TWI681853B - Scoring device - Google Patents

Abstract

The invention provides a scoring device which can automatically and accurately correct the inclination of a circular substrate placed on a platform.

The scoring device A is to place the circular substrate W on the rotatable energy platform 1, and use the cutter wheel 10 or laser to perform scoring along the predetermined scoring lines S1 and S2 on the surface, thereby forming a cut-off turtle In which, the circumference of the circular substrate W is parallel to the planned lines S1 and S2, and a notch K is formed on the line passing through the center point P of the circle. Observe the circular substrate W placed on the platform 1 The image data obtained by the camera 15 for correcting the angle of the outer shape is analyzed and processed, and it is provided to detect the inclination angle α of the scribe lines S1 and S2 of the circular substrate W with respect to the scribe direction of the cutter wheel 10, and to the platform 1 The control part 18 of the computer C which performs the rotation operation so that this inclination angle α is zero.

Description

Scoring device

The present invention relates to a scoring device for processing cracks for breaking on a round substrate made of brittle materials such as glass, silicon, ceramics, compound semiconductors, and the like. The present invention particularly relates to a scoring device for processing a crack for breaking a unit product such as a wafer from a circular semiconductor substrate (semiconductor wafer).

Generally speaking, in the process of cutting out a wafer (unit product) from a semiconductor substrate that is a mother substrate, first, the semiconductor substrate is placed on an adsorption platform of a scoring device, and the surface is scheduled to be scribed with a cutter wheel or a laser along the edge Lines (streets) are scored, and scribe lines (cracking) in the X direction and the Y direction orthogonal to each other are formed. After that, the cleaving bar is pressed from the surface on the opposite side of the scribe line by the cleaving device to flex the substrate, thereby breaking the semiconductor substrate into a square wafer (refer to Patent Document 1 and Patent Document 2).

When the semiconductor substrate is placed on the suction platform of the scribing device, it must be positioned that the direction of travel of the cutter wheel and the parallelism of the predetermined line of scribing are exactly the same.

When the semiconductor substrate is square, as shown in FIG. 10, the predetermined scribe line S is designed in parallel along the side of the semiconductor substrate W1. Therefore, by positioning a plurality of positionings along the scribe direction on the suction platform 1 in advance The pin 30 is aligned with the side to the positioning pin 30 to mount the semiconductor substrate W1, that is, it can be easily positioned by hand.

Advanced technical literature

[Patent Document 1] Japanese Patent Laid-Open No. 2015-70135

[Patent Document 2] Japanese Patent Laid-Open No. 2004-39931

However, the above positioning pins cannot be used when the semiconductor substrate is circular. Therefore, as shown in FIG. 11, in the past, a notch portion such as a V groove (orientation flat) or the like was provided on the peripheral portion of the substrate W2 in alignment with the scribe line S′ passing through the center of the substrate W2 K, and install the L-shaped block 32 on the adsorption platform 1. Then, the predetermined scoring line S'passing through the notch K is parallel to one side of the L-shaped block 32 while looking at the notch K while positioning it by hand operation. However, this alignment operation is often troublesome and requires a highly skilled technique because it is performed with high accuracy.

Furthermore, in most cases, the semiconductor substrate is formed with electronic components such as circuits on the surface of each wafer to be disconnected. Therefore, the scribe lines used for dividing these lines, that is, the predetermined lines are displayed in a grid pattern. It can be visually recognized, but when the mold cannot be visually recognized, the direction of the scribed predetermined line can also be judged by using a notch provided on the periphery of the substrate as a rough criterion.

In view of the above-mentioned previous problems, an object of the present invention is to provide an automatic and accurate correction of the inclined scoring device of a circular substrate placed on a platform.

In order to achieve the above object, the present invention adopts the following technical means. That is, the scoring device of the present invention places a round substrate made of brittle materials on a rotatable platform, and scribes on its surface along a predetermined scoring line using a cutter wheel or a laser to follow the predetermined scoring line Forming a crack for disconnection, characterized in that at the periphery of the circular substrate, a notch is formed as a mark on a line parallel to the scribed line and passing through the center point of the circular substrate; Observe the circular substrate mounted on the platform to detect the camera for angle correction of its outer shape; equipped with a computer control unit to analyze the image data obtained by the camera for angle correction to detect the circle The inclination angle of the predetermined scoring line of the substrate with respect to the scoring direction of the cutter wheel, and the platform is rotated to make the inclination angle zero.

In the present invention, the control unit obtains the center point of the circular substrate from the outer shape obtained by the angle correction camera, and it is preferable to detect the inclination angle from the center point and the position of the notch.

According to the present invention, the inclination of the semiconductor substrate placed on the platform is automatically corrected before the scoring process of scoring the predetermined line, so the step of positioning operation which is cumbersome and time-consuming by conventional operations can be omitted, It can quickly perform high-efficiency and high-precision scoring.

In addition, since the position and size of the circular substrate placed on the platform can be known, the idle portion of the cutter wheel or laser can be eliminated, and only the inner region of the circular substrate can be efficiently scored.

In addition, in the present invention, a precision camera provided with a predetermined line for scoring the circular substrate whose tilt angle is corrected by the detection camera of the angle correction camera to perform the alignment of the cutter wheel or laser The composition is better.

In this way, the cutter wheel or laser can be correctly scribed along the predetermined scoring line.

A‧‧‧scoring device

C‧‧‧Computer

K‧‧‧Notch

P‧‧‧ Center point

S1‧‧‧Scribe line

S2‧‧‧Scribing the scheduled line

W‧‧‧Semiconductor substrate (round substrate)

α‧‧‧Tilt angle

1‧‧‧platform

10‧‧‧Cutter wheel

14‧‧‧Precision Camera

15‧‧‧Line scan camera (camera for angle correction)

FIG. 1 is a schematic front view and a side view of main parts showing an embodiment of a scribing device of the present invention.

FIG. 2 is an explanatory diagram showing the first stage of the operation of the scoring device in a plan view.

Fig. 3 is an explanatory diagram showing the second stage similar to Fig. 2.

FIG. 4 is an explanatory diagram showing the third stage similar to FIG. 2.

5 is an explanatory diagram showing the fourth stage, which is the same as FIG. 2.

FIG. 6 is a flowchart showing the operation flow of the scoring device of the present invention.

7 is a block diagram showing a computer in the scribing device of the present invention.

FIG. 8 is an image diagram of a line scan camera.

Fig. 9 is a view showing an image of an area camera.

FIG. 10 is a perspective view showing a conventional square semiconductor substrate positioning method.

11 is a perspective view showing a conventional positioning method of a circular semiconductor substrate.

Hereinafter, description will be given based on the embodiment in which the details of the present invention are shown in the drawings. The circular substrate to be scribed in this embodiment is a semiconductor substrate W for an image sensor of a laminated glass wafer and a silicon wafer. As shown in FIG. 2, a grid-shaped wafer with electronic components such as circuits is arranged on the semiconductor substrate W, and the lines for dividing these wafers in the X-Y direction are predetermined scribe lines (scribe lines) S1 and S2. And a predetermined line is scribed on either side of the center point P of the semiconductor substrate W. In this embodiment, a V groove or a flat notch is provided as a mark on the predetermined line S1 and on the peripheral edge of the semiconductor substrate W The notch K.

1(a) and (b) show an embodiment of the scoring device A of the present invention, which includes a platform 1 for mounting and holding a semiconductor substrate W. FIG. There are many empty spaces on the surface of platform 1 An air suction hole (not shown) is used to suction and hold the semiconductor substrate W by suction through the suction hole.

In addition, the platform 1 can move in the Y direction along the horizontal rail 2 and is driven by the screw 4 rotated by the motor 3. Furthermore, the platform 1 can be rotated in the horizontal plane by the rotation driving part 5 of the built-in motor.

The bridge 8 provided with the support columns 6, 6 on both sides and the beam 7 extending horizontally in the X direction across the platform 1 is installed so as to span the platform 1. The beam 7 is provided with a guide 9 extending horizontally in the X direction. The guide 9 is provided with a scoring head 11 for holding a cutter wheel 10 for processing a crack on the semiconductor substrate W along a predetermined scoring line. The scoring head 11 can be moved in the X direction along the guide 9 by a moving mechanism (not shown) using the motor 12 as a driving source. The cutter wheel 10 is formed to be able to be raised and lowered toward the semiconductor substrate W by a lifting mechanism (not shown) provided in the scoring head 11.

In addition, a precision camera 14 for aligning the position of the cutter wheel 10 with the scribe lines S1 and S2 is attached to the scoring head 11 of the cutter wheel 10. Accordingly, it can move in the X direction together with the cutter wheel 10.

Furthermore, an angle correction camera capable of detecting the outline shape of the semiconductor substrate W is provided above the stage 1. In this embodiment, the line scan camera 15 is used as the camera for angle correction. The line scan camera 15 is held at the front end of the stay 16 protruding from the bridge 8 in the Y direction, and is arranged above the Y axis of the platform 1 moving in the Y direction.

The line scan camera 15 is provided with an illumination lamp 17 for illuminating the imaging part of the subject. The illuminating lamp 17 is composed of a combination of a regular reflection light source 17a and a diffuse reflection light source 17b, and the regular reflection light is irradiated to the semiconductor substrate as the subject through the half mirror 17c W. With these two light sources, it is possible to efficiently illuminate the photographed part with small power. In addition, the specular reflection light may be directly irradiated to the subject without passing through the half mirror 17c.

The line scan camera 15 uses a line sensor (one-dimensional CCD) 15a as an imaging element, as shown in the image diagram of FIG. 8, while moving the semiconductor substrate W as a subject through the stage 1 in the arrow direction (Y direction) The images of the moving and capturing lines 15b side by side form an overall image of the semiconductor substrate W accordingly.

The image data captured to the line scan camera 15 is calculated by the control unit 18 of the computer C (see FIG. 7) attached to the scribing device A. When the predetermined lines S1 and S2 are inclined relative to the X-axis or Y-axis of the platform 1, it is corrected by the rotation of the platform 1. In addition, the details will be described later.

The computer C attached to the scribing device A, in addition to the control unit 18 described above, as shown in the block diagram of FIG. 7, also includes an input unit 19 and a display unit 20. The control unit 18 is realized by computer hardware such as CPU, RAM, ROM, etc. In addition to the above-mentioned shooting of the line scanning camera 15 and precision camera 14 of the scribing device A and the arithmetic processing of image data, the platform 1 is also rotated and The movement in the Y-axis direction, the scoring operation by the cutter wheel 10, and the overall control of the operation of each mechanism. The input unit 19 is for the operator to input various operation instructions and data to the scoring device A, and the display unit 20 is for displaying the processing menu and the operation status.

Next, based on the operation explanatory diagrams of FIGS. 2 to 5 and the flowchart of FIG. 6, the flow of the scoring operation of the semiconductor substrate W by the scoring device A will be described. First, as shown in FIGS. 1 and 2, the semiconductor substrate W is placed on the stage 1 and sucked and held (step 1).

At this time, if it is within the range of the shooting area of the next line scan camera 15, it can be placed at any position on the platform 1, but to reduce the platform during correction The amount of rotation is preferably placed in such a manner that any of the predetermined lines S1 and S2 is roughly parallel to the X-Y axis direction of the stage 1. In FIG. 2, the planned scribe line S1 having the notch K is substantially parallel to the X axis of the stage 1.

Next, as shown in FIGS. 3 and 8, while the semiconductor substrate W is moved in the Y-axis direction by the stage 1, the semiconductor substrate W is scanned by the line scan camera 15. The scanned image data is calculated by the control unit 18 of the computer C, and then the center point P of the semiconductor substrate W is obtained from the overall image shape, and then the straight line L1 connecting the notch K from the center point P to the platform 1 is obtained. The angle of the straight line L2 in the X-axis direction, that is, the inclination angle α of the planned scribe line S1 of the semiconductor substrate W (step 2).

Next, as shown in FIG. 4, the platform 1 is rotated counterclockwise so that the tilt angle α is zero. In this way, the parallel degree of the scribe line S1 of the semiconductor substrate W and the scribe direction of the cutter wheel 10 can be made uniform (step 3).

Thereafter, as shown in FIG. 5, the semiconductor substrate W is sent to the scribing position by the cutter wheel 10 by the movement of the stage 1 (step 4).

Next, the precision camera 14 observes the planned scribing line S1, and the control unit 18 performs the alignment of the cutter wheel 10 and the planned scribing line S1 (step 5).

Since the number and spacing of the predetermined scoring lines are determined in advance, the position alignment performed by the precision camera 14 may be performed only once, so that all the predetermined scoring lines S1 can be scribed by moving the platform 1 in sequence to set the spacing. After the scoring of the predetermined line S1 is completed, the platform 1 is rotated 90 degrees to perform the scoring of the predetermined line S2 (step 6).

In addition, alignment marks that can be observed with the precision camera 14 may be preset on the predetermined scribe lines S1 and S2.

As described above, the scribing device A of the present invention automatically corrects the inclination of the semiconductor substrate W placed on the stage 1 before scribing with the cutter wheel 10, so it can save the trouble of the conventional and Positioning operation that takes time and time to perform high-precision scoring. In addition, since the position and size of the circular substrate placed on the platform can be grasped, the idle part of the cutter wheel or laser can be eliminated, and only the area within the circle of the circular substrate can be efficiently scored.

In addition, in the above embodiment, although the line correction camera 15 capable of obtaining a wide field of view area with high resolution is used as the camera for angle correction, as long as it has the ability to detect the outer shape of the circular semiconductor substrate W with good accuracy The camera is not particularly limited. For example, an area camera 21 equipped with a high-precision two-dimensional sensor 21a as shown in FIG. 9 may also be used.

Furthermore, in the above embodiment, the cutter wheel 10 is used as the scoring means for the scribe lines S1 and S2 of the semiconductor substrate W, but a known laser may be used instead.

In the above, the representative embodiments of the present invention have been described, but the present invention is not limited to the above-mentioned embodiments. Of course, it can be appropriately modified or changed within the scope of achieving its purpose without departing from the scope of the patent application.

Industrial availability

The present invention can be applied to a scoring device that performs processing to crack a unit product such as a wafer from a round semiconductor substrate.

A‧‧‧scoring device

W‧‧‧Semiconductor substrate (round substrate)

1‧‧‧platform

2‧‧‧ Orbit

3‧‧‧Motor

4‧‧‧screw

5‧‧‧rotation drive

6‧‧‧Support column

7‧‧‧ Liang

8‧‧‧Bridge

9‧‧‧Guide

10‧‧‧Cutter wheel

11‧‧‧Scribe head

12‧‧‧Motor

14‧‧‧Precision Camera

15‧‧‧Line scan camera (camera for angle correction)

16‧‧‧Strut

17‧‧‧Lighting

17a‧‧‧Reflective light source

17b‧‧‧Diffusion reflection light source

17c‧‧‧Half mirror

Claims (5)

A scoring device is to place a round substrate made of brittle materials on a rotatable platform, and use its cutter wheel or laser to scribe on its surface along a predetermined scoring line to form a break along the predetermined scoring line A crack is characterized in that, at the periphery of the circular substrate, a notch is formed as a mark on a line parallel to the predetermined line and passing through the center point of the circular substrate; an observable placement is provided on the circular substrate The circular substrate on the platform is an angle correction camera for detecting its external shape; a computer control unit is used to analyze and process the image data obtained by the angle correction camera to detect the scoring schedule of the circular substrate The inclination angle of the line relative to the scoring direction of the cutter wheel, and the platform is rotated to make the inclination angle zero. As in the scoring device according to item 1 of the patent application scope, wherein the control unit obtains the center point of the circular substrate from the outer shape obtained by the camera for correcting the angle, and detects the center point from the position of the notch part slope. The scoring device according to item 1 or 2 of the patent application scope, wherein a predetermined line for scoring the circular substrate whose inclination angle is corrected by the detection of the angle correction camera is provided for carrying out the cutter wheel or Precision camera with aligned laser position. A scoring device according to item 1 or 2 of the patent application, in which the angle correction camera is a line scan camera. A scoring device according to item 3 of the patent application, wherein the angle correction camera is a line scan camera.

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