JP6727651B2 - Continuous inspection method for electrical characteristics of chip electronic components - Google Patents

Description

The present invention relates to a method for continuously inspecting electrical characteristics of a large number of chip electronic components at high speed using an automated chip electronic component inspection/sorting device.

With the increase in the production amount of small electronic devices such as mobile phones, smartphones, liquid crystal televisions, and electronic game machines, the production amount of minute chip electronic components incorporated in such electronic devices has significantly increased. Most of the chip electronic components are formed of a main body and electrodes provided on both end surfaces of the main body that face each other. Examples of the chip electronic component having such a configuration include a chip capacitor (also called a chip capacitor), a chip resistor (including a chip varistor), and a chip inductor.

In recent years, the chip electronic components have become extremely small in accordance with the further downsizing of electronic devices incorporating the chip electronic components and the increase in the number of chip electronic components incorporated into the electronic devices. For example, as chip capacitors, chip capacitors of extremely small size (eg, 0402 chip, size of 0.2 mm×0.2 mm×0.4 mm) have been used in recent years, and such a minute capacitor is used. Mass production of chip electronic components produces one lot in the unit of tens to hundreds of thousands.

In an electronic device in which a chip electronic component is incorporated, in order to reduce a defective product rate of the electronic device due to a defect in the embedded chip electronic component, it is general that 100% inspection is performed on mass produced chip electronic components. For example, all the chip capacitors used as products are inspected for electrical characteristics such as capacitance and leakage current.

It is necessary to inspect the electrical characteristics of a large number of chip electronic components at a high speed, and in recent years, as an apparatus for automatically performing the high speed inspection, a chip electronic component transfer disk (disc) having a large number of through holes is formed. An automated device (that is, a chip electronic component inspection device) for inspecting the electrical characteristics of a chip electronic component, which includes a chip electronic component transport plate) is generally used. A chip electronic component transfer disk (hereinafter sometimes simply referred to as a transfer disk) usually has a large number of through holes for accommodating and holding the chip electronic parts to be inspected in a plurality of rows of three or more rows along the circumference. Are formed in a line. When the chip electronic component inspection/sorting device is used, after the chip electronic components are temporarily accommodated and held in the through holes of the transport disc under intermittent rotation, the chip electronic components held in the transport disc are held. A pair of electrode terminals (inspection contacts) attached to the component along the rotation path of the transfer disc are brought into contact with each electrode of the chip electronic component to apply a predetermined voltage, and the electrical characteristics of the chip electronic component Is measured.

For example, in the case of inspecting the electrostatic capacitance of a chip capacitor, in the electrical characteristic inspection unit, an inspection device (electrical characteristic measuring device) provided in the chip electronic component inspection/sorting device, through an inspection electrode terminal, An inspection voltage having a predetermined frequency is applied to the chip capacitor. Then, the tester detects the current value of the current generated in the chip capacitor by applying the test voltage, and based on the detected current value and the voltage value of the test voltage, the capacitance of the chip capacitor to be tested. Is measured.

That is, in the above-described inspection device for the electrical characteristics of chip electronic components, at least three rows of through holes are formed on the surface of the chip electronic components concentrically on the surface, and the transportation disc can be intermittently rotated. As described above, a base rotatably supported at the center of the row of concentric through holes, and a chip electronic component supply accommodating portion and a roller electrode terminal and a fixed electrode terminal, which are respectively arranged at positions along the surface of the transfer disk, are included. It can be said to be a chip electronic component electric characteristic inspection device including an electric characteristic inspection section provided with an electrode terminal set.

When the inspection of the chip electronic components held on the transport disc is completed, the chip electronic components are ejected from the through holes of the transport disc and sorted (or classified) so as to be stored in a predetermined container based on the inspection result. Work is carried out. For this reason, the ordinary chip electronic component inspection device is further provided with a chip electronic component classification unit (classification area) for sorting (or classifying) the chip electronic components after the inspection, and the chip electronic component electrical characteristics It is often commercialized as an inspection and sorting device.

As an example of the chip electronic component inspection/sorting apparatus, the apparatus described in Patent Document 1 can be cited. That is, in Patent Document 1, using the chip electronic component inspection/sorting apparatus having the above-described configuration, chip electronic components to be inspected, which are manufactured based on the same standard so as to exhibit predetermined same electrical characteristics, are mutually separated. It is housed and held (temporarily housed) in the through hole of the transfer disk in the state of being arranged closely, and then the inspection device is electrically connected to the electrode of the chip electronic component, and the inspection voltage is applied from the inspection device to each chip electronic component. Then, an improved method of the method for continuously inspecting the electrical characteristics of the chip electronic component including the step of detecting the current value generated in each chip electronic component by the inspector is described.

In the chip electronic component electrical characteristic inspection section of the above-mentioned chip electronic component inspection/sorting device, a fixed probe electrode (usually simply referred to as a fixed electrode) arranged on the back side (or lower side) of the transfer disc and the transfer disc are usually provided. A plurality of sets of electrical property inspection tools configured in combination with movable probe electrodes (normally simply referred to as movable electrodes) arranged on the front side (or upper side) are provided along the radial direction of the transport disk.

As a movable probe provided in the chip electronic component electrical characteristic inspection unit of the above-mentioned chip electronic component inspection/sorting device, conventionally, a probe tip portion (a portion in contact with the electrode surface of the chip electronic component) is processed into a rod shape or a brush shape. In order to achieve reliable contact between the probe tip and the electrode of the chip electronic component, it has been devised in recent years. It is common to use a roller electrode terminal (that is, an electrode terminal provided with a roller at the tip) in which the tip of the probe is less worn or damaged, and the electrode of a chip electronic component that comes into contact is less damaged.

Examples of the roller electrode terminals provided in the electronic component electrical characteristic inspection unit of the chip electronic component inspection/sorting apparatus are described in detail in Patent Documents 2 to 6 together with examples of configuration diagrams.

Of the above Patent Documents 2 to 6, Patent Document 2 discloses a configuration example of a known roller electrode terminal provided in a chip electronic component inspection/sorting device, and a chip provided with electrodes at both ends. It is described that when the inspection of the electrical characteristics of the electronic component is performed using the roller electrode terminal, the electrode of the chip electronic component is partially damaged (contact scratch). Patent Document 2 describes that contact scratches on the electrodes of the chip electronic component occur when the electrodes of the chip electronic component are in contact with the roller electrode terminals and when the contact is released. Further, in Patent Document 2, a ring-shaped elastic body is attached to the tip roller portion of the roller electrode as a means for suppressing contact scratches generated on the electrode of the chip electronic component due to contact with the roller electrode terminal. Proposed.

Patent Document 3 and Patent Document 4, which is an international publication corresponding to Patent Document 3, and Patent Document 6 that is a corresponding international publication to Patent Document 5 and Patent Document 5, also include roller electrodes provided in a chip electronic component inspection/sorting apparatus. Another configuration example of the terminal is disclosed. Then, a conventional method for preventing the damage of the electrodes that occurs during the inspection of the electrical characteristics of the chip electronic component described above is described. In this conventional method, when the transport disc is rotated, the roller electrode terminals are arranged at a position away from the surface of the transport disc, and the roller electrode terminals are housed in the through holes of the transport disc and transported to the electrodes of the chip electronic component. When the chip electronic components in the through holes are transported to the electrical characteristics inspection unit by the rotation of the transport disc and the rotation is stopped, the roller electrode terminals are moved (lowered) to move the chip electronics. After inspecting the electrical characteristics by making contact with the electrode of the component, after the end of the subsequent inspection, this time, the roller electrode terminal is moved (raised) away from the electrode of the chip electronic component, and then the transport disc is rotated. The method is explained. However, in these patent documents, it is pointed out that in this method, the productivity of the inspection work is reduced (the time required for the inspection work is lengthened) due to the lifting and lowering operation of the roller electrode terminals. There is.

JP, 2015-213121, A JP, 2008-224418, A Japanese Patent Publication No. 2010-511865 WO2008/067129 A2 Japanese Patent Publication No. 2010-517058 WO2008/094831 A1

The inventor of the present invention uses a chip electronic component inspection/sorting apparatus provided with a roller electrode terminal, which is exemplified as a conventional technique in Patent Document 2 as a movable probe electrode of an inspection contactor, to continuously perform electrical operation of chip electronic components. A characteristic inspection test was conducted. As a result, when the inspection of the electrical characteristics of the chip electronic component provided with electrodes at both ends described in Patent Document 2 is performed by using the roller electrode terminals, as described in Patent Document 2, It was confirmed that contact scratches were generated on the electrodes of the chip electronic component. It should be noted that the presence of contact scratches on the electrodes of the chip electronic component observed after the inspection of the electrical characteristics is necessary for the chip electronic component that has been inspected to be mounted (mounted) on the printed wiring board using solder. Wetting of solder on the electrodes of electronic components is likely to be non-uniform, which causes troubles when mounting chip electronic components. Therefore, it is desirable to minimize contact scratches on the electrode surface of the chip electronic component that has undergone the electrical characteristic inspection.

The inventor of the present invention further discloses a known method described in Patent Documents 3 to 6, that is, the roller electrode terminal is retracted (conveyance disc) in synchronization with intermittent rotation of a conveyance disc having chip electronic components housed in through holes. Occurrence of contact damage to the electrode of the inspected chip electronic component by repeating the (movement away from the surface) and the forward movement (movement for contacting the electrode surface of the chip electronic component housed in the through hole of the transfer disk). It was also confirmed that can be suppressed. However, according to the study of the inventor of the present invention, when the inspection work of the electrical characteristics of the chip electronic component by the above method is performed, the reproducibility of the inspection result of the electrical characteristics of the chip electronic component tends to be poor (that is, all non-defective products ( When measuring the electrical characteristics of a chip electronic component that should be a (qualified product), there should be some error in the measured value, although the measured values should be aligned within a slight error range. It has been found that there is a tendency to do). Originally, the measured values should be aligned within a certain error range.If such an error occurs in the measurement result of the electrical characteristics of the acceptable chip electronic parts, the reliability of the measured value is not guaranteed, and the error level In some cases, the suitability as a method for measuring the electrical characteristics of chip electronic components becomes a problem.

That is, according to the studies conducted so far by the inventor of the present invention, in a known chip electronic component inspection apparatus using a transfer disc, it is necessary to suppress the occurrence of contact scratches on the electrodes of the inspected chip electronic components and to determine the inspection result. It was found that it is difficult to achieve the level of satisfying both important requirements of maintaining the reliability of the measured values of electrical characteristics.

In the above description of the present specification, a continuous inspection method for a chip electronic component using a chip electronic component inspection device that uses a transfer disk has been described. There are various known methods using a chip electronic component carrier plate having a shape other than the disk shape (hereinafter, may be simply referred to as a carrier plate).

That is, a general continuous inspection method for chip electronic components can be referred to as a method for measuring the electrical characteristics of the following chip electronic components including the known inspection methods.

A chip electronic component temporary accommodation hole of a carrier plate having a plurality of chip electronic component temporary accommodation holes is provided with chip electronic components equipped with electrodes at both ends facing each other, one electrode at the top and the other at the other end. Temporarily housing the terminal electrode of the chip so that it is located at the bottom; moving the carrier plate along the plane of its surface to the electrical characteristic measurement position; applying electric power to the top electrode and the bottom electrode of the chip electronic component respectively. A step of measuring the electrical characteristics of the chip electronic component by bringing the characteristic measuring terminals into contact with each other and applying a voltage; and further moving the chip electronic component transport plate along the plane of the surface of the chip electronic component to measure the electrical characteristics. A method of measuring the electrical characteristics of a chip electronic component, including the step of separating the finished chip electronic component from the electrical characteristic measurement position.

Therefore, the problem of the present invention is likely to occur in the use of a chip electronic component inspection device using a carrier plate having a plurality of chip electronic component temporary accommodation holes, and using a roller electrode terminal as one of the electrical characteristic measuring terminals, Chip electronic parts that can fulfill the important requirements of suppressing the occurrence of contact scratches on the electrodes of inspected chip electronic parts and maintaining the reliability of the measured values of the electrical characteristics necessary for determining the inspection results To provide the inspection method.

The inventor of the present invention has conducted extensive studies to solve the above problems, and as a result, an inspection by a chip electronic component inspection device that uses a carrier disk and uses roller electrode terminals as a movable probe provided in a chip electronic component electrical characteristic inspection unit. In the method, in synchronization with the intermittent rotation of the transport disc, the roller electrode terminals are in contact with the surface of the transport disc or at a position in the vicinity of the surface of the transport disc during rotation of the transport disc. When the chip electronic component housed in the through hole of the disk moves to the electrical characteristic inspection unit due to the rotation of the carrier disk, it is placed at the position where the electrode of the chip electronic component and the roller electrode terminal come into contact and housed in the carrier disk. After the transfer disk has stopped rotating after the chip electronic parts have moved to the electrical characteristics inspection section, and the electrical characteristics have been measured with the roller electrode terminals in contact with the electrodes of the chip electronic parts, the transfer disk The roller electrode terminal is separated from the electrode of the chip electronic component while the device is in a stopped state, and then the roller electronic terminal is moved to the outside of the electrical characteristic inspection section after the chip electronic component is moved out of the electrical characteristics inspection section by the rotation of the transportation disc. It has been found that the above problems can be solved to a satisfactory level at a practical level by moving them so as to return them to the contact position or the position near the surface of the transport disk.

Therefore, the present invention is a method for continuously inspecting the electrical characteristics of chip electronic components described below.

A chip electronic component temporary accommodation hole of a carrier plate having a plurality of chip electronic component temporary accommodation holes is provided with chip electronic components equipped with electrodes at both ends facing each other, one electrode at the top and the other at the other end. Temporarily storing the terminal electrode of the so that it is located at the bottom;
Moving the carrier plate along the plane of its surface to the electrical property measuring position;
By contacting the top electrode and the bottom electrode of the chip electronic component with the electrical characteristic measuring terminals and applying a voltage (however, the electrical characteristic measuring terminal that contacts the top electrode is a roller electrode terminal) Measuring the electrical characteristics of the;
And further moving the carrier plate along the plate plane to disengage the chip electronic component for which electrical characteristic measurement has been completed from the electrical characteristic measurement position;
A method for measuring electrical characteristics of a chip electronic component including
Until the chip electronic component moves and its top electrode starts contacting the roller electrode terminal, place the roller electrode terminal in a position in contact with one corner of the top electrode, and then after measuring the electrical characteristics. Is a method for measuring electrical characteristics of a chip electronic component, wherein the roller electrode terminal is moved in a direction away from the surface of the chip transport plate so as not to contact the other corner of the top electrode.

The present invention can be particularly advantageously used when measuring the electrical characteristics of a chip electronic component, which is a chip electronic component transport disc in which the transport plate rotates intermittently around the center.

By using the continuous inspection method of the electrical characteristics of the chip electronic component of the present invention, the contact damage of the electrode of the inspected chip electronic component is detected by using the chip electronic component inspection device using the transport disc and the roller electrode terminal. It is possible to realize both important requirements such as suppression of generation and maintenance of high reliability of measured values of electric characteristics required for determination of inspection results.

It is a front view showing an example of the whole composition of a chip electronic parts inspection sorting device. It is sectional drawing which shows the state which inspects the electric characteristic of the chip electronic component accommodated in the through hole of a conveyance disk in an inspection part. It is a figure which shows the structure of the roller electrode terminal of patent document 2. FIG. 6 is a diagram showing a contact state before and after an electrical characteristic inspection between a chip electronic component housed in a transport disk and a roller portion of a roller electrode terminal shown in Patent Document 2. It is a figure which shows the contact state before and after an electric characteristic inspection of the chip electronic component accommodated in the conveyance disk and the roller part of a roller electrode terminal in the continuous inspection method of the electric characteristic of the chip electronic component of this invention. An elevating mechanism for the roller electrode terminals used in the method for continuously inspecting the electrical characteristics of the chip electronic component of the present invention (from the state in which the roller is in contact with the surface of the transport disc, the roller is the electrode surface of the chip electronic component after the electrical characteristic inspection. It is a figure explaining the example of the mechanism which moves so that it may separate from.

First, a chip electronic component inspection/sorting apparatus (that is, a chip electronic component sorting means is provided, which uses a transport disc as a transport plate that is advantageously used for carrying out the continuous inspection method of the electrical characteristics of the chip electronic component of the present invention. A configuration example of a chip electronic component inspection device) will be described with reference to FIGS. 1 and 2 of the accompanying drawings.

A chip capacitor, which is a typical example of a chip electronic component to be inspected, is composed of a capacitor body made of a dielectric material and a pair of electrodes (or electrode surfaces) provided so as to face both ends thereof. A normal chip capacitor is a chip ceramic capacitor using ceramic as a dielectric. The electrodes of chip electronic components that are generally used at present are made of tin, and a solder layer for mounting the chip electronic components on various substrates is formed on the surface thereof.

The chip electronic components to be inspected are often of the same manufacturing lot, but even if the chip electronic components of the same manufacturing lot are mixed with the chip electronic components of another lot, Good. However, the chip electronic parts of both manufacturing lots are manufactured according to the same standard so as to show the same electrical characteristics (usually, they are manufactured for the purpose of selling each other as the same product). It is common to have.

FIG. 1 is a front view showing a configuration example of a chip electronic component inspection/sorting apparatus using a transport disc. In the chip electronic component inspection/sorting device 10 shown in FIG. 1, a plurality of through holes 11a that can temporarily accommodate chip electronic components are arranged along the circumference on the surface of a transport disc (disc-shaped transport plate). A chip electronic component transfer disk (hereinafter, simply referred to as a transfer disk) 11 formed by the arrangement is pivotally supported on a base 41 so as to be rotatable along the plane of the disk. In the rotation path of the transport disk 11, there are provided a supply unit (supply storage region) 101 for chip electronic components, an inspection unit (inspection region) 102 for electric characteristics of chip electronic components, and a classification unit (classification region) 103 for chip electronic components. It is set. The inspection unit 102 is provided with electrode terminals (electrical characteristic measuring terminals) for measuring electrical characteristics at positions close to both openings of each through hole 11a of each row of the transport disk 11. The electrode terminals are provided with a controller 15 electrically connected to the inspectors 14a and 14b and electrically connected to the inspector so as to supply the inspector with a signal regarding an inspection process. The chip electronic component to be inspected is put into the hopper 47, and is supplied from the chip electronic component supply port 31 to the through hole of the transfer disk 11 via the bucket.

The through holes 11a of the transport disc 11 are normally arranged on the surface of the transport disc on a plurality of concentric circles at positions where the concentric circles are equally divided.

The chip electronic component inspection/sorting apparatus 10 shown in the accompanying drawings is provided with a total of 6 through holes arranged in the diametrical direction between the center and the peripheral edge of the transfer disk 11, and each through hole is provided. The electrical characteristics of the chip electronic components are inspected for each of the six chip electronic components in total. The number of through holes arranged in the diametrical direction between the center and the peripheral edge of the transport disk 11 is preferably in the range of 3 to 20, and more preferably in the range of 3 to 12.

The transfer disk 11 is rotatably installed (fixed) on a base 41 via, for example, a base plate (reference stand) and a central shaft 42, and operates a rotation drive device 43 arranged on the back side thereof. By doing so, the periphery of the central shaft 42 is intermittently rotated.

A chip electronic component to be inspected is temporarily accommodated in the through hole 11a of the transport disc 11 in the chip electronic component supply/accommodation portion 101 in order to inspect its electrical characteristics.

As shown in FIG. 2, in the inspection unit (electrical characteristic measurement position) 102, electrodes (22a, 22b) at both ends of the chip electronic components 19a, 19b, 19c, 19d, 19e, 19f are electrically connected to the inspection device. In order to connect the electrodes 11a, 13a, 12b, 13b, 12c, 13c, 12d, 13d, 12e, 13e, which are formed as a pair, at positions close to both openings of the through hole 11a of the transport disk 11. , 12f, 13f are arranged. The roller electrode terminals used in the present invention correspond to the electrode terminals indicated by 13a, 13b, 13c, 13d, 13e and 13f.

The electrode terminal (12a, etc.) other than the roller electrode terminal is fixed to the base plate 45 via an electrically insulating cylindrical body arranged around the electrode terminal.

By moving the electrode terminal support plate supporting the roller electrode terminals to the side of the transport disc 11, the roller electrode terminals (13a, etc.) supported by the electrode terminal support plate also move to the transport disc 11 side. .. By the movement of the roller electrode terminals (13a, etc.), the chip electronic component is sandwiched between the paired electrode terminals (12a, 13a, etc.) and brought into contact with each other. Therefore, the electrodes of the chip electronic component are electrically connected to the fixed electrode terminals (12a, etc.) and the roller electrode terminals (13a, etc.).

Then, in the inspection unit (electrical characteristic measurement position) 102, with respect to each of the six chip electronic components 19a, 19b, 19c, 19d, 19e, 19f accommodated and arranged so as to be arranged in a line in the diameter direction of the transport disk 11, Predetermined electrical properties are tested.

The chip electronic components whose electrical characteristics have been inspected are continuously sent to the chip electronic component classifying unit 103 shown in FIG. 1 by intermittent rotation movement of the transfer disk 11, and the chip electronic components are classified (sorted) based on the inspection result. Is done.

Next, the movement of the roller electrode terminals, which is a characteristic operation in the method for continuously inspecting the electrical characteristics of the chip electronic component of the present invention, will be described in detail.

First, an example of a known roller electrode terminal will be described with reference to the drawing showing the structure of the roller electrode terminal shown in FIG. 3A is a front view of the roller electrode terminal, and FIG. 3B is a side view showing the internal structure of the roller electrode terminal.

In the example of the roller electrode terminals shown in FIGS. 3A and 3B, the roller electrode terminal 13 includes a case 131, a connection terminal 132 to the inspection device, a roller electrode 133, a roller electrode rotating shaft 134, and a roller electrode. A holder 135, a swing fulcrum 136, a coil spring 137, and a connection cable 138 are included.

4A, 4B, and 4C show contact between the chip electronic component 19 and the roller electrode 133 in the inspection unit (electrical characteristic measurement position) illustrated in Patent Document 2 which is a document showing the conventional technique. It is a figure which shows the change of a state. That is, the roller electrode 133 moves the transfer disk 11 in the direction of the arrow shown in (a), so that the chip electronic component 19 housed (temporarily stored) in the through hole of the transfer disk 11 and the electrode on the top thereof. First, the contact is made at one corner, and then the surface of the top electrode is overlaid. At this point, the transfer disk 11 is temporarily stopped, and during the stop, a voltage is applied between the upper roller electrode 133 and the lower fixed electrode terminal, and the electrical characteristics of the chip electronic component 19 are measured. Then, after the electrical measurement is completed, the transport disk 11 moves again in the direction of the arrow, and as a result, the roller electrode 133 comes into contact with the other corner portion of the electrode on the top of the chip electronic component, and from the top. Get off. The damage (contact scratch) of the top electrode of the chip electronic component at the electrical characteristic measurement position described above is mainly caused by the start of contact with the roller electrode (contact with the top electrode shown in FIGS. 4A and 4B). It occurs when the roller electrode rides up) and the contact is released.

FIG. 5 is a diagram showing changes in the contact state between the chip electronic component 19 and the roller electrode 133 at the electrical characteristic measuring position in the electrical characteristic measuring method for a chip electronic component of the present invention.

(1) of FIG. 5 shows a state in which neither the fixed electrode terminal 12 nor the roller electrode 133 of the roller electrode terminal is in contact with the chip electronic component 19 which is housed in the transport disc 11 and rotates in the direction of the arrow. In this state, the roller electrode 133 is in contact with the surface of the transport disc 11 or in a position close to the surface of the transport disc 11.

FIG. 5B is a diagram showing a state where the roller electrode is in contact with one corner of the top electrode of the chip electronic component and is about to ride on the surface of the electrode.

In (3) of FIG. 5, the roller electrode is mounted on the surface of the top electrode of the chip electronic component, and the electrical characteristics of the chip electronic component are measured in this state. In the process of moving the roller electrode from the state (2) of FIG. 5 to the state (3) of FIG. 5, damage (friction) is caused at and around the corner (the right corner in the figure) of the surface of the top electrode of the chip electronic component. Scratches) occur. At the same time, the metal oxide film (eg, tin oxide film that is an oxide of tin that is the electrode material) that had formed on the surface of the top electrode of the chip electronic component was partially peeled off, and the electrode material (usually tin) Is exposed. Also, non-conductive contaminants such as metal oxides such as tin oxide deposited on the surface of the roller electrode are partially peeled off by repeated contact of the roller electrode with the top electrode of the chip electronic component. Therefore, the electrical contact between the top electrode of the chip electronic component and the roller electrode is made smoother.

That is, in the process from the state of (2) to the state of (3) of FIG. 5, damage (friction scratch) occurs at one corner of the top electrode of the chip electronic component and the area around the top electrode. Since the non-conductive contaminants generated on the top electrode of the electronic component and the non-conductive contaminants deposited on the surface of the roller electrode are peeled off and removed, smooth operation of the top electrode and the roller electrode of the chip electronic component is achieved. Electrical contact is realized with high reliability. The process from the state (2) to the state (3) in FIG. 5 is substantially the same as the process from (a) to (b) in FIG.

After the measurement of the electrical characteristics of the chip electronic component in the state of (3) of FIG. 5, the roller electrode is moved from the top electrode of the chip electronic component and the transport disc as shown in (4) of FIG. Move away (upward in the figure).

After the roller electrode is separated from the top electrode of the chip electronic component to be in the state of (4) of FIG. 5, as shown in (5) of FIG. The part moves away from the electrical property measurement position. Therefore, when the method for measuring the electrical characteristics of the chip electronic component of the present invention is used, the corners on the other side of the electrode surface of the chip electronic component observed in the states of (b) to (c) of FIG. No damage will occur.

When the chip electronic component moves away from the electric characteristic measurement position, the roller electrode descends and returns to the position where it comes into contact with or comes close to the carrier plate again, as shown in (6) of FIG. ) To (6) will be repeated.

As described above, by measuring the electrical characteristics of the chip electronic component according to the method of the present invention, the damage (contact scratch) to the electrodes of the chip electronic component that occurs before and after the measurement operation of the electrical characteristics is reduced. It is also possible to remove non-conductive contaminants such as metal oxides generated on the surface of the electrodes of chip electronic parts and non-conductive contaminants accumulated on the roller electrodes of the roller electrode terminals. Become. Also, there is no substantial extension in the time required to measure the electrical characteristics.

FIG. 6 shows an elevating mechanism for a roller electrode terminal used in the method for continuously inspecting the electrical characteristics of a chip electronic component according to the present invention (from the state where the roller is in contact with the surface of the transport disc, the roller is the chip It is a figure explaining the example of the mechanism which moves in order to separate from the electrode surface of a component. (A) shows a state in which the roller electrode is in a lowered position (a position in contact with or close to the transport disk 11), and (b) shows a roller electrode in a raised position (position apart from the top electrode of the chip electronic component). Shows the state.

The roller electrode terminal lifting mechanism shown in FIG. 6 includes a case 131, a roller electrode 133, a roller electrode holder 135, a coil spring 137, and a cam 139. The connection cable and the connection terminal to the inspection device are not shown. By using the roller electrode terminal elevating mechanism of FIG. 6, it is possible to control the raising and lowering of the roller electrode 133 by swinging the cam 139 up and down.

In the present specification, a description will be given of the configuration of the chip electronic component inspection/sorting device, and the operation and effect of the present invention will be described by way of an example of the chip electronic component inspection/sorting device in which the chip electronic component transport discs are vertically arranged and operate. However, the chip electronic component inspection/sorting device used in the method for measuring the electrical characteristics of the chip electronic component of the present invention may be a device in which the chip electronic component transport disc is pivotally supported in a state of being inclined to the base. Further, as described above, a chip electronic component inspection/sorting device using a transport plate that moves in a straight line may be used instead of the transport disk that rotates.

10 Chip electronic component inspection/sorting device 11 Chip electronic component transport disc (transport disc)
11a through hole 12, 12a, 12b, 12c, 12d, 12e, 12f fixed electrode terminal 13 roller electrode terminal 13a, 13b, 13c, 13d, 13e, 13f movable electrode terminal 14a, 14b inspection device (capacitance meter)
15 Controller 19 Chip Electronic Component 19a, 19b, 19c, 19d, 19e, 19f Chip Electronic Component 22a, 22b Electrode 31 Chip Electronic Component Supply Port 41 Base 42 Center Shaft 43 Rotation Drive 45 Base Plate (Reference Base)
133 roller electrode

Claims (2)

A chip electronic component temporary accommodation hole of a carrier plate having a plurality of chip electronic component temporary accommodation holes is provided with chip electronic components equipped with electrodes at both ends facing each other, one electrode at the top and the other at the other end. Temporarily storing the terminal electrode of the so that it is located at the bottom;
Moving the carrier plate along the plane of its surface to the electrical property measuring position;
Applying a voltage by contacting each of the top electrode and bottom electrode of the chip electronic component with a terminal for measuring electrical characteristics, provided that the terminal for measuring electrical characteristics contacting the top electrode is a roller electrode terminal. Measuring the electrical characteristics of the;
And further moving the carrier plate along the plate plane to disengage the chip electronic component for which electrical characteristic measurement has been completed from the electrical characteristic measurement position;
A method for measuring electrical characteristics of a chip electronic component including
Until the chip electronic component moves and its top electrode starts contacting the roller electrode terminal, place the roller electrode terminal in a position in contact with one corner of the top electrode, and then after measuring the electrical characteristics. Is a method for measuring electrical characteristics of a chip electronic component, wherein the roller electrode terminal is moved in a direction away from the surface of the chip transport plate so as not to contact the other corner of the top electrode. 2. The method for measuring electrical characteristics of a chip electronic component according to claim 1, wherein the transport plate is a chip electronic component transport disc that rotates intermittently around the center.

Images