TWI676868B - Exposure device, substrate processing apparatus, exposure method of substrate and substrate processing method - Google Patents

Abstract

In the present invention, when the substrate is carried into the processing chamber, the mounting plate is located in a standby position in the processing chamber, and the driving plate is moved to the standby position by a driving device. When the placing plate is at least in the standby position, the placing plate is cooled by the cooling section. The substrate is placed on a mounting plate in a processing chamber. Vacuum ultraviolet rays are emitted by the light source section. When the substrate is irradiated with vacuum ultraviolet rays by the light source section, the mounting plate is positioned closer to the processing position of the light source section than the standby position, and the mounting plate is moved to the processing position by the driving device. When the substrate is placed in a standby position in the processing room when the substrate is carried out to the processing room, the mounting plate is moved to the standby position by a driving device.

Description

Exposure device, substrate processing device, substrate exposure method, and substrate processing method

The present invention relates to an exposure apparatus, a substrate processing apparatus, a substrate exposure method, and a substrate processing method that perform exposure processing on a substrate.

In recent years, in order to miniaturize the pattern formed on the substrate, the development of photolithography technology using Directed Self Assembly (DSA) of block copolymers has been continuously promoted. In such a photolithography technique, after a substrate coated with a block polymer is subjected to a heat treatment, one side of the substrate is exposed, thereby modifying the block polymer. In this process, it is required to accurately adjust the exposure amount of the substrate. Patent Document 1 describes an exposure apparatus that exposes a film (DSA film) containing an oriented self-assembly material on a substrate. The exposure device is configured to include a light emitting portion that can emit vacuum ultraviolet rays with a cross-section in a band shape, and the substrate can move from a position in front of the light emitting portion to a rear position so as to cross the path of the vacuum ultraviolet rays from the light emitting portion. Before the exposure process, the illuminance sensor detects the illuminance of vacuum ultraviolet rays in advance, and calculates the movement speed of the substrate based on the detected illuminance so as to irradiate the vacuum ultraviolet rays with a desired exposure amount. During the exposure process, the DSA film on the substrate is irradiated with vacuum ultraviolet rays of a desired exposure amount by moving the substrate at the calculated moving speed. [Patent Document 1] Japanese Patent Laid-Open No. 2016-183990

[Problems to be Solved by the Invention] In the exposure process, the substrate is heated by irradiating the substrate with vacuum ultraviolet rays, and the temperature of the substrate rises. When a substrate having a relatively high temperature is carried out from the exposure device by the holding portion of the carrying device, the temperature of the holding portion of the carrying device rises. In this case, the temperature of other substrates transferred by the holding section of the exposure apparatus will also rise. Variations in substrate temperature affect the uniformity of substrate processing. Therefore, after the temperature of the substrate is lowered below a specific temperature (for example, 50 degrees) in the exposure device, the substrate is carried out from the exposure device. However, it takes time to reduce the temperature of the substrate to a specific temperature or lower, so the efficiency of the substrate exposure process is reduced. An object of the present invention is to provide an exposure device, a substrate processing device, an exposure method, and a substrate processing method that can improve the efficiency of substrate exposure processing. [Technical means to solve the problem] (1) An exposure apparatus according to one aspect of the present invention includes: a processing chamber that houses a substrate; a mounting section that mounts the substrate in the processing chamber; a light source section that emits vacuum ultraviolet rays; a drive It moves the placement section to the first position and the second position in such a manner that the placement section is located at the first position in the processing chamber when the substrate is moved into the processing chamber and the substrate is removed from the processing chamber, and when When the light source section irradiates the substrate with vacuum ultraviolet rays, the mounting section is located at a second position closer to the light source section than the first position; and the cooling section cools the mounting section when the mounting section is at least in the first position. In this exposure apparatus, a substrate is housed in a processing chamber. The driving section moves the mounting section to the first position so that the mounting section is located at the first position in the processing chamber when the substrate is carried into the processing chamber. When the placement portion is at least in the first position, the placement portion is cooled by the cooling portion. The substrate is placed on the placing section in the processing chamber. Vacuum ultraviolet rays are emitted by the light source section. When the substrate is irradiated with vacuum ultraviolet rays by the light source section, the mounting section is positioned at the second position closer to the light source section than the first position, and the mounting section is moved to the second position by the driving section. When the mounting portion is located at the first position in the processing chamber when the substrate is carried out to the processing room, the mounting portion is moved to the first position by the driving portion. According to this configuration, when the substrate is irradiated with vacuum ultraviolet rays by the light source section, the substrate approaches the light source section while being placed on the placement section. Here, since the mounting portion is cooled in advance by the cooling portion, even when the substrate is irradiated with vacuum ultraviolet rays by the light source portion, the temperature of the substrate does not rise above a specific temperature. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to perform a separate process for cooling the substrate. In addition, the cooling of the placing section by the cooling section is performed in synchronization with the processing of transferring the substrate into the processing chamber and the processing of transferring the substrate out of the processing chamber, and is performed while the substrate is not present in the processing chamber. Therefore, it is not necessary to separately secure a time for cooling the placement section by the cooling section. As a result, the efficiency of the substrate exposure process can be improved. (2) The exposure device may further include a contact member in contact with the placement portion at the first position, and the cooling portion may be provided on the contact member to cool the contact member. In this case, the placing section is cooled by the cooling section via the contact member when the placing section contacts the contact member at the first position. Therefore, there is no need to provide a cooling section in the mounting section, and it is not necessary to connect a driving device for driving the cooling section to the cooling section provided in the mounting section. Thereby, the structure for moving a mounting part between a 1st position and a 2nd position can be simplified. (3) The mounting portion may have a lower surface, and the contact member may have a contact surface that contacts the lower surface of the mounting portion when the mounting portion is cooled. In this case, movement of the thermal self-mounting portion to the contact member is performed over a wide area. Thereby, the mounting part can be efficiently cooled. (4) The light source section can also be arranged above the mounting section and emits vacuum ultraviolet rays downward. The second position can be positioned below the light source section and the first position can be positioned below the second position. The driving section can place the mounting section on the Lift between the first position and the second position. In this case, by lowering the placement portion to the first position, the substrate and the light source portion do not interfere with each other, and the substrate can be easily carried into the processing chamber or the substrate can be easily carried out of the processing chamber. In addition, the substrate and the light source portion can be easily accessed by raising the placement portion to the second position while the substrate is placed. (5) The cooling section may be disposed below the placing section, and is in contact with the placing section when the placing section is located at the first position. In this case, by lowering the placement portion to the first position, the placement portion can be brought into contact with the cooling portion to easily cool it. (6) The exposure device may further include a plurality of support members extending upward from the contact member. The upper end of the plurality of support members may be higher than the first position and lower than the second position, and the mounting portion may include a plurality of support members. The plurality of through holes that pass through, and the plurality of support members penetrate the plurality of through holes of the mounting portion when the mounting portion is located at the first position. In this case, the plurality of supporting members may support the substrate that has been moved into the processing chamber at an upper end higher than the first position and lower than the second position. Therefore, the substrate can be easily placed on the placement portion by raising the placement portion from the first position. In addition, by lowering the mounting portion from the second position, the substrate can be supported on the upper ends of the plurality of supporting members. Thereby, the substrate can be easily carried out from the upper end of the plurality of supporting members to the processing room. (7) The cooling section may be provided on the placement section. In this case, the mounting section can be continuously cooled by the cooling section. Thereby, the mounting part can be cooled more efficiently. (8) The driving unit may also move the mounting unit from the first position to the second position after starting to use the light source unit to emit vacuum ultraviolet rays. In this case, the time point at which the mounting portion is moved from the first position to the second position is later than the time point at which the vacuum ultraviolet rays are emitted from the light source portion. Therefore, the placement portion can be sufficiently cooled by the cooling portion at the first position. (9) The driving unit may move the mounting unit from the second position to the first position before stopping the use of the light source unit to emit the vacuum ultraviolet light. In this case, the time point at which the placement section is moved from the second position to the first position is earlier than the time point at which the use of the light source section to stop emitting vacuum ultraviolet rays. Therefore, the placement portion can be sufficiently cooled by the cooling portion at the first position. (10) The light source unit may be configured to emit vacuum ultraviolet rays having a planar cross section. In this case, vacuum ultraviolet rays are emitted in a wide range. Therefore, the exposure of the substrate is ended in a shorter time. This can further improve the efficiency of the substrate exposure process. (11) The emission area of the vacuum ultraviolet rays of the light source portion may be larger than the area of the substrate. In this case, the entire surface of the substrate can be exposed, so the exposure of the substrate is ended in a shorter time. This can further improve the efficiency of the substrate exposure process. (12) A substrate processing apparatus according to another aspect of the present invention includes: a coating processing section that forms a film on a substrate by applying a processing liquid to the substrate; and a thermal processing section that is formed with the coating processing section. The substrate of the film is heat-treated; the exposure device according to one aspect of the present invention exposes the substrate that has been heat-treated by the heat-treating portion; and the developing treatment portion that supplies the solvent to the substrate that has been exposed by the exposure device, Thereby, the film of the substrate is developed. In this substrate processing apparatus, a processing liquid is applied to a substrate by a coating processing unit, thereby forming a film on a substrate. The substrate having been formed with a film by the coating treatment portion is subjected to a heat treatment by a heat treatment portion. The substrate subjected to the heat treatment by the heat treatment section is exposed by the exposure apparatus described above. A solvent is supplied to the substrate that has been exposed by the exposure device by a development processing unit, thereby developing the film of the substrate. In the exposure device, the mounting section has been cooled by the cooling section in advance, so even when the substrate is irradiated with vacuum ultraviolet rays by the light source section, the temperature of the substrate does not rise above a specific temperature. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. In addition, the cooling of the placing section by the cooling section is performed in synchronization with the processing of transferring the substrate into the processing chamber and the processing of transferring the substrate out of the processing chamber, and is performed while the substrate is not present in the processing chamber. Therefore, it is not necessary to separately secure a time for cooling the placement section by the cooling section. As a result, the efficiency of the substrate exposure process can be improved. (13) The treatment liquid may also include a directional self-assembling material. In this case, micro-phase separation occurs on one surface of the substrate by heat-treating the substrate coated with a processing solution containing an oriented self-assembly material. In addition, a substrate on which a pattern of two polymers was formed by microphase separation was exposed and developed. By removing one of the two polymers, a finer pattern can be formed. (14) According to yet another aspect of the present invention, the exposure method includes the steps of: accommodating the substrate in the processing chamber; and placing the substrate at the first position in the processing chamber when the substrate is carried into the processing chamber by the driving unit. Move the mounting portion to the first position; when the mounting portion is at least in the first position, cool the mounting portion by the cooling portion; place the substrate on the mounting portion in the processing chamber; and emit through the light source portion Vacuum ultraviolet light; the mounting portion is moved to the second position by the driving portion so that the mounting portion is located at the second position closer to the light source portion than the first position when the substrate is irradiated with the vacuum ultraviolet light by the light source portion; and When the substrate is carried out to the processing chamber, the mounting section is located at the first position in the processing chamber. The driving section moves the mounting section to the first position. According to this exposure method, the placing section is cooled by the cooling section in advance, so that even when the substrate is irradiated with vacuum ultraviolet rays by the light source section, the temperature of the substrate does not rise above a specific temperature. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. In addition, the cooling of the placing section by the cooling section is performed in synchronization with the processing of transferring the substrate into the processing chamber and the processing of transferring the substrate out of the processing chamber, and is performed while the substrate is not present in the processing chamber. Therefore, it is not necessary to separately secure a time for cooling the placement section by the cooling section. As a result, the efficiency of the substrate exposure process can be improved. (15) According to yet another aspect of the present invention, a substrate processing method includes: a step of applying a processing solution to a processed surface of the substrate by a coating processing section, thereby forming a film on the substrate; A step of heat-treating the substrate on which the film has been formed by applying the processing portion; according to yet another aspect of the exposure method of the present invention, exposing the substrate that has been heat-treated by the heat-treatment portion by an exposure device; And, the development processing section supplies a solvent to the processed surface of the substrate that has been exposed by the exposure device, thereby developing the film of the substrate. According to this substrate processing method, the substrate after film formation and before development is exposed by vacuum ultraviolet rays. In the exposure method, the placement section has been cooled by the cooling section in advance, so even when the substrate is irradiated with vacuum ultraviolet rays by the light source section, the temperature of the substrate does not rise above a specific temperature. Therefore, it is not necessary to make the substrate stand by in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate. In addition, the cooling of the placing section by the cooling section is performed in synchronization with the processing of transferring the substrate into the processing chamber and the processing of transferring the substrate out of the processing chamber, and is performed while the substrate is not present in the processing chamber. Therefore, it is not necessary to separately secure a time for cooling the placement section by the cooling section. As a result, the efficiency of the substrate exposure process can be improved. [Effects of the Invention] According to the present invention, the efficiency of the exposure processing of the substrate can be improved.

(1) Structure of Exposure Apparatus Hereinafter, an exposure apparatus, a substrate processing apparatus, an exposure method, and a substrate processing method according to an embodiment of the present invention will be described using drawings. In the following description, the substrate refers to a substrate for an FPD (Flat Panel Display) such as a semiconductor substrate, a liquid crystal display device, or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, and a magnetic disk. Substrates, substrates for magneto-optical disks, substrates for photomasks, substrates for solar cells, and the like. FIG. 1 is a schematic cross-sectional view showing the structure of an exposure apparatus according to an embodiment of the present invention. As shown in FIG. 1, the exposure apparatus 100 includes a control section 110, a processing chamber 120, a closed section 130, a transfer section 140, a lifting section 150, a light projection section 160, a replacement section 170, and a measurement section 180. The control unit 110 acquires a measurement value from the measurement unit 180 and controls operations of the closing unit 130, the lifting unit 150, the light projecting unit 160, and the replacement unit 170. The functions of the control unit 110 will be described later. The processing chamber 120 includes a casing 121 having an upper opening and an internal space, an annular member 122 and a covering member 123. A transfer opening 121 a is formed on a side surface of the case 121 for transferring the substrate W to be processed between the inside and the outside of the case 121. Furthermore, in this embodiment, a film (hereinafter, referred to as a DSA (Directed Self Assembly) film) including a directional self-assembly material is formed on the substrate W to be processed. Further, an opening portion 121b is formed on the bottom surface of the housing 121 to allow the connection member 152 of the elevating portion 150 described below to pass through. The outer cover 161 of the light-emitting portion 160 described below is disposed on the upper portion of the casing 121 via the ring-shaped member 122, thereby closing the opening of the upper portion of the casing 121. Between the housing 121 and the ring-shaped member 122, and between the ring-shaped member 122 and the cover 161, seal members s1 and s2 are respectively mounted. A covering member 123 is attached between the housing 121 and the cover 161 so as to cover the outer peripheral surface of the ring-shaped member 122. The closing portion 130 includes a baffle 131, a rod-shaped connecting member 132, and a driving device 133. The connecting member 132 connects the shutter 131 and the driving device 133. The driving device 133 is, for example, a stepping motor. The driving device 133 moves the baffle 131 between an open position where the baffle 131 opens the transfer opening 121a and a closed position where the baffle 131 closes the transfer opening 121a. A sealing member 131 a is attached to the baffle 131. In a state where the baffle plate 131 is in the closed position, the sealing member 131 a is in close contact with a portion of the casing 121 that surrounds the conveyance opening 121 a, thereby sealing the inside of the casing 121. Furthermore, in order to prevent friction between the sealing member 131 a and the case 121, when the driving device 133 moves the shutter 131 between the open position and the closed position, the drive device 133 moves the shutter 131 in a vertical direction while leaving the case 121. Position sensors 133a and 133b for detecting the upper limit position and the lower limit position of the baffle plate 131 are installed on the driving device 133, respectively. The position sensors 133a and 133b provide the detection result to the control unit 110. In this embodiment, the driving device 133 and the following driving device 153 are provided outside the processing chamber 120. Therefore, even when dust is generated by the driving of the driving devices 133 and 153, it is possible to prevent the dust from directly intruding into the housing 121. The transfer section 140 includes, for example, a circular plate-shaped support plate 141, a plurality of (three in this example) support pins 142, and a cooling section 143. The support plate 141 is disposed in the casing 121 in a horizontal posture. An opening portion 141 a is formed in the central portion of the support plate 141 and allows the connecting member 152 of the elevating portion 150 described below to pass through. The plurality of support pins 142 extend upward from the upper surface of the support plate 141 so as to surround the opening portion 141 a. On the upper end 142 a of the plurality of support pins 142, a substrate W to be processed can be placed. FIG. 2 is a plan view showing the support plate 141 of the transfer part 140. As shown in FIG. 2, the cooling unit 143 includes a cooling pipe 143 a and a medium supply source 143 b. The cooling pipe 143 a is provided to be coiled in a state in contact with the support plate 141 and surrounds the support plate 141. Both ends of the cooling pipe 143a are connected to a medium supply source 143b. The medium supply source 143b supplies a cooling medium into the cooling pipe 143a from one end of the cooling pipe 143a, and recovers the cooling medium from the other end of the cooling pipe 143a. Thereby, a cooling medium is circulated in the cooling pipe 143a, and the support plate 141 is cooled. In this embodiment, the medium supply source 143b is a constant-temperature water circulation device and supplies constant-temperature pure water as a cooling medium, but the present invention is not limited to this. The medium supply source 143b may also be a cooling water circulation device that supplies cooled pure water as a cooling medium. The cooling pipe 143a is provided in the support plate 141, but the present invention is not limited to this. The cooling pipe 143a may be provided outside the support plate 141 in a state of being in contact with the lower surface of the support plate 141, for example. The lifting portion 150 in FIG. 1 includes a flat plate-shaped mounting plate 151, a rod-shaped connecting member 152, and a driving device 153. The mounting plate 151 is disposed in the housing 121 above the support plate 141 of the transfer portion 140 in a horizontal posture. A plurality of through holes 151 a corresponding to the plurality of support pins 142 of the support plate 141 are formed in the mounting plate 151. The connecting member 152 is disposed so as to extend up and down through the opening 121 b of the case 121 and the opening 141 a of the support plate 141, and the driving device 153 is disposed below the case 121. The connecting member 152 connects the mounting plate 151 and the driving device 153. Between the outer peripheral surface of the connecting member 152 and the inner peripheral surface of the opening 121b, a sealing member s3 is arranged so that the connecting member 152 can slide in the vertical direction. The driving device 153 is, for example, a stepping motor, and places the mounting plate 151 in a vertical direction between a processing position above the upper end 142a of the plurality of support pins 142 and a standby position below the upper end 142a of the plurality of support pins 142 mobile. Position sensors 153a and 153b for detecting the upper limit position and the lower limit position of the mounting plate 151 are mounted on the driving device 153, respectively. The position sensors 153a and 153b provide the detection results to the control unit 110. When the mounting plate 151 is in the standby position, the plurality of support pins 142 are respectively inserted into the plurality of through holes 151a, and the lower surface 151b of the mounting plate 151 is in contact with the upper surface (contact surface) 141b of the support plate 141. Accordingly, the placing plate 151 is cooled by the cooling portion 143 via the support plate 141. The light projecting section 160 includes a cover 161 having a lower opening and an internal space, a light transmitting plate 162, a planar light source section 163, and a power supply device 164. In this embodiment, the light transmitting plate 162 is a quartz glass plate. As the material of the light-transmitting plate 162, another material that transmits the vacuum ultraviolet rays described below may be used. As described above, the cover 161 is disposed on the upper portion of the casing 121 so as to close the opening of the upper portion of the casing 121. The light-transmitting plate 162 is mounted on the cover 161 so as to close the opening of the lower portion of the cover 161. The internal space of the housing 121 and the internal space of the outer cover 161 are optically partitioned by a light transmitting plate 162. The light source section 163 and the power supply device 164 are housed in a cover 161. In this embodiment, the light source unit 163 is configured by horizontally arranging a plurality of rod-shaped light sources of vacuum ultraviolet light having an emission wavelength of about 120 nm or more and about 230 nm or less at specific intervals. Each light source may be, for example, a xenon excimer lamp, or another excimer lamp or a deuterium lamp. The light source unit 163 emits vacuum ultraviolet rays having a substantially uniform light amount distribution into the housing 121 through the light transmitting plate 162. The area of the exit surface of the vacuum ultraviolet rays of the light source portion 163 is larger than the area of the processed surface of the substrate W. The power supply device 164 supplies power to the light source section 163. The replacement unit 170 includes pipes 171p, 172p, and 173p, valves 171v and 172v, and a suction device 173. The pipes 171p and 172p are connected between the air supply port of the housing 121 and the inert gas supply source. In this embodiment, the inert gas is, for example, nitrogen. Valves 171v and 172v are inserted into the pipes 171p and 172p. An inert gas is supplied into the casing 121 from the side of the support plate 141 through a pipe 171p. An inert gas is supplied into the casing 121 from below the support plate 141 through a pipe 172p. The flow rate of the inert gas is adjusted by the valves 171v and 172v. In this embodiment, nitrogen is used as the inert gas. The pipe 173p is branched into a branch pipe 173a and a branch pipe 173b. The branch pipe 173a is connected to the exhaust port of the casing 121, and the end of the branch pipe 173b is disposed between the casing 121 and the baffle 131. A suction device 173 is inserted into the pipe 173p. A valve 173v is inserted into the branch pipe 173b. The suction device 173 is, for example, an ejector. The piping 173p is connected to an exhaust system. The suction device 173 exhausts the gas in the casing 121 through the branch pipe 173a and the pipe 173p. In addition, the suction device 173 exhausts the gas between the casing 121 and the baffle plate 131 and the dust generated by the movement of the baffle plate 131 through the branch pipe 173b and the pipe 173p. The gas system exhausted by the suction device 173 is rendered harmless by the exhaust device. The measurement unit 180 includes an oxygen concentration meter 181, an ozone concentration meter 182, and an illuminance meter 183. The oxygen concentration meter 181, the ozone concentration meter 182, and the illuminance meter 183 are connected to the control unit 110 through connection ports p1, p2, and p3 provided in the housing 121, respectively. The oxygen concentration meter 181 is, for example, a Jafani battery type oxygen sensor or a zirconia type oxygen sensor, and measures the oxygen concentration in the case 121. The ozone concentration meter 182 measures the ozone concentration in the casing 121. The illuminance meter 183 includes a light-receiving element such as a photodiode, and measures the illuminance of vacuum ultraviolet rays from the light source unit 163 that is irradiated to the light-receiving surface of the light-receiving element. Here, the illuminance refers to the power of vacuum ultraviolet rays per unit area irradiated to the light receiving surface. The unit of the illuminance is, for example, "W / m ² ". (2) Outline Operation of Exposure Device In the exposure device 100, the substrate W is irradiated with vacuum ultraviolet rays from the light source unit 163 to perform exposure processing. However, when the oxygen concentration in the case 121 is high, the oxygen molecules absorb vacuum ultraviolet rays and are separated into oxygen atoms, and the separated oxygen atoms are recombined with other oxygen molecules to generate ozone. In this case, the vacuum ultraviolet rays reaching the substrate W are attenuated. Compared with the attenuation of ultraviolet rays with a longer wavelength of about 230 nm, the attenuation of vacuum ultraviolet rays is greater. Therefore, in the exposure process, the gas in the casing 121 is replaced with an inert gas by the replacement unit 170. This reduces the oxygen concentration in the casing 121. When the oxygen concentration measured by the oxygen concentration meter 181 decreases to a predetermined concentration, the substrate W is irradiated with vacuum ultraviolet rays from the light source section 163. Here, the predetermined concentration is preferably an oxygen concentration (for example, 1%) that does not generate ozone due to the vacuum ultraviolet rays emitted from the light source section 163. When the exposure amount of the vacuum ultraviolet ray irradiated to the substrate W reaches a predetermined exposure amount set in advance, the irradiation of the vacuum ultraviolet ray is stopped, and the exposure process ends. Here, the exposure amount refers to the energy of vacuum ultraviolet rays per unit area which is irradiated onto the processed surface of the substrate W during the exposure processing. The unit of the exposure amount is, for example, "J / m ² ". Therefore, the exposure amount of the vacuum ultraviolet ray is obtained by accumulating the illuminance of the vacuum ultraviolet ray measured by the illuminance meter 183. In the above-mentioned exposure process, the substrate W is heated by irradiating the substrate W with vacuum ultraviolet rays. In this case, if the temperature of the substrate W rises to a specific temperature (for example, 50 degrees or more), the substrate W cannot be carried out from the exposure device, and it is necessary to wait until the temperature of the substrate W decreases to a specific temperature. Therefore, the efficiency of the exposure process of the substrate W is reduced. In this embodiment, the placing plate 151 is moved to a standby position before being exposed to the exposure, and is brought into contact with the support plate 141 to be cooled in advance. During the exposure process, the substrate W is placed on the placing plate 151. Thereafter, the mounting plate 151 is moved to a processing position, and the substrate W is irradiated with vacuum ultraviolet rays while the substrate W is close to the light source portion 163. In this case, since the substrate W is placed on the cooled mounting plate 151, the temperature of the substrate W is prevented from rising above a specific temperature. This prevents the efficiency of the exposure process of the substrate W from being lowered. (3) Control section FIG. 3 is a functional block diagram showing the configuration of the control section 110 of FIG. 1. As shown in FIG. 3, the control section 110 includes a closed control section 1, a lift control section 2, an exhaust control section 3, an air supply control section 4, a concentration acquisition section 5, a concentration comparison section 6, an illuminance acquisition section 7, and an exposure amount calculation. Section 8, exposure amount comparison section 9, and light emission control section 10. The control unit 110 includes, for example, a CPU (Central Processing Unit) and a memory. A control program is stored in the memory of the control unit 110 in advance. By causing the CPU of the control section 110 to execute the control program stored in the memory, the functions of the sections of the control section 110 are realized. Based on the detection results of the position sensors 133a and 133b in FIG. 1, the closing control unit 1 controls the driving device 133 to move the shutter 131 between the closed position and the open position. The lift control unit 2 controls the driving device 153 so as to move the mounting plate 151 between the standby position and the processing position based on the detection results of the position sensors 153a and 153b in FIG. 1. The exhaust control unit 3 controls the suction device 173 and the valve 173v so as to exhaust the gas in the casing 121 and the gas between the casing 121 and the baffle 131 in FIG. 1. The gas supply control unit 4 controls the valves 171v and 172v of FIG. 1 so as to supply an inert gas into the housing 121. The concentration acquisition unit 5 acquires the value of the oxygen concentration measured by the oxygen concentration meter 181 in FIG. 1. The concentration comparison unit 6 compares the oxygen concentration measured by the concentration acquisition unit 5 with a predetermined concentration. The illuminance acquisition unit 7 acquires the value of the illuminance of the vacuum ultraviolet ray measured by the illuminance meter 183 in FIG. 1. The exposure amount calculation section 8 calculates the exposure amount of the vacuum ultraviolet rays irradiated to the substrate W based on the illuminance of the vacuum ultraviolet rays obtained by the illuminance acquisition section 7 and the irradiation time of the vacuum ultraviolet rays to the substrate W from the light source section 163 in FIG. 1. The exposure amount comparison unit 9 compares the exposure amount calculated by the exposure amount calculation unit 8 with a preset exposure amount. The light projection control unit 10 controls the supply of electric power from the power supply device 164 to the light source unit 163 in a manner that the light source unit 163 emits vacuum ultraviolet rays based on the comparison result obtained by the concentration comparison unit 6. In addition, the light projection control unit 10 controls the power source device 164 so that the light source unit 163 stops the emission of the vacuum ultraviolet rays based on the comparison result obtained by the exposure amount comparison unit 9. (4) Exposure Processing FIGS. 4 to 7 are schematic diagrams for explaining the operation of the exposure apparatus 100. In FIGS. 4 to 7, in order to facilitate understanding of the structure inside the casing 121 and the cover 161, the illustration of some constituent elements is omitted, and the outlines of the casing 121 and the cover 161 are shown by a single-dot chain line. 8 and 9 are flowcharts showing an example of exposure processing performed by the control unit 110 of FIG. 3. Hereinafter, the exposure processing performed by the control unit 110 will be described with reference to FIGS. 4 to 7. As shown in FIG. 4, in the initial state of the exposure process, the shutter 131 is located at the closed position, and the mounting plate 151 is located at the standby position. Therefore, the lower surface 151b of the mounting plate 151 is in contact with the upper surface 141b of the support plate 141. Thereby, the mounting plate 151 is cooled in advance by the cooling plate 143a via the support plate 141. The oxygen concentration in the casing 121 is continuously or periodically measured by the oxygen concentration meter 181 and is acquired by the concentration acquisition unit 5. At this point, the oxygen concentration in the casing 121 measured by the oxygen concentration meter 181 is equal to the oxygen concentration in the atmosphere. First, as shown in FIG. 5, the closing control part 1 moves the shutter 131 to an open position (step S1). Thereby, the substrate W to be processed is placed on the upper end 142a of the plurality of support pins 142 through the transfer opening 121a. In this example, the substrate W is placed on the upper end 142 a of the plurality of support pins 142 by the transfer device 220 of FIG. 10 described below. Next, the elevation control unit 2 determines whether or not the substrate W has been placed on the upper end 142a of the plurality of support pins 142 (step S2). When the substrate W is not placed, the lift control unit 2 stands by until the substrate W is placed on the upper end 142 a of the plurality of support pins 142. When the substrate W is placed, as shown in FIG. 6, the lift control unit 2 moves the shutter 131 to the closed position (step S3). Then, the exhaust control unit 3 exhausts the gas in the casing 121 by the suction device 173 in FIG. 1 (step S4). The gas supply control unit 4 supplies an inert gas into the housing 121 through the pipes 171p and 172p in FIG. 1 (step S5). The processing of steps S4 and S5 may be started either first or at the same time. Thereafter, the concentration comparison unit 6 determines whether the oxygen concentration in the casing 121 has been reduced to a specific concentration (step S6). When the oxygen concentration has not decreased to a specific concentration, the concentration comparison unit 6 waits until the oxygen concentration decreases to a specific concentration. When the oxygen concentration has been reduced to a specific concentration, the light emission control unit 10 emits vacuum ultraviolet rays through the light source unit 163 (step S7). Next, as shown in FIG. 7, the raising / lowering control part 2 moves the mounting board 151 to a processing position (step S8). Thereby, the substrate W is transferred to the mounting plate 151 from the plurality of support pins 142. In this case, the substrate W approaches the light-transmitting plate 162 while being cooled by the mounting plate 151. In this state, the substrate W is irradiated with vacuum ultraviolet rays from the light source section 163 through the light-transmitting plate 162 to expose the DSA film formed on the surface to be processed. Here, the illuminance acquisition unit 7 starts the illuminance meter 183 to measure the illuminance of vacuum ultraviolet rays, and acquires the measured illuminance from the illuminance meter 183 (step S9). The exposure amount calculation unit 8 calculates the exposure amount of the vacuum ultraviolet rays irradiated to the substrate W by accumulating the illuminance of the vacuum ultraviolet rays acquired by the illuminance acquisition unit 7 (step S10). Next, the exposure amount comparison section 9 determines whether the exposure amount calculated by the exposure amount calculation section 8 has reached the set exposure amount (step S11). When the exposure amount does not reach the set exposure amount, the exposure amount comparison section 9 waits until the exposure amount reaches the set exposure amount. When the exposure amount reaches the set exposure amount, as shown in FIG. 6, the elevation control unit 2 moves the placing plate 151 to the standby position (step S12). Thereby, the substrate W is transferred from the mounting plate 151 to the plurality of support pins 142. The lower surface 151b of the mounting plate 151 is in contact with the upper surface 141b of the support plate 141. Thereby, the mounting plate 151 is cooled in advance by the cooling pipe 143 a to prepare for the next exposure process of the substrate W carried into the exposure apparatus 100. Next, the light emission control unit 10 stops the emission of the vacuum ultraviolet rays from the light source unit 163 (step S13). The illuminance acquisition unit 7 stops the measurement of the illuminance by the illuminance meter 183 (step S14). Then, the exhaust control unit 3 stops the exhaust of the gas in the casing 121 by the suction device 173 (step S15). The gas supply control unit 4 stops the supply of the inert gas from the pipes 171p and 172p to the case 121 (step S16). The processing of steps S13 to S16 may be started either first or at the same time. Thereafter, as shown in FIG. 5, the closing control unit 1 moves the shutter 131 to the open position (step S17). Thereby, the exposed substrate W can be carried out from the plurality of supporting pins 142 to the outside of the housing 121 through the carrying opening 121 a. In this example, the substrate W is carried out from the plurality of support pins 142 to the outside of the housing 121 by the transfer device 220 of FIG. 10 described below. Next, the closing control unit 1 determines whether or not the substrate W has been carried out from the plurality of support pins 142 (step S18). When the substrate W is not carried out, the closed control unit 1 waits until the substrate W is carried out from the plurality of support pins 142. When the substrate W has been carried out, as shown in FIG. 4, the closing control unit 1 moves the shutter 131 to the closed position (step S19), and ends the exposure processing. By repeatedly performing the above operations, the plurality of substrates W can be sequentially exposed. In the above-mentioned exposure processing, after the emission of vacuum ultraviolet rays by the light source unit 163 is started, the placing plate 151 is moved from the standby position to the processing position. Before stopping the emission of vacuum ultraviolet rays by the light source section 163, the mounting plate 151 is moved from the processing position to the standby position. Thereby, the mounting plate 151 can be sufficiently cooled by the cooling pipe 143a in the standby position. On the other hand, when the mounting plate 151 can be sufficiently cooled, the mounting plate 151 may be moved from the standby position to the processing position before starting to emit vacuum ultraviolet rays through the light source unit 163. Alternatively, the mounting plate 151 may be moved from the processing position to the standby position after the emission of the vacuum ultraviolet rays by the light source unit 163 is stopped. That is, the processing of step S8 may be performed before the processing of step S7, and the processing of step S12 may also be performed after the processing of step S13. (5) Substrate processing apparatus FIG. 10 is a schematic block diagram showing the overall configuration of a substrate processing apparatus including the exposure apparatus 100 of FIG. 1. In the substrate processing apparatus 200 described below, a process using a directed self-assembly (DSA) of a block copolymer is performed. Specifically, a processing liquid containing an oriented self-assembling material is coated on the processed surface of the substrate W. Thereafter, a pattern of two polymers is formed on the treated surface of the substrate W by the micro-phase separation generated by the oriented self-assembly material. The pattern of one of the two polymers was removed by a solvent. A processing solution containing a directional self-assembling material is referred to as a DSA solution. The process of removing one of the two polymer patterns formed on the treated surface of the substrate W by microphase separation is called a developing process, and the solvent used for the developing process is called a developing solution. As shown in FIG. 10, the substrate processing apparatus 200 includes, in addition to the exposure apparatus 100, a control device 210, a conveying device 220, a heat treatment device 230, a coating device 240, and a developing device 250. The control device 210 includes, for example, a CPU and a memory, or a microcomputer, and controls operations of the conveying device 220, the heat treatment device 230, the coating device 240, and the developing device 250. In addition, the control device 210 gives a command to the control unit 110 to control the operations of the closed portion 130, the elevation portion 150, the light projection portion 160, and the replacement portion 170 of the exposure device 100 of FIG. The transfer device 220 transfers the substrate W between the exposure device 100, the heat treatment device 230, the coating device 240, and the developing device 250 while holding the substrate W to be processed. The heat treatment device 230 performs heat treatment on the substrate W before and after the coating treatment by the coating device 240 and the development treatment by the developing device 250. The coating device 240 performs a film coating process by supplying a DSA liquid to the processing surface of the substrate W. In this embodiment, as the DSA solution, a block copolymer containing two types of polymers is used. Examples of the combination of the two polymers include polystyrene-polymethyl methacrylate (PS-PMMA), polystyrene-polydimethylsiloxane (PS-PDMS), and polystyrene-polydimethacrylate. Ferrocene dimethylsiloxane (PS-PFS), polystyrene-polyethylene oxide (PS-PEO), polystyrene-polyvinylpyridine (PS-PVP), polystyrene-polyhydroxybenzene Ethylene (PS-PHOST), and polymethylmethacrylate-polymethacrylate polyhedral oligomeric polysilsesquioxane (PMA-PMAPOSS). The developing device 250 supplies a developing solution to the processed surface of the substrate W to perform a film developing process. Examples of the solvent of the developing solution include toluene, heptane, acetone, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), cyclohexanone, acetic acid, tetrahydrofuran, isopropyl alcohol (IPA), or Tetramethylammonium hydroxide (TMAH) and the like. FIG. 11 is a schematic diagram showing an example of the processing of the substrate W by the substrate processing apparatus 200 of FIG. 10. In FIG. 11, the state of the board | substrate W which changes with each process is shown by sectional drawing. In this example, as an initial state before the substrate W is carried into the substrate processing apparatus 200, as shown in FIG. 11 (a), a base layer L1 is formed so as to cover the processed surface of the substrate W, and is formed on the base layer L1. There is, for example, a guide pattern L2 including a photoresist. The operation of the substrate processing apparatus 200 will be described below with reference to FIGS. 10 and 11. The transfer device 220 sequentially transfers the substrate W to be processed to the heat treatment device 230 and the coating device 240. In this case, in the heat treatment apparatus 230, the temperature of the substrate W is adjusted to a temperature suitable for forming a DSA film. In the coating device 240, a DSA liquid is supplied to the processing surface of the substrate W, and a coating process is performed. As a result, as shown in FIG. 11 (b), a DSA film L3 including two polymers is formed in a region on the base layer L1 where the guide pattern L2 is not formed. Next, the transfer device 220 sequentially transfers the substrate W on which the DSA film L3 is formed to the heat treatment device 230 and the exposure device 100. In this case, micro-phase separation occurs in the DSA film L3 due to the heat treatment of the substrate W in the heat treatment device 230. Thereby, as shown in FIG. 11 (c), a pattern Q1 including one polymer and a pattern Q2 including another polymer are formed. In this example, a linear pattern Q1 and a linear pattern Q2 are formed directionally along the guide pattern L2. Thereafter, the substrate W is cooled in the heat treatment apparatus 230. Further, in the exposure apparatus 100, the entire DSA film L3 after the microphase separation is irradiated with vacuum ultraviolet rays for modifying the DSA film L3 to perform an exposure process. Thereby, the bond between one polymer and another polymer is cut off, so that the pattern Q1 and the pattern Q2 are separated. Then, the transfer device 220 sequentially transfers the substrate W that has been subjected to the exposure processing by the exposure device 100 to the heat treatment device 230 and the developing device 250. In this case, the substrate W is cooled in the heat treatment apparatus 230. In the developing device 250, a developing solution is supplied to the DSA film L3 on the substrate W, and development processing is performed. Thereby, as shown in FIG. 11 (d), the pattern Q1 is removed, and finally the pattern Q2 remains on the substrate W. Finally, the transfer device 220 recovers the substrate W after the development process from the developing device 250. (6) Effect In the exposure apparatus 100 of this embodiment, the mounting plate 151 is positioned at the standby position when the substrate W is carried into the processing chamber 120, and the mounting plate 151 is moved to the standby position by the driving device 153. . In this state, the placing plate 151 is in contact with the supporting plate 141, and the placing plate 151 is cooled by the cooling pipe 143a through the supporting plate 141. Thereafter, by moving the mounting plate 151 upward, the substrate W is transferred from the upper end 142 a of the plurality of support pins 142 to the mounting plate 151 to be placed on the mounting plate 151. When the substrate W is irradiated with vacuum ultraviolet rays by the light source section 163, the mounting plate 151 is positioned at a processing position higher than the upper end 142a of the plurality of support pins 142, which are the transfer positions of the substrate W, by the driving device 153 The mounting plate 151 moves to a processing position. When the mounting plate 151 is located at the standby position when the substrate W is carried out of the processing chamber 120, the mounting plate 151 is moved to the standby position by the driving device 153. Thereby, the substrate W is handed over from the mounting plate 151 to the plurality of support pins 142 to support the upper end 142 a of the plurality of support pins 142. According to this configuration, the substrate W and the light source unit 163 can be easily carried into the processing chamber 120 without the substrate W interfering with each other, or the substrate W can be easily carried out of the processing chamber 120. In addition, when the substrate W is irradiated with vacuum ultraviolet rays by the light source section 163, the substrate W can be easily approached to the light source section 163 with the substrate W placed on the mounting plate 151. Here, since the mounting plate 151 is cooled in advance by the cooling pipe 143a, even when the substrate W is irradiated with vacuum ultraviolet rays by the light source section 163, the temperature of the substrate W does not rise above a specific temperature. Therefore, it is not necessary to make the substrate W stand by in the processing chamber 120, and it is not necessary to separately perform a process for cooling the substrate W. In addition, the cooling of the mounting plate 151 by the cooling pipe 143a is performed in synchronization with the processing of transferring the substrate W into the processing chamber 120 and the processing of removing the substrate W from the processing chamber 120, and is performed in the processing chamber 120 where there is no substrate W During. Therefore, it is not necessary to separately secure a time for cooling the mounting plate 151 by the cooling pipe 143a. As a result, the efficiency of the exposure process of the substrate W can be improved. Furthermore, in the above-mentioned embodiment, the mounting plate 151 is indirectly cooled by the cooling plate 143a via the support plate 141, so that it is not necessary to install the cooling tube 143a on the mounting plate 151. Therefore, it is not necessary to connect the medium supply source 143b to the cooling portion 143 on the mounting plate 151. This can simplify the configuration for moving the mounting plate 151 between the standby position and the processing position. In addition, the lower surface 151b of the mounting plate 151 and the upper surface 141b of the support plate 141 are thermally moved from the mounting plate 151 to the support plate 141 through a wide range of contact, so that the mounting plate 151 can be highly efficient. Ground to cool. (7) Other Embodiments (a) In the above embodiment, the cooling unit 143 includes the cooling pipe 143a and the medium supply source 143b, but the present invention is not limited to this. FIG. 12 is a plan view showing a support plate 141 in another embodiment. As shown in FIG. 12, in another embodiment, the cooling unit 143 includes a plurality of (eight in the example of FIG. 12) cooling elements 143 c and a power supply source 143 d. Each cooling element 143c is, for example, a Peltier element having a cooling surface and a heating surface. The plurality of cooling elements 143c are arranged at substantially regular intervals so as to surround the opening portion 141a in a state where the cooling surface is in contact with the support plate 141. Each cooling element 143c is connected to a power supply source 143d. In FIG. 12, only one cooling element 143c is connected to the power supply source 143d, and the connection between the plurality of cooling elements 143c and the power supply source 143d is omitted. Each cooling element 143c is supplied with power from the power supply source 143d, and the support plate 141 is cooled. (b) In the above embodiment, the cooling plate 143a is provided on the support plate 141, and the placing plate 151 is indirectly cooled by the cooling plate 143a through the support plate 141, but the present invention is not limited thereto. A cooling pipe 143a may be provided on the mounting plate 151, so that the mounting plate 151 may be directly cooled by the cooling pipe 143a. Similarly, a cooling element 143c of FIG. 12 may be provided on the mounting plate 151, so that the mounting plate 151 may be directly cooled by the cooling element 143c. In such cases, the mounting plate 151 may be continuously cooled. (c) In the above embodiment, DSA liquid was used as the processing liquid, but the present invention is not limited to this. It is also possible to use other treatment liquids different from DSA liquid. (d) In the above embodiment, the exit surface of the vacuum ultraviolet light is larger than the treated surface of the substrate W, and the entire surface of the substrate W is exposed, but the present invention is not limited to this. The emitting surface of the vacuum ultraviolet light may be smaller than the processed surface of the substrate W, and may also emit the vacuum ultraviolet light having no planar cross section and having a linear cross section. In this case, the entire surface to be processed of the substrate W is irradiated with vacuum ultraviolet by moving the exit surface of the vacuum ultraviolet to the processed surface of the substrate W relatively. (e) In the above embodiment, an inert gas is supplied into the housing 121 during the exposure process, but the present invention is not limited to this. When the oxygen concentration in the casing 121 can be sufficiently reduced during the exposure process, the inert gas may not be supplied into the casing 121. (8) Correspondence between the various constituent elements of the patent application scope and the various embodiments of the embodiment The following describes examples of the correspondence between the constituent elements of the patent application scope and the various embodiments of the embodiment, but the present invention is not limited to the following Examples. As each constituent element of the scope of patent application, various other constituent elements having the structure or function described in the scope of patent application may be used. In the above embodiment, the substrate W is an example of a substrate, the processing chamber 120 is an example of a processing chamber, the mounting plate 151 is an example of a mounting portion, the light source portion 163 is an example of a light source portion, and the driving device 153 is an example of a driving portion. The cooling section 143 is an example of a cooling section. The exposure device 100 is an example of an exposure device, the support plate 141 is an example of a contact member, the lower surface 151b is an example of a lower surface, the upper surface 141b is an example of a contact surface, the support pin 142 is an example of a support member, and the upper end 142a is an upper end. example. The through hole 151a is an example of a through hole, the coating device 240 is an example of a coating processing section, the heat treatment device 230 is an example of a thermal processing section, the developing device 250 is an example of a developing processing section, and the substrate processing device 200 is an example of a substrate processing device. .

1‧‧‧ closed control department

2‧‧‧ Lifting Control Department

3‧‧‧Exhaust Control Department

4‧‧‧Air Supply Control Department

5‧‧‧Concentration Acquisition Department

6‧‧‧Concentration Comparison Department

7‧‧‧Illuminance Acquisition Department

8‧‧‧Exposure Calculation Department

9‧‧‧Exposure Comparison Section

10‧‧‧lighting control department

100‧‧‧ exposure device

110‧‧‧Control Department

120‧‧‧Processing Room

121‧‧‧shell

121a‧‧‧Transport opening

121b‧‧‧ opening

122‧‧‧ Ring member

123‧‧‧ Covered member

130‧‧‧Closed

131‧‧‧ bezel

131a‧‧‧sealing member

132‧‧‧Connecting members

133‧‧‧Drive

133a‧‧‧Position sensor

133b‧‧‧Position sensor

140‧‧‧Transfer Department

141‧‧‧Support board

141a‧‧‧ opening

141b‧‧‧upper surface (contact surface)

142‧‧‧Support

142a‧‧‧Top

 143‧‧‧Cooling Department

143a‧‧‧cooling pipe

143b‧‧‧ media supply source

143c‧‧‧cooling element

143d‧‧‧ Electricity supply source

150‧‧‧ Lifting Department

151‧‧‧mounting plate

151a‧‧‧through hole

151b‧‧‧ lower surface

152‧‧‧Connecting members

153‧‧‧Drive

153a‧‧‧Position sensor

153b‧‧‧Position sensor

160‧‧‧light projection department

161‧‧‧Cover

162‧‧‧Transparent board

163‧‧‧Light source department

164‧‧‧Power supply unit

170‧‧‧ Replacement Department

171p‧‧‧Piping

171v‧‧‧ valve

172p‧‧‧Piping

172v‧‧‧ valve

173‧‧‧Suction device

173a‧‧‧ branch pipe

173b‧‧‧ branch pipe

173p‧‧‧Piping

173v‧‧‧ valve

180‧‧‧Measurement Department

181‧‧‧ oxygen concentration meter

182‧‧‧ ozone concentration meter

183‧‧‧illuminance meter

210‧‧‧Control device

220‧‧‧ transfer device

230‧‧‧ heat treatment equipment

240‧‧‧ coating device

250‧‧‧Developing device

L1‧‧‧ basal layer

L2‧‧‧Guide pattern

L3‧‧‧DSA film

Q1‧‧‧ pattern

Q2‧‧‧ pattern

W‧‧‧ substrate

p1‧‧‧port

p2‧‧‧Port

p3‧‧‧Port

s1‧‧‧sealing member

s2‧‧‧sealing member

s3‧‧‧sealing member

FIG. 1 is a schematic cross-sectional view showing the structure of an exposure apparatus according to an embodiment of the present invention. Fig. 2 is a plan view showing a support plate of the transfer portion. FIG. 3 is a functional block diagram showing the configuration of the control section of FIG. 1. FIG. FIG. 4 is a schematic diagram for explaining the operation of the exposure device. FIG. 5 is a schematic diagram for explaining the operation of the exposure device. FIG. 6 is a schematic diagram for explaining the operation of the exposure device. FIG. 7 is a schematic diagram for explaining the operation of the exposure device. FIG. 8 is a flowchart showing an example of exposure processing performed by the control unit in FIG. 3. FIG. 9 is a flowchart showing an example of exposure processing performed by the control unit in FIG. 3. FIG. 10 is a schematic block diagram showing the overall configuration of a substrate processing apparatus including the exposure apparatus of FIG. 1. 11 (a) to (d) are schematic diagrams showing an example of processing of a substrate by the substrate processing apparatus of FIG. Fig. 12 is a plan view showing a supporting plate in another embodiment.

Claims (15)

An exposure device includes: a processing chamber that houses a substrate; a mounting section that mounts a substrate in the processing chamber; an exhaust section that exhausts the gas in the processing chamber; a light source section that emits vacuum ultraviolet rays; a driving section When the substrate is loaded into the processing chamber and the substrate is discharged from the processing chamber, the mounting portion is located at the first position in the processing chamber, and when the substrate is irradiated with vacuum ultraviolet rays by the light source portion, the mounting portion is located at In a manner closer to the second position of the light source section than the first position, the placement section is moved to the first position and the second position; and the cooling section is located when the placement section is at least the first position. Cooling the mounting portion and not cooling the mounting portion when the second portion is located; a contact member that is in contact with the mounting portion at the first position; and a plurality of supporting members from the above The contact member extends upward, and the plurality of support members support the substrate when the placing portion is located at the first position, and the cooling portion is provided to the contact member. Line mode of cooling is provided to the contact member. The exposure device according to claim 1, wherein the mounting portion has a lower surface, and the contact member has a contact surface that contacts a lower surface of the mounting portion when the mounting portion is cooled. For the exposure device of claim 1 or 2, wherein the light source unit is disposed above the mounting unit and emits vacuum ultraviolet rays downward, the second position is below the light source unit, and the first position is located in the Below the 2 position, and the driving section raises and lowers the placing section between the first position and the second position. The exposure device according to claim 3, wherein the cooling section is disposed below the mounting section, and is in contact with the mounting section when the mounting section is located at the first position. As for the exposure device of claim 4, wherein the upper end of the plurality of supporting members is higher than the first position and lower than the second position, the mounting portion has a plurality of through holes through which the plurality of supporting members can pass, and The plurality of support members penetrate the plurality of through holes of the mounting portion when the mounting portion is located at the first position. An exposure device includes: a processing chamber that houses a substrate; a mounting section that mounts a substrate in the processing chamber; an exhaust section that exhausts the gas in the processing chamber; a light source section that emits vacuum ultraviolet rays; a driving section When the substrate is loaded into the processing chamber and the substrate is discharged from the processing chamber, the mounting portion is located at the first position in the processing chamber, and when the substrate is irradiated with vacuum ultraviolet rays by the light source portion, the mounting portion is located at In a manner closer to the second position of the light source section than the first position, the mounting section is moved to the first position and the second position; and a cooling section is provided to cool the mounting section. The mounting portion; a contact member in contact with the mounting portion at the first position; and a plurality of support members extending upward from the contact member, the plurality of support members being located in the mounting portion at the first portion Supports substrate in 1 position. For example, the exposure device according to claim 1, 2 or 6, wherein the driving unit moves the mounting unit from the first position to the second position after starting to emit vacuum ultraviolet rays through the light source unit. According to the exposure device of claim 1, 2 or 6, wherein the driving section moves the mounting section from the second position to the first position before stopping the emission of vacuum ultraviolet rays through the light source section. The exposure device according to claim 1, 2 or 6, wherein the light source unit is configured to emit vacuum ultraviolet rays having a planar cross section. For example, the exposure device according to claim 9, wherein the emission area of the vacuum ultraviolet rays caused by the light source section is larger than the area of the substrate. A substrate processing apparatus includes: a coating processing section that forms a film on a substrate by applying a processing solution to the substrate; and a thermal processing section that heat-processes a substrate on which a film has been formed by the coating processing section; The exposure device of claim 1, 2 or 6, which exposes a substrate that has been heat-treated by the above-mentioned heat treatment section; and a development processing section that supplies a solvent to the substrate that has been exposed by the above-mentioned exposure device, thereby applying a solvent to the substrate. The film was developed. The substrate processing apparatus according to claim 11, wherein the processing liquid includes a directional self-assembly material. An exposure method includes the steps of: accommodating a substrate in a processing chamber; and when the substrate is carried into the processing chamber, the mounting portion is positioned at a first position in the processing chamber, and the driving portion moves the mounting portion to The first position; when the mounting portion is at least the first position, the mounting portion is cooled by a cooling portion provided on the contact member in a manner to cool the contact member; when the mounting portion is positioned In the first position, the substrate is supported by a plurality of supporting members extending upward from the contact member; the substrate is placed in the placing portion in the processing chamber; the gas in the processing chamber is discharged; the cooling is not performed by the above The cooling portion emits vacuum ultraviolet rays through the light source portion; when the substrate is irradiated with vacuum ultraviolet rays by the light source portion, the placing portion is located at a second position closer to the light source portion than the first position. In one aspect, the mounting section is moved to the second position by the driving section; and when the substrate is unloaded outside the processing room, In a mode in which the placement portion is located at the first position in the processing chamber, the placement portion is moved to the first position by the driving portion. An exposure method includes the steps of: accommodating a substrate in a processing chamber; and when the substrate is carried into the processing chamber, the mounting portion is positioned at a first position in the processing chamber, and the driving portion moves the mounting portion to The first position; cooling the mounting portion by a cooling portion provided on the mounting portion; and supporting the substrate by a plurality of supporting members extending upward from the contact member when the mounting portion is located at the first position ; In the processing chamber, the substrate is placed in the mounting section; the gas in the processing chamber is exhausted; the mounting section is cooled by the cooling section, and the vacuum ultraviolet light is emitted by the light source section; When the light source unit irradiates the substrate with vacuum ultraviolet rays, the mounting unit is positioned at a second position closer to the light source unit than the first position, and the driving unit moves the mounting unit to the second position; and When the substrate is carried out outside the processing chamber, the mounting portion is located at the first position in the processing chamber, and the mounting portion is moved by the driving portion Move to the first position. A substrate processing method, comprising: a step of applying a processing solution to a processed surface of a substrate by a coating processing unit, thereby forming a film on the substrate; and a heat treatment unit, forming a film on the coating processing unit. A step of subjecting the substrate to heat treatment; an exposure method, such as the item 13 or 14, for exposing a substrate that has been heat-treated by the heat treatment section by an exposure device; and a development processing section, which has passed the exposure device described above A step of developing a film of the substrate by supplying a solvent to the processed surface of the substrate to be exposed.