TW201946724A - Inspection jig and inspection method that includes first, second, and third patterns having different widths on a surface of a plate and a two-dimensional code recording widths of the patterns - Google Patents
Inspection jig and inspection method that includes first, second, and third patterns having different widths on a surface of a plate and a two-dimensional code recording widths of the patterns Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
- G06K7/1417—2D bar codes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/1439—Methods for optical code recognition including a method step for retrieval of the optical code
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/146—Methods for optical code recognition the method including quality enhancement steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8411—Application to online plant, process monitoring
Abstract
Description
本發明是有關用以測定被設在加工裝置的攝像手段的像素大小(pixel size)的檢查治具及使用檢查治具的檢查方法。The present invention relates to an inspection jig for measuring a pixel size of an imaging means provided in a processing device, and an inspection method using the inspection jig.
一般切削加工晶圓等的被加工物的加工裝置是進行由在加工裝置上攝像的畫像來檢測出碎屑或加工溝的寬度的所謂切口檢查(kerf check)的動作(例如參照專利文獻1)。此時，在碎屑或加工溝的寬度的計測是利用攝像手段的像素大小(每1像素的長度；亦稱為畫像分解能)。
[先前技術文獻]
[專利文獻]In general, a processing device for processing a workpiece such as a wafer performs a so-called kerf check operation that detects the width of a chip or a processing groove from an image captured on the processing device (for example, refer to Patent Document 1). . At this time, the measurement of the width of the chip or the processing groove is the pixel size (length per pixel; also referred to as image resolution energy) using imaging means.
[Prior technical literature]
[Patent Literature]
[專利文獻1]日本特開平05-326700號公報[Patent Document 1] Japanese Patent Laid-Open No. 05-326700
(發明所欲解決的課題)(Problems to be solved by the invention)
可是，為了正確地進行上述的切口檢查，須正確地測定攝像手段的像素大小。但，以往的構成是藉由使具有成為檢查用基準的圖案的晶圓與攝像手段相對地移動，只使成為攝像手段的目標的圖案移動預定距離，圖案的移動量除以像素的變化量(移動量)，藉此加工裝置自動進行算出像素大小的所謂像素大小計量的動作。此情況，若在具有成為檢查用基準的圖案的晶圓與攝像手段的機械性的移動量產生稍微的誤差，則被算出的像素大小不會正確，利用像素大小來計測的碎屑或加工溝寬有可能不是正確。However, in order to perform the above-mentioned incision inspection accurately, it is necessary to accurately measure the pixel size of the imaging means. However, in the conventional configuration, a wafer having a pattern serving as a reference for inspection is moved relative to the imaging means, and only the pattern targeted by the imaging means is moved by a predetermined distance. The amount of pattern movement is divided by the amount of change in pixels ( (Movement amount), whereby the processing device automatically performs a so-called pixel size measurement operation that calculates the pixel size. In this case, if there is a slight error in the amount of mechanical movement between the wafer having the pattern used as the reference for inspection and the imaging means, the calculated pixel size will not be correct, and debris or processed grooves will be measured using the pixel size. The width may not be correct.
因此，本發明的目的是在於提供一種可正確地測定攝像手段的像素大小的檢查治具及檢查方法。
(用以解決課題的手段)Therefore, an object of the present invention is to provide an inspection jig and an inspection method that can accurately measure the pixel size of an imaging means.
(Means for solving problems)
若根據本發明之一個的形態，則提供一種檢查治具，係用以測定加工裝置的攝像手段的像素大小的板狀的檢查治具，其係在表面具備圖案及記錄該圖案的寬度的二維碼。According to one aspect of the present invention, there is provided an inspection jig, which is a plate-shaped inspection jig for measuring the pixel size of the imaging means of a processing device, and has a pattern on the surface and a width of two that records the width of the pattern. Dimension code.
若根據此構成，則藉由以攝像手段來讀取二維碼，可取得被記錄於二維碼的圖案的實際的寬度，因此藉由此圖案的實際的寬度除以對應於該圖案的寬度的像素數，可正確地算出像素大小。又，即使為具有複數的檢查治具的情況，也能以攝像手段來識別被形成於檢查治具的二維碼，因此可防止檢查治具的拿錯。又，藉由在二維碼事先記錄圖案的實際的寬度，即使不以高的精度來將圖案的寬度作成預先決定的預定長度，也可高精度地測定像素大小。According to this configuration, the actual width of the pattern recorded in the two-dimensional code can be obtained by reading the two-dimensional code with the imaging means. Therefore, the actual width of the pattern is divided by the width corresponding to the pattern. The number of pixels can accurately calculate the pixel size. In addition, even in the case of a plurality of inspection jigs, the two-dimensional code formed on the inspection jigs can be recognized by imaging means, so that the inspection jigs can be prevented from being mistakenly picked. In addition, by recording the actual width of the pattern in advance in the two-dimensional code, the pixel size can be measured with high accuracy without making the width of the pattern into a predetermined predetermined length with high accuracy.
在此構成中，該圖案是亦可形成複數個寬度不同者。若根據此構成，則藉由分別攝取寬度不同的複數的圖案來算出像素大小，例如，可減低攝像手段的透鏡的歪斜等所造成的誤差。In this configuration, the pattern may be formed in a plurality of different widths. According to this configuration, the pixel size can be calculated by taking a plurality of patterns with different widths, and for example, it is possible to reduce errors caused by lens distortion of the imaging means.
若根據本發明的其他的形態，則提供一種檢查方法，係用以測定具備控制手段、保持手段、加工手段、攝像手段及顯示攝像後的畫像的畫面之加工裝置的該攝像手段的像素大小的檢查方法，其係具備：
保持步驟，其係將在表面具有圖案及記錄了該圖案的寬度的二維碼之檢查治具保持於該保持手段；
讀取步驟，其係以該攝像手段來讀取該二維碼，使該圖案的寬度記憶於該控制手段；
平行調合步驟，其係將該圖案與該攝像手段調成平行；
測定步驟，其係攝取該圖案而測定在該畫面上對應於該圖案的寬度的像素數；及
算出步驟，其係藉由在該讀取步驟讀入的該圖案的寬度除以在該測定步驟測定的像素數，算出像素大小。
[發明的效果]According to another aspect of the present invention, there is provided an inspection method for measuring the pixel size of the imaging means of a processing device including a control means, a holding means, a processing means, an imaging means, and a screen that displays a screen of a captured image Inspection method, which has:
The holding step is to hold the inspection jig having a pattern on the surface and a two-dimensional code recording the width of the pattern on the holding means;
The reading step is to read the two-dimensional code by the camera means, so that the width of the pattern is memorized in the control means;
A parallel blending step, which is to align the pattern in parallel with the camera means;
The measuring step is to take the pattern and measure the number of pixels corresponding to the width of the pattern on the screen; and the calculating step is to divide the width of the pattern read in the reading step by the measuring step. Measure the number of pixels and calculate the pixel size.
[Effect of the invention]
若根據本發明，則藉由以攝像手段來讀取二維碼，可取得被記錄於二維碼的圖案的實際的寬度，因此藉由此圖案的實際的寬度除以對應於該圖案的寬度的像素數，可正確地算出像素大小。According to the present invention, the actual width of the pattern recorded in the two-dimensional code can be obtained by reading the two-dimensional code with the imaging means. Therefore, the actual width of the pattern is divided by the width corresponding to the pattern. The number of pixels can accurately calculate the pixel size.
說明有關本發明的實施形態的檢查治具及檢查方法。本發明不是藉由以下的實施形態記載的內容來限定。並且，在以下記載的構成要素是包含該當業者容易設想者，實質上相同者。而且，以下記載的構成是可適當組合。又，可在不脫離本發明的主旨範圍進行構成的各種的省略、置換或變更。An inspection jig and an inspection method according to an embodiment of the present invention will be described. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include those that are easy to imagine for the practitioner, and are substantially the same. The configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes can be made in the configuration without departing from the gist of the present invention.
[第1實施形態]
圖1是表示使用第1實施形態的檢查治具的加工裝置的構成例的立體圖。圖2是表示第1實施形態的檢查治具的構成例的平面圖。圖3是表示加工裝置的控制手段的構成例的方塊圖。加工裝置1是切削加工作為被加工物的晶圓200，將晶圓200分割成各個的晶片的裝置。加工裝置1是如圖1所示般，具備：吸盤台(保持手段)10、加工手段20、門型框架30、加工進給手段40、分度進給手段50、切入進給手段60、攝像手段70、顯示手段74及控制手段80。[First Embodiment]
FIG. 1 is a perspective view showing a configuration example of a processing apparatus using an inspection jig of the first embodiment. FIG. 2 is a plan view showing a configuration example of an inspection jig of the first embodiment. FIG. 3 is a block diagram showing a configuration example of a control means of the processing apparatus. The processing device 1 is a device that cuts and processes the wafer 200 as a workpiece, and divides the wafer 200 into individual wafers. The processing device 1 is as shown in FIG. 1 and includes: a suction table (holding means) 10, a processing means 20, a gate frame 30, a processing feed means 40, an indexing feed means 50, a cutting feed means 60, and a camera Means 70, display means 74, and control means 80.
晶圓200是形成半導體裝置或光裝置的半導體晶圓、光裝置晶圓、無機材料基板、延性樹脂材料基板、陶瓷基板或玻璃基板等的被加工物。晶圓200是被形成圓板狀，在其表面形成有被配列成格子狀的多數的分割預定線，及藉由該等分割預定線來區劃的複數的區域，在各區域是分別形成有IC、LSI等的裝置。晶圓200是例如經由黏著膠帶201來被環狀框架202支撐。The wafer 200 is a processed object such as a semiconductor wafer, an optical device wafer, an inorganic material substrate, a ductile resin material substrate, a ceramic substrate, or a glass substrate forming a semiconductor device or an optical device. The wafer 200 is formed in a circular plate shape, and a plurality of predetermined division lines arranged in a grid shape are formed on the surface, and a plurality of regions divided by the predetermined division lines are formed with ICs in each region. , LSI, etc. The wafer 200 is supported by the ring frame 202 via, for example, an adhesive tape 201.
吸盤台10是在裝置本體2的上面沿著設於X軸方向的開口部2a來可移動地配設。吸盤台10是具備保持面11及複數的保持部12。吸盤台10是被形成圓板狀，藉由未圖示的旋轉手段來以和保持面11的中心正交的旋轉軸旋轉。保持面11是吸盤台10的鉛直方向的上端面，相對於水平面平坦地形成。保持面11是例如以多孔的陶瓷等所構成，藉由未圖示的真空吸引源的負壓來吸引保持晶圓200。複數的保持部12是在保持面11的周圍配設4處，挾持環狀框架202而固定。The chuck table 10 is movably arranged on the upper surface of the apparatus main body 2 along an opening portion 2 a provided in the X-axis direction. The chuck table 10 includes a holding surface 11 and a plurality of holding portions 12. The chuck table 10 is formed in a disc shape, and is rotated by a rotation means (not shown) around a rotation axis orthogonal to the center of the holding surface 11. The holding surface 11 is an upper end surface in the vertical direction of the chuck table 10 and is formed flat with respect to a horizontal plane. The holding surface 11 is made of, for example, a porous ceramic or the like, and sucks and holds the wafer 200 by a negative pressure of a vacuum suction source (not shown). The plurality of holding portions 12 are arranged around the holding surface 11 at four positions, and are fixed by holding the ring frame 202.
加工手段20是加工被保持於吸盤台10的晶圓200者。加工手段20是經由分度進給手段50及切入進給手段60來固定於門型框架30，該門型框架30是以能在Y軸方向跨越被設在裝置本體2的上面的開口部2a之方式立設於裝置本體2。加工手段20是具備切削刀刃21、主軸22及外殼23。切削刀刃21是極薄的圓板狀且環狀地形成的切削砥石。主軸22是在其前端可裝卸地安裝切削刀刃21。外殼23是具有未圖示的馬達等的驅動源，圍繞Y軸方向的旋轉軸旋轉自如地支撐主軸22。使主軸22高速旋轉而藉由切削刀刃21來切削晶圓200。The processing means 20 processes a wafer 200 held on the chuck table 10. The processing means 20 is fixed to a gate-shaped frame 30 via an indexing feeding means 50 and a cutting-in feeding means 60. The gate-shaped frame 30 is an opening 2a provided on the upper surface of the apparatus body 2 in the Y-axis direction. This method stands on the device body 2. The processing means 20 includes a cutting edge 21, a spindle 22, and a housing 23. The cutting blade 21 is a cutting vermiculite formed in an extremely thin disk shape and annularly. The main shaft 22 has a cutting blade 21 detachably attached to a front end thereof. The housing 23 is a drive source such as a motor (not shown), and supports the main shaft 22 rotatably around a rotation axis in the Y-axis direction. The main shaft 22 is rotated at high speed to cut the wafer 200 by the cutting blade 21.
加工進給手段40是使吸盤台10及加工手段20相對移動於X軸方向者。例如，加工進給手段40是具有延伸於X軸方向的未圖示的滾珠螺桿、脈衝馬達等的驅動源，使支撐吸盤台10的未圖示的X軸移動基台移動於X軸方向。另外，在開口部2a是配設有覆蓋X軸移動基台的罩子構件41，及在罩子構件41的前後延伸於X軸方向的蛇腹構件42。The processing feed means 40 is a device that relatively moves the chuck table 10 and the processing means 20 in the X-axis direction. For example, the processing feed means 40 has a drive source such as a ball screw, a pulse motor (not shown) extending in the X-axis direction, and moves an X-axis moving base (not shown) that supports the chuck table 10 in the X-axis direction. A cover member 41 covering the X-axis moving base and a bellows member 42 extending in the X-axis direction in the front and rear of the cover member 41 are disposed in the opening portion 2 a.
分度進給手段50是使吸盤台10及加工手段20相對移動於Y軸方向者。
例如，分度進給手段50是具備：
延伸於Y軸方向的一對的導軌51；
與導軌51平行配設的滾珠螺桿52；
被螺合於滾珠螺桿52的未圖示的螺帽所固定，且滑動自如地配設在導軌51的Y軸移動基台53；及
使滾珠螺桿52旋轉的未圖示的脈衝馬達。
分度進給手段50是藉由脈衝馬達來使滾珠螺桿52旋轉，藉此使支撐切入進給手段60的Y軸移動基台53移動於Y軸方向。The indexing feeding means 50 is a device that relatively moves the chuck table 10 and the processing means 20 in the Y-axis direction.
For example, the indexing feeding means 50 is provided with:
A pair of guide rails 51 extending in the Y-axis direction;
A ball screw 52 arranged in parallel with the guide rail 51;
It is fixed by a nut (not shown) screwed to the ball screw 52 and is slidably arranged on the Y-axis moving base 53 of the guide rail 51; and a pulse motor (not shown) that rotates the ball screw 52.
The indexing feeding means 50 rotates the ball screw 52 by a pulse motor, thereby moving the Y-axis moving base 53 supporting the plunging feeding means 60 in the Y-axis direction.
切入進給手段60是使加工手段20移動於和吸盤台10的保持面11正交的Z軸方向者。
例如，切入進給手段60是具備：
延伸於Z軸方向，且被固定於Y軸移動基台53的一對的導軌61；
與導軌61平行配設的滾珠螺桿62；
被螺合於滾珠螺桿62的未圖示的螺帽所固定，且滑動自如地配設在導軌61的Z軸移動基台63；及
使滾珠螺桿62旋轉的脈衝馬達64。
切入進給手段60是藉由脈衝馬達64來使滾珠螺桿62旋轉，藉此使支撐加工手段20的Z軸移動基台63移動於Z軸方向。The cutting feed means 60 moves the processing means 20 in the Z-axis direction orthogonal to the holding surface 11 of the chuck table 10.
For example, the cut-in feeding means 60 is provided with:
A pair of guide rails 61 extending in the Z-axis direction and fixed to the Y-axis moving base 53;
A ball screw 62 arranged in parallel with the guide rail 61;
It is fixed by a nut (not shown) screwed to the ball screw 62 and is slidably arranged on the Z-axis moving base 63 of the guide rail 61; and a pulse motor 64 that rotates the ball screw 62.
The plunge feeding means 60 rotates the ball screw 62 by the pulse motor 64, thereby moving the Z-axis moving base 63 supporting the processing means 20 in the Z-axis direction.
攝像手段70是一體地具備光學系71及攝像本體72而構成，經由分度進給手段50及切入進給手段60來固定於門型框架30。光學系71是取得被保持於吸盤台10的晶圓200或檢查治具100(後述)的表面的光學像者。光學系71是組合一個或複數的透鏡(未圖示)來構成，相對於晶圓200或檢查治具100來設定於預定位置，將被射入的光結像而於攝像本體72形成光學像。The imaging device 70 is configured by integrally including the optical system 71 and the imaging body 72, and is fixed to the door frame 30 via the indexing feeding device 50 and the cutting feeding device 60. The optical system 71 is an optical imager who acquires the surface of the wafer 200 or the inspection jig 100 (described later) held on the chuck table 10. The optical system 71 is configured by combining one or a plurality of lenses (not shown). The optical system 71 is set at a predetermined position with respect to the wafer 200 or the inspection jig 100, and an incident light image is formed to form an optical image on the imaging body 72. .
攝像本體72是攝取光學系71所取得的晶圓200或檢查治具100的光學像者，例如，使用CCD(Charge Coupled Device)影像感測器的照相機等。攝像本體72是將光學像予以光電變換而把畫像資料輸出至控制手段80。The imaging body 72 is a person who picks up an optical image of the wafer 200 or the inspection jig 100 obtained by the optical system 71, and for example, a camera using a CCD (Charge Coupled Device) image sensor. The imaging body 72 performs photoelectric conversion of an optical image and outputs image data to the control means 80.
顯示手段74是例如觸控面板，被配設於裝置本體2的預定位置。顯示手段74是顯示攝像手段70所攝取的畫像，或操作員輸入加工條件等者。The display means 74 is, for example, a touch panel, and is arranged at a predetermined position of the device body 2. The display means 74 displays a picture taken by the imaging means 70, or an operator inputs processing conditions.
控制手段80是控制加工裝置1的各構成要素者。例如，控制手段80是被連接至驅動加工進給手段40、分度進給手段50及切入進給手段60的脈衝馬達之未圖示的驅動電路，控制驅動電路來決定吸盤台10的X軸方向的位置或加工手段20的Y軸方向及Z軸方向的位置。並且，控制手段80是根據攝像手段70所攝取的畫像資料來進行檢測出吸盤台10上的晶圓200的碎屑或加工溝的寬度之切口檢查。The control means 80 controls each component of the processing apparatus 1. For example, the control means 80 is a drive circuit (not shown) of a pulse motor connected to the drive processing feed means 40, the indexing feed means 50, and the cutting feed means 60, and controls the drive circuit to determine the X-axis of the chuck table 10. The position in the direction or the position in the Y-axis direction and the Z-axis direction of the processing means 20. In addition, the control means 80 performs a cut inspection that detects chipping of the wafer 200 on the chuck table 10 or the width of the processing groove based on the image data captured by the imaging means 70.
可是，在切口檢查時，為了正確地測量碎屑或加工溝的大小，而須正確地求取攝像手段70的像素大小。因此，在本實施形態中，利用圖2所示的檢查治具100來測定攝像手段70的像素大小而算出。However, in the incision inspection, in order to accurately measure the size of debris or processing grooves, the pixel size of the imaging means 70 must be accurately obtained. Therefore, in this embodiment, the pixel size of the imaging means 70 is calculated using the inspection jig 100 shown in FIG. 2.
檢查治具100是用以測定及算出被設在加工裝置1的攝像手段70的像素大小的治具。如圖2所示般，檢查治具100是具備大致長方形形狀的板體101。此板體101是熱膨脹率低的材質(例如石英)所形成，在板體101的表面是被覆比石英更光反射性強的材料(例如鉻)。並且，在板體101的表面是形成有沿著板體101的長度方向來延伸的第一圖案102、第二圖案103、第三圖案104，及分別記錄了該等各圖案的寬度方向的寬度的實際尺寸的二維碼105。The inspection jig 100 is a jig for measuring and calculating the pixel size of the imaging means 70 provided in the processing device 1. As shown in FIG. 2, the inspection jig 100 is provided with a plate body 101 having a substantially rectangular shape. The plate body 101 is formed of a material (for example, quartz) having a low thermal expansion coefficient, and the surface of the plate body 101 is coated with a material (for example, chromium) which is more light-reflective than quartz. In addition, a first pattern 102, a second pattern 103, and a third pattern 104 extending along the longitudinal direction of the plate body 101 are formed on the surface of the plate body 101, and the widths in the width direction of each of the patterns are recorded. The actual size of the QR code 105.
第一圖案102、第二圖案103及第三圖案104是在板體101的表面藉由蝕刻、切割或雷射加工來形成的溝，被覆的鉻會被除去而溝底的石英露出。第一圖案102、第二圖案103及第三圖案104的寬度方向的寬度是配合被使用在晶圓200的加工之切削刀刃21的刃寬來分別相異形成。在本實施形態中，第一圖案102的寬度La是被形成20[μm]，第二圖案103的寬度Lb是被形成10[μm]，第三圖案104的寬度Lc是被形成5[μm]。The first pattern 102, the second pattern 103, and the third pattern 104 are grooves formed by etching, cutting, or laser processing on the surface of the plate body 101. The covered chromium is removed and the quartz at the bottom of the groove is exposed. The widths in the width direction of the first pattern 102, the second pattern 103, and the third pattern 104 are formed differently in accordance with the widths of the cutting edges 21 of the cutting edges 21 used in the processing of the wafer 200. In this embodiment, the width La of the first pattern 102 is formed to 20 [μm], the width Lb of the second pattern 103 is formed to 10 [μm], and the width Lc of the third pattern 104 is formed to 5 [μm]. .
二維碼105是記憶檢查治具100的各種資訊。本實施形態是記憶有上述的第一圖案102、第二圖案103及第三圖案104的各寬度La、Lb、Lc的實測值。因此，不須以高的精度來將各種圖案的寬度作成預先決定的預定長度，可使檢查治具100的加工性變容易。又，由於本實施形態是在檢查治具100的表面設置二維碼105，因此藉由以攝像手段70來攝影此二維碼105，可取得被記憶於二維碼105的檢查治具100的各種資訊。因此，例如，即使為具有複數的檢查治具的情況，也可防止檢查治具的拿錯。The two-dimensional code 105 is various information of the memory inspection jig 100. In this embodiment, the measured values of the widths La, Lb, and Lc of the first pattern 102, the second pattern 103, and the third pattern 104 are stored. Therefore, it is not necessary to make the width of various patterns into a predetermined length determined in advance with high accuracy, and the workability of the inspection jig 100 can be facilitated. In addition, since the two-dimensional code 105 is provided on the surface of the inspection jig 100 in this embodiment, by capturing the two-dimensional code 105 with the imaging means 70, the inspection jig 100 stored in the two-dimensional code 105 can be obtained. Various information. Therefore, for example, even in the case of having a plurality of inspection jigs, it is possible to prevent the inspection jigs from being mistakenly taken.
控制手段80是利用檢查治具100來測定及算出攝像手段70的像素大小，因此如圖3所示般，具備記憶手段81、畫像讀取手段82、測定手段83及運算手段84。畫像讀取手段82是利用攝像手段70來讀取被形成於檢查治具100的表面的二維碼105的各種資訊(各圖案的寬度的實測值)。記憶手段81是記憶畫像讀取手段82從二維碼105讀取的各圖案的寬度的實測值。測定手段83是測定被顯示於顯示手段74的畫面75之例如對應於第一圖案102的寬度La的像素數。運算手段84是藉由被記憶於記憶手段81之第一圖案102的寬度La的實測值除以測定手段83所測定的像素數，算出像素大小。被算出的像素大小是例如被利用在為了確認像素的變化量除以朝預定的軸方向(例如X軸方向)的軸的移動量而算出的像素大小計量(未圖示)的精度高的情形。The control means 80 uses the inspection jig 100 to measure and calculate the pixel size of the imaging means 70. Therefore, as shown in FIG. 3, the control means 80 includes a memory means 81, an image reading means 82, a measuring means 83, and a calculation means 84. The image reading means 82 uses the imaging means 70 to read various information (the actual measured values of the width of each pattern) of the two-dimensional code 105 formed on the surface of the inspection jig 100. The memory means 81 is an actual measured value of the width of each pattern read from the two-dimensional code 105 by the memory image reading means 82. The measuring means 83 measures the number of pixels corresponding to the width La of the first pattern 102 on the screen 75 displayed on the display means 74, for example. The calculation means 84 calculates the pixel size by dividing the actual measured value of the width La of the first pattern 102 stored in the storage means 81 by the number of pixels measured by the measurement means 83. The calculated pixel size is used, for example, when the accuracy of the pixel size measurement (not shown) calculated in order to confirm the amount of change in the pixel divided by the amount of movement of the axis in a predetermined axis direction (for example, the X-axis direction) is high. .
其次，說明有關用以測定攝像手段70的像素大小的檢查方法。圖4是說明檢查方法的程序的流程圖。圖5是被顯示於畫面的檢查治具的畫像資料的模式圖。首先，操作員是將檢查治具100載置於吸盤台10的保持面11而保持於該吸盤台10(步驟S1；保持步驟)。例如圖2所示般，以檢查治具100的長度方向大致與X軸方向平行的方式載置。此情況，被形成於檢查治具100的表面的第一圖案102(第二圖案103、第三圖案104)也大致沿著X軸方向來延伸。另外，不限於操作員將檢查治具100載置於吸盤台10上，例如，亦可利用搬送晶圓200的搬送機構(未圖示)。Next, an inspection method for measuring the pixel size of the imaging means 70 will be described. FIG. 4 is a flowchart illustrating a procedure of an inspection method. Fig. 5 is a schematic diagram of image data of an inspection jig displayed on a screen. First, the operator places the inspection jig 100 on the holding surface 11 of the chuck table 10 and holds it on the chuck table 10 (step S1; holding step). For example, as shown in FIG. 2, the inspection jig 100 is placed so that the longitudinal direction thereof is substantially parallel to the X-axis direction. In this case, the first pattern 102 (the second pattern 103 and the third pattern 104) formed on the surface of the inspection jig 100 also extends substantially along the X-axis direction. In addition, the operator is not limited to placing the inspection jig 100 on the chuck table 10, and for example, a transfer mechanism (not shown) for transferring the wafer 200 may be used.
其次，以攝像手段70讀取檢查治具100的二維碼105，使檢查治具100的第一圖案102、第二圖案103、第三圖案104的各寬度的實測值記憶於記憶手段81(步驟S2；讀取步驟)。此情況，藉由操作員操作加工裝置1，控制手段80會使加工進給手段40及分度進給手段50動作，在檢查治具100的二維碼105上配置攝像手段70，在此位置攝取二維碼105。畫像讀取手段82是從攝像畫像讀取被登錄於二維碼105的各圖案的寬度的實測值，將此讀取的各圖案的寬度的實測值記憶於記憶手段81。此讀取步驟是只要至少比後述的算出步驟更前面實施即可，例如，亦可在實施保持步驟之前預先讀取被登錄於二維碼105的各圖案的寬度的實測值。Next, the two-dimensional code 105 of the inspection jig 100 is read by the imaging means 70, and the actual measured values of the widths of the first pattern 102, the second pattern 103, and the third pattern 104 of the inspection jig 100 are stored in the memory means 81 ( Step S2; reading step). In this case, when the operator operates the processing device 1, the control means 80 causes the processing feed means 40 and the indexing feed means 50 to operate, and the imaging means 70 is arranged on the two-dimensional code 105 of the inspection jig 100 at this position. Take the QR code 105. The image reading means 82 reads the actual measured value of the width of each pattern registered in the two-dimensional code 105 from the captured image, and stores the actual measured value of the width of each pattern read in the storage means 81. This reading step may be implemented at least before the calculation step described later. For example, the measured value of the width of each pattern registered in the two-dimensional code 105 may be read in advance before the holding step is performed.
其次，將檢查治具100的第一圖案102形成與攝像手段70平行(步驟S3；平行調合步驟)。在本實施形態中，例如，意指將第一圖案102的延伸的方向形成與檢查治具100(吸盤台10)對於攝像手段70相對地移動的方向平行。具體而言，如圖2所示般，將第一圖案102的延伸的方向形成與檢查治具100(吸盤台10)對於固定位置的攝像手段70移動的方向(X軸方向)平行。此情況，控制手段80是以第一圖案102的一方的側壁102a的Y座標會至少2點一致的方式，使吸盤台10旋轉而進行角度調整。例如，控制手段80是以位於第一圖案102的一方的側壁102a上的角部的Y座標彼此間會一致的方式，使吸盤台10旋轉而進行角度調整。藉此，第一圖案102的延伸的方向與X軸方向會形成平行。另外，雖圖示省略，但亦可將第一圖案102的延伸的方向形成與攝像手段70對於固定位置的檢查治具100(吸盤台10)移動的方向(Y軸方向)平行。並且，在本實施形態中，舉第一圖案102為例，但當然亦可使用其他的圖案(第二圖案103或第三圖案104)。Next, the first pattern 102 of the inspection jig 100 is formed in parallel with the imaging means 70 (step S3; parallel blending step). In the present embodiment, for example, it means that the direction in which the first pattern 102 extends is formed parallel to the direction in which the inspection jig 100 (chuck table 10) moves relatively to the imaging means 70. Specifically, as shown in FIG. 2, the direction in which the first pattern 102 extends is formed parallel to the direction (X-axis direction) in which the inspection jig 100 (chuck table 10) moves to the imaging means 70 at a fixed position. In this case, the control means 80 adjusts the angle of the chuck table 10 by rotating the chuck table 10 such that the Y coordinate of one of the side walls 102a of the first pattern 102 coincides with at least two points. For example, the control means 80 adjusts the angle of the chuck table 10 by rotating the chuck table 10 so that the Y-coordinates of the corners located on one of the side walls 102a of the first pattern 102 coincide with each other. As a result, the extending direction of the first pattern 102 is parallel to the X-axis direction. Although the illustration is omitted, the extending direction of the first pattern 102 may be formed parallel to the direction (Y-axis direction) in which the imaging device 70 moves the inspection jig 100 (chuck table 10) at a fixed position. In this embodiment, the first pattern 102 is taken as an example, but of course, other patterns (the second pattern 103 or the third pattern 104) may be used.
其次，以攝像手段70攝取檢查治具100的第一圖案102，測定在顯示手段74的畫面75上對應於第一圖案102的寬度的像素數(步驟S4；測定步驟)。此情況，操作員指示被攝像的第一圖案102，實際確認第一圖案102被攝像的情形。一旦攝像手段70攝取檢查治具100的第一圖案102，則如圖3所示般，在顯示手段74的畫面75顯示包含第一圖案102的檢查治具100的畫像資料。被顯示於畫面75的檢查治具100的畫像資料是如圖5所示般，為被設在攝像本體72的複數的攝像元件攝像後的像素(pixel)P的集合體。在本實施形態中，各圖案(第一圖案102)是使光反射性與板體101的表面不同。因此，測定手段83是例如藉由實施畫像處理，如圖5所示般，區分第一圖案102與板體101的表面，測定排列於第一圖案102的寬度方向的像素數Lp。在此圖5的例子，對應於第一圖案102的寬度的像素數Lp是成為12[像素]。Next, the first pattern 102 of the inspection jig 100 is taken by the imaging means 70, and the number of pixels corresponding to the width of the first pattern 102 on the screen 75 of the display means 74 is measured (step S4; measurement step). In this case, the operator instructs the first pattern 102 to be imaged, and actually confirms that the first pattern 102 is imaged. When the imaging means 70 captures the first pattern 102 of the inspection jig 100, as shown in FIG. 3, the image data of the inspection jig 100 including the first pattern 102 is displayed on the screen 75 of the display means 74. As shown in FIG. 5, the image data of the inspection jig 100 displayed on the screen 75 is an aggregate of pixels P after being imaged by a plurality of imaging elements provided in the imaging body 72. In the present embodiment, each pattern (the first pattern 102) is different from the surface of the plate body 101 in light reflectivity. Therefore, the measurement means 83 performs, for example, image processing, as shown in FIG. 5, distinguishes the first pattern 102 from the surface of the plate body 101, and measures the number of pixels Lp arranged in the width direction of the first pattern 102. In the example of FIG. 5, the number of pixels Lp corresponding to the width of the first pattern 102 is 12 [pixels].
其次，運算手段84是算出像素大小(每單位像素P的長度)(步驟S5；算出步驟)。具體而言，運算手段84是藉由在讀取步驟中畫像讀取手段82讀入的第一圖案102的寬度La的實測值除以對應於在測定步驟中測定手段83測定的第一圖案102的寬度La的像素數Lp，算出像素大小。Next, the calculation means 84 calculates a pixel size (length per unit pixel P) (step S5; calculation step). Specifically, the calculation means 84 is the actual measured value of the width La of the first pattern 102 read by the image reading means 82 in the reading step divided by the first pattern 102 corresponding to the measurement by the measuring means 83 in the measuring step. The number of pixels Lp of the width La is used to calculate the pixel size.
攝像手段70的像素大小是例如有因為光學系71的透鏡的歪斜等而在透鏡的中央及外側變動的可能性。因此，在本實施形態中，第一圖案102、第二圖案103及第三圖案104的寬度是配合被使用在晶圓200的加工之切削刀刃21的刃寬來分別相異形成。若根據此構成，則例如在使用刃寬為20[μm]的切削刀刃21時，可利用具有相當於刃寬的寬度的第一圖案102來算出像素大小，在使用刃寬為5[μm]的切削刀刃21時，可利用具有相當於刃寬的寬度的第三圖案104來算出像素大小。因此，利用被算出的像素大小，例如，在切削加工後進行切口檢查時，可減低透鏡的歪斜等的影響，進行正確的切口檢查。並且，不限於上述的構成者，藉由分別利用第一圖案102、第二圖案103及第三圖案104，算出對應於各圖案的像素大小，以該等算出的像素大小作為平均值，可算出考慮透鏡的歪斜等的像素大小，可進行正確的切口檢查。The pixel size of the imaging means 70 may be changed in the center and the outside of the lens due to, for example, the distortion of the lens of the optical system 71. Therefore, in this embodiment, the widths of the first pattern 102, the second pattern 103, and the third pattern 104 are formed differently in accordance with the width of the cutting edge 21 of the cutting blade 21 used in the processing of the wafer 200. According to this configuration, for example, when the cutting blade 21 having a cutting width of 20 [μm] is used, the pixel size can be calculated by using the first pattern 102 having a width corresponding to the cutting width, and when the cutting width is 5 [μm] In the case of a cutting blade 21 having a rectangular shape, the pixel size can be calculated using the third pattern 104 having a width corresponding to the blade width. Therefore, by using the calculated pixel size, for example, when a cut inspection is performed after cutting, the influence of lens distortion and the like can be reduced, and a correct cut inspection can be performed. In addition, it is not limited to the above-mentioned constituents. By using the first pattern 102, the second pattern 103, and the third pattern 104, the pixel size corresponding to each pattern is calculated, and the calculated pixel size is used as an average to calculate Taking into account the pixel size of lens distortion, etc., accurate cut inspection can be performed.
[第2實施形態]
其次，說明有關第2實施形態的檢查治具100A。圖6是表示第2實施形態的檢查治具的構成例的平面圖。檢查治具100A是與上述的檢查治具100作比較，以具備平行調合用的一對的基準圖案106，106的點來使構成相形不同。有關與檢查治具100相同的構成是附上相同的符號而省略說明。一對的基準圖案106，106是以相同的大小來形成相同的形狀(十字形狀)。一對的基準圖案106，106是排列於與上述的第一圖案102等的長度方向平行的方向而配置。一對的基準圖案106，106是與上述的第一圖案102等同樣，在板體101的表面藉由蝕刻、切割或雷射加工來形成的十字溝，被覆的鉻會被除去而溝底的石英露出。[Second Embodiment]
Next, an inspection jig 100A according to the second embodiment will be described. 6 is a plan view showing a configuration example of an inspection jig according to a second embodiment. The inspection jig 100A is compared with the inspection jig 100 described above, and the configuration is different by using a pair of reference patterns 106, 106 for parallel blending. The same components as those of the inspection jig 100 are assigned the same reference numerals, and descriptions thereof are omitted. The pair of reference patterns 106, 106 are formed in the same shape (cross shape) with the same size. The pair of reference patterns 106 and 106 are arranged in a direction parallel to the longitudinal direction of the aforementioned first pattern 102 and the like. The pair of reference patterns 106 and 106 are the same as the first pattern 102 described above. The cross groove formed on the surface of the plate body 101 by etching, cutting, or laser processing. The covered chromium is removed and the groove bottom is formed. The quartz is exposed.
在二維碼105是與上述的第一圖案102、第二圖案103及第三圖案104的各寬度La、Lb、Lc的實測值一起分別記憶有一對的基準圖案106，106與第一圖案102、第二圖案103及第三圖案104的距離。The two-dimensional code 105 stores a pair of reference patterns 106, 106 and the first pattern 102 together with the measured values of the widths La, Lb, and Lc of the first pattern 102, the second pattern 103, and the third pattern 104 described above. , The distance between the second pattern 103 and the third pattern 104.
上述的平行調合步驟是將一對的基準圖案106，106所排列的方向設為與檢查治具100A(吸盤台10)對於攝像手段70相對性地移動的方向平行。此情況，控制手段80是以一方的基準圖案106的預定的角部的Y座標與另一方的基準圖案106的預定的角部的Y座標會一致的方式，使吸盤台10旋轉而進行角度調整。藉此，第一圖案102等的延伸的方向與X軸方向會形成平行。In the parallel blending step described above, the direction in which the pair of reference patterns 106 and 106 are arranged is set to be parallel to the direction in which the inspection jig 100A (chuck table 10) relatively moves with respect to the imaging means 70. In this case, the control means 80 adjusts the angle of the yoke table 10 by rotating the y-coordinate of the predetermined corner of one reference pattern 106 and the y-coordinate of the predetermined corner of the other reference pattern 106 so that . Thereby, the extending direction of the first pattern 102 and the like will be parallel to the X-axis direction.
又，由於本實施形態是在二維碼105分別記憶有一對的基準圖案106，106與第一圖案102、第二圖案103及第三圖案104的距離，因此例如可利用加工裝置1所具備的切口檢查的機能來自動地算出像素大小。此情況，在測定步驟中，從基準圖案106移動被記錄的預定距離份，例如，攝取第一圖案102，測定在顯示手段74的畫面75上對應於第一圖案102的寬度La的像素數。而且，在算出步驟中算出像素大小。然後，從基準圖案106移動被記錄的預定距離份，例如，攝取第二圖案103來測定對應於第二圖案103的寬度Lb的像素數而算出像素大小。更亦可從基準圖案106移動被記錄的預定距離份，例如，攝取第三圖案104來測定對應於第三圖案104的寬度Lc的像素數而算出像素大小。In this embodiment, since the pair of reference patterns 106 and 106 are stored in the two-dimensional code 105 with the distances of the first pattern 102, the second pattern 103, and the third pattern 104, for example, the processing device 1 can be used. The function of the notch inspection automatically calculates the pixel size. In this case, in the measurement step, the recorded predetermined distance is moved from the reference pattern 106. For example, the first pattern 102 is taken and the number of pixels corresponding to the width La of the first pattern 102 on the screen 75 of the display means 74 is measured. Then, the pixel size is calculated in the calculation step. Then, the recorded predetermined distance is moved from the reference pattern 106. For example, the second pattern 103 is taken to measure the number of pixels corresponding to the width Lb of the second pattern 103 to calculate the pixel size. It is also possible to move the recorded predetermined distance from the reference pattern 106. For example, the third pattern 104 is taken to measure the number of pixels corresponding to the width Lc of the third pattern 104 to calculate the pixel size.
[第3實施形態]
其次，說明有關第3實施形態的檢查治具100B。圖7是表示第3實施形態的檢查治具的構成例的平面圖。在此第3實施形態中，檢查治具100B是具備圓板狀的板體101B，在此板體101B的表面形成有一對的第一基準圖案107，107及一對的第二基準圖案108，108。[Third Embodiment]
Next, an inspection jig 100B according to the third embodiment will be described. 7 is a plan view showing a configuration example of an inspection jig according to a third embodiment. In this third embodiment, the inspection jig 100B is provided with a disc-shaped plate body 101B, and a pair of first reference patterns 107 and 107 and a pair of second reference patterns 108 are formed on the surface of the plate body 101B. 108.
板體101B是形狀設為圓板狀的點與板體101不同，但材質等是同等。第一基準圖案107，107是以相同的大小來形成相同的形狀(十字形狀)。第二基準圖案108，108雖比第一基準圖案107，107更小，但以相同的大小來形成相同的形狀(十字形狀)。第一基準圖案107，107及第二基準圖案108，108是排列於成為互相平行的方向。第一基準圖案107，107及第二基準圖案108，108是配合被使用在晶圓200的加工之切削刀刃21的刃寬來分別相異形成。在本實施形態中，第一基準圖案107的寬度Ld是被形成20[μm]，第二基準圖案108的寬度Le是被形成5[μm]。The plate body 101B is different from the plate body 101 in that the shape of the plate body is circular, but the material and the like are the same. The first reference patterns 107, 107 are formed in the same shape (cross shape) with the same size. Although the second reference patterns 108 and 108 are smaller than the first reference patterns 107 and 107, they have the same shape (cross shape) in the same size. The first reference patterns 107 and 107 and the second reference patterns 108 and 108 are arranged in directions parallel to each other. The first reference patterns 107 and 107 and the second reference patterns 108 and 108 are formed differently in accordance with the width of the cutting edge 21 of the cutting edge 21 used in the processing of the wafer 200. In this embodiment, the width Ld of the first reference pattern 107 is formed to be 20 [μm], and the width Le of the second reference pattern 108 is formed to be 5 [μm].
在二維碼105是與上述的第一基準圖案107及第二基準圖案108的各寬度Ld、Le的實測值一起分別記憶有第一基準圖案107，107與第二基準圖案108，108的距離。The two-dimensional code 105 stores the distances between the first reference patterns 107 and 107 and the second reference patterns 108 and 108 together with the measured values of the respective widths Ld and Le of the first reference pattern 107 and the second reference pattern 108 described above. .
上述的平行調合步驟是將第一基準圖案107，107或第二基準圖案108，108所排列的方向設為與檢查治具100A(吸盤台10)對於攝像手段70相對性地移動的方向平行。此情況，控制手段80是例如以一方的第一基準圖案107的預定的角部的Y座標與另一方的第一基準圖案107的預定的角部的Y座標會一致的方式，使吸盤台10旋轉而進行角度調整。藉此，第一基準圖案107，107所排列的方向(第二基準圖案108，108所排列的方向)與X軸方向會形成平行。In the parallel blending step described above, the direction in which the first reference patterns 107, 107 or the second reference patterns 108, 108 are arranged is set to be parallel to the direction in which the inspection jig 100A (chuck table 10) relatively moves with respect to the imaging means 70. In this case, for example, the control means 80 causes the chuck table 10 to match the Y coordinate of the predetermined corner of the first reference pattern 107 with the Y coordinate of the predetermined corner of the other first reference pattern 107. Rotate to adjust the angle. Thereby, the direction in which the first reference patterns 107 and 107 are arranged (the direction in which the second reference patterns 108 and 108 are arranged) and the X-axis direction are formed in parallel.
又，由於本實施形態是在二維碼105記憶有第一基準圖案107，107與第二基準圖案108，108的距離，因此例如可利用加工裝置1所具備的切口檢查的機能來自動地算出像素大小。此情況，利用第一基準圖案107來進行平行調合之後，攝取第一基準圖案107，測定在顯示手段74的畫面75上對應於第一基準圖案107的寬度Ld的像素數，而算出像素大小。然後，亦可從第一基準圖案107移動被記錄的預定距離份，攝取第二基準圖案108來測定對應於第二基準圖案108的寬度Le的像素數而算出像素大小。Since the distance between the first reference patterns 107 and 107 and the second reference patterns 108 and 108 is memorized in the two-dimensional code 105 in the present embodiment, it can be automatically calculated by, for example, the function of the incision inspection provided in the processing device 1. Pixel size. In this case, after the first reference pattern 107 is used for parallel blending, the first reference pattern 107 is taken, the number of pixels corresponding to the width Ld of the first reference pattern 107 on the screen 75 of the display means 74 is measured, and the pixel size is calculated. Then, the recorded reference distance may be moved from the first reference pattern 107, and the second reference pattern 108 may be taken to measure the number of pixels corresponding to the width Le of the second reference pattern 108 to calculate the pixel size.
如以上說明般，若根據本實施形態，則藉由以攝像手段70讀取二維碼105，可取得被記錄於二維碼105的各圖案的實際的寬度，因此可藉由此圖案的實際的寬度除以對應於該圖案的寬度的像素數來正確地算出像素大小。又，即使為具有複數的檢查治具的情況，也能以攝像手段70來識別被形成於檢查治具的二維碼105，因此可防止檢查治具的拿錯。又，藉由在二維碼105事先記錄各圖案的實際的寬度，即使不以高的精度來將圖案的寬度作成預先決定的預定長度，也可高精度地測定像素大小。As described above, according to this embodiment, the actual width of each pattern recorded in the two-dimensional code 105 can be obtained by reading the two-dimensional code 105 with the imaging means 70. Therefore, the actual width of each pattern can be obtained from this pattern. Divide the width by the number of pixels corresponding to the width of the pattern to correctly calculate the pixel size. In addition, even in the case of a plurality of inspection jigs, the two-dimensional code 105 formed on the inspection jig can be identified by the imaging means 70, so that the inspection jigs can be prevented from being mistakenly held. In addition, by recording the actual width of each pattern in advance in the two-dimensional code 105, the pixel size can be measured with high accuracy without making the width of the pattern into a predetermined predetermined length with high accuracy.
另外，本發明是不限於上述實施形態者。亦即，可在不脫離本發明的主旨範圍實施各種變形。例如，在上述的各實施形態中，第一圖案102~第三圖案104及基準圖案106~第二基準圖案108是舉在板體101、101B的表面所形成的溝為例進行說明，但不限於此，例如，亦可為藉由印刷所形成的凸部。又，二維碼105是為了以攝像手段70讀取，而設在板體101、101B的表面為理想，但若為另外具備讀取手段(例如條碼讀取器之類的可攜帶者)的構成，則亦可設在板體101、101B的背面或側面來事前實施讀取步驟。The present invention is not limited to the above-mentioned embodiments. That is, various modifications can be made without departing from the gist of the present invention. For example, in each of the embodiments described above, the first pattern 102 to the third pattern 104 and the reference pattern 106 to the second reference pattern 108 are described by taking the grooves formed on the surfaces of the plate bodies 101 and 101B as examples, but not It is limited to this, for example, it may be a convex part formed by printing. The two-dimensional code 105 is ideally provided on the surfaces of the boards 101 and 101B for reading by the imaging means 70. However, if the two-dimensional code 105 is provided with a reading means (for example, a portable reader such as a bar code reader) The structure may be provided on the back or side of the plates 101 and 101B to perform the reading step in advance.
1‧‧‧加工裝置1‧‧‧Processing Equipment
10‧‧‧吸盤台(保持手段) 10‧‧‧ Suction table (holding means)
20‧‧‧加工手段 20‧‧‧Processing means
21‧‧‧切削刀刃 21‧‧‧ cutting blade
70‧‧‧攝像手段 70‧‧‧ camera means
71‧‧‧光學系 71‧‧‧ Department of Optics
72‧‧‧攝像本體 72‧‧‧ camera body
74‧‧‧顯示手段 74‧‧‧ Display means
75‧‧‧畫面 75‧‧‧screen
80‧‧‧控制手段 80‧‧‧ Control means
81‧‧‧記憶手段 81‧‧‧means of memory
82‧‧‧畫像讀取手段 82‧‧‧Image reading method
83‧‧‧測定手段 83‧‧‧Measurement method
84‧‧‧運算手段 84‧‧‧ Computing Means
100、100A、100B‧‧‧檢查治具 100, 100A, 100B ‧‧‧ Inspection fixture
101、101B‧‧‧板體 101, 101B‧‧‧ Plate
102‧‧‧第一圖案 102‧‧‧The first pattern
102a‧‧‧側壁 102a‧‧‧ sidewall
103‧‧‧第二圖案 103‧‧‧Second pattern
104‧‧‧第三圖案 104‧‧‧ The third pattern
105‧‧‧二維碼 105‧‧‧ QR code
106‧‧‧基準圖案 106‧‧‧ reference pattern
107‧‧‧第一基準圖案 107‧‧‧first reference pattern
108‧‧‧第二基準圖案 108‧‧‧ second reference pattern
200‧‧‧晶圓 200‧‧‧ wafer
圖1是表示使用第1實施形態的檢查治具的加工裝置的構成例的立體圖。FIG. 1 is a perspective view showing a configuration example of a processing apparatus using an inspection jig of the first embodiment.
圖2是表示第1實施形態的檢查治具的構成例的平面圖。 FIG. 2 is a plan view showing a configuration example of an inspection jig of the first embodiment.
圖3是表示加工裝置的控制手段的構成例的方塊圖。 FIG. 3 is a block diagram showing a configuration example of a control means of the processing apparatus.
圖4是表示檢查方法的程序的流程圖。 FIG. 4 is a flowchart showing a procedure of an inspection method.
圖5是被顯示於畫面的檢查治具的畫像資料的模式圖。 Fig. 5 is a schematic diagram of image data of an inspection jig displayed on a screen.
圖6是表示第2實施形態的檢查治具的構成例的平面圖。 6 is a plan view showing a configuration example of an inspection jig according to a second embodiment.
圖7是表示第3實施形態的檢查治具的構成例的平面圖。 7 is a plan view showing a configuration example of an inspection jig according to a third embodiment.
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