TW201700245A - Scribing device capable of automatically and correctly correcting the inclination of a circular substrate placed on a platform - Google Patents

Abstract

The invention provides a scribing device capable of automatically and correctly correcting the inclination of a circular substrate placed on a platform. The scribing device A loads the circular substrate W on a rotatable platform 1, and scribes along the predetermined scribed lines S1, S2 of the surface using a cutter wheel 10 or a laser, so as to form a crack for breaking. A notch portion K parallel to the predetermined scribed lines S1, S2 is formed on the periphery of the circular substrate W on a line passing through the center point P of the circle. An angle correction camera 15 is provided to observe the circular substrate W placed on the platform 1 for inspecting its outer shape. A control part 18 of a computer C is also provided to analyze and process the image data obtained by the angle correction camera 15 and inspect the inclination angle [alpha] of the predetermined surface lines S1, S2 of the circular substrate W with respect to the scribing direction of the cutter wheel 10, and to rotate the platform 1 to make the inclination angle [alpha] equal to zero.

Description

Scribe device

The present invention relates to a scribing device for processing a crack that is broken in a circular substrate made of a brittle material such as glass, tantalum, ceramics, or a compound semiconductor. The present invention is particularly directed to a scribing apparatus for processing a crack that breaks a unit product such as a wafer from a circular semiconductor substrate (semiconductor wafer).

Generally, in the process of cutting out a wafer (unit product) from a semiconductor substrate as a mother substrate, first, the semiconductor substrate is placed on an adsorption platform of the scribing device, and the surface thereof is scheduled by a cutter wheel or a laser along the surface. Lines (streets) are scribed to form scribe lines (cracks) in the X direction and the Y direction orthogonal to each other. After that, the cracking device presses the split rod from the surface opposite to the scribe line to deflect the substrate, thereby breaking the semiconductor substrate into a square wafer (see Patent Document 1 and Patent Document 2).

When the semiconductor substrate is placed on the adsorption platform of the scribing device, it is necessary to perform the positioning in which the parallel direction of the traveling direction of the cutter wheel and the predetermined line of scoring is correctly matched.

In the case where the semiconductor substrate is square, as shown in FIG. 10, the scribe line S is designed to be parallel along the side of the semiconductor substrate W1, so that a plurality of positioning along the scribe direction are provided on the adsorption platform 1 in advance. The pin 30 is aligned with the side of the positioning pin 30 to mount the semiconductor substrate W1, so that the positioning can be easily performed by hand.

Advanced technical literature

[Patent Document 1] JP-A-2015-70135

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-39931

However, the above-described positioning pin cannot be used when the semiconductor substrate is circular. Therefore, as shown in FIG. 11, in the past, a notch portion as a mark such as a V-notch or a flattening flat is provided on the peripheral edge portion of the substrate W2 through the scribed line S' at the center of the substrate W2. K, and an L-shaped block 32 is mounted on the adsorption platform 1. The alignment line S' is aligned with one side of the L-shaped block 32 so as to be parallel to one side of the L-shaped block 32, and the position is aligned by hand while looking at the notch portion K. However, this position alignment operation is often troublesome, and because of high precision, a highly skilled technique is required.

Moreover, in many cases, the semiconductor substrate is formed with electronic components such as circuits on the surface of each of the wafers to be disconnected, so that the scribe lanes, that is, the scribed lines are displayed in a lattice pattern. It is visually recognized, but when it is not possible to visually recognize the mold, the direction of the predetermined line can be judged by using a notch portion provided on the periphery of the substrate as a general standard.

In view of the foregoing prior problems, it is an object of the present invention to provide a scoring apparatus that automatically and correctly corrects the tilt of a circular substrate placed on a platform.

In order to achieve the above object, the present invention adopts the following technical means. That is, the scoring device of the present invention places a circular substrate composed of a brittle material on a rotatable platform. The surface is scored along the line to be scored using a cutter wheel or a laser to form a crack for breaking along a predetermined line, wherein a predetermined line is formed on the periphery of the circular substrate. a notch portion that is parallel to the line passing through the center point of the circular substrate; a lens for observing the circular substrate that is placed on the platform to detect the shape of the lens; and a control unit for the computer And analyzing the image data obtained by the camera with the angle correction to detect an inclination angle of the scribed line of the circular substrate with respect to the scribed direction of the cutter wheel, and rotating the platform to make the The tilt angle is zero.

In the present invention, the control unit obtains the center point of the circular substrate from the outer shape obtained by the angle correction camera, and it is preferable to detect the inclination angle from the position of the center point and the notch portion.

According to the present invention, the inclination of the semiconductor substrate placed on the stage is automatically corrected before the scribe process of the scribe line is scribed, so that the cumbersome and time consuming step of the positioning operation by the hand operation can be omitted. High-efficiency, high-precision scoring can be performed quickly.

Moreover, since the position and size of the circular substrate placed on the platform can be known, it is possible to eliminate the idling portion of the cutter wheel or the laser and perform high-efficiency scribing only on the inner region of the circular substrate.

Further, in the present invention, the precision camera which performs the positional alignment of the cutter wheel or the laser is provided with a predetermined line for the circular substrate on which the detection angle of the camera for correcting the angle correction is corrected. The composition is preferred.

In this way, the cutter wheel or laser can be correctly scored along the scribed line.

A‧‧‧ scoring device

C‧‧‧ computer

K‧‧‧Gap section

P‧‧‧ Center Point

S1‧‧‧scribed line

S2‧‧‧scribed line

W‧‧‧Semiconductor substrate (round substrate)

‧‧‧‧ tilt angle

1‧‧‧ platform

10‧‧‧Cutter wheel

14‧‧‧Precision camera

15‧‧‧Line Scan Camera (Angle Correction Camera)

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side elevational view and a side elevational view of a main portion showing an embodiment of the scoring apparatus of the present invention.

Fig. 2 is an explanatory view showing a first stage of the operation of the scribing device in a plan view.

Fig. 3 is an explanatory view showing the second stage in the same manner as Fig. 2.

Fig. 4 is an explanatory view showing the third stage in the same manner as Fig. 2.

Fig. 5 is an explanatory view showing the fourth stage in the same manner as Fig. 2.

Figure 6 is a flow chart showing the flow of operations using the scoring apparatus of the present invention.

Figure 7 is a block diagram showing a computer in the scoring apparatus of the present invention.

Figure 8 is a view showing an image of a line scan camera.

Figure 9 is a view showing an image of an area camera.

Fig. 10 is a perspective view showing a positioning means of a conventional square semiconductor substrate.

Figure 11 is a perspective view showing a positioning means of a conventional circular semiconductor substrate.

Hereinafter, the details of the present invention will be described based on the embodiments of the drawings. The circular substrate to be scribed in this embodiment is a semiconductor substrate W for an image sensor for a laminated glass wafer and a silicon wafer. As shown in FIG. 2, a wafer having electronic components such as circuits in a grid shape is disposed on the semiconductor substrate W, and lines for arranging the X-Y directions of the wafers are scribed lines (scratches) S1 and S2. A predetermined line is drawn through one of the center points P of the semiconductor substrate W. In the present embodiment, a predetermined groove is formed on the predetermined line S1 and a peripheral portion of the semiconductor substrate W is provided with a V-groove or a flat notch as a mark. The notch K.

1(a) and 1(b) show an embodiment of the scribing apparatus A of the present invention, which is provided with a stage 1 on which a semiconductor substrate W is placed and held. There are many empty spaces on the surface of the platform 1. The gas suction hole (not shown) absorbs and holds the semiconductor substrate W by suctioning the hole.

Further, the platform 1 is movable in the Y direction along the horizontal rail 2, and is driven by the screw 4 which is rotated by the motor 3. Further, the platform 1 can be rotated in a horizontal plane by the rotary drive unit 5 of the built-in motor.

The bridge 8 having the support columns 6, 6 disposed on both sides of the platform 1 and the beam 7 extending horizontally in the X direction is disposed to straddle the platform 1. The beam 7 is provided with a guide 9 extending horizontally in the X direction. In this guide member 9, a scribing head 11 for holding a cutter wheel 10 for machining a crack along a predetermined line of the semiconductor substrate W is mounted. The scribing head 11 is movable in the X direction along the guide 9 by a moving mechanism (not shown) that uses the motor 12 as a driving source. The cutter wheel 10 is formed so as to be movable up and down toward the semiconductor substrate W by an elevating mechanism (not shown) provided on the scribing head 11.

Further, a precision camera 14 for aligning the position of the cutter wheel 10 with the planned line S1, S2 is attached to the scribe head 11 of the cutter wheel 10. According to this, it is possible to move in the X direction together with the cutter wheel 10.

Further, an angle correction camera capable of detecting the shape of the semiconductor substrate W is provided above the stage 1. In the present embodiment, the line scan camera 15 is used as the angle correction camera. The line scan camera 15 is held at the front end of the strut 16 projecting from the bridge 8 in the Y direction, and is disposed above the Y axis of the platform 1 moving in the Y direction.

The line scan camera 15 is provided with an illumination lamp 17 for illuminating an imaged portion of the subject. The illuminating lamp 17 is composed of a combination of a specular reflected light source 17a and a diffused reflected light source 17b, and the specular reflected light is transmitted through the half mirror 17c to a semiconductor substrate as a subject. W. The two light sources can effectively illuminate the imaged portion with small electric power. Further, the specular reflected light may be directly irradiated to the subject without passing through the half mirror 17c.

As shown in the image diagram of FIG. 8, the line scan camera 15 uses a line sensor (one-dimensional CCD) 15a as a photographing element, and causes the semiconductor substrate W as a subject to pass the platform 1 in the arrow direction (Y direction). The image of the line 15b is moved one by one to form an overall image of the semiconductor substrate W.

The image data captured to the line scan camera 15 is subjected to arithmetic processing by the control unit 18 attached to the computer C (see FIG. 7) of the scribing apparatus A. When the planned line S1, S2 is inclined with respect to the X-axis or the Y-axis of the platform 1, it is corrected by the rotation of the platform 1. Also, the details are left to be described later.

The computer C attached to the scribing apparatus A includes an input unit 19 and a display unit 20, as shown in the block diagram of FIG. 7, in addition to the control unit 18. The control unit 18 is realized by a computer hardware such as a CPU, a RAM, or a ROM. In addition to the imaging of the line scan camera 15 and the precision camera 14 of the scribing device A and the arithmetic processing of the image data, the rotation of the platform 1 is also performed. The movement of the Y-axis direction and the scribing operation by the cutter wheel 10 control the entire operation of each mechanism. The input unit 19 is for the operator to input various operation instructions and materials to the scribing device A, and the display unit 20 is for displaying the processing menu and the operation status.

Next, the flow of the scribing operation of the semiconductor substrate W by the scribing apparatus A will be described based on the operation explanatory diagrams of FIGS. 2 to 5 and the flowchart of FIG. First, as shown in FIGS. 1 and 2, the semiconductor substrate W is placed on the stage 1 and adsorbed and held (step 1).

At this time, if it is within the range of the shooting area of the next line scan camera 15, it may be placed at any position on the platform 1, but to reduce the platform at the time of correction. The amount of rotation is preferably placed so that either of the planned lines S1 and S2 is substantially parallel to the X-Y axis direction of the stage 1. In Fig. 2, the scribed line S1 having the notch portion K is substantially parallel to the X-axis of the stage 1.

Next, as shown in FIGS. 3 and 8, the semiconductor substrate W is scanned by the line scan camera 15 while moving the semiconductor substrate W in the Y-axis direction by the stage 1. The scanned image data is subjected to arithmetic processing by the control unit 18 of the computer C, and the center point P of the semiconductor substrate W is obtained from the overall shape of the external image, and the straight line L1 connecting the notch portion K from the center point P and the edge of the platform 1 are obtained. The angle of the straight line L2 in the X-axis direction, that is, the inclination angle α of the predetermined line S1 of the semiconductor substrate W (step 2).

Next, as shown in FIG. 4, the platform 1 is rotated counterclockwise so that the tilt angle α is zero. Thus, the parallelism between the scribed line S1 of the semiconductor substrate W and the scribed direction of the cutter wheel 10 can be made uniform (step 3).

Thereafter, as shown in FIG. 5, the semiconductor substrate W is sent to the scribing position by the cutter wheel 10 by the movement of the stage 1 (step 4).

Next, the scoring line S1 is observed by the precision camera 14, and the control unit 18 performs alignment of the cutter wheel 10 with the scribing line S1 (step 5).

Since the number and the pitch of the planned lines are determined in advance, the alignment by the precision camera 14 can be performed once, and all the planned line S1 can be scored by sequentially moving the platform 1 by the set distance. After the scribe of the scribe line S1 is completed, the stage 1 is rotated by 90 degrees to perform scribe of the scribe line S2 (step 6).

Further, an alignment mark which can be observed by the precision camera 14 can be preliminarily provided on the planned line S1, S2.

As described above, the scribing apparatus A of the present invention automatically corrects the inclination of the semiconductor substrate W placed on the stage 1 before the scribing by the cutter wheel 10, thereby eliminating the cumbersome and conventional The positioning operation of the time-consuming hand operation quickly marks the high-precision. In addition, since the position and size of the circular substrate placed on the platform can be grasped, it is possible to eliminate the idling portion of the cutter wheel or the laser to effectively scribe only the inner region of the circular substrate.

Further, in the above-described embodiment, the line scanning camera 15 capable of obtaining a wide field of view with high resolution is used as the angle correction camera, but it is capable of detecting the shape of the circular semiconductor substrate W with good precision. The camera is not particularly limited. For example, an area camera 21 having a high-precision two-dimensional sensor 21a as shown in FIG. 9 can also be used.

Further, in the above-described embodiment, the scribing means 10 is used as the scribing means for the predetermined line S1, S2 of the semiconductor substrate W, but a known laser may be used instead.

The present invention has been described with reference to the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described above, and may be appropriately modified or changed without departing from the scope of the invention.

Industrial availability

The present invention can be utilized in a scribing apparatus for performing a process of dividing a crack of a unit product such as a wafer from a circular semiconductor substrate.

A‧‧‧ scoring device

W‧‧‧Semiconductor substrate (round substrate)

1‧‧‧ platform

2‧‧‧ Track

3‧‧‧Motor

4‧‧‧ screw

5‧‧‧Rotary drive department

6‧‧‧Support column

7‧‧ ‧ beams

8‧‧‧ Bridge

9‧‧‧ Guides

10‧‧‧Cutter wheel

11‧‧‧Scratch

12‧‧‧ motor

14‧‧‧Precision camera

15‧‧‧Line Scan Camera (Angle Correction Camera)

16‧‧‧ poles

17‧‧‧Lights

17a‧‧‧Reflective light source

17b‧‧‧Diffuse reflected light source

17c‧‧‧half mirror

Claims (5)

A scribing device is a circular substrate made of a brittle material placed on a rotatable platform, and is scribbled on a surface thereof along a predetermined line by using a cutter wheel or a laser to form a disconnection along a predetermined line. a crack, characterized in that a peripheral portion of the circular substrate is formed with a notch portion which is parallel to the predetermined line of the scribed line and is marked on a line passing through the center point of the circular substrate; and is disposed to be placed on the platform a circular correction substrate for detecting an angular shape of the circular substrate; and a computer control unit for analyzing the image data obtained by the angle correction camera to detect a predetermined line of the circular substrate The tilting angle with respect to the scoring direction of the cutter wheel, and rotating the platform to make the tilt angle zero. The scribing device of claim 1, wherein the control unit obtains a center point of the circular substrate from an outer shape obtained by the camera for correcting the angle, and detects the position from the center point and the position of the notch portion slope. The scoring device of claim 1 or 2, wherein a scribed line for the circular substrate corrected by the detection of the angle correction camera is provided for performing the cutter wheel or A precision camera with a laser-aligned position. The scoring device of claim 1 or 2, wherein the angle correction camera is a line scan camera. The scoring device of claim 3, wherein the angle correction camera is a line scan camera.