TWI419254B - A desk that penetrates lighting - Google Patents
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Description
本發明係關於一種穿透照明工作台，其自與工作台接觸一側之基板面(稱為背面)，對載置於工作台上之矽基板等紅外光穿透性基板照射紅外光，以使此紅外光穿透基板內，藉此可檢測形成於背面上之對準用標記之穿透圖像。The invention relates to a penetrating illumination worktable, which is irradiated with infrared light to an infrared light transmissive substrate such as a crucible substrate placed on a workbench from a substrate surface (referred to as a back surface) on the side in contact with the workbench. This infrared light is allowed to penetrate through the substrate, whereby the penetration image of the alignment mark formed on the back surface can be detected.
當對形成於半導體基板上之配線層之覆蓋狀態進行檢查、或對半導體積體電路之微細圖案形成時所用之光掩模(光罩)之表背面之作為位置基準之標記之位置偏移進行測定時，獲取由基板之背面側照射並穿透至基板表面側之紅外光的穿透照明圖像，進行基板之檢查或位置偏移測定(參照專利文獻1、2)。When the state of coverage of the wiring layer formed on the semiconductor substrate is inspected or the position of the front surface of the photomask (mask) used for forming the fine pattern of the semiconductor integrated circuit is shifted as a positional reference mark At the time of measurement, a through-illumination image of infrared light which is irradiated on the back side of the substrate and penetrates to the surface side of the substrate is obtained, and inspection of the substrate or measurement of positional deviation is performed (see Patent Documents 1 and 2).
例如，專利文獻1中揭示了如下方法：於半導體基板上形成配線層後，檢測階差覆蓋之不良部位，此時，自基板之背面照射包含波長為1.3~6 μm之紅外光之光，並利用紅外線檢測器檢測穿透基板之光，再通過穿透光來檢查配線層之覆蓋狀態。根據該文獻，利用配置於基板下方之反射鏡使由燈箱照射之紅外光反射，對基板照射反射紅外光，從而實現穿透照明。再者，於該文獻中，關於進行穿透照明時之基板之支持方法之具體構造，並無任何揭示。For example, Patent Document 1 discloses a method of detecting a defective portion covered by a step after forming a wiring layer on a semiconductor substrate, and at this time, irradiating light having a wavelength of 1.3 to 6 μm from the back surface of the substrate, and The infrared ray detector is used to detect the light that penetrates the substrate, and then the light is used to check the coverage state of the wiring layer. According to this document, infrared light irradiated by a light box is reflected by a mirror disposed under the substrate, and the substrate is irradiated with reflected infrared light to realize penetrating illumination. Furthermore, in this document, there is no disclosure as to the specific structure of the method of supporting the substrate when performing illumination illumination.
再者，專利文獻2中揭示有一種基板表背面標記位置測定裝置：其可於使用矽基板製造光掩模時，簡易地測定光掩模之表面與背面之對準誤差。Further, Patent Document 2 discloses a substrate back surface mark position measuring device which can easily measure an alignment error between a surface and a back surface of a photomask when a photomask is manufactured using a germanium substrate.
根據該專利文獻2，自矽基板之表面或背面(第一面)對標記周圍照射近紅外光(波長0.98 μm)之照明光，於基板之另一面(第二面)側將照明光穿透基板後之光導入至圖像獲取裝置中，獲得第一面上之第一標記之圖像之以及第二面上之第二標記之圖像之，並將兩標記之圖像合成後，測定兩者之位置差。According to Patent Document 2, illumination light of near-infrared light (wavelength of 0.98 μm) is irradiated around the surface of the substrate or the back surface (first surface), and illumination light is transmitted through the other side (second surface) side of the substrate. The light behind the substrate is introduced into the image acquiring device to obtain an image of the first mark on the first surface and an image of the second mark on the second surface, and the images of the two marks are combined and determined. The position of the two is poor.
該基板表背面標記位置測定裝置係通過將矽基板載置於光掩模工作台上來支持基板。由於要求光掩模工作台較牢固，故而使光掩模工作台由金屬等不穿透紅外光之材料構成。因此，於光掩模工作台中設置著用以使穿透照明用之紅外光穿過之孔，並且以使進行矽基板之位置測定之第一標記、第二標記位於該孔上之方式載置矽基板。The substrate front and back mark position measuring device supports the substrate by placing the germanium substrate on the photomask stage. Since the photomask table is required to be relatively strong, the photomask table is made of a material such as metal that does not penetrate infrared light. Therefore, a hole for passing the infrared light for penetrating illumination is disposed in the photomask table, and the first mark and the second mark for measuring the position of the ruthenium substrate are placed on the hole.矽 substrate.
[專利文獻1]日本專利特開平1-109735號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 1-197355
[專利文獻2]日本專利特開2004-349544號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-349544
於對矽基板進行劃線加工或切斷加工之情況下，有時將該基板載置於工作台(亦稱為工作台)上，利用預先形成於基板上之對準用標記來進行基板對工作台之定位，然後使用刀輪等加工工具沿著所需之加工預定線進行加工。When the ruthenium substrate is subjected to scribing or cutting, the substrate may be placed on a table (also referred to as a table), and the substrate may be operated by an alignment mark formed on the substrate in advance. The positioning of the table is then processed along the desired machining line using a machining tool such as a cutter wheel.
如上上述，當於工作台上相繼進行基板之定位與基板加工之情況下，有時因被加工基板不同，而必須根據加工步驟，使形成有對準標記一側之基板面為與工作台接觸一側之面(背面)。As described above, when the positioning of the substrate and the substrate processing are successively performed on the stage, the substrate surface on which the alignment mark is formed must be in contact with the stage depending on the processing step depending on the processing substrate. One side (back).
此時，必須通過利用先前技術中所說明之穿透照明而自背面側對形成有對準標記之區域照射紅外光，並檢測其穿透圖像，藉此來進行定位。At this time, it is necessary to perform the positioning by irradiating the region in which the alignment mark is formed from the back side to the infrared light by using the penetration illumination described in the prior art, and detecting the penetration image thereof.
另一方面，於劃線加工或切斷加工時，則使用加工工具以一定程度之按壓力局部地按壓基板，但若受按壓之位置正下方並非金屬製之工作台面，而是與專利文獻2揭示之光掩模工作台相同之用以使紅外光穿過之孔，則可能會使基板因按壓而彎曲、破損。On the other hand, in the scribing process or the cutting process, the substrate is locally pressed with a certain degree of pressing force using a processing tool, but if it is not directly under the pressed position, it is not a metal work surface, but is related to Patent Document 2 The disclosed photomask table is similar to the hole through which infrared light passes, which may cause the substrate to bend and break due to pressing.
因此，對於形成有用以使紅外光穿過之孔之工作台(亦稱為工作台)而言，難以於一個工作台上利用穿透照明進行定位、以及通過加工工具按壓進行基板加工。Therefore, for a work table (also referred to as a workbench) that forms a hole through which infrared light passes, it is difficult to perform positioning using a penetrating illumination on one workbench, and substrate processing by pressing with a processing tool.
進而，於基板加工時，為了移動載置著基板之工作台，使基板朝二維方向或三維方向移動或者旋轉，而必須於工作台下設置移動工作台之移動機構或旋轉機構，故無法自由地設計進行穿透照明時之光源之設置場所或自光源至基板之照射光學系統。Further, in the processing of the substrate, in order to move the table on which the substrate is placed, the substrate is moved or rotated in the two-dimensional direction or the three-dimensional direction, and the moving mechanism or the rotating mechanism of the moving table must be provided under the table, so that it is not free. The ground is designed to be used for the illumination source when the illumination is penetrated or the illumination optical system from the light source to the substrate.
因此，本發明之目的在於提供一種具穿透照明之工作台，其可於使形成有對準標記一側之基板面與工作台面接觸之狀態下，通過穿透照明來確認對準標記，進行基板之定位，並且可使刀輪等加工工具按壓著進行基板加工。Accordingly, it is an object of the present invention to provide a workbench having a penetrating illumination that can confirm an alignment mark by penetrating illumination in a state where a substrate surface on a side where an alignment mark is formed is in contact with a work surface. The substrate is positioned, and a processing tool such as a cutter wheel can be pressed to perform substrate processing.
為了解決上述課題而研製之本發明之具穿透照明之工作台包含：紅外光源；金屬製之副工作台，其於下部安裝著活動機構，並且於上部形成有支持上工作台之工作台支持面；以及，上工作台，其具有與副工作台之工作台支持面為面接觸之底面、以面接觸狀態載置基板之背面全面之上表面、及紅外光源之紅外光所入射之入射側面，且由紅外穿透性材料形成；並且，於上工作台之內部且載置基板之位置下方，設置使自入射側面入射之紅外光向上表面反射之反射面；紅外光係穿透構成上工作台之紅外穿透性材料而照射至基板上。The workbench with penetrating illumination of the present invention developed to solve the above problems comprises: an infrared light source; a metal sub-workbench, which is provided with a movable mechanism at a lower portion, and a workbench support for supporting the upper workbench is formed at an upper portion thereof. And an upper workbench having a bottom surface in surface contact with the work surface support surface of the sub-stage, an upper surface of the back surface on which the substrate is placed in a surface contact state, and an incident side on which the infrared light of the infrared light source is incident And formed by an infrared penetrating material; and, under the position of the upper workbench and below the substrate, a reflecting surface for reflecting the infrared light incident from the incident side surface to the upper surface is provided; the infrared light system is configured to penetrate The infrared penetrating material of the stage is irradiated onto the substrate.
此處，反射面亦可由埋入切除上工作台之一部分而形成之空間內之金屬塊之表面而形成。Here, the reflecting surface may also be formed by embedding a surface of a metal block in a space formed by cutting a portion of the upper working table.
再者，反射面亦可係於切除上工作台之一部分而形成之傾斜面上設置紅外光反射膜。Furthermore, the reflecting surface may be provided with an infrared light reflecting film on an inclined surface formed by cutting a part of the upper working table.
再者，反射面亦可包含藉由對上工作台之一部分照射雷射而製成於之反射屏幕。Furthermore, the reflecting surface may also comprise a reflective screen made by irradiating a portion of the upper table with a laser.
根據本發明之具穿透照明之工作台，使紅外光自上工作台之入射側面入射，並利用反射面對上表面照射紅外光。藉此，可自基板之背面側照射穿透構成上工作台之紅外材料內之紅外光，從而可利用穿透照明來進行測定。此時，就基板而言，係將基板之背面全面以面接觸狀態載置於上工作台之上表面上，因此即使通過加工工具進行按壓時，基板亦不會產生彎曲或破損。According to the table of the present invention for penetrating illumination, infrared light is incident from the incident side surface of the upper stage, and the upper surface is irradiated with infrared light by reflection. Thereby, the infrared light in the infrared material constituting the upper stage can be irradiated from the back side of the substrate, and the measurement can be performed by the penetration illumination. At this time, in the case of the substrate, the back surface of the substrate is placed on the upper surface of the upper table in a state of being in surface contact, so that the substrate does not become bent or broken even when pressed by the processing tool.
以下，根據圖式對本發明之實施形態進行說明。此處，以如下之基板加工裝置為例進行說明，即，該基板加工裝置係對於基板之單面上形成有對準標記之矽基板進行基板定位，並進行雷射劃線加工者。再者，對準標記係由紅外線無法穿透之金屬薄膜等材料形成。此外，將矽基板載置於加工裝置之加工用工作台上時，為利於進行加工步驟，以形成有對準標記之面與工作台面接觸之方式載置矽基板。Hereinafter, embodiments of the present invention will be described based on the drawings. Here, a description will be given of a substrate processing apparatus which performs substrate positioning on a substrate on which a alignment mark is formed on one surface of a substrate, and performs laser scribing. Further, the alignment mark is formed of a material such as a metal film which cannot be penetrated by infrared rays. Further, when the ruthenium substrate is placed on the processing table of the processing apparatus, in order to facilitate the processing step, the ruthenium substrate is placed so that the surface on which the alignment mark is formed is in contact with the work surface.
圖1係採用本發明之具穿透照明之工作台之基板加工裝置LS1之概略構成圖。圖2係表示具穿透照明之工作台之主要部分之放大圖。Fig. 1 is a schematic view showing a configuration of a substrate processing apparatus LS1 using a table for penetrating illumination of the present invention. Figure 2 is an enlarged view showing the main part of a workbench with penetrating illumination.
首先，對基板加工裝置LS1之整體構成進行說明。於水平之架台1上，設置著沿著平行配置之一對導軌3、4，於圖1之紙面前後方向(以下稱為Y方向)上往復移動之滑動工作台2。於兩導軌3、4之間，沿著前後方向配置著螺桿5，並於該螺桿5上螺合固定於滑動工作台2上之牽條6，藉由馬達(未圖示)使螺桿5正轉、反轉，藉此使滑動工作台2沿著導軌3、4於Y方向上往復移動。First, the overall configuration of the substrate processing apparatus LS1 will be described. The horizontal stage 1 is provided with a slide table 2 which reciprocates in the rear direction (hereinafter referred to as the Y direction) in front of the paper of Fig. 1 along one of the parallel arrangement rails 3, 4. A screw 5 is disposed between the two guide rails 3 and 4 along the front-rear direction, and the lead rod 6 is screwed to the sliding table 2 on the screw 5, and the screw 5 is fixed by a motor (not shown). Turning and reversing, thereby causing the slide table 2 to reciprocate in the Y direction along the guide rails 3, 4.
於滑動工作台2上，以沿著導軌8於圖1之左右方向(以下稱為X方向)往復移動之方式配置著水平之底座7。於固定於底座7之牽條10a上，貫穿螺合著藉由馬達9而旋轉之螺桿10，並藉由螺桿10進行正轉、反轉，而使底座7沿著導軌8於X方向上往復移動。The horizontal base 7 is disposed on the slide table 2 so as to reciprocate along the guide rail 8 in the left-right direction (hereinafter referred to as the X direction) of FIG. The screw 10 which is rotated by the motor 9 is screwed into the tension bar 10a fixed to the base 7, and the base 7 is reciprocated in the X direction along the guide rail 8 by forward rotation and reverse rotation by the screw 10. mobile.
於底座7之移動範圍之外側設置著紅外光源23、24，以使紅外光入射至下述之上工作台20之側面。The infrared light sources 23, 24 are disposed on the outer side of the movement range of the base 7 so that the infrared light is incident on the side surface of the upper table 20 described below.
於底座7上設置著藉由旋轉機構11而可旋轉之旋轉工作台12。該旋轉工作台12之上表面呈水平面，成為用以支持下述之上工作台20之副工作台。再者，當所要加工之基板之面積與旋轉工作台12之大小相比大出許多時等，亦可載置於與旋轉工作台12分開之另一副工作台上，將旋轉工作台與副工作台設為分開的構件。A rotary table 12 rotatable by a rotating mechanism 11 is disposed on the base 7. The upper surface of the rotary table 12 is a horizontal surface and serves as a sub-stage for supporting the upper table 20 described below. Furthermore, when the area of the substrate to be processed is much larger than the size of the rotary table 12, it may be placed on another sub-station separate from the rotary table 12, and the rotary table and the sub-stage The workbench is set as a separate component.
於旋轉工作台12(副工作台)之上表面上載置使用能使來自紅外光源23、24之紅外光穿透之材料即玻璃材料製成之上工作台20。上工作台20係外形呈長方體。On the upper surface of the rotary table 12 (sub-stage), a table 20 is formed by using a glass material which is a material which can penetrate infrared light from the infrared light sources 23 and 24, that is, a glass material. The upper workbench 20 is in the shape of a rectangular parallelepiped.
如圖2所示，於上工作台20中形成有於底面20a側開口之V字槽21，藉由該V字槽21而於上工作台20之內部形成有傾斜面20c、20d。該傾斜面20c、20d相對於底面20a及上表面20b成45度之角。而且，V字槽21係與側面20e、20f平行排列，且槽之兩端連接至側面20g及側面20h。因此，V字槽21呈現自側面20a(20h)觀察具有直角等腰三角形之剖面之三角柱形狀。As shown in FIG. 2, a V-shaped groove 21 opened on the bottom surface 20a side is formed in the upper table 20, and inclined surfaces 20c and 20d are formed in the upper table 20 by the V-shaped groove 21. The inclined faces 20c, 20d are at an angle of 45 degrees with respect to the bottom face 20a and the upper face 20b. Further, the V-shaped groove 21 is arranged in parallel with the side faces 20e and 20f, and both ends of the groove are connected to the side surface 20g and the side surface 20h. Therefore, the V-shaped groove 21 exhibits a triangular prism shape having a cross section of a right-angled isosceles triangle viewed from the side surface 20a (20h).
而且，將外形具有與該V字槽21相同之三角柱形狀且表面經鏡面加工之金屬塊22(例如鐵製塊)，嵌入至V字槽21中。藉此，由與上工作台20之傾斜面20c、20d接觸之金屬塊22之傾斜面22c、22d形成對紅外光之反射面。即，金屬塊22之傾斜面22c、22d係發揮使自側面20e及20f之法線方向入射之紅外光反射、並沿上表面20b之法線方向出射之反射面之作用。Further, a metal block 22 (for example, an iron block) having a triangular prism shape having the same shape as the V-shaped groove 21 and having a mirror-finished surface is embedded in the V-shaped groove 21. Thereby, the inclined surfaces 22c and 22d of the metal block 22 which are in contact with the inclined faces 20c and 20d of the upper table 20 form a reflecting surface for infrared light. In other words, the inclined surfaces 22c and 22d of the metal block 22 function to reflect the infrared light incident from the normal directions of the side surfaces 20e and 20f and to emit the reflection surface in the normal direction of the upper surface 20b.
再者，上述實施形態中形成有V字槽21，但亦可如圖3所示，取代V字槽而形成梯形槽31，並且形成梯形金屬塊32，而延長反射面32c、32d之間之距離。藉由調整兩個反射面之間之距離，可調整上表面20b中進行穿透照明之範圍。Further, in the above embodiment, the V-shaped groove 21 is formed. However, as shown in FIG. 3, the trapezoidal groove 31 may be formed instead of the V-shaped groove, and the trapezoidal metal block 32 may be formed to extend between the reflecting surfaces 32c and 32d. distance. By adjusting the distance between the two reflecting surfaces, the range of penetration illumination in the upper surface 20b can be adjusted.
再者，亦可使兩條V字槽或梯形槽正交而形成十字形槽(此情形時使各槽之端部不到達工作台之側面)，進而將與該十字形之槽相對應之金屬塊嵌入而使反射面成為4個面，從而可反射來自側面20e、20f、20g、20h之任一側面之紅外光。Furthermore, the two V-shaped grooves or the trapezoidal grooves may be orthogonal to form a cross-shaped groove (in this case, the end portions of the grooves do not reach the side of the table), and the groove corresponding to the cross-shaped groove may be correspondingly The metal block is embedded so that the reflecting surface has four faces, so that infrared light from either side of the side faces 20e, 20f, 20g, 20h can be reflected.
加工對象之矽基板S係藉由未圖示之機械手或操作員之手動操作而被載置於上工作台20上。此時，以使形成於矽基板S上之對準標記與上工作台20之上表面20b接觸之方式載置矽基板S。因此，矽基板S之形成有對準標記一側之面成為背面，而進行劃線一側之面則成為表面。The substrate S to be processed is placed on the upper table 20 by manual operation by a robot or an operator (not shown). At this time, the ruthenium substrate S is placed so that the alignment mark formed on the ruthenium substrate S comes into contact with the upper surface 20b of the upper stage 20. Therefore, the surface on which the alignment mark is formed on the side of the ruthenium substrate S serves as the back surface, and the surface on which the scribe line is formed becomes the surface.
於載置矽基板S之上工作台之上方安裝著：雷射束光學系統14，其使自雷射電源13照射之雷射束以所需之射束形狀(例如橢圓形)進行照射；噴嘴16，其噴射冷媒；刀輪17，其形成對基板進行劃線加工時之觸發裂縫；以及攝像機25、26，其用於確認對準標記之位置。Mounted above the table above the mounting substrate S: a laser beam optical system 14 that illuminates a laser beam irradiated from the laser power source 13 in a desired beam shape (e.g., an elliptical shape); 16. A jet refrigerant; a cutter wheel 17 that forms a triggering crack when the substrate is scribed; and cameras 25, 26 for confirming the position of the alignment mark.
接著，對利用該基板加工裝置LS1進行雷射劃線加工之操作進行說明。Next, an operation of performing laser scribing processing by the substrate processing apparatus LS1 will be described.
於將上工作台20之側面20e、20f設置於與紅外光源23、24相向之位置上之狀態下，以使矽基板S之背面與上工作台20之上表面20b接觸之方式載置矽基板S。接著，當自紅外光源23、24照射紅外光時，紅外光將自側面20e、20f入射至上工作台20內，由金屬塊之傾斜面22c、22d(與上工作台20之傾斜面20c、20d之交界)反射而自上表面20b出射。接著，自矽基板S之背面入射之紅外光將穿透基板內，利用攝像機25、26對此時反映矽基板S之對準標記之位置之穿透圖像進行檢測。因此，一邊監視攝像機25、26之圖像，一邊以對準標記之位置作參考，而驅動旋轉工作台12或底座7，藉此進行矽基板S對上工作台20之定位。The side surfaces 20e and 20f of the upper stage 20 are placed at positions facing the infrared light sources 23 and 24, and the back surface of the top substrate S is placed on the upper surface 20b of the upper stage 20 so as to be placed on the substrate. S. Next, when the infrared light is irradiated from the infrared light sources 23, 24, the infrared light is incident on the upper table 20 from the side faces 20e, 20f, and the inclined faces 22c, 22d of the metal block (the inclined faces 20c, 20d with the upper table 20) The junction is reflected and emerges from the upper surface 20b. Then, the infrared light incident from the back surface of the substrate S will penetrate through the substrate, and the camera 25, 26 detects the penetration image of the position of the alignment mark of the substrate S by the cameras 25, 26. Therefore, while monitoring the images of the cameras 25 and 26, the rotary table 12 or the base 7 is driven with reference to the position of the alignment mark, whereby the positioning of the upper substrate S to the upper table 20 is performed.
完成定位後，接著使上工作台20移動，利用刀輪17於所需之位置上形成觸發裂縫，進而，將雷射之照射位置對準於劃線預定線進行雷射照射，且隨後立即進行冷媒噴射，藉此進行雷射劃線加工。After the positioning is completed, the upper table 20 is then moved, and the triggering crack is formed at the desired position by the cutter wheel 17, and then the laser irradiation position is aligned with the predetermined line of the laser line for laser irradiation, and then immediately The refrigerant is sprayed, thereby performing laser scribing processing.
藉由以上動作，可一邊以位於矽基板S背面之對準標記為參考，一邊進行表面側之劃線加工。By the above operation, the scribing process on the surface side can be performed with reference to the alignment mark on the back surface of the cymbal substrate S.
其次，對本發明之另一實施形態進行說明。圖4係表示作為第二實施形態之具穿透照明之工作台之主要部分之圖。圖中，對與圖2相同之構成標註相同符號，省略部分說明。Next, another embodiment of the present invention will be described. Fig. 4 is a view showing a main part of a table with penetrating illumination as a second embodiment. In the drawings, the same components as those in FIG. 2 are denoted by the same reference numerals, and the description thereof will be omitted.
本實施形態中，並不利用金屬塊22(參照圖1、圖2)形成上工作台20內部所形成之反射面，而是藉由附著於傾斜面20c、20d之金屬薄膜27c、27d形成上述反射面。即，於上工作台20之傾斜面20c、20d上形成金屬薄膜27c、27d。具體而言，例如藉由蒸鍍、濺鍍等來形成鋁膜等，藉此形成反射面。利用該金屬薄膜，亦可將自側面入射之紅外光反射至上表面。In the present embodiment, the metal block 22 (see Figs. 1 and 2) is not used to form the reflecting surface formed inside the upper table 20, but is formed by the metal thin films 27c and 27d attached to the inclined surfaces 20c and 20d. Reflective surface. That is, the metal thin films 27c and 27d are formed on the inclined surfaces 20c and 20d of the upper table 20. Specifically, for example, an aluminum film or the like is formed by vapor deposition, sputtering, or the like to form a reflecting surface. With the metal thin film, infrared light incident from the side surface can also be reflected to the upper surface.
圖5係表示作為第三實施形態之具穿透照明之工作台之主要部分之圖。圖中，對與圖2相同之構成標註相同符號，省略部分說明。Fig. 5 is a view showing a main part of a table with penetrating illumination as a third embodiment. In the drawings, the same components as those in FIG. 2 are denoted by the same reference numerals, and the description thereof will be omitted.
本實施形態中，並非切除上工作台20而形成V字槽21，而是於上工作台之內部藉由雷射照射而形成反射屏幕28c、28d。即，使雷射束之焦點對準上工作台內之所需位置並進行掃描，藉此使內部熔融，而製成包含傾斜之平面之反射屏幕。藉由該反射屏幕，亦可將自側面入射之紅外光反射至上表面。In the present embodiment, instead of cutting the upper table 20 to form the V-shaped groove 21, the reflection screens 28c and 28d are formed by laser irradiation inside the upper table. That is, the focus of the laser beam is directed to a desired position in the upper stage and scanned, whereby the inside is melted, and a reflective screen including the inclined plane is formed. The infrared light incident from the side surface can also be reflected to the upper surface by the reflective screen.
以上，對本發明之代表性實施例進行了說明，但本發明並非僅限定於上述實施例，可於不脫離請求項之範圍內適當進行修正、變更。The representative embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and modifications and changes may be appropriately made without departing from the scope of the claims.
本發明可應用於需要進行矽基板等紅外穿透性基板之定位之加工裝置。The present invention can be applied to a processing apparatus that requires positioning of an infrared penetrating substrate such as a germanium substrate.
1．．．水平之架台1. . . Horizontal platform
2．．．滑動工作台2. . . Sliding table
3、4．．．導軌3, 4. . . guide
5、10．．．螺桿5, 10. . . Screw
6、10a．．．牽條6, 10a. . . Pulling
7．．．底座7. . . Base
8．．．導軌8. . . guide
9．．．底座9. . . Base
11．．．旋轉機構11. . . Rotating mechanism
12．．．旋轉工作台(副工作台)12. . . Rotary table (sub-workbench)
13．．．雷射電源13. . . Laser power supply
14．．．雷射束光學系統14. . . Laser beam optical system
16．．．噴嘴16. . . nozzle
17．．．刀輪17. . . Knife wheel
20．．．上工作台20. . . Workbench
21．．．V字槽twenty one. . . V slot
22．．．金屬塊twenty two. . . Metal block
22b、22c．．．金屬工作台之傾斜面(反射面)22b, 22c. . . Inclined surface of metal work table (reflecting surface)
23、24．．．紅外光源23, 24. . . Infrared source
25、26．．．攝像機25, 26. . . Camera
27c、27d．．．金屬薄膜(反射面)27c, 27d. . . Metal film (reflecting surface)
28c、28d．．．反射屏幕(反射面)28c, 28d. . . Reflective screen
31．．．梯形槽31. . . Trapezoidal slot
32．．．金屬塊32. . . Metal block
LSI．．．基板加工裝置LSI. . . Substrate processing device
S．．．太陽電池基板S. . . Solar cell substrate
圖1係表示採用作為本發明一實施形態之具穿透照明之工作台而成之基板加工裝置之構成圖。Fig. 1 is a view showing the configuration of a substrate processing apparatus using a table for penetrating illumination as an embodiment of the present invention.
圖2係表示圖1之具穿透照明之工作台之主要部分構成之圖。Fig. 2 is a view showing the configuration of a main part of the workbench having the penetrating illumination of Fig. 1.
圖3係表示作為本發明其他實施形態之具穿透照明之工作台之主要部分構成之圖。Fig. 3 is a view showing the configuration of a main part of a workbench having a penetrating illumination according to another embodiment of the present invention.
圖4係表示作為本發明其他實施形態之具穿透照明之工作台之主要部分構成之圖。Fig. 4 is a view showing the configuration of a main part of a workbench having a penetrating illumination according to another embodiment of the present invention.
圖5係表示作為本發明其他實施形態之具穿透照明之工作台之主要部分構成之圖。Fig. 5 is a view showing the configuration of a main part of a workbench having a penetrating illumination according to another embodiment of the present invention.
1．．．水平之架台1. . . Horizontal platform
2．．．滑動工作台2. . . Sliding table
3、4．．．導軌3, 4. . . guide
5、10．．．螺桿5, 10. . . Screw
6、10a．．．牽條6, 10a. . . Pulling
7．．．底座7. . . Base
8．．．導軌8. . . guide
9．．．底座9. . . Base
11．．．旋轉機構11. . . Rotating mechanism
12．．．旋轉工作台(副工作台)12. . . Rotary table (sub-workbench)
13．．．雷射電源13. . . Laser power supply
14．．．雷射束光學系統14. . . Laser beam optical system
16．．．噴嘴16. . . nozzle
17．．．刀輪17. . . Knife wheel
20．．．上工作台20. . . Workbench
21．．．V字槽twenty one. . . V slot
22．．．金屬塊twenty two. . . Metal block
23、24．．．紅外光源23, 24. . . Infrared source
25、26．．．攝像機25, 26. . . Camera
LSI．．．基板加工裝置LSI. . . Substrate processing device
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009089462A JP2010245123A (en) | 2009-04-01 | 2009-04-01 | Table with transmissive lighting |
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|---|---|
| TW201106441A TW201106441A (en) | 2011-02-16 |
| TWI419254B true TWI419254B (en) | 2013-12-11 |
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| TW99108060A TWI419254B (en) | 2009-04-01 | 2010-03-18 | A desk that penetrates lighting |
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| JP (1) | JP2010245123A (en) |
| KR (1) | KR101170963B1 (en) |
| CN (1) | CN101859724B (en) |
| TW (1) | TWI419254B (en) |
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| KR101720299B1 (en) * | 2010-10-12 | 2017-04-10 | 엘지이노텍 주식회사 | Air conditioner with ultra violet light emitting diode |
| JP7163577B2 (en) * | 2017-12-28 | 2022-11-01 | 富士電機株式会社 | Semiconductor device manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW392093B (en) * | 1995-10-20 | 2000-06-01 | Ushio Electric Inc | Process for projection exposure of a workpiece with alignment marks on the rear side and device for executing the process |
| US20060114442A1 (en) * | 2004-11-29 | 2006-06-01 | Asml Netherlands B.V. | Substrate table, method of measuring a position of a substrate and a lithographic apparatus |
| WO2008038752A1 (en) * | 2006-09-29 | 2008-04-03 | Nikon Corporation | Mobile unit system, pattern forming device, exposing device, exposing method, and device manufacturing method |
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| JP4826146B2 (en) * | 2004-06-09 | 2011-11-30 | 株式会社ニコン | Exposure apparatus and device manufacturing method |
| US20070268470A1 (en) * | 2004-07-16 | 2007-11-22 | Nikon Corporation | Support Method and Support Structure of Optical Member, Optical Unit, Exposure Apparatus, and Device Manufacturing Method |
| US8411271B2 (en) * | 2005-12-28 | 2013-04-02 | Nikon Corporation | Pattern forming method, pattern forming apparatus, and device manufacturing method |
| JP2007322706A (en) * | 2006-05-31 | 2007-12-13 | Nsk Ltd | Exposure device and exposure method |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW392093B (en) * | 1995-10-20 | 2000-06-01 | Ushio Electric Inc | Process for projection exposure of a workpiece with alignment marks on the rear side and device for executing the process |
| US20060114442A1 (en) * | 2004-11-29 | 2006-06-01 | Asml Netherlands B.V. | Substrate table, method of measuring a position of a substrate and a lithographic apparatus |
| WO2008038752A1 (en) * | 2006-09-29 | 2008-04-03 | Nikon Corporation | Mobile unit system, pattern forming device, exposing device, exposing method, and device manufacturing method |
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| Publication number | Publication date |
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| KR20100109876A (en) | 2010-10-11 |
| KR101170963B1 (en) | 2012-08-03 |
| TW201106441A (en) | 2011-02-16 |
| CN101859724B (en) | 2012-10-10 |
| JP2010245123A (en) | 2010-10-28 |
| CN101859724A (en) | 2010-10-13 |
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