing 121 through the transport opening 121a. In this example, the substrate W is carried out from the plurality of support pins 142 to the outside of the housing 121 by the transport device 220 of FIG. 10 described later.

Next, the blockage control unit 1 determines whether or not the substrate W has been carried out from the plurality of support pins 142 (step S18). When the board W is not carried out, the blockage control unit 1 waits until the board W is carried out from the plurality of support pins 142. When the substrate W is carried out, the blockage control unit 1 moves the shutter 131 to the blockage position (step S19) as shown in FIG. 4, and ends the exposure process. By repeating the above operation, the exposure process can be sequentially performed on the plurality of substrates W.

In the above exposure process, the mounting plate 151 is moved from the standby position to the processing position after the emission of the vacuum ultraviolet rays by the light source unit 163 is started. Further, the mounting plate 151 is moved from the processing position to the standby position before the emission of the vacuum ultraviolet rays by the light source unit 163 is stopped. As a result, the mounting plate 151 can be sufficiently cooled by the cooling pipe 143a at the standby position.

On the other hand, if the mounting plate 151 can be sufficiently cooled, the mounting plate 151 may be moved from the standby position to the processing position before the emission of the vacuum ultraviolet rays by the light source unit 163 is started. Alternatively, the mounting plate 151 may be moved from the processing position to the standby position after the emission of the vacuum ultraviolet rays by the light source unit 163 is stopped. That is, the process of step S8 may be executed before the process of step S7, or the process of step S12 may be executed after the process of step S13.

(5) Substrate Processing Device FIG. 10 is a schematic block diagram showing an overall configuration of a substrate processing device provided with the exposure device 100 of FIG. In the substrate processing apparatus 200 described below, processing using inductive self-assembly (DSA) of block copolymers is performed. Specifically, a treatment liquid containing an inductive self-assembling material is applied onto the surface to be treated of the substrate W. After that, a pattern of two kinds of polymers is formed on the surface to be treated of the substrate W by the microphase separation generated in the induced self-assembling material. The pattern of one of the two polymers is removed by the solvent.

The treatment liquid containing the inductive self-assembling material is called a DSA liquid. Further, a process of removing one of two types of polymer patterns formed on the surface to be processed of the substrate W by microphase separation is called a developing process, and a solvent used in the developing process is called a developing solution.

As shown in FIG. 10, the substrate processing device 200 includes a control device 210, a transfer device 220, a heat treatment device 230, a coating device 240, and a developing device 250 in addition to the exposure device 100. The control device 210 includes, for example, a CPU and a memory, or a microcomputer, and controls the operations of the transfer device 220, the heat treatment device 230, the coating device 240, and the developing device 250. Further, the control device 210 gives a command to the control unit 110 to control the operations of the closing unit 130, the elevating unit 150, the light projecting unit 160, and the replacement unit 170 of the exposure device 100 shown in FIG.

The transport device 220 transports the substrate W to be processed between the exposure device 100, the heat treatment device 230, the coating device 240, and the developing device 250 while holding the substrate W to be processed. The heat treatment apparatus 230 heat-treats the substrate W before and after the coating treatment by the coating apparatus 240 and the development treatment by the developing apparatus 250.

The coating device 240 coats the film by supplying the DSA liquid to the surface to be treated of the substrate W. In this embodiment, a block copolymer composed of two types of polymers is used as the DSA solution. As a combination of the two polymers, for example, polystyrene-polymethylmethacrylate (PS-PMMA), polystyrene-polydimethylsiloxane (PS-PDMS), polystyrene-polyferrocenyldimethylsilane (PS-PFS), polystyrene-polyethylene oxide (PS-PEO), polystyrene - polyvinylpyridine (PS-PVP), polystyrene - polyhydroxystyrene (PS-PHOST), and polymethyl methacrylate - polymethacrylate polyhedral oligomeric Shi Ruse Sukiokisan (PMMA-PMAPOSS) or the like can be mentioned Be done.

The developing apparatus 250 develops a film by supplying a developing solution to the surface to be processed of the substrate W. As the solvent of the developing solution, for example, toluene, heptane, acetone, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), cyclohexanone, acetic acid, tetrahydrofuran, isopropyl alcohol (IPA) or tetramethylammonium hydroxide (TMAH). ) Etc. can be mentioned.

FIG. 11 is a schematic view showing an example of processing of the substrate W by the substrate processing apparatus 200 of FIG. In FIG. 11, a cross-sectional view shows a state of the substrate W that changes each time the process is performed. In this example, as an initial state before the substrate W is carried into the substrate processing apparatus 200, as shown in FIG. 11A, the underlayer L1 is formed so as to cover the surface to be processed of the substrate W, and the underlayer is formed. A guide pattern L2 made of, for example, a photoresist is formed on L1. Hereinafter, the operation of the substrate processing apparatus 200 will be described with reference to FIGS. 10 and 11.

The transport device 220 sequentially transports the substrate W to be processed to the heat treatment device 230 and the coating device 240. In this case, in the heat treatment apparatus 230, the temperature of the substrate W is adjusted to a temperature suitable for forming the DSA film. Further, in the coating device 240, the DSA liquid is supplied to the surface to be treated of the substrate W, and the coating process is performed. As a result, as shown in FIG. 11B, a DSA film L3 composed of two types of polymers is formed in a region on the base layer L1 on which the guide pattern L2 is not formed.

Next, the transfer device 220 transfers the substrate W on which the DSA film L3 is formed to the heat treatment device 230 and the exposure device 100 in this order. In this case, the heat treatment apparatus 230 heat-treats the substrate W to cause microphase separation in the DSA film L3. As a result, as shown in FIG. 11C, a pattern Q1 composed of one polymer and a pattern Q2 composed of the other polymer are formed. In this example, the linear pattern Q1 and the linear pattern Q2 are directionally formed along the guide pattern L2.

After that, the substrate W is cooled in the heat treatment apparatus 230. Further, in the exposure apparatus 100, the entire DSA film L3 after the microphase separation is irradiated with vacuum ultraviolet rays for modifying the DSA film L3, and the exposure process is performed. As a result, the bond between one polymer and the other polymer is broken, and the pattern Q1 and the pattern Q2 are separated.

Subsequently, the transport device 220 transports the substrate W after the exposure process by the exposure device 100 to the heat treatment device 230 and the developing device 250 in this order. In this case, the substrate W is cooled in the heat treatment apparatus 230. Further, in the developing apparatus 250, the developing solution is supplied to the DSA film L3 on the substrate W, and the developing process is performed. As a result, as shown in FIG. 11D, the pattern Q1 is removed, and finally the pattern Q2 remains on the substrate W. Finally, the transport device 220 collects the developed substrate W from the developing device 250.

(6) Effect In the exposure apparatus 100 according to the present embodiment, the mounting plate 151 is set by the driving device 153 so that the mounting plate 151 is in the standby position when the substrate W is carried into the processing chamber 120. Moved to the standby position. In this state, when the mounting plate 151 comes into contact with the support plate 141, the mounting plate 151 is cooled by the cooling pipe 143a via the support plate 141. After that, as the mounting plate 151 moves upward, the substrate W is transferred from the upper ends 142a of the plurality of support pins 142 to the mounting plate 151 and mounted on the mounting plate 151.

When the substrate W is irradiated with vacuum ultraviolet rays by the light source unit 163, the drive device 153 is located so that the mounting plate 151 is located above the upper ends 142a of the plurality of support pins 142, which are the transfer positions of the substrate W. The mounting plate 151 is moved to the processing position. The mounting plate 151 is moved to the standby position by the drive device 153 so that the mounting plate 151 is in the standby position when the substrate W is carried out of the processing chamber 120. As a result, the substrate W is transferred from the mounting plate 151 to the plurality of support pins 142, and is supported by the upper ends 142a of the plurality of support pins 142.

According to this configuration, the substrate W can be easily carried into the processing chamber 120 or can be easily carried out of the processing chamber 120 without causing the substrate W to interfere with the light source unit 163. Further, when the substrate W is irradiated with the vacuum ultraviolet rays by the light source unit 163, the substrate W can be easily brought close to the light source unit 163 while the substrate W is mounted on the mounting plate 151.

Here, since the mounting plate 151 is pre-cooled by the cooling pipe 143a, the temperature of the substrate W does not rise above a predetermined temperature even when the substrate W is irradiated with vacuum ultraviolet rays by the light source unit 163. Therefore, it is not necessary to make the substrate W stand by in the processing chamber 120, and it is not necessary to separately perform a process for cooling the substrate W.

Further, the cooling of the mounting plate 151 by the cooling pipe 143a is performed in parallel with the process of carrying the substrate W into the processing chamber 120 and the process of carrying the substrate W out of the processing chamber 120, and also in the processing chamber 120. This is done during the period when the substrate W does not exist. Therefore, it is not necessary to separately secure a time for cooling the mounting plate 151 by the cooling pipe 143a. As a result, the efficiency of the exposure processing of the substrate W can be improved.

Further, in the above embodiment, since the mounting plate 151 is indirectly cooled by the cooling pipe 143a via the support plate 141, it is not necessary to provide the mounting plate 143a on the mounting plate 151. Therefore, it is not necessary to connect the medium supply source 143b to the cooling unit 143 on the mounting plate 151. This makes it possible to simplify the configuration for moving the mounting plate 151 between the standby position and the processing position. Further, since the lower surface 151b of the mounting plate 151 and the upper surface 141b of the support plate 141 come into contact with each other over a wide range, heat is transferred from the mounting plate 151 to the support plate 141. It can be cooled efficiently.

(7) Other Embodiments (a) In the above embodiment, the cooling unit 143 includes a cooling pipe 143a and a medium supply source 143b, but the present invention is not limited thereto. FIG. 12 is a plan view showing the support plate 141 in another embodiment. As shown in FIG. 12, in another embodiment, the cooling unit 143 includes a plurality of (8 in the example of FIG. 12) cooling elements 143c and a power supply source 143d. Each cooling element 143c is, for example, a Perche element having a cooling surface and a heating surface.

The plurality of cooling elements 143c are arranged at substantially equal intervals so as to surround the openings 141a with the cooling surface in contact with the support plate 141. Each cooling element 143c is connected to a power supply source 143d. In FIG. 12, only the connection between one cooling element 143c and the power supply source 143d is shown, and the connection between the other plurality of cooling elements 143c and the power supply source 143d is not shown. The support plate 141 is cooled by supplying electric power from the electric power supply source 143d to each cooling element 143c.

(B) In the above embodiment, the support plate 141 is provided with the cooling pipe 143a, and the mounting plate 151 is indirectly cooled by the cooling pipe 143a through the support plate 141, but the present invention is not limited thereto. A cooling pipe 143a may be provided on the mounting plate 151, and the mounting plate 151 may be directly cooled by the cooling pipe 143a. Similarly, the mounting plate 151 may be provided with the cooling element 143c of FIG. 12, and the mounting plate 151 may be directly cooled by the cooling element 143c. In these cases, the mounting plate 151 can be constantly cooled.

(C) In the above embodiment, the DSA liquid is used as the treatment liquid, but the present invention is not limited thereto. Other treatment liquids different from the DSA liquid may be used.

(D) In the above embodiment, the emission surface of the vacuum ultraviolet rays is larger than the surface to be treated of the substrate W, and the entire surface of the substrate W is exposed, but the present invention is not limited to this. The emission surface of the vacuum ultraviolet rays may be smaller than the surface to be treated of the substrate W, or the vacuum ultraviolet rays having a linear cross section without having a planar cross section may be emitted. In this case, the emission surface of the vacuum ultraviolet rays and the surface to be processed of the substrate W are relatively moved, so that the entire surface to be processed of the substrate W is irradiated with the vacuum ultraviolet rays.

(E) In the above embodiment, the inert gas is supplied into the housing 121 during the exposure process, but the present invention is not limited to this. If the oxygen concentration in the housing 121 can be sufficiently reduced during the exposure process, the inert gas may not be supplied into the housing 121.

(8) Correspondence relationship between each component of the claim and each part of the embodiment The following describes an example of the correspondence between each component of the claim and each component of the embodiment. Not limited to the example. As each component of the claim, various other components having the structure or function described in the claim can also be used.
(9) Reference form
(9-1) The exposure apparatus according to the first reference embodiment includes a processing chamber for accommodating a substrate, a mounting portion on which the substrate is placed, a light source portion for emitting vacuum ultraviolet rays, and a processing chamber. The mounting portion is in the first position in the processing chamber when the substrate is carried in and out of the processing chamber, and the mounting portion is in the first position when the light source unit irradiates the substrate with vacuum ultraviolet rays. When the drive unit that moves the mounting unit to the first position and the second position and the mounting unit are at least in the first position so that they are in the second position closer to the light source unit than the position. It is provided with a cooling unit for cooling the mounting unit.
In this exposure apparatus, the substrate is housed in the processing chamber. The drive unit moves the mounting portion to the first position so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber. The cooling section cools the mounting section when the mounting section is in at least the first position. In the processing chamber, the substrate is placed on the mounting portion. Vacuum ultraviolet rays are emitted by the light source unit. When the light source unit irradiates the substrate with vacuum ultraviolet rays, the mounting unit is moved to the second position by the driving unit so that the mounting unit is in the second position closer to the light source unit than the first position. To. The drive unit moves the mounting unit to the first position so that the mounting unit is in the first position in the processing chamber when the substrate is carried out of the processing room.
According to this configuration, when the light source unit irradiates the substrate with vacuum ultraviolet rays, the substrate is placed close to the light source unit in a state of being mounted on the mounting unit. Here, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate.
Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.
(9-2) The exposure apparatus may further include a contact member that comes into contact with the mounting portion at the first position, and the cooling portion may be provided on the contact member so as to cool the contact member. In this case, the mounting portion is cooled by the cooling portion via the contact member by coming into contact with the contact member at the first position. Therefore, it is not necessary to provide the cooling unit in the mounting unit, and it is not necessary to connect the driving device for driving the cooling unit to the cooling unit provided in the mounting unit. This makes it possible to simplify the configuration for moving the mounting portion between the first position and the second position.
(9-3) The mounting portion may have a lower surface, and the contact member may have a contact surface that comes into contact with the lower surface of the mounting portion when the mounting portion is cooled. In this case, heat is transferred from the mounting portion to the contact member over a wide range. As a result, the mounting portion can be efficiently cooled.
(9-4) The light source unit is arranged above the mounting unit, emits vacuum ultraviolet rays downward, the second position is below the light source unit, and the first position is below the second position. Yes, the drive unit may raise and lower the mounting unit between the first position and the second position. In this case, by lowering the mounting portion to the first position, the substrate can be easily carried into the processing chamber or the substrate can be easily carried out of the processing chamber without interfering with the light source portion. it can. Further, by raising the mounting portion to the second position while the substrate is mounted, the substrate and the light source portion can be easily brought close to each other.
(9-5) The cooling unit may be arranged below the mounting unit and may come into contact with the mounting unit when the mounting unit is in the first position. In this case, by lowering the mounting portion to the first position, the mounting portion can be brought into contact with the cooling portion to be easily cooled.
(9-6) The exposure apparatus further includes a plurality of support members extending upward from the contact member, the upper ends of the plurality of support members are higher than the first position and lower than the second position, and the mounting portion is , The plurality of support members may have a plurality of through holes through which the plurality of support members can pass, and the plurality of support members may penetrate the plurality of through holes of the mounting portion when the mounting portion is in the first position.
In this case, the plurality of support members can support the substrate carried into the processing chamber at the upper end higher than the first position and lower than the second position. Therefore, the substrate can be easily mounted on the mounting portion by raising the mounting portion from the first position. Further, the substrate can be supported by the upper ends of the plurality of support members by lowering the mounting portion from the second position. As a result, the substrate can be easily carried out of the processing chamber from the upper ends of the plurality of support members.
(9-7) The cooling unit may be provided in the mounting unit. In this case, the mounting portion can be constantly cooled by the cooling portion. As a result, the mounting portion can be cooled more efficiently.
(9-8) The driving unit may move the mounting unit from the first position to the second position after the emission of the vacuum ultraviolet rays by the light source unit is started. In this case, the time point at which the mounting portion moves from the first position to the second position is later than the time point at which the light source unit starts emitting the vacuum ultraviolet rays. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.
(9-9) The driving unit may move the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped. In this case, the time point at which the mounting portion moves from the second position to the first position is before the time point at which the emission of the vacuum ultraviolet rays by the light source unit is stopped. Therefore, in the first position, the mounting portion can be sufficiently cooled by the cooling portion.
(9-10) The light source unit may be configured to emit vacuum ultraviolet rays having a planar cross section. In this case, vacuum ultraviolet rays are emitted over a wide range. Therefore, the exposure of the substrate is completed in a shorter time. Thereby, the efficiency of the exposure processing of the substrate can be further improved.
(9-11) The area of the vacuum ultraviolet rays emitted by the light source unit may be larger than the area of the substrate. In this case, since the entire surface of the substrate can be exposed, the exposure of the substrate is completed in a shorter time. Thereby, the efficiency of the exposure processing of the substrate can be further improved.
(9-12) The substrate processing apparatus according to the second reference embodiment heat-treats a coating processing unit that forms a film on the substrate by applying a processing liquid to the substrate and a substrate on which the film is formed by the coating processing unit. A heat treatment unit, an exposure apparatus according to a first reference mode for exposing a substrate heat-treated by the heat treatment unit, and a development processing unit for developing a film of the substrate by supplying a solvent to the substrate exposed by the exposure apparatus. Be prepared.
In this substrate processing apparatus, a film is formed on the substrate by applying the processing liquid to the substrate by the coating processing unit. The substrate on which the film is formed by the coating treatment section is heat-treated by the heat treatment section. The substrate heat-treated by the heat-treated section is exposed by the above-mentioned exposure apparatus. The film of the substrate is developed by supplying a solvent to the substrate exposed by the exposure apparatus by the developing processing unit.
In the exposure apparatus, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate.
Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.
(9-13) The treatment liquid may contain an inducible self-assembling material. In this case, the substrate coated with the treatment liquid containing the inductive self-assembling material is heat-treated, so that microphase separation occurs on one surface of the substrate. In addition, a substrate on which two types of polymer patterns are formed by microphase separation is exposed and developed. As a result, one of the two types of polymers can be removed to form a finely divided pattern.
(9-14) The exposure method according to the third reference embodiment is such that the step of accommodating the substrate in the processing chamber and the mounting portion at the first position in the processing chamber when the substrate is carried into the processing chamber. In addition, a step of moving the mounting portion to the first position by the driving unit, a step of cooling the mounting portion by the cooling unit when the mounting portion is at least in the first position, and mounting in the processing chamber. The step of mounting the substrate on the unit, the step of emitting vacuum ultraviolet rays by the light source unit, and the step where the mounting unit is closer to the light source unit than the first position when the substrate is irradiated with the vacuum ultraviolet rays by the light source unit. The step of moving the mounting unit to the second position by the drive unit as in position 2 and the mounting unit in the first position in the processing chamber when the substrate is carried out of the processing chamber. , Including a step of moving the mounting unit to the first position by the driving unit.
According to this exposure method, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.
(9-15) In the substrate processing method according to the fourth reference embodiment, a step of forming a film on the substrate by applying a treatment liquid to the surface to be processed of the substrate by the coating processing section and a film forming by the coating processing section. The step of heat-treating the heat-treated substrate by the heat-treated section, the exposure method according to the third reference embodiment in which the substrate heat-treated by the heat-treated section is exposed by the exposure apparatus, and the development treatment on the surface to be processed of the substrate exposed by the exposure apparatus. It includes a step of developing a film of a substrate by supplying a solvent to the unit.
According to this substrate processing method, the substrate after the film is formed and before the development is exposed to vacuum ultraviolet rays. In the exposure method, since the mounting portion is pre-cooled by the cooling portion, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. Further, the cooling of the mounting portion by the cooling unit is performed in parallel with the process of carrying the substrate into the processing chamber and the process of carrying the substrate out of the processing chamber, and is performed during a period when the substrate does not exist in the processing chamber. Therefore, it is not necessary to separately secure the time for cooling the mounting portion by the cooling portion. As a result, the efficiency of the exposure processing of the substrate can be improved.

In the above embodiment, the substrate W is an example of a substrate, the processing chamber 120 is an example of a processing chamber, the mounting plate 151 is an example of a mounting portion, and the light source unit 163 is an example of a light source unit. The drive device 153 is an example of a drive unit, and the cooling unit 143 is an example of a cooling unit. The exposure apparatus 100 is an example of an exposure apparatus, the support plate 141 is an example of a contact member, the lower surface 151b is an example of a lower surface, the upper surface 141b is an example of a contact surface, and the support pin 142 is an example of a support member. Yes, the upper end 142a is an example of the upper end. The through hole 151a is an example of a through hole, the coating device 240 is an example of a coating processing section, the heat treatment device 230 is an example of a heat treatment section, the developing device 250 is an example of a developing processing section, and the substrate processing device 200. Is an example of a substrate processing device.

1 ... Blockage control unit, 2 ... Elevation control unit, 3 ... Exhaust control unit, 4 ... Air supply control unit, 5 ... Density acquisition unit, 6 ... Density comparison unit, 7 ... Illumination acquisition unit, 8 ... Exposure calculation unit, 9 ... Exposure comparison unit, 10 ... Light projection control unit, 100 ... Exposure device, 110 ... Control unit, 120 ... Processing room, 121 ... Housing, 121a ... Conveyance opening, 121b, 141a ... Opening, 122 ... Annular member , 123 ... Covering member, 130 ... Closing part, 131 ... Shutter, 131a, s1 to s3 ... Sealing member, 132, 152 ... Connecting member, 133, 153 ... Drive device, 133a, 133b, 153a, 153b ... Position sensor, 140 ... Delivery part, 141 ... Support plate, 141b ... Top surface, 142 ... Support pin, 142a ... Upper end, 143 ... Cooling part, 143a ... Cooling pipe, 143b ... Medium supply source, 143c ... Cooling element, 143d ... Power supply source, 150 ... Elevating part, 151 ... Mounting plate, 151a ... Through hole, 151b ... Bottom surface, 160 ... Light projecting part, 161 ... Housing, 162 ... Translucent plate, 163 ... Light source part, 164 ... Power supply device, 170 ... Replacement part, 171p to 173p ... Piping, 171v to 173v ... Valve, 173 ... Suction device, 173a, 173b ... Branch pipe, 180 ... Measuring unit, 181 ... Oxygen concentration meter, 182 ... Ozone concentration meter, 183 ... Luminometer, 200 ... Substrate processing Equipment, 210 ... Control device, 220 ... Conveyor device, 230 ... Heat treatment device, 240 ... Coating device, 250 ... Development device, L1 ... Underlayer, L2 ... Guide pattern, L3 ... DSA film, p1 to p3 ... Connection port, Q1 , Q2 ... Pattern, W ... Board

Claims (19)

A processing room for accommodating the substrate and
In the processing chamber, a mounting portion on which the substrate is mounted and a mounting portion
An exhaust unit that exhausts the atmosphere in the processing room and
A light source that emits vacuum ultraviolet rays and
When the substrate is carried into the processing chamber and the substrate is carried out of the processing chamber, the above-mentioned placing portion is in the first position in the processing chamber, and when the light source portion irradiates the substrate with vacuum ultraviolet rays. A drive unit that moves the pre-described installation unit to the first position and the second position so that the pre-described installation unit is located at a second position closer to the light source unit than the first position.
A cooling unit that cools the preamble when it is at least in the first position and does not cool the predecessor when it is in the second position.
With the contact member in contact with the above-mentioned resting portion at the first position,
A plurality of support members extending upward from the contact member are provided.
The plurality of support members support the substrate when the above-mentioned mounting portion is in the first position.
The cooling unit is provided on the contact member so as to cool the contact member.
The driver may Before moving the placing part to the second position from the first position after the emission of vacuum ultraviolet rays by the light source unit is started, the exposure apparatus. The exposure apparatus according to claim 1, wherein the driving unit moves the above-described mounting unit from the second position to the first position before the emission of vacuum ultraviolet rays by the light source unit is stopped. A processing room for accommodating the substrate and
In the processing chamber, a mounting portion on which the substrate is mounted and a mounting portion
An exhaust unit that exhausts the atmosphere in the processing room and
A light source that emits vacuum ultraviolet rays and
When the substrate is carried into the processing chamber and the substrate is carried out of the processing chamber, the above-mentioned placing portion is in the first position in the processing chamber, and when the light source portion irradiates the substrate with vacuum ultraviolet rays. A drive unit that moves the pre-described installation unit to the first position and the second position so that the pre-described installation unit is located at a second position closer to the light source unit than the first position.
A cooling unit that cools the preamble when it is at least in the first position and does not cool the predecessor when it is in the second position.
With the contact member in contact with the above-mentioned resting portion at the first position,
A plurality of support members extending upward from the contact member are provided.
The plurality of support members support the substrate when the above-mentioned mounting portion is in the first position.
The cooling unit is provided on the contact member so as to cool the contact member.
The driving unit is an exposure device that moves the above-mentioned mounting unit from the second position to the first position before the emission of vacuum ultraviolet rays by the light source unit is stopped. The above-mentioned rest has a lower surface and has a lower surface.
The exposure apparatus according to any one of claims 1 to 3, wherein the contact member has a contact surface that comes into contact with the lower surface of the previously described placing portion when the previously described placing portion is cooled. The light source unit is arranged above the above-mentioned installation unit, emits vacuum ultraviolet rays downward, and emits vacuum ultraviolet rays downward.
The second position is below the light source unit, the first position is below the second position, and so on.
The exposure apparatus according to claim 4 , wherein the drive unit raises and lowers the above-mentioned placement unit between the first position and the second position. The exposure apparatus according to claim 5 , wherein the cooling unit is arranged below the previously described placing portion and comes into contact with the previously described placing portion when the previously described placing portion is in the first position. The upper ends of the plurality of support members are higher than the first position and lower than the second position.
The above-mentioned mounting portion has a plurality of through holes through which the plurality of support members can pass.
The exposure apparatus according to claim 6 , wherein the plurality of support members penetrate the plurality of through holes of the previously described mounting portion when the previously described mounting portion is in the first position. A processing room for accommodating the substrate and
In the processing chamber, a mounting portion on which the substrate is mounted and a mounting portion
An exhaust unit that exhausts the atmosphere in the processing room and
A light source that emits vacuum ultraviolet rays and
When the substrate is carried into the processing chamber and the substrate is carried out of the processing chamber, the above-mentioned placing portion is in the first position in the processing chamber, and when the light source portion irradiates the substrate with vacuum ultraviolet rays. A drive unit that moves the pre-described installation unit to the first position and the second position so that the pre-described installation unit is located at a second position closer to the light source unit than the first position.
A cooling unit provided in the previously described mounting portion so as to cool the previously described mounting portion, and a cooling unit.
With the contact member in contact with the above-mentioned resting portion at the first position,
A plurality of support members extending upward from the contact member are provided.
The plurality of support members support the substrate when the above-mentioned mounting portion is in the first position .
The driver may Before moving the placing part to the second position from the first position after the emission of vacuum ultraviolet rays by the light source unit is started, the exposure apparatus. The exposure apparatus according to claim 8 , wherein the driving unit moves the above-described mounting unit from the second position to the first position before the emission of vacuum ultraviolet rays by the light source unit is stopped. A processing room for accommodating the substrate and
In the processing chamber, a mounting portion on which the substrate is mounted and a mounting portion
An exhaust unit that exhausts the atmosphere in the processing room and
A light source that emits vacuum ultraviolet rays and
When the substrate is carried into the processing chamber and the substrate is carried out of the processing chamber, the above-mentioned placing portion is in the first position in the processing chamber, and when the light source portion irradiates the substrate with vacuum ultraviolet rays. A drive unit that moves the pre-described installation unit to the first position and the second position so that the pre-described installation unit is located at a second position closer to the light source unit than the first position.
A cooling unit provided in the pre-described installation unit so as to cool the pre-described installation unit,
With the contact member in contact with the above-mentioned resting portion at the first position,
A plurality of support members extending upward from the contact member are provided.
The plurality of support members support the substrate when the above-mentioned mounting portion is in the first position.
The driving unit is an exposure device that moves the above-mentioned mounting unit from the second position to the first position before the emission of vacuum ultraviolet rays by the light source unit is stopped. The exposure apparatus according to any one of claims 1 to 10 , wherein the light source unit is configured to emit vacuum ultraviolet rays having a planar cross section. The exposure apparatus according to claim 11 , wherein the emission area of the vacuum ultraviolet rays by the light source unit is larger than the area of the substrate. A coating treatment unit that forms a film on the substrate by applying the treatment liquid to the substrate,
A heat treatment section that heat-treats the substrate on which the film is formed by the coating treatment section, and a heat treatment section.
The exposure apparatus according to any one of claims 1 to 12 , which exposes the substrate heat-treated by the heat-treated portion.
A substrate processing apparatus including a developing processing unit that develops a film of the substrate by supplying a solvent to the substrate exposed by the exposure apparatus. The substrate processing apparatus according to claim 13 , wherein the treatment liquid contains an inductive self-assembling material. The step of accommodating the substrate in the processing chamber and
A step of moving the previously described mounting portion to the first position by the driving unit so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber.
A step of cooling the previously described resting portion by a cooling portion provided on the contacting member so as to cool the contacting member when the previously described resting portion is at least in the first position.
A step of supporting the substrate by a plurality of support members extending upward from the contact member when the above-described resting portion is in the first position.
In the processing chamber, a step in which the substrate is placed on the above-mentioned placing portion, and
The step of exhausting the atmosphere in the processing room and
The step of emitting vacuum ultraviolet rays by the light source unit without cooling the above-mentioned storage unit by the cooling unit,
After the irradiation of the substrate with the vacuum ultraviolet rays by the light source portion is started, the above- described mounting portion is located at a second position closer to the light source portion than the first position from the first position. A step of moving the previously described mounting portion to the second position by the driving unit, and
A step of moving the pre-described mounting portion to the first position by the driving unit so that the pre-described mounting portion is at the first position in the processing chamber when the substrate is carried out of the processing chamber. Including, exposure method. The step of accommodating the substrate in the processing chamber and
A step of moving the previously described mounting portion to the first position by the driving unit so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber.
A step of cooling the previously described resting portion by a cooling portion provided on the contacting member so as to cool the contacting member when the previously described resting portion is at least in the first position.
A step of supporting the substrate by a plurality of support members extending upward from the contact member when the above-described resting portion is in the first position.
In the processing chamber, a step in which the substrate is placed on the above-mentioned placing portion, and
The step of exhausting the atmosphere in the processing room and
The step of emitting vacuum ultraviolet rays by the light source unit without cooling the above-mentioned storage unit by the cooling unit,
When the substrate is irradiated with vacuum ultraviolet rays by the light source unit, the drive unit causes the pre-described unit to be placed at a second position closer to the light source unit than the first position. The step to move to the second position and
When the substrate is carried out of the processing chamber, the drive unit moves forward so that the previously described mounting unit is in the first position in the processing chamber before the emission of the vacuum ultraviolet rays by the light source unit is stopped. An exposure method comprising the step of moving the description portion from the second position to the first position. The step of accommodating the substrate in the processing chamber and
A step of moving the previously described mounting portion to the first position by the driving unit so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber.
A step of cooling the previously described mounting portion by a cooling portion provided on the previously described mounting portion, and
A step of supporting the substrate by a plurality of support members extending upward from the contact member when the above-described resting portion is in the first position.
In the processing chamber, a step in which the substrate is placed on the above-mentioned placing portion, and
The step of exhausting the atmosphere in the processing room and
A step of emitting vacuum ultraviolet rays by a light source unit while cooling the above-mentioned storage unit by the cooling unit.
After the irradiation of the substrate with the vacuum ultraviolet rays by the light source portion is started, the above- described mounting portion is located at a second position closer to the light source portion than the first position from the first position. A step of moving the previously described mounting portion to the second position by the driving unit, and
A step of moving the pre-described mounting portion to the first position by the driving unit so that the pre-described mounting portion is at the first position in the processing chamber when the substrate is carried out of the processing chamber. Including, exposure method. The step of accommodating the substrate in the processing chamber and
A step of moving the previously described mounting portion to the first position by the driving unit so that the mounting portion is in the first position in the processing chamber when the substrate is carried into the processing chamber.
A step of cooling the previously described mounting portion by a cooling portion provided on the previously described mounting portion, and
A step of supporting the substrate by a plurality of support members extending upward from the contact member when the above-described resting portion is in the first position.
In the processing chamber, a step in which the substrate is placed on the above-mentioned placing portion, and
The step of exhausting the atmosphere in the processing room and
A step of emitting vacuum ultraviolet rays by a light source unit while cooling the above-mentioned storage unit by the cooling unit.
When the substrate is irradiated with vacuum ultraviolet rays by the light source unit, the drive unit causes the pre-described unit to be placed at a second position closer to the light source unit than the first position. The step to move to the second position and
When the substrate is carried out of the processing chamber, the drive unit moves forward so that the previously described mounting unit is in the first position in the processing chamber before the emission of the vacuum ultraviolet rays by the light source unit is stopped. An exposure method comprising the step of moving the description portion from the second position to the first position. The step of forming a film on the substrate by applying the treatment liquid to the surface to be treated of the substrate by the coating treatment unit, and
The step of heat-treating the substrate on which the film is formed by the coating treatment section by the heat treatment section,
The exposure method according to any one of claims 15 to 18, wherein the substrate heat-treated by the heat-treated portion is exposed by an exposure apparatus.
A substrate processing method comprising a step of developing a film of a substrate by supplying a solvent to a surface to be processed of the substrate exposed by the exposure apparatus by a developing processing unit.

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