201106441 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種穿透照明工作A , i ώ & 邗D，其自與工作台接觸201106441 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a penetrating illumination operation A, i ώ & 邗D, which is in contact with a workbench
一側之基板面（稱為背面），對載置於工作A 、1 F α上之矽基板等 紅外光穿透性基板照射紅外光，以使此紅外光穿透基板 内’藉此可檢測形成於背面上之對準用標記之穿透圖像。 【先前技術】 S對形成於半導體基板上之配線層之覆蓋狀態進行檢 查、或對半導體積體電路之微細圖案形成時所用之光掩模 (光罩)之表背面之作為位置基準之標記之位置偏移進行測 定時’獲取由基板之背面侧照射並穿透至基板表面側之紅 外光的穿透照明圖像，進行基板之檢查或位置偏移測定 (參照專利文獻1、2)。 例如，專利文獻丨中揭示了如下方法：於半導體基板上 形成配線層後，檢測階差覆蓋之不良部位，此時，自基板 之背面照射包含波長為1 ·3〜6 μπι之紅外光之光，並利用紅 外線檢測器檢測穿透基板之光，再通過穿透光來檢查配線 層之覆蓋狀態。根據該文獻，利用配置於基板下方之反射 鏡使由燈箱照射之紅外光反射，對基板照射反射紅外光， 從而實現穿透照明。再者，於該文獻中，關於進行穿透照 明時之基板之支持方法之具體構造，並無任何揭示。 再者’專利文獻2中揭示有一種基板表背面標記位置測 定裝置：其可於使用矽基板製造光掩模時，簡易地測定冕 掩模之表面與背面之對準誤差。 I46813.doc 201106441 根據該專利文獻2，自矽基板之表面或背面（第一面）對 標記周圍照射近紅外光（波長0 98 μιη)之照明光，於基板之 另一面（第二面）側將照明光穿透基板後之光導入至圖像獲 取裝置中，獲得第一面上之第一標記之圖像之以及第二面 上之第二標記之圖像之，並將兩標記之圖像合成後，測定 兩者之位置差。 該基板表背面標記位置測定裝置係通過將矽基板載置於 光掩模工作台上來支持基板。由於要求光掩模工作台較牢 固，故而使光掩模工作台由金屬等不穿透紅外光之材料構 成。因此，於光掩模工作台中設置著用以使穿透照明用之 紅外光穿過之孔，並且以使進行矽基板之位置測定之第一 標記、第二標記位於該孔上之方式載置石夕基板。 [先前技術文獻] [專利文獻] [專利文獻1 ]曰本專利特開平1 _ 109735號公報 [專利文獻2]曰本專利特開2004-349544號公報 【發明内容】 [發明所欲解決之問題] 於對矽基板進行劃線加工或切斷加工之情況下，有時將 該基板載置於工作台（亦稱為工作台）上，利用預先形成於 基板上之對準用標記來進行基板對工作台之定位，然後使 用刀輪等加工工具沿著所需之加工預定線進行加工。 如上上述，當於工作台上相繼進行基板之定位與基板加 工之情況下’有時因被加工基板不同’而必須根據加工步 146813.doc 201106441 驟，使形成有對準標記一側之基板面為與工作台接觸一側 之面（背面）。 此時，必須通過利用先前技術中所說明之穿透照明而自 背面側對形成有對準標記之區域照射紅外光，並檢測其穿 透圖像’藉此來進行定位。 另一方面，於劃線加工或切斷加工時則使用加工工具 乂疋程度之按壓力局部地按壓基板，但若受按壓之位置 正下方並非金屬製之工作台面，而是與專利文獻2揭示之 光掩模工作台相同之用以使紅外光穿過之孔，則可能會使 基板因按壓而脊曲、破損。 因此，對於形成有用以使紅外光穿過之孔之工作台（亦 稱為工作台）而言’難以於一個工作台上利用穿透照明進 行定位、以及通過加工工具按壓進行基板加工。 進而，於基板加工時，為了移動載置著基板之工作台， 使基板朝二維方向或三維方向移動或者旋轉，而必須於工 作σ下汉置移動工作台之移動機構或旋轉機構，故無法自 由地6X计進行穿透照明時之光源之設置場所或自光源至基 板之照射光學系統。 因此，本發明之目的在於提供一種具穿透照明之工作 〇其可於使形成有對準標記一側之基板面與工作台面接 觸之狀態下，通過穿透照明來確認對準標記，進行基板之 疋位，並且可使刀輪等加工工具按壓著進行基板加工。 [解決問題之技術手段] 為了解決上述課題而研製之本發明之具穿透照明之工作 146813.doc 201106441 α已3 .紅外光源，金屬製之副工作台，其於下部安穿著 活動機構，並且於上部形成有支持上工作台之工作台支持 面，以及，上工作台，其具有與副工作台之工作台支持面 為面接觸之底面、以面接觸狀態載置基板之背面全面之上 表面、及紅外光源之紅外光所入射之入射側面，且由紅外 穿透性材料形成；並且，於上工作台之内部且載置基板之 位置下方，設置使自入射側面入射之紅外光向上表面反射 之反射面；紅外光係穿透構成上工作台之紅外穿透性材料 而照射至基板上。 此處，反射面亦可由埋入切除上工作台之一部分而形成 之空間内之金屬塊之表面而形成。 再者’反射面亦可係於切除上工作台之一部分而形成之 傾斜面上設置紅外光反射膜。 再者’反射面亦可包含藉由對上工作台之一部分照射雷 射而製成於之反射屏幕。 [發明之效果] 根據本發明之具穿透照明之工作台，使紅外光自上工作 〇之入射側面入射，並利用反射面對上表面照射紅外光。 藉此，可自基板之背面側照射穿透構成上工作台之紅外材 料内之紅外光’從而可利用穿透照明來進行測定。此時， 就基板而言，係將基板之背面全面以面接觸狀態載置於上 工作台之上表面上，因此即使通過加工工具進行按壓時， 基板亦不會產生彎曲或破損。 【實施方式】 146813.doc 201106441 以下’根據圖式對本發明之實施形態進行說明。此處， 以如下之基板加工裝置為例進行說明，即，該基板加工裝 置係對於基板之單面上形成有對準標記之矽基板進行基板 定位’並進行雷射劃線加工者❶再者，對準標記係由紅外 線無法穿透之金屬薄膜等材料形成。此外，將矽基板載置 於加工裝置之加工用工作台上時，為利於進行加工步驟， 以形成有對準標記之面與工作台面接觸之方式載置矽基 板。 圖1係採用本發明之具穿透照明之工作台之基板加工裂 置LSI之概略構成圖β圖2係表示具穿透照明之工作台之主 要部分之放大圖。 首先’對基板加工裝置LSI之整體構成進行說明《於水 平之架台1上，設置著沿著平行配置之一對導軌3、4，於 圖1之紙面前後方向（以下稱為γ方向）上往復移動之滑動工 作台2。於兩導軌3、4之間，沿著前後方向配置著螺桿$， 並於該螺桿5上螺合固定於滑動工作台2上之牽條6，藉由 馬達（未圖示）使螺桿5正轉、反轉，藉此使滑動工作台之沿 著導轨3、4於γ方向上往復移動。 於滑動工作台2上，以沿著導執8於圖丨之左右方向（以下 稱為X方向）往復移動之方式配置著水平之底座7。於固定 於底座7之牽條10a上，貫穿螺合著藉由馬達9而旋轉之螺 桿1〇,並藉由螺桿10進行正#、反轉，而使底座7沿著導 軌8於X方向上往復移動。 於底座7之移動範圍之外側設置著紅外光源23、μ，以 1468l3.doc 201106441 使紅外光入射至下述之上工作台20之側面β 於底座7上設置著藉由旋轉機構11而可旋轉之旋轉工作 台12。該旋轉工作台12之上表面呈水平面，成為用以支持 下述之上工作台20之副工作台。再者，當所要加工之基板 之面積與旋轉工作台12之大小相比大出許多時等，亦可載 置於與旋轉工作台12分開之另一副工作台上，將旋轉工作 台與副工作台設為分開的構件。 於旋轉工作台12(副工作台）之上表面上載置使用能使來 自紅外光源23、24之紅外光穿透之材料即玻璃材料製成之 上工作台20。上工作台20係外形呈長方體。 如圖2所示，於上工作台20中形成有於底面2〇3側開口之 V字槽21 ’藉由該V字槽21而於上工作台20之内部形成有 傾斜面20c、20d。該傾斜面20c、20d相對於底面20a及上 表面20b成45度之角。而且，v字槽21係與側面2〇e、20f平 行排列’且槽之兩端連接至側面2〇g及側面20h。因此，v 字槽21呈現自側面2〇a(20h)觀察具有直角等腰三角形之剖 面之三角柱形狀。 而且’將外形具有與該V字槽21相同之三角柱形狀且表 面經鏡面加工之金屬塊22(例如鐵製塊），嵌入至V字槽21 中。藉此，由與上工作台20之傾斜面20c、20d接觸之金屬 塊22之傾斜面22c、22d形成對紅外光之反射面。即，金屬 塊22之傾斜面22c、22d係發揮使自側面20e及20f之法線方 向入射之紅外光反射、並沿上表面20b之法線方向出射之 反射面之作用。 146813.doc 201106441 再者，上述實施形態中形成有V字槽21，但亦可如圖3所 不，取代V字槽而形成梯形槽31，並且形成梯形金屬塊 U ’而延長反射面32c、32d之間之距離。藉由調整兩個反 射面之間之距離，可調整上表面20b中進行穿透照明之範 再者，亦可使兩條V字槽或梯形槽正交而形成十字形槽 (此情形時使各槽之端部不到達工作台之侧面），進而將與 該十字形之槽相對應之金屬塊嵌入而使反射面成為伟 面，從而可反射來自側面20e、20f、2〇g、2〇h之任一側面 之紅外光。 加工對象之矽基板S係藉由未圖示之機械手或操作員之 手_作㈣載置於上工作台2()上。此時，以使形成於石夕 基板S上之對準標記與上4台2G之上表面鳥接觸之方式 載置矽基板S。因此’矽基板s之形成有對準標記一側之面 成為背面，而進行劃線一側之面則成為表面。 於載置矽基板S之上工作台之上方安裳著：雷射束光學 系統14,其使自雷射電源13照射之雷射束以所需之射束形 狀（例如橢圓形）進行照射；喷嘴16，其喷射冷媒；刀輪 17 ’其形成對基板進行劃線加工時之觸發裂縫；以及攝像 機25、26，其用於確認對準標記之位置。 。接著’對利用該基板加工裝置LS1進行雷射劃線加工之 操作進行說明。 於將上工作台20之側面20e、 24相向之位置上之狀態下，以 2〇f設置於與紅外光源23、 使矽基板S之背面與上工作 146813.doc 201106441 台20之上表面20b接觸之方式載置矽基板S。接著，當自紅 外光源23、24照射紅外光時，紅外光將自側面2〇e、20f入 射至上工作台20内，由金屬塊之傾斜面22c、22d(與上工 作台20之傾斜面20c、20d之交界）反射而自上表面20b出 射。接著，自矽基板S之背面入射之紅外光將穿透基板 内’利用攝像機25、26對此時反映矽基板S之對準標記之 位置之穿透圖像進行檢測。因此，一邊監視攝像機25、26 之圖像’一邊以對準標記之位置作參考，而驅動旋轉工作 台12或底座7 ’藉此進行矽基板S對上工作台2〇之定位。 元成疋位後，接著使上工作台2 〇移動，利用刀輪17於所 需之位置上形成觸發裂縫，進而，將雷射之照射位置對準 於劃線預定線進行雷射照射，且隨後立即進行冷媒喷射， 藉此進行雷射劃線加工。 藉由以上動作，可一邊以位於矽基板s背面之對準標記 為參考’一邊進行表面側之劃線加工。 其次，對本發明之另—實施形態進行說明。圖4係表示 作為第二實施形態之具穿透照明之工作台之主要部分之 圖》圖中，對與圖2相同之構成標註相同符號，省略部分 說明》 本實施形態中，並不利用金屬塊22(參照^、圖2)形成 上工作台2G内部所形成之反射面’而是藉由附著於傾斜面 2〇c、20d之金屬薄膜27卜27(1形成上述反射面。即，於上 工作台20之傾斜面20c、2〇dJl形成金屬薄膜27。、2仏具 體而言，例如藉由蒸鑛、親等來形成銘膜等，藉此形成 146813.doc •10. 201106441 反射面。利用該金屬薄膜，亦可將自側面入射之紅外光反 射至上表面。 圖5係表示作為第三實施形態之具穿透照明之工作台之 主要部分之圖。圖中，對與圖2相同之構成標註相同符 號’省略部分說明。 本實施形態中，並非切除上工作台20而形成v字槽21， 而是於上工作台之内部藉由雷射照射而形成反射屏幕 28c、28d。即，使雷射束之焦點對準上工作台内之所需位 置並進行掃描，藉此使内部熔融，而製成包含傾斜之平面 之反射屏幕。藉由該反射屏幕，亦可將自側面入射之紅外 光反射至上表面。 上對本發明之代表性實施例進行了說明，但本發明 並非僅限定於上述實施例，可於不脫離請求項之範圍内適 當進行修正、變更。 [產業上之可利用性] 本發明可應用於需要進行矽基板等紅外穿透性基板之定 位之加工裝置。 【圖式簡單說明】 圖1係表示採用作為本發明一實施形態之具穿透照明之 工作台而成之基板加工裝置之構成圖。 圖2係表示圖1之具穿透照明之工作台之主要部分構成之 圖。 圖3係表示作為本發明其他實施形態之具穿ϋ照明之工 作台之主要部分構成之圖。 146813.doc -11 - 201106441 之工 之工 圖4係表示作為本發明其他實施形態之具穿透照明 作台之主要部分構成之圖。 圖5係表示作為本發明其他實施形態之具穿透照明 作台之主要部分構成之圖。 【主要元件符號說明】 1 水平之架台 2 滑動工作台 3、4 導轨 5、10 螺桿 6 ' 1 〇a 牵條 7 底座 8 導轨 9 底座 11 旋轉機構 12 旋轉工作台（副工作台） 13 雷射電源 14 雷射束光學系統 16 喷嘴 17 刀輪 20 上工作台 21 V字槽 22 金屬塊 22b ' 22c 金屬工作台之傾斜面（反射面） 23 > 24 紅外光源 146813.doc •12- 201106441 25 ' 26 攝像機 27c 、 27d 金屬薄膜（反射面） 28c 、 28d 反射屏幕（反射面） 31 梯形槽 32 金屬塊 LSI 基板加工裝置 S 太陽電池基板 146813.doc - 13 -The substrate surface on one side (referred to as the back surface) irradiates infrared light to an infrared light-transmitting substrate such as a germanium substrate placed on the working A, 1 F α so that the infrared light penetrates through the substrate A penetration image of the alignment mark formed on the back surface. [Prior Art] S inspects the state of coverage of the wiring layer formed on the semiconductor substrate or marks the front surface of the photomask (mask) used for forming the fine pattern of the semiconductor integrated circuit as a position reference When the positional shift is measured, the penetration illumination image of the infrared light that is irradiated on the back side of the substrate and penetrates to the surface of the substrate is taken, and the inspection of the substrate or the measurement of the positional deviation is performed (see Patent Documents 1 and 2). For example, the patent document discloses a method of detecting a defective portion covered by a step after forming a wiring layer on a semiconductor substrate, and at this time, irradiating light having an infrared light having a wavelength of 3.4 to 6 μm from the back surface of the substrate. And detecting the light passing through the substrate by using an infrared detector, and then checking the coverage state of the wiring layer by penetrating the light. According to this document, infrared light irradiated from a light box is reflected by a mirror disposed under the substrate, and the substrate is irradiated with reflected infrared light to realize penetrating illumination. Further, in this document, there is no disclosure as to the specific structure of the method of supporting the substrate at the time of penetrating illumination. Further, Patent Document 2 discloses a substrate back surface mark position measuring device which can easily measure an alignment error between a front surface and a back surface of a ruthenium mask when a photomask is produced using a ruthenium substrate. According to Patent Document 2, illumination light of near-infrared light (wavelength 0 98 μm) is applied to the periphery of the mark from the front surface or the back surface (first surface) of the substrate, on the other side (second surface) side of the substrate. Introducing the light of the illumination light through the substrate into the image acquisition device, obtaining an image of the first mark on the first surface and the image of the second mark on the second surface, and drawing the two marks After the synthesis, the difference in position between the two was measured. The substrate back surface mark position measuring device supports the substrate by placing the germanium substrate on the photomask stage. Since the photomask table is required to be relatively rigid, the photomask stage is made of a material such as metal that does not penetrate infrared light. Therefore, a hole for passing the infrared light for penetrating illumination is disposed in the photomask table, and the first mark and the second mark for determining the position of the ruthenium substrate are placed on the hole.夕 substrate. [Prior Art] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. 2004-349544. When the ruthenium substrate is subjected to scribing or cutting, the substrate may be placed on a stage (also referred to as a table), and the substrate pair may be formed by an alignment mark formed on the substrate in advance. The table is positioned and then machined along the desired line of processing using a tool such as a cutter wheel. As described above, in the case where the positioning of the substrate and the substrate processing are successively performed on the stage, 'sometimes different from the substrate to be processed', the substrate surface on which the alignment mark side is formed must be formed according to the processing step 146813.doc 201106441. The side (back) that is in contact with the workbench. At this time, it is necessary to perform the positioning by irradiating the region in which the alignment mark is formed from the back side to the infrared light by using the penetration illumination described in the prior art, and detecting the penetration image thereof. On the other hand, in the scribing process or the cutting process, the substrate is partially pressed by the pressing force of the processing tool, but if the pressed position is not the metal work surface, it is disclosed in Patent Document 2 The same photomask table is used to pass infrared light through the hole, which may cause the substrate to be bent and damaged due to pressing. Therefore, it is difficult for the table (also referred to as a table) to form a hole through which the infrared light passes, and it is difficult to perform positioning by using the penetrating illumination on one table and pressing the substrate by the processing tool. Further, in the processing of the substrate, in order to move the table on which the substrate is placed, the substrate is moved or rotated in the two-dimensional direction or the three-dimensional direction, and the moving mechanism or the rotating mechanism of the moving table must be placed under the operation σ. The 6X meter is freely placed at the place where the light source is penetrated or the illumination optical system from the light source to the substrate. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an operation for penetrating illumination which can confirm an alignment mark by penetrating illumination in a state in which a substrate surface on a side on which an alignment mark is formed is brought into contact with a work surface. In the clamp position, the processing tool such as a cutter wheel can be pressed to perform substrate processing. [Technical means for solving the problem] The work for penetrating illumination of the present invention developed to solve the above problems is 146813.doc 201106441 α 3. An infrared light source, a metal workbench, which is worn in the lower part, and A workbench support surface for supporting the upper workbench is formed on the upper portion, and an upper workbench having a bottom surface in surface contact with the workbench support surface of the sub-workbench and a full-surface upper surface on the back surface of the substrate in a surface contact state And an incident side surface of the infrared light source incident on the infrared light source, and formed by the infrared penetrating material; and, under the position of the upper workbench and below the substrate, the infrared light incident from the incident side surface is arranged to be reflected upward The reflective surface; the infrared light penetrates the substrate through the infrared penetrating material constituting the upper stage. Here, the reflecting surface may be formed by embedding a surface of a metal block in a space formed by cutting a portion of the upper table. Further, the reflecting surface may be provided with an infrared light reflecting film on an inclined surface formed by cutting a part of the upper table. Further, the 'reflecting surface' may also include a reflective screen made by irradiating a portion of the upper stage with a laser. [Effects of the Invention] According to the table for penetrating illumination of the present invention, infrared light is incident from the incident side surface of the upper working cymbal, and the upper surface is irradiated with infrared light by reflection. Thereby, the infrared light in the infrared material constituting the upper stage can be irradiated from the back side of the substrate so that the measurement can be performed by the penetration illumination. In this case, in the case of the substrate, the back surface of the substrate is placed on the upper surface of the upper table in a state of being in surface contact, so that the substrate is not bent or broken even when pressed by the processing tool. [Embodiment] 146813.doc 201106441 Hereinafter, embodiments of the present invention will be described based on the drawings. Here, a description will be given of a substrate processing apparatus which performs substrate positioning on a substrate on which a alignment mark is formed on one surface of a substrate and performs laser scribing processing. The alignment mark is formed of a material such as a metal film that cannot be penetrated by infrared rays. Further, when the ruthenium substrate is placed on the processing table of the processing apparatus, in order to facilitate the processing step, the ruthenium substrate is placed so that the surface on which the alignment mark is formed is in contact with the work surface. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the construction of a substrate processing LSI having a table through which illumination is applied. Fig. 2 is an enlarged view showing a main portion of a table having a penetrating illumination. First, the overall configuration of the substrate processing apparatus LSI will be described. "On the horizontal stage 1, the guide rails 3 and 4 are arranged along one of the parallel arrangements, and the paper is reciprocated in the front-rear direction (hereinafter referred to as the gamma direction) in the paper of FIG. Move the sliding table 2. A screw $ is disposed between the two guide rails 3 and 4 along the front-rear direction, and the tension bar 6 is screwed to the sliding table 2 on the screw 5, and the screw 5 is fixed by a motor (not shown). Turning and reversing, thereby causing the slide table to reciprocate in the γ direction along the guide rails 3, 4. The horizontal base 7 is disposed on the slide table 2 so as to reciprocate along the left and right directions (hereinafter referred to as the X direction) of the guide 8 in the figure. The screw 1 旋转 rotated by the motor 9 is screwed into the tension bar 10a fixed to the base 7, and the screw 10 is rotated forward and reversed, so that the base 7 is along the guide rail 8 in the X direction. Reciprocating. The infrared light source 23 and μ are disposed on the outer side of the moving range of the base 7, and the infrared light is incident on the side surface β of the upper work table 20 at 1468l3.doc 201106441. The base 7 is provided to be rotatable by the rotating mechanism 11. Rotate the table 12. The upper surface of the rotary table 12 is a horizontal surface and serves as a sub-stage for supporting the upper table 20 described below. Furthermore, when the area of the substrate to be processed is much larger than the size of the rotary table 12, it may be placed on another sub-station separate from the rotary table 12, and the rotary table and the sub-stage The workbench is set as a separate component. On the upper surface of the rotary table 12 (sub-stage), an upper stage 20 made of a glass material which is a material which can penetrate infrared light from the infrared light sources 23, 24 is placed. The upper workbench 20 is in the shape of a rectangular parallelepiped. As shown in Fig. 2, the V-shaped groove 21' opened in the upper table 20 on the side of the bottom surface 2〇3 is formed with inclined surfaces 20c and 20d in the upper table 20 by the V-shaped groove 21. The inclined faces 20c, 20d are at an angle of 45 degrees with respect to the bottom face 20a and the upper face 20b. Further, the v-shaped groove 21 is arranged in parallel with the side faces 2〇e, 20f' and both ends of the groove are connected to the side surface 2〇g and the side surface 20h. Therefore, the v-shaped groove 21 has a triangular prism shape having a cross section of a right-angled isosceles triangle viewed from the side surface 2〇a (20h). Further, a metal block 22 (e.g., an iron block) having a triangular prism shape having the same outer shape as the V-shaped groove 21 and having a mirror-finished surface is embedded in the V-shaped groove 21. Thereby, the reflecting surfaces for the infrared light are formed by the inclined faces 22c, 22d of the metal block 22 which are in contact with the inclined faces 20c, 20d of the upper table 20. In other words, the inclined surfaces 22c and 22d of the metal block 22 function to reflect the infrared light incident from the normal directions of the side surfaces 20e and 20f and to emit the reflection surface in the normal direction of the upper surface 20b. 146813.doc 201106441 In addition, in the above embodiment, the V-shaped groove 21 is formed. However, as shown in FIG. 3, the trapezoidal groove 31 may be formed instead of the V-shaped groove, and the trapezoidal metal block U' may be formed to extend the reflecting surface 32c. The distance between 32d. By adjusting the distance between the two reflecting surfaces, the upper surface 20b can be adjusted to penetrate the illumination. Alternatively, the two V-shaped grooves or the trapezoidal grooves can be orthogonal to form a cross-shaped groove (in this case, The end of each groove does not reach the side of the table, and the metal block corresponding to the cross-shaped groove is embedded to make the reflecting surface a great surface, so as to be reflected from the side faces 20e, 20f, 2〇g, 2〇 Infrared light on either side of h. The substrate S to be processed is placed on the upper table 2 () by a robot or an operator (not shown). At this time, the ruthenium substrate S is placed so that the alignment marks formed on the slab substrate S are in contact with the upper surface of the upper four 2G birds. Therefore, the surface on which the alignment mark is formed on the substrate s is the back surface, and the surface on which the scribe line is formed becomes the surface. Mounted above the table above the substrate S: a laser beam optical system 14 that illuminates a laser beam irradiated from the laser power source 13 in a desired beam shape (for example, an elliptical shape); A nozzle 16 that ejects refrigerant; a cutter wheel 17' that forms a trigger crack when the substrate is scribed; and cameras 25, 26 that confirm the position of the alignment mark. . Next, an operation of performing laser scribing processing using the substrate processing apparatus LS1 will be described. In a state where the side faces 20e, 24 of the upper table 20 are opposed to each other, 2〇f is disposed in contact with the infrared light source 23, and the back surface of the substrate S is contacted with the upper surface 20b of the upper surface 146813.doc 201106441 The substrate S is placed on the substrate. Next, when the infrared light is irradiated from the infrared light sources 23, 24, the infrared light is incident on the upper table 20 from the side faces 2〇e, 20f, and the inclined faces 22c, 22d of the metal block (the inclined face 20c with the upper table 20) The junction of 20d is reflected and emerges from the upper surface 20b. Then, the infrared light incident from the back surface of the substrate S will pass through the inside of the substrate, and the through images of the positions of the alignment marks of the substrate S are detected by the cameras 25 and 26 at this time. Therefore, while monitoring the images of the cameras 25, 26 while referring to the position of the alignment marks, the rotary table 12 or the base 7' is driven to position the upper substrate S to the upper table 2'. After the element is clamped, the upper table 2 is moved, and the triggering crack is formed at the desired position by the cutter wheel 17, and then the laser irradiation position is aligned with the predetermined line of the line for laser irradiation, and Immediately thereafter, a refrigerant jet is performed, thereby performing laser scribing processing. By the above operation, the surface side scribing can be performed while referring to the alignment mark on the back surface of the ruthenium substrate s. Next, another embodiment of the present invention will be described. 4 is a view showing a main part of a table with a through-lighting illumination according to a second embodiment. In the drawings, the same components as those in FIG. 2 are denoted by the same reference numerals, and the description thereof is omitted. In this embodiment, the metal is not used. The block 22 (see FIG. 2 and FIG. 2) forms a reflecting surface formed by the inside of the upper table 2G, but is formed by the metal thin film 27 attached to the inclined surfaces 2〇c and 20d (1). The inclined surfaces 20c, 2〇dJ1 of the upper table 20 form a metal thin film 27. Specifically, for example, a film or the like is formed by steaming or affinity, thereby forming a reflecting surface of 146813.doc • 10. 201106441. According to the metal thin film, infrared light incident from the side surface can be reflected to the upper surface. Fig. 5 is a view showing a main part of a table having a through illumination as a third embodiment, and is the same as Fig. 2 In the present embodiment, the v-shaped grooves 21 are not formed by cutting the upper table 20, but the reflection screens 28c and 28d are formed by laser irradiation inside the upper table. Focusing the beam The desired position in the workbench is aligned and scanned, thereby melting the interior to form a reflective screen including a slanted plane. The reflective screen can also reflect infrared light incident from the side to the upper surface. The present invention is not limited to the above-described embodiments, and modifications and changes may be appropriately made without departing from the scope of the claims. [Industrial Applicability] The present invention is applicable to the present invention. A processing apparatus for positioning an infrared penetrating substrate such as a ruthenium substrate is required. [Brief Description of the Drawings] Fig. 1 is a view showing a configuration of a substrate processing apparatus using a table for penetrating illumination according to an embodiment of the present invention. Fig. 2 is a view showing a configuration of a main part of a workbench having a penetrating illumination of Fig. 1. Fig. 3 is a view showing a configuration of a main part of a workbench having a through-lighting illumination according to another embodiment of the present invention. -11 - 201106441 Figure 4 is a diagram showing the configuration of a main part of a penetrating illumination stage as another embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing the main components of a penetrating illumination stage. [Main component symbol description] 1 Horizontal gantry 2 Sliding table 3, 4 Guide rail 5, 10 Screw 6 ' 1 〇a Strut 7 Base 8 Guide rail 9 Base 11 Rotating mechanism 12 Rotary table (sub-workbench) 13 Laser power supply 14 Laser beam optical system 16 Nozzle 17 Cutter wheel 20 Upper table 21 V-shaped groove 22 Metal block 22b ' 22c Metal table Inclined surface (reflective surface) 23 > 24 Infrared light source 146813.doc •12- 201106441 25 ' 26 Camera 27c, 27d Metal film (reflecting surface) 28c, 28d Reflective screen (reflecting surface) 31 Trapezoidal groove 32 Metal block LSI substrate processing Device S Solar Cell Substrate 146813.doc - 13 -