KR101170963B1

KR101170963B1 - Table for transmission illumination

Info

Publication number: KR101170963B1
Application number: KR20100029713A
Authority: KR
Inventors: 마사노부 소야마
Original assignee: 미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date: 2009-04-01
Filing date: 2010-04-01
Publication date: 2012-08-03
Also published as: JP2010245123A; TW201106441A; KR20100109876A; TWI419254B; CN101859724A; CN101859724B

Abstract

(Problem) The transmission illumination mounting table which can perform positioning of a board | substrate by transmission illumination, and can process a board | substrate by pressing a processing tool is provided.
(Solution means) An infrared light source, a metal subtable with a movable mechanism attached to the lower part, and a table mounting surface on which a top table is placed on the upper surface, and a bottom surface for surface contact with the table mounting surface of the subtable. And a top table having an upper surface on which the substrate is placed, an incident side for injecting the infrared light of the infrared light source, and formed of an infrared transmissive material, inside the top table, and below the position where the substrate is placed, The reflective surface reflecting the infrared light incident from the incident side toward the upper surface is formed.

Description

Transmission table {TABLE FOR TRANSMISSION ILLUMINATION}

The present invention is directed to an infrared light transmissive substrate such as a silicon substrate placed on a table by irradiating infrared light from the substrate surface (referred to as the back side) on the side in contact with the table so as to pass through the substrate. The present invention relates to a table for transmitting illumination that enables to detect a transmission image of an alignment mark formed on the rear surface.

It is possible to inspect the coating state of the wiring layer formed on the semiconductor substrate or to measure the positional deviation of the mark serving as the positional reference of the front and back surfaces of the reticle used to form the fine pattern of the semiconductor integrated circuit. At this time, the transmission illumination image by the infrared light which irradiated from the back surface side of the board | substrate and permeate | transmitted to the front surface side of a board | substrate is acquired, and the test | inspection and position shift measurement of a board | substrate are performed (refer patent document 1, 2).

For example, in Patent Literature 1, after forming a wiring layer on a semiconductor substrate, a defective portion of step covering is detected, but at that time, light containing infrared light having a wavelength of 1.3 to 6 µm is emitted from the back surface of the substrate. The method of irradiating and detecting the light which permeate | transmits a board | substrate with an infrared detector and inspecting the coating | covering state of a wiring layer by transmitted light is disclosed. According to this document, the infrared light irradiated from the lamp house is reflected by a mirror disposed below the substrate, and the reflected infrared light is irradiated onto the substrate to thereby transmit light. In addition, nothing is disclosed in this document about the specific structure of the support method of the board | substrate at the time of transmitting illumination.

Moreover, in patent document 2, when manufacturing a reticle using a silicon substrate, the board | substrate front surface mark position measuring apparatus which can measure the alignment error of the front surface and back surface of a reticle easily is disclosed.

According to this, the illumination light of near-infrared light (wavelength 0.98 mu m) is projected from the surface or the back surface (first surface) of the silicon substrate to the periphery of the mark, and the light transmitted through the substrate is illuminated on the other side (second surface) side of the substrate. Guide the image acquisition device to obtain the image of the first mark on the first surface and the image of the second mark on the second surface, and synthesize the images of both marks, and then the difference between the positions of both To be measured.

In this board | substrate front and back mark position measuring apparatus, a board | substrate is supported by placing a silicon substrate on a reticle stage. Since the reticle stage is required to be solid, it is composed of a material that does not transmit infrared light such as metal. Therefore, the reticle stage is provided with a hole for passing infrared light for transmission illumination, and the first mark and the second mark for measuring the position of the silicon substrate are placed on the hole.

Japanese Patent Application Laid-open No. 1-109735 Japanese Laid-open Patent Publication 2004-349544

When scribe processing or dividing processing is performed on a silicon substrate, the substrate is placed on a table (also called a stage) and aligned by a mark for alignment previously formed on the substrate. After positioning a board with respect to a table, it may process along a desired process planned line using a processing tool, such as a cutter wheel.

As described above, in the case where the positioning of the substrate and the substrate processing are subsequently performed on the table, depending on the substrate to be processed, the surface of the side on which the substrate surface on the side on which the alignment mark is formed is in contact with the table on account of the process. It may be necessary to make (the back side).

In that case, it is necessary to perform infrared positioning by irradiating infrared light to the area | region in which the alignment mark was formed from the back surface side by using the transmission illumination demonstrated by the background art, and detecting the transmission image.

On the other hand, in scribing and dividing, the substrate is pressed locally by a certain pressing force using a processing tool, but the lower portion of the pressed position is not a metal table surface, but a patent document. If it is made into the hole for allowing infrared light to pass through the same reticle stage as disclosed in 2, there exists a possibility that a board | substrate may bend and be damaged by pressing.

Therefore, in a table (also called a stage) in which a hole for passing infrared light is formed, it is difficult to perform positioning by transmission illumination and substrate processing by pressing a processing tool on one stage.

In order to move or rotate the substrate in the two-dimensional or three-dimensional direction by moving the table on which the substrate is raised during substrate processing, a moving mechanism and a rotating mechanism for moving the table need to be installed under the table. In the case of illumination, the installation position of the light source and the irradiation optical system from the light source to the substrate could not be freely designed.

Therefore, in the present invention, the alignment mark can be confirmed by transmission illumination while the substrate surface on the side where the alignment mark is formed is brought into contact with the table surface, and the substrate can be positioned. An object of the present invention is to provide a transmission lighting mounting table capable of performing substrate processing.

The table for transmission illumination of this invention made | formed in order to solve the said subject is an infrared light source, the metal sub table with the movable mechanism attached to the lower part, and the table mounting surface which puts the top table on the upper part, and the table of the sub table. A top table having a bottom surface in surface contact with the mounting surface, an upper surface on which the entire back surface of the substrate is placed in surface contact state, and an incident side surface at which infrared light from the infrared light source is incident, and formed of an infrared transmissive material. A reflection surface reflecting the infrared light incident from the incident side surface toward the upper surface is formed inside the top table and below the position where the substrate is placed, and the infrared light constitutes the top table. The infrared permeable material is transmitted to irradiate the substrate.

Here, the reflective surface may be formed by the surface of the metal block inserted in the space formed by cutting away a part of the top table.

In addition, the reflective surface may form an infrared light reflective film on the inclined surface formed by cutting a part of the top table.

The reflective surface may be made of a reflective screen created by laser irradiation on a part of the top table.

According to the transmission illumination mounting table of this invention, infrared light is made to enter from the incident side surface of a sub table, and an infrared light is irradiated to an upper surface with a reflecting surface. Thereby, the infrared light which permeate | transmitted in the infrared permeable material which comprises a top table can be irradiated from the back surface side of a board | substrate, and the measurement by transmission illumination is attained. At this time, since the board | substrate puts the whole back surface of a board | substrate in the surface contact state with respect to the upper surface of a top table, even if it presses with a processing tool, a board | substrate does not bend and be damaged.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the board | substrate processing apparatus which employ | adopted the transmission illumination mounting table which is one Embodiment of this invention.
It is a figure which shows the structure of the principal part of the permeation | attachment illumination mounting table in FIG.
It is a figure which shows the structure of the principal part of the permeation | transmission illumination mounting table which is another embodiment of this invention.
It is a figure which shows the structure of the principal part of the permeation | attachment illumination mounting table which is another embodiment of this invention.
It is a figure which shows the structure of the principal part of the permeation | attachment illumination mounting table which is another embodiment of this invention.

(Mode for carrying out the invention)

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. Here, the substrate processing apparatus which performs laser scribe processing after positioning a board | substrate with respect to the silicon substrate in which the alignment mark was formed in the single side | surface of a board | substrate is demonstrated as an example. In addition, the alignment mark shall be formed from materials, such as a metal thin film which does not permeate | transmit infrared rays. When the silicon substrate is placed on the processing table of the processing apparatus, the surface on which the alignment mark is formed is brought up in contact with the table surface for the convenience of the process.

1: is a schematic block diagram of the board | substrate processing apparatus LS1 which employ | adopted the transmission illumination mounting table of this invention. It is an enlarged view which shows the principal part of the transmission lighting mounting table.

First, the whole structure of the substrate processing apparatus LS1 is demonstrated. A slide table which reciprocates in a front-rear direction (hereinafter referred to as a Y-direction) in FIG. 1 along a pair of guide rails 3 and 4 arranged in parallel on a horizontal stand 1 ( 2) is formed. The screw screw 5 is arrange | positioned along the front-back direction between both guide rails 3 and 4, The stay 6 fixed to the slide table 2 is screwed to this screw screw 5, By rotating the screw screw 5 forward and backward with a motor (not shown), the slide table 2 is formed to reciprocate along the guide rails 3 and 4 in the Y direction.

On the slide table 2, a horizontal pedestal 7 is arranged along the guide rail 8 so as to reciprocate in the left-right direction (hereinafter referred to as X direction) in FIG. The screw screw 10 rotated by the motor 9 is coupled to the stay 10a fixed to the pedestal 7, and the screw 7 is rotated forward and backward, so that the pedestal 7 is rotated. Along the guide rail 8, it reciprocates in the X direction.

Infrared light sources 23 and 24 are formed outside the movement range of the pedestal 7, and the infrared light is incident on the side surface of the top table 20 described later.

On the pedestal 7, a rotary table 12 which is rotatable by the rotary mechanism 11 is formed. The upper surface of this turntable 12 forms a horizontal surface, and serves as a subtable for supporting the top table 20 described later. In addition, in the case where the area of the substrate to be processed is considerably larger than the size of the turntable 12, the turntable and the subtable may be formed separately from the turntable 12, so that the turntable and the subtable may be separate members. .

The top table 20 using the glass material which is a material which can permeate the infrared light from the infrared light sources 23 and 24 is mounted on the upper surface of the turntable 12 (subtable). The top table 20 has a rectangular shape.

As shown in FIG. 2, the top table 20 is provided with the V-shaped groove 21 which opens to the bottom surface 20a side, and this V-shaped groove 21 is provided in the inside of the top table 20. As shown in FIG. Inclined surfaces 20d and 20c are formed. These inclined surfaces 20d and 20c form an angle of 45 degrees with respect to the bottom surface 20a and the upper surface 20b. In addition, the V-shaped grooves 21 are arranged in parallel with the side surfaces 20e and 20f, and both ends of the grooves reach the side surfaces 20g and the side surfaces 20h. Therefore, the V-shaped groove 21 is configured to form a delta shape having a cross section that is a right angle isosceles triangle when viewed from the side surface 20g (20h).

And while the external shape has the same delta shape as this V-shaped groove 21, the metal block 22 (for example, steel block) whose surface was mirror-finished is inserted in the V-shaped groove 21. As shown in FIG. . As a result, the inclined surfaces 22d and 22c of the metal block 22 in contact with the inclined surfaces 20d and 20c of the top table 20 form a reflective surface for infrared light. That is, the inclined surfaces 22d and 22c of the metal block 22 reflect the infrared light incident from the normal direction of the side surfaces 20e and 20f as a reflecting surface which is emitted in the normal direction of the upper surface 20b. Function.

In the above embodiment, the V-shaped groove 21 is formed, but as shown in FIG. 3, the trapezoidal groove 31 is formed in place of the V-shaped groove, and the trapezoidal metal block 32 is formed. ) May be formed to increase the distance between the reflecting surfaces 32c and 32d. By adjusting the distance between the two reflecting surfaces, the range of performing transmissive illumination on the upper surface 20b can be adjusted.

Also, two orthogonal V-shaped grooves or trapezoidal grooves are formed to form a cross-shaped groove (in this case, the end of each groove does not reach the side of the table), and the cross-shaped groove It is also possible to reflect the infrared light from any of the side surfaces 20e, 20f, 20g, and 20h by making the reflective surface four surfaces so as to sandwich the metal block.

The silicon substrate S to be processed is placed on the top table 20 by manual operation of a robot hand and an operator (not shown). At this time, the alignment mark formed on the silicon substrate S is raised in contact with the upper surface 20b of the top table 20. Therefore, the surface of the side in which the alignment mark of the silicon substrate S is formed becomes a back surface, and the surface of the side on which the scribe is performed becomes a surface.

Above the top table on which the silicon substrate S is placed, the laser beam optical system 14 which irradiates the laser beam irradiated from the laser power supply 13 into a desired beam shape (for example, elliptical shape), and a refrigerant The nozzle 16 to inject, the cutter wheel 17 which forms a trigger crack at the time of scribing a board | substrate, and the cameras 25 and 26 for confirming the position of an alignment mark are attached.

Next, operation | movement of the laser scribing process by this board | substrate processing apparatus LS1 is demonstrated. The back surface of the silicon substrate S is brought into contact with the top surface 20b of the top table 20 while the side surfaces 20e and 20f of the top table 20 are set at positions facing the infrared light sources 23 and 24. Put it on. When infrared light is irradiated from the infrared light sources 23 and 24, the infrared light is incident from the side surfaces 20e and 20f into the top table 20, and the inclined surfaces 22c and 22d of the metal block (top table 20). Is reflected from the inclined surfaces 20c and 20d, and exits from the upper surface 20b. The infrared light incident from the back surface of the silicon substrate S is transmitted through the substrate, and the transmission images reflecting the position of the alignment mark of the silicon substrate S are detected by the cameras 25 and 26. Therefore, the position of the silicon substrate S relative to the top table 20 is driven by driving the rotary table 12 or the pedestal 7 with reference to the position of the alignment mark while monitoring the images of the cameras 25 and 26. Make a decision.

After the positioning is completed, the top table 20 is moved to form a trigger crack at a desired position by the cutter wheel 17, and further, the laser irradiation position is adjusted by aligning the irradiation position of the laser on the scribe scheduled line. Laser scribing is performed by performing immediate refrigerant injection.

By the above operation | movement, the surface side scribing can be performed, referring the alignment mark on the back surface of the silicon substrate S. As shown in FIG.

Next, another embodiment of the present invention will be described. It is a figure which shows the principal part of the permeation illumination mounting table which is 2nd Embodiment. In the drawings, the same components as in FIG. 2 are denoted by the same reference numerals to omit part of the description.

In the present embodiment, the metal thin film 27c in which the reflective surface formed inside the top table 20 is attached to the inclined surfaces 20c and 20d without using the metal blocks 22 (see FIGS. 1 and 2). 27d). That is, metal thin films 27c and 27d are formed on the inclined surfaces 20c and 20d of the top table 20. Specifically, for example, a reflective surface is formed by forming an aluminum film or the like by vapor deposition, sputtering or the like. Also by this metal thin film, the infrared light incident from the side surface can be reflected and sent to the upper surface.

It is a figure which shows the principal part of the permeation illumination mounting table which is 3rd Embodiment. In the drawings, the same components as in FIG. 2 are denoted by the same reference numerals to omit part of the description.

In the present embodiment, the top tables 20 are not cut to form the V-shaped grooves 21, but the reflective screens 28c and 28d are formed inside the top table by laser irradiation. That is, by scanning the focus of the laser beam in accordance with a desired position in the top table, the interior is melted to create a reflective screen composed of an inclined plane. This reflective screen can also reflect infrared light incident from the side surface and send it to the upper surface.

As mentioned above, although the typical Example of this invention was described, this invention is not necessarily limited only to the said Example, It is possible to modify and change suitably within the range which does not deviate from the claim.

INDUSTRIAL APPLICABILITY The present invention can be applied to a processing apparatus requiring positioning of an infrared transmissive substrate such as a silicon substrate.

S: solar cell board
7: base
11: rotating mechanism
12: rotary table (subtable)
20: saw table
21: V-shaped groove
22: metal block
22c, 22d: slope of the metal table (reflection surface)
27c, 27d: metal thin film (reflective surface)
28c, 28d: Reflective screen (reflective surface)
31: trapezoidal groove
32: metal block

Claims

For transmissive illumination for detecting the transmission image of the alignment mark formed on the back surface of the substrate, which becomes the substrate surface on the side contacting the table, with respect to the infrared light transmissive substrate placed on the table for scribing or dividing processing In the table,
With infrared light source,
A metal subtable with a movable mechanism attached to the lower part and a table mounting surface on which the top table is placed;
The bottom surface which is in surface contact with the table mounting surface of the said sub table, the upper surface on which the whole back surface of the said board | substrate is put in the surface contact state, and the incident side surface where the infrared light of the said infrared light source injects are made of an infrared permeable material. Consists of a saw table that is formed,
Inside the top table and below the position where the substrate is placed, a reflection surface for reflecting infrared light incident from the incident side surface toward the upper surface is formed,
The infrared light transmits the infrared transparent material constituting the top table, is irradiated onto the substrate by the reflective surface, and is transmitted through the substrate to form a transmission image of the alignment mark.
The reflective surface is an inclined surface formed by cutting a part of the bottom surface of the top table,
The reflecting surface is formed at an angle of 45 degrees with respect to the upper surface of the top table,
And said sub table and said top table are moved along a plane parallel to the upper surface of said top table by said movable mechanism.

The method of claim 1,
The inclined surface is a table for transmission illumination formed by the surface of a metal block embedded in a space formed by cutting a part of the top table.

The method of claim 1,
A table for transmitting illumination comprising forming an infrared light reflecting film on the inclined surface.

For transmissive illumination for detecting the transmission image of the alignment mark formed on the back surface of the substrate, which becomes the substrate surface on the side contacting the table, with respect to the infrared light transmissive substrate placed on the table for scribing or dividing processing In the table,
With infrared light source,
A metal subtable with a movable mechanism attached to the lower part and a table mounting surface on which the top table is placed;
The bottom surface which is in surface contact with the table mounting surface of the said sub table, the upper surface on which the whole back surface of the said board | substrate is put in the surface contact state, and the incident side surface where the infrared light of the said infrared light source injects are made of an infrared permeable material. Consists of a saw table that is formed,
Inside the top table and below the position where the substrate is placed, a reflection surface for reflecting infrared light incident from the incident side surface toward the upper surface is formed,
The infrared light passes through the infrared transparent material constituting the top table, is irradiated onto the substrate by the reflecting surface, and is transmitted through the substrate to form a transmission image of the alignment mark.
The said reflective surface consists of a reflective screen created by laser irradiation to a part of said top table,
The reflecting surface is formed at an angle of 45 degrees with respect to the upper surface of the top table,
And said sub table and said top table are moved along a plane parallel to the upper surface of said top table by said movable mechanism.