TWI680304B - Wafer electronic parts inspection and screening device - Google Patents

Abstract

Provided is a novel connection switching system that replaces the connection switching system for inspection electrode terminals and inspectors used in conventional wafer electronic component inspection screening devices.

As a switching means for the inspection electrode terminal group consisting of a fixed electrode terminal and a movable electrode terminal of a wafer electronic component inspection and screening device, and a connection switching system with an inspector, a MOSFET housed in a frame is used to house the MOSFET The frames are adjacent to the fixed electrode terminal and the movable electrode terminal for inspection, and the MOSFET is connected to the fixed electrode terminal and the movable electrode terminal through a connector.

Description

Wafer electronic parts inspection and screening device

The present invention relates to an improvement of a wafer electronic component inspection and screening device used for high-speed and continuous inspection of electrical characteristics of a large number of wafer electronic components.

As the production volume of small electrical products such as portable telephones, smart phones, LCD TVs, and electronic game machines has increased, the production volume of microchip electronic components incorporated into such electrical products has also increased significantly. Most wafer electronic components are formed using a main body portion made of an insulating material and electrodes provided on both end surfaces facing the main body portion, respectively. Examples of such a chip electronic component include a chip capacitor (also referred to as a chip capacitor), a chip resistor (including a chip variable resistor), and a chip inductor.

In recent years, in response to the miniaturization of electrical products incorporating chip electronic components and the increase in the number of chip electronic components incorporated into electrical products, chip electronic components have become extremely small. For example, with regard to chip capacitors, in recent years, a capacitor having a very small size (for example, a size of 0.2 mm × 0.2 mm × 0.4 mm called a 0402 chip) has been generally used. This type Because of the mass production of small wafer electronic components, a batch is produced in units of tens of thousands to hundreds of thousands.

In order to reduce the failure rate of electrical products caused by defects in wafer electronic components in electrical products incorporating wafer electronic components, mass inspection of wafer electronic components is generally performed. For example, with regard to the chip capacitance, the electrical characteristics such as capacitance and leakage current are all checked.

Therefore, it is necessary to perform a high-speed inspection of the electrical characteristics of a large number of wafer electronic components. In recent years, as a device for automatically performing the high-speed inspection, a transport circle having a plurality of through-holes is generally used. An automated device for inspecting and screening electrical characteristics of wafer electronic components (ie, wafer electronic component temporary holding plates) (that is, a wafer electronic component inspection and screening device) is usually used to transport the discs to the wafers to be inspected. The plurality of through-holes in which electronic parts are temporarily housed and held are in a state of being arranged in a plurality of rows of three or more along the circumference. Next, when the wafer electronic component inspection and screening device is used, the wafer electronic components temporarily held and held in the through-holes of the transfer disk in a rotating state, and the wafer electronic components held in the transfer disk are transported along the transfer. A plurality of electrode terminal groups (contacts for inspection) composed of a pair of fixed electrode terminals and movable electrode terminals are assembled and arranged on the rotation path of the disc to contact each electrode of the wafer electronic component, and the designation of the wafer electronic component is measured. Then, based on the measurement results, a wafer electronic component is screened (or sorted) to be discharged from the through-hole of the transfer disc and stored in a designated container (sorting container).

That is, the recent wafer electronic component inspection and screening device that has been automated can be said to be a wafer electronic component inspection and screening device, including: a base; a wafer electronic component transfer disc, which is rotatably supported on the base by a shaft (However, in this wafer electronic component transfer disk, it is possible to form three or more rows of through-holes for temporarily accommodating wafer electronic components having electrodes on opposite end faces along the circumference. The storage area) is arranged along the rotation path of the transfer disc in order to supply the wafer electronic components to the through holes accommodated in the transfer disc. The electronic characteristics inspection section (inspection area) of the wafer electronic components is used for the wafer electronic components. Inspection of electrical characteristics of the wafer; Next, the wafer electronic component classification section (classification area) classifies the inspected wafer electronic components based on the inspection results.

For example, when inspecting the capacitance of a wafer capacitor, an electrical property inspection unit is used to inspect an electrode terminal for inspection from an inspector (electrical property measurement device) provided in a wafer electronic component inspection and screening device through an inspection electrode terminal. The wafer capacitor applies an inspection voltage having a predetermined frequency. Next, by applying the inspection voltage, a current value of a current generated in the wafer capacitance is detected by an inspector, and the capacitance of the wafer capacitance to be inspected is inspected based on the detected current value and the voltage value of the inspection voltage.

As an example of a wafer electronic component inspection and screening device, the device described in Patent Document 1 can be exemplified. That is, Patent Document 1 describes a wafer electronic component inspection and screening device for continuously inspecting the electrical characteristics of a wafer electronic component, and includes the following process: The wafer electronic component inspection and screening device having the above-mentioned configuration is used to make each Same specifications On the other hand, the electronic components of the wafer to be inspected, which are manufactured with the same specified electrical characteristics, are temporarily housed and held close to each other through the through holes arranged in a plurality of rows, and then the inspectors are electrically connected to each After the wafer electronic components, an inspection voltage is applied to each wafer electronic component from the inspector, and a current value generated by each wafer electronic component via the inspection voltage is detected by the inspector.

In the conventional wafer electronic component inspection and screening device, wafer electronics are arrayed along the radial direction of the transfer disk within the wafer electronic components that are accommodated in a plurality of through-holes arranged along the circumference of the transfer disk. The electrodes at both ends of the component are in a state where the inspection electrode terminal group composed of the fixed electrode terminal and the movable electrode terminal is in contact with each other at the same time, and the current (or voltage) is sequentially applied to each chip electronic component. Check (measure) the electrical characteristics of each wafer electronic component. The application of the sequential current to the plurality of chip electronic components and the acquisition of the inspection value are performed using an inspector (for example, a capacitance tester), but the simplicity of the structure of the inspection and screening device is necessary for the purpose of Inspectors that apply the current to the electronic components of each chip and obtain the inspection values do not make all the preparations for each of the electrode terminal groups for inspection. Generally, one for two or four groups of electrode terminal groups for inspection is prepared. Group inspector. Next, the inspection electrode terminal group of these multiple arrays and the inspector are connected via a connection switch (relay switching means), and the connection between the electronic components of each chip and the inspector is performed at high speed by using the relay switching means. Switch.

[Prior technical literature] [Patent Literature]

[Patent Document 1] WO2014 / 010623A1

Patent Document 1 does not describe a specific aspect, but conventionally, a wafer electronic component inspection and screening device used as a switch (relay switching means) generally uses a mercury relay switch capable of stable switching. However, as mentioned above, the electronic components of wafers that have been measured in recent years are very small, and the size of the electrode terminal group for inspection is also very small. The reason why the mercury relay switch is relatively large is that The mercury relay switch cannot be placed close to the electrode terminal group for inspection. For this reason, in general, the mercury relay switcher is disposed at a position away from each of the fixed electrode terminal and the movable electrode terminal of the inspection electrode terminal group, and the inspection current is applied by using a cable for inspection current application and inspection. Coaxial cables consisting of cables for value acquisition are connected.

In the conventional wafer electronic component inspection and screening device, the mercury relay switch that is used as a connection switching means for the electrical property measurement tester and the electrode terminal group for inspection is because it can switch the connection with high reliability (switching ), It can be said that it is an excellent connection switching method, but because it is a mechanical connection switching method, it has insufficient service life, high speed connection switching has its limits, and the use of mercury causes environmental risks. problem.

For this reason, the inventors of the present invention have sought to replace mercury relays The connection switching means of the switcher. Then, as a result, it was seen that a MOSFET using one of the semiconductor switching elements can be switched at high speed without using mercury, and the service life can be extended.

However, as a result of further research, it has been confirmed that the accuracy of the measurement results of the electrical characteristics is reduced when the MOSFET (and its driving circuit) that replaces the mercury relay switch as a connection switching means is used. For example, a conventional wafer electronic component inspection and screening device is used (a mercury relay switch is used as a ' connection switching means, and the mercury relay switch is connected to a coaxial cable of about 1 meter using an electrode terminal set for inspection), The capacitance (Cp) and the loss coefficient (Df) of a capacitor (capacitance) with a capacitance of 1 pF are measured, and the standard deviation of these is calculated. The standard deviation of Cp is about 0.000250 pF, and the standard deviation of Df is about 0.000043. In contrast, using the same length of coaxial cable connection inspection electrode terminal group and switching means including MOSFET, similarly, the capacitance and loss coefficient of a capacitor with a capacitance of 1 pF are measured, and after calculating these standard deviations, the standard deviation of Cp is approximately 0.000455pF, followed by a standard deviation of Df of about 0.000082, the standard deviation of the capacitance and the standard deviation of the loss coefficient have all increased by about two times. It is understood that the accuracy of the measurement data has decreased.

The inventors of the present invention have considered the above-mentioned measurement results in order to find out why the standard deviation of the capacitance and the standard deviation of the loss coefficient increase when the MOSFET is used as the connection switching means, respectively, and have studied. Next, in the course of his research, after investigating the effect of the length of the coaxial cable connecting the electrode terminal group for inspection and the connection switching means, as shown in the graph in FIG. The standard deviation of each of the capacitance and the loss coefficient seen in the case of using a MOSFET is strongly related to the length of the coaxial cable. In the case where the length of the coaxial cable is 0 meters (that is, the coaxial cable is not used) In the case of a cable), even if a MOSFET is used instead of a mercury relay switch as a connection switching means, it is seen that there is almost no difference in the standard deviation of either the capacitance or the loss coefficient.

The inventor of this case, based on the above-mentioned new insights, further reviewed the connection switching method that uses MOSFET as a connection switching method and obtains high-precision measurement data without degradation when using a mercury relay switch. Method for setting and checking device of wafer electronic parts. Then, as a result of the review, the MOSFET was housed in a frame, and the frame containing the MOSFET was placed adjacent to the fixed electrode terminal and the movable electrode terminal of the electrode terminal group for inspection so as to be housed in the frame. The MOSFET (and its driving circuit) directly connects the fixed electrode terminal and the movable electrode terminal through the connector, which can avoid the use of a coaxial cable connecting the MOSFET and the electrode terminal group for inspection. Then, as a result, the electronic component inspection of the chip is performed. The screening device was used as a means for switching the connection between the tester for electrical characteristics measurement and the electrode terminal group for inspection, and it was found that the MOSFET could not be used with practical problems, and the present invention was achieved.

Therefore, the present invention is a wafer electronic component inspection and screening device, which includes: a base; a wafer electronic component transfer disc, which is supported by a shaft; The abutment is rotatable. However, in the wafer electronic component transfer disk, a plurality of through holes for temporarily accommodating a wafer electronic component having electrodes on opposite end faces may be formed into a plurality of rows along its circumference. The electronic component supply and accommodating section is provided in order along the rotation path of the conveying disk, so that the chip electronic components are supplied and stored in the through holes of the conveying disk; The test electrode terminal group is composed of a fixed electrode terminal and a movable electrode terminal for the inspection of the characteristics. Then, the classification department classifies the electronic components of the wafer after the inspection according to the inspection results. The electrical property checker is respectively connected to the above-mentioned fixed electrode terminal and movable electrode terminal; it is characterized in that the MOSFET (and its driving circuit) housing the MOSFET (and its driving circuit) housed in the frame is used as the relay switching means. , Which are adjacent to the fixed electrode terminal and the movable electrode terminal respectively arranged to the above-mentioned electrode terminal group for inspection, and The above-described connector is connected to the fixed electrode terminal MOSFET with the movable electrode terminals.

In the wafer electronic component inspection and screening device of the present invention, it is preferable that the connector is provided on an end surface of the housing, and the MOSFET is preferably a MOSFET having an ON resistance of 500 mΩ or less and an OFF capacitance of 20 pF or less.

In the wafer electronic component inspection and screening device of the present invention, as a connection means between the inspection electrode terminal group and the electrical characteristic checker, a semiconductor switching element is used instead of a mercury relay switch, that is, The MOSFET and its driving circuit can avoid the problems caused by the use of the mercury relay switch, that is, the insufficient service life, the speed limit of the connection switching, and the environmental impact caused by the use of mercury. risk.

Furthermore, in the wafer electronic component inspection and screening device of the present invention, the connection operation between the electrical property inspection tool and the electrode terminal set for inspection for measuring the electrical characteristics of the wafer electronic component becomes extremely easy, and there are also inspections. The electrode terminal group can be easily installed and repaired. That is, in the conventional wafer electronic component inspection and screening device, for example, when three sets of electrode terminal groups and three sets of mercury relay switches are connected by coaxial cables, each fixed electrode terminal of each group and movable A total of 6 coaxial cables are connected to the electrode terminals and the three sets of mercury relay switches. Next, when the electrode terminal group is unsuitable, it is necessary to temporarily remove, repair or exchange the coaxial cable from the electrode group, and complicated work becomes necessary. Moreover, as mentioned above, because the electrode terminal group is small in size, it is often necessary to remove the coaxial cable from the electrode terminal group adjacent to it when removing the coaxial cable from the electrode terminal group of one group. Therefore, the work of exchanging or repairing the electrode terminal group tends to be more complicated. In addition, such a complicated operation is of course necessary when the electrode terminal group for inspection of the screening machine is incorporated and the coaxial cable is connected. In the wafer electronic component inspection and screening device of the present invention, it is not necessary to use a coaxial cable for connection between the inspection electrode terminal group and the connection switching means (means for switching the electrical connection between the electrode terminal group and the inspector), The above-mentioned complicated work becomes unnecessary, so there are also chip electronics The advantage of assembling or repairing the part inspection and screening device is extremely simple.

10‧‧‧Chip electronic component inspection and screening device

11‧‧‧Chip electronic parts transfer disc

11a‧‧‧through hole

12a, 12b, 12c, 12d, 12e, 12f‧‧‧Fixed electrode terminals

13a, 13b, 13c, 13d, 13e, 13f

14a, 14b‧‧‧ Inspector

15‧‧‧controller

19‧‧‧Chip Electronic Components (Chip Capacitor)

19a, 19b, 19c‧‧‧‧Chip electronic parts (chip capacitors)

19d, 19e, 19f‧‧‧‧Chip electronic parts (chip capacitors)

20‧‧‧ Mercury Relay Switcher

21‧‧‧Capacitor body

22a, 22b‧‧‧electrode

23‧‧‧Frame (for electrode terminal connection)

24‧‧‧MOSFET

25‧‧‧ Connector

26‧‧‧electrode terminal unit (movable electrode terminal unit)

31‧‧‧Chip electronic parts supply port

32‧‧‧fan bucket

33‧‧‧ partition

41‧‧‧ abutment

42‧‧‧center axis

43‧‧‧Rotary drive

45‧‧‧ base plate (bench)

101‧‧‧ Wafer electronic parts supply storage unit (supply area)

102‧‧‧ Wafer electronic component electrical characteristics inspection section (inspection area)

103‧‧‧Chip electronic parts Electronic parts classification department (classification area)

[Fig. 1] A perspective view showing a configuration of a wafer electronic component to be inspected, taking a wafer capacitor as an example.

FIG. 2 is a front view showing an example of the overall configuration of a wafer electronic component inspection and screening device.

[Fig. 3] A wafer electronic component transfer disk showing a wafer electronic component inspection and screening device, and a wafer electronic component supply receiving section (supply storage area) and a wafer electronically arranged in a rotation path of the transfer disk along its rotation direction The part electrical property inspection section (inspection area) includes a wafer electronic part classification section (classification area).

4 is a front view of a wafer electronic component transfer disc, and a cross-sectional view of the transfer disc and a support structure behind the wafer.

Fig. 5 is a front view and a side view showing a wafer electronic component supply and storage section. In addition, the dashed lines represent the internal structure of the wafer electronic component supply housing section added for the purpose of illustration.

6 is a view showing an internal structure of a fan bucket provided in a wafer electronic component supply and storage section, (a) is a front view showing the internal structure of the fan bucket, and (b) is a side sectional view of the fan bucket. Moreover, the side cross-sectional view of the latter fan bucket also shows the cross section of the side surface of a conveyance disk and the base plate (reference table) provided in the back of a conveyance disk.

[Fig. 7] A cross-sectional view showing a state in which wafer electronic parts are supplied and stored in through-holes of a transfer disc in a wafer electronic part supply and storage section, and the wafer electronic parts are stored to be arranged along the circumference on the transfer disc. This is a diagram of the state where the through holes are arranged in an arc shape and conveyed. The arrows indicate the rotation direction (moving direction of the through hole) of the conveying disk.

[Fig. 8] Fig. 8 is a cross-sectional view showing a state in which electrical characteristics of a wafer electronic component stored in a through-hole of a transfer disk are inspected by an inspection unit.

[Fig. 9] Fig. 9 is a diagram showing a state in which a sorting unit for a wafer electronic component is accommodated in a through hole of a transfer disc and is inspected by an inspection unit.

10 is a circuit diagram showing a wiring system including a mercury relay used as a switching means in a known wafer electronic component.

11 is a circuit diagram showing an example of a wiring system including a MOSFET used as a switching means and housed in a housing in a wafer electronic component of the present invention.

FIG. 12 is a schematic diagram showing a combination of a housing (with a connector) housing a MOSFET used in a wafer electronic component of the present invention and an electrode group for inspection.

FIG. 13 is a schematic view showing a state in which a frame (containing a MOSFET) shown in FIG. 12 is assembled to an electrode group for inspection.

14 is a schematic diagram showing a state in which wafer electronic components are inspected using an inspection electrode group in which a casing (containing a MOSFET) shown in FIG. 13 is assembled.

15 is a diagram showing the length of a coaxial cable connecting a MOSFET and an electrode terminal group for inspection in a wafer electronic component inspection and screening device. A graph showing the relationship between the degree and the accuracy (indicated by standard deviation) of the measured value of electrical characteristics.

Hereinafter, a representative configuration of the wafer electronic component inspection and screening device of the present invention will be described with reference to FIGS. 1 to 14 of the accompanying drawings. Moreover, in order to make it clear from the description here, the present invention relates to an improvement of a connection switching structure including a connection switching means (relay switching) of a known wafer electronic component inspection and screening device. A representative configuration of the part inspection and screening device will be described.

FIG. 1 is a perspective view of a wafer electronic component that is an inspection object, which uses a wafer capacitor as an example and a structure thereof. The wafer electronic component (wafer capacitor) 19 uses a capacitor body 21 made of a dielectric and opposite ends thereof. A pair of electrodes 22a and 22b are provided. The conventional chip capacitor 19 is a chip ceramic capacitor using ceramics as a dielectric. Furthermore, a solder layer for mounting the various types of substrates of the wafer electronic component on the surface of the electrode of the general wafer electronic component is attached.

FIG. 2 is a front view showing a configuration example of a wafer electronic component inspection and screening device; FIG. 3 shows a wafer electronic component transfer disk of the wafer electronic component inspection and screening device, and the rotation path of the transfer disk is arranged along the rotation direction of the wafer The wafer electronic component supply and storage section (supply storage area), the wafer electronic component electrical property inspection section (inspection area), and the wafer electronic component classification section (sorting area). Wafer electron zero of Figure 2 The piece inspection and screening device is a device in which a plurality of through holes are arranged in a row along the circumference of the conveying disk. In addition, the conveyance disk of FIG. 3 is a structure in which the conveyance disks are arranged in three rows along the circumference of the conveyance disk for simplicity of illustration. FIG. 4 (a) is a front view of the wafer electronic component transfer disk shown in FIG. 3, and then FIG. 4 (b) is a cross-sectional view showing the transfer disk and a support structure behind it.

In the wafer electronic component inspection and screening device 10 shown in FIG. 2, a plurality of through holes 11 a capable of temporarily accommodating a wafer electronic component (for example, a wafer capacitor) are arranged along a circumference on the surface of the disc-shaped material, and the wafer electronic component is transported. A disk (hereinafter simply referred to as a conveying disk) 11 is supported on the base 41 by a shaft so as to be rotatable along the plane of the disk. In the rotation path of the conveying disk 11, as shown in FIG. 3, the supply and storage section (supply storage area) 101 of the wafer electronic component, the inspection section (inspection area) 102 of the electrical characteristics of the wafer electronic component, and the wafer electronics are set. The classification section (classification area) 103 of the part. The inspection section 102 includes electrode terminals for measuring electrical characteristics at positions close to the two openings of the through holes 11 a in each row of the conveyance disk 11. The controller 15 is electrically connected to the inspector so that the inspectors 14a and 14b are electrically connected to the electrode terminals, and then the inspector is supplied with a signal related to the inspection process. In addition, the wafer electronic component to be inspected enters a hopper 47, passes through a fan bucket (see FIGS. 5 and 6) from the wafer electronic component supply port 31, and is supplied to a through hole of the transfer disc 11.

The through-holes 11a of the wafer electronic component transfer disc 11 are usually arranged on the surface of the transfer disc, and the concentric segments are equally divided on a plurality of concentric circles. The position of the circle.

The apparatus 10 shown in FIG. 2 is provided with a total of six through-holes arranged in a radial direction between the center and the periphery of the conveying disk 11, and a total of six wafers accommodated in the respective through-holes. One of the electronic parts is to check the electrical characteristics of the electronic parts of the chip. The number of the through holes arranged in the diameter direction between the center and the peripheral edge of the transfer disc 11 is preferably within a range of 3 to 20, and more preferably within a range of 3 to 12.

The conveying disk 11 is installed (fixed) on a base 41, such as a base plate (reference table) 45, that is, it is rotatably provided through a central axis 42. The rotation drive device 43 is disposed on the back side of the base. In the operation mode, intermittent rotation is performed around the central shaft 42.

The through-holes 11 a of the transfer disk 11 are temporarily accommodated in the wafer electronic component supply and storage unit 101 for the purpose of inspecting the electrical characteristics of the wafer electronic components to be inspected.

The detailed structure of the wafer electronic component supply and storage section 101 is shown in FIGS. 5 and 6. The wafer electronic component supply and storage unit 101 is also called a fan bucket portion, and is a field for accommodating the wafer electronic components supplied from the wafer electronic component supply port 31 from the outside into the through hole 11 a of the transfer disc 11 through the fan bucket 32. In FIGS. 5 and 6, the fan bucket 32 is formed as a through hole for supplying wafer electronic components to three rows provided on the transfer disc 11 (the same as in FIG. 3, which is shown as three rows for simplicity). In the structure of the group, the grooves for three rows for separating the wafer electronic components in a circular arc shape are separated by the partition wall 33. Via chip electronic parts supply port 31 The supplied wafer electronic components descending along the partition wall 33 inside the fan bucket 32 are located near the bottom of the fan bucket 32 and pass through the gas suction passage 45a formed in the base plate (reference table) 45 and pass through the transfer disc. The strong attractive force brought by the 11 through holes 11a is attracted and accommodated in the through holes 11a. In addition, the suction and accommodation of the through-holes 11 of the wafer electronic component transfer disc 11 is usually performed while the disc is temporarily stationary.

FIG. 7 shows a state where the wafer electronic component is sucked and stored in the through hole 11 a of the transfer disc 11. That is, the wafer electronic components 19 gathered near the bottom of the fan bucket 32 pass through the gas suction passage 45a formed in the base plate (reference table) 45, and are compared by the through holes 11a of the transfer disc 11. The strong attraction force is attracted and accommodated in the through hole 11a. In addition, when the wafer electronic components 19 collected near the bottom of the fan bucket 32 are received in the through hole 11a, air is blown in from the outside near the bottom of the fan bucket 32 to generate an airflow, and the wafer is stirred in a state The electronic component 19 floats, and it is preferable to attract the receiver of the wafer electronic component smoothly. The blowing of external air toward the vicinity of the bottom of the fan bucket 32 can be performed by, for example, the air blowing section 37 shown in FIG. 6.

As described above, the base plate 45 is disposed on the back side of the wafer electronic component transfer disk 11 or the rear side (on the right side in FIG. 7) of the device. A plurality of gas suction passages 45 a are formed in the base plate 45, and each of the gas suction passages 45 a is opened on the surface on the side of the conveyance disk 11. Each gas suction path is connected to a gas suction device 46 that supplies a strong suction force to the through hole. When the gas suction device 46 is actuated, the gas in the gas suction passage 45 a is attracted by a strong suction force, and a gap is formed between the transfer disk 11 and the base plate 45. The pressure is reduced.

While rotating the conveying disc 11 in the direction indicated by the arrow shown in FIG. 7, intermittent rotation is performed, and the wafer electronic parts are supplied to the surface of the conveying disc through the wafer electronic part supply port 31 and the fan 32 to make the gas suction device When the operation is performed at 46 to reduce the gap between the transfer disk 11 and the base plate 45 to a reduced pressure state, each of the through-holes 11 a of the transfer disk 11 sucks and accommodates the wafer electronic component 19.

The wafer electronic components 19 accommodated in the through-holes 11 a of the transfer disc 11 are intermittently transferred to the inspection unit 102 shown in FIGS. 2 and 3 through the intermittent rotation movement of the transfer disc 11 described above. In addition, the gap between the transfer disc 11 and the base plate 45 is after the storage of the wafer electronic component 19 in the through-hole 11a is completed, the transfer disk 11 is rotated, and the wafer electronic component 19 stored in the through-hole 11a moves. The inspection unit 102 is further in a weakly decompressed state until it reaches the classification unit 103. For this reason, the wafer electronic components 19 accommodated in the through hole 11a of the transfer disc 11 in the wafer electronic component supply and storage unit 101 is rotated by the transfer disc 11 through the inspection unit 102 until it reaches the sorting unit 103. It does not come off from the through hole 11a.

In the inspection section, as shown in FIG. 8, in order to electrically connect the electronic components of the wafer to the inspector for electrical characteristics, the inspection sections are arranged in pairs at positions close to the two openings of the through-hole 11 a of the transfer disc 11. The combination of 12a and 13a (the former is a fixed electrode terminal and the latter is a movable electrode terminal, the same applies below), the combination of 12b and 13b, the combination of 12c and 13c, the combination of 12d and 13d, the combination of 12e and 13e, Have 12f With 13f.

As described above, one of the electrode terminals (12a and others) is fixed to the base plate 45 via an electrically insulating cylinder disposed around the electrode terminal. The surface of the electrode terminal and the base plate 45 on the transfer disk side is generally a smooth flat surface by grinding or the like. The other electrode terminals (13a and others) are movable electrodes and are supported by the electrode terminal support plate 53 so that they can move forward and backward.

By moving the electrode terminal support plate 53 to the conveyance disk 11 side, the movable electrode terminal (13a, he) supported by the electrode terminal support plate 53 also moves to the conveyance disk 11 side. Through the movement of the movable electrode terminals (13a, and others), the wafer electronic components are sandwiched between the pair of electrode terminals (12a, 13a, and others) and come into contact. To this end, the electrode 22a of the wafer electronic component is electrically connected to the electrode terminal (12a, and others), and then the electrode 22b is electrically connected to the electrode terminal (13a, and others). Through this, the chip electronic components are electrically connected to the inspector via the pair of electrode terminals (12a, 13a, and others).

In addition, the "close position" to the two openings of the through holes of the transfer disk where the pair of electrode terminals are arranged means that the electrode terminals are electrically connected when the wafer electronic components are accommodated in the through holes. When the position of the electrode of each chip electronic component or the electrode terminal is configured in a movable state, the electrode terminal can be electrically connected to the position of the electrode of the chip electronic component by moving the electrode terminal.

Next, in the inspection section 102, the Each of the six wafer electronic components 19a, 19b, 19c, 19d, 19e, and 19f arranged in a row in a radial direction is inspected for a specified electrical characteristic.

The wafer electronic components for which the electrical characteristics are checked are continuously transferred to the wafer electronic component classification unit 103 shown in FIGS. 2 and 3 by intermittent rotation movement of the transfer disc 11.

As shown in FIG. 9, in the sorting unit 103, a tube support cover 61 having a plurality of through holes 61 a is formed on the front side of the conveying disk 11 or the front side of the device (the left side in FIG. 9). Each through hole 61a of the tube support cover 61 is connected to a tube 62 constituting a discharge path of the wafer electronic component 19a. Moreover, in FIG. 2, only a part of the tubes connected to the tubes 62 of the respective through holes 61 a of the tube support cover 61 is shown.

The base plate 45 disposed on the back side of the transport disc 11 or the rear side (right side in FIG. 9) of the device is formed in the area of the sorting section 103 on the surface of the transport disc 11 side. The plurality of gas supply passages 45b. Each gas supply passage 45 b is connected to a pressurized gas supply device 63.

When the pressurized gas supply device 63 is operated, the pressurized gas is supplied to the gas supply path 45b, and the pressurized gas is sprayed on the wafer electronic component 19a accommodated in the through hole 11a of the transfer disc 11. As a result, the wafer electronic components are discharged to the tube 62.

The wafer electronic component 19a is, for example, a plurality of through-holes 61a formed in the tube support cover 61 as shown in FIG. 2, and a total of ten through-holes 61a located on the outermost peripheral side. The 10 through holes 61a, It is connected to the wafer electronic component storage container 64 via the tube 62, respectively.

Therefore, the wafer electronic components discharged from the through-holes in the sorting unit 103 pass through any one of a total of 10 tubes 62 connected to the 10 through-holes 61a of the tube support cover 61, and the results of the inspection are clearly understood based on the determination. Electrical characteristics are stored in a predetermined wafer electronic component storage container 64.

Next, the relay means (switcher) used in the wafer electronic component inspection and screening apparatus of the present invention will be described. However, the arrangement of the mercury relay in the known wafer electronic component inspection and screening apparatus has been described before.

The arrangement of the mercury relay in the wafer electronic component inspection and screening device can be roughly understood from the description of Patent Document 1 and FIG. 7. However, FIG. 10 of the drawing of the specification of the present application further shows the detailed configuration. FIG. 10 shows a combination of three sets of fixed electrode terminals 12a, 12b, and 12c and movable electrode terminals 13a, 13b, and 13c caused by the four-terminal method, which can be electrically connected to the inspector via a mercury relay switch 20, respectively. Circuit diagram of the 14a system. The inspector 14a is provided with four terminals (Hcur, Hpot, Lcur, Lpot) electrically connected to each electrode terminal of each of the wafer electronic components 19a, 19b, and 19c via the mercury relay switcher 20.

Each mercury relay switcher 20 switches the electrical connection between the checker 14a and each electrode terminal in accordance with an instruction sent from the checker 14a and the controller 15. From FIG. 10, the wafer electronic component inspection and screening device for the mercury relay switcher 20 cannot be obtained. Configuration, but as mentioned above, mercury relay switches are generally large because they are not located near the electrode terminals. They are located near the inspector 14a, which is far away from the electrode terminal group. They are connected by coaxial cables. Electrode terminal and mercury relay switch.

Next, the MOSFETs accommodated in the frame used in the present invention and the arrangement thereof will be described with reference to FIGS. 11 to 14.

As can be understood from FIG. 11, the MOSFET 24 housed in the frame body 23 is connected to the inspector 14 a at one end portion, and the connector (and electrode terminal) protruding to the outside of the frame body 23 at the other end portion. The connection connector 25) is connected. The connector may be attached to a recessed portion provided on an end surface of the housing.

A MOSFET is a relay switch classified in a semiconductor switching element, and its structure or characteristics are widely known. As a MOSFET used in a switch (relay switching) of the wafer electronic component inspection and screening device of the present invention, a MOSFET having an ON resistance of 500 mΩ or less and an OFF capacitance of 20 pF or less is preferred.

As can be understood from FIG. 12, the frame body 23 that houses the MOSFET is attached to the end surface on the left side of the figure, and includes a coaxial cable connected to the inspector, and includes a connector 25 on the right end surface. Each connector 25 is configured to be electrically connected to each electrode terminal of an electrode terminal unit (an integrated electrode terminal group, and the movable electrode terminal unit is shown in the figure) 26.

FIG. 13 shows a state where the frame body 23 and the electrode terminal unit (movable electrode terminal unit) 26 housed in the MOSFET shown in FIG. 12 are connected via a connector. The movable electrode terminal unit 26 is Equipped with 6 electrode terminals, in combination with a corresponding fixed electrode terminal unit that also has 6 fixed electrode terminals, the electrical characteristics of 6 chip electronic components can be measured sequentially at high speed through the connection switching mechanism using MOSFET24. .

FIG. 14 shows a unit (movable electrode terminal side unit) that connects the housing 23 housing the MOSFET shown in FIG. 13 and the movable electrode terminal unit through a connector, and also connects the housing 23 housing the MOSFET and the fixed electrode terminal through the connector. The unit of the unit (unit on the fixed electrode terminal side) is a schematic view of a state where the electrode terminal of the wafer electronic component 19 is contacted in order to measure the electrical characteristics of the wafer electronic component 19 housed in the transfer disc 11.

In addition, in this specification, the description of the structure of the wafer electronic component inspection and screening device is described by exemplifying a device in which the wafer electronic component transfer disc described in Patent Document 1 is arranged to operate in a vertical direction, but the present invention The wafer electronic component inspection and screening device may, of course, be a device in which the wafer electronic component transfer disc is supported by a shaft in a state where the wafer electronic component is tilted with respect to the base.

Claims (2)

A wafer electronic component inspection and screening device includes: a base; a wafer electronic component conveying disk that is rotatably supported by a shaft on a base; however, the wafer electronic component conveying disk can be respectively placed on opposite end faces. A plurality of through-holes for temporarily containing a wafer electronic component having an electrode forms a plurality of rows along its circumference; then, the wafer electronic component supply accommodation unit is sequentially arranged along the rotation path of the transfer disc, so that the wafer electronic component is supplied and accommodated to The through hole of the conveying disk; the electrical property inspection unit is an electrode terminal group for inspection which is composed of a fixed electrode terminal and a movable electrode terminal and has a plurality of arrays for inspecting the electrical characteristics of the electronic component of the wafer; and, The classification department is used to classify the inspected wafer electronic components according to the inspection results; the electrical characteristic checker is connected to the fixed electrode terminal and the movable electrode terminal respectively through the relay switching means; Means Use a MOSF with an ON resistance of 500mΩ or less and an OFF capacitance of 20pF or less stored in the housing. ET is provided with a connector connected to the output circuit of the MOSFET in the casing, and the fixed electrode terminal and the movable electrode terminal of the electrode terminal group for inspection are connected to the connector, respectively, and the casing is provided. They are arranged adjacent to the fixed electrode terminal and the movable electrode terminal, respectively. The wafer electronic component inspection and screening device according to claim 1, wherein the connector is provided on an end surface of the housing.