TWI636265B - Device for inspection and classification of characteristics of chip electronic parts - Google Patents

Abstract

An object of the present invention is to provide an apparatus for inspecting a wafer by contacting an electrode terminal with each electrode of a wafer electronic component having electrodes on opposite end faces of a wafer electronic component holding plate having a plurality of through holes. The electrical characteristics of the electronic component, and the device for classifying the measured electronic component of the wafer according to the inspection result, which can suppress the occurrence of contact damage of the electrode surface of the electronic component of the wafer due to contact with the electrode terminal for electrical property inspection. .

The solution of the present invention is to use a conductive fiber having a bundled Young's modulus in the range of 140 to 1000 GPa, a Vickers hardness of 7000 MPa or more, and a volume resistivity of 200 μΩcm or less, as an electrode terminal that is in contact with the electronic component of the wafer. Electrode terminals formed by superimposing them in a two-dimensional direction.

Description

Device for inspecting and classifying characteristics of chip electronic parts

The present invention relates to a device for arranging electronic components of a wafer having electrodes on opposite end faces for checking electrical characteristics and then classifying the electronic components of the wafer based on the results of the inspection.

With the increase in the production of electrical products represented by mobile phones, LCD TVs, and game machines, the production of electronic components for wafers incorporated into the above-mentioned electrical products has also increased remarkably. The chip electronic component is generally formed by a body portion and an electrode provided on opposite end faces of the body portion, and are well known in the art, such as a wafer capacitor (also referred to as a wafer capacitor) and a chip resistor ( A tiny electronic component including a wafer varistor) and a chip inductor.

In recent years, with the miniaturization of electrical products incorporating wafer electronic components and the increase in the number of electronic components of wafers assembled into electrical products, wafer electronic components have been further developed and miniaturized. For example, in recent years, as a wafer capacitor system, a capacitor having a very small size (for example, a size of 0.2 mm × 0.2 mm × 0.4 mm called a 0402 wafer) is used. With mass production, one batch can produce the above in units of tens of thousands to hundreds of thousands. Tiny chip electronic parts.

In order to reduce the defective rate caused by defects in electronic components of a chip, electrical products of the electronic components of the wafer are generally inspected for a large number of manufactured electronic components. For example, for the wafer capacitor system, the electrical characteristics such as electrostatic capacitance or leakage current are checked.

The inspection of the electrical characteristics of a large number of wafer electronic components must be performed at a high speed. As a device for performing the above-described high-speed inspection, generally, a wafer electronic having a disk (wafer electronic component holding plate) having a plurality of through holes formed therein is used. A device for inspecting and classifying features of a part (hereinafter also referred to as a chip electronic part inspection sorting device or an inspection sorting device). On the disk, a plurality of through holes for temporarily accommodating the electronic components of the wafer to be inspected are formed in a positional relationship close to each other. When the inspection and classification device is used, the wafer electronic component is housed in the through hole of the disk in a rotating state, and the pair of electrode terminals (inspection contacts) attached to the device are mounted on the wafer electronic component in the accommodated state. Each of the electrodes of the electronic component of the wafer is contacted to measure predetermined electrical characteristics of the electronic component of the wafer, and then the electronic component of the wafer is discharged from the disk according to the measurement result and the sorting operation is performed.

The device for inspecting and classifying the characteristics of the electronic components of the chip, that is, the inspection and sorting device for the electronic components of the wafer generally includes a disk-shaped electronic component holding plate (transporting disk) for temporarily accommodating in the opposite direction. Two or more through holes of the wafer electronic component having the electrodes on the end faces are formed at positions close to each other; a pair of electrode terminals are arranged At a position close to the two opening portions of the through holes of the electronic component holding plate of the wafer; the inspector is electrically connected to the pair of electrode terminals respectively; and the controller is electrically connected to the inspector for the inspection And a classification system for classifying and accommodating the electronic components of the wafer that have been inspected according to the difference in electrical characteristics of the inspection, by contacting a pair of electrode terminals Each electrode of the electronic component of the wafer is applied to the electronic component of the wafer accommodated in the through hole by the voltage for inspection transmitted from the inspection device to the electrode terminal, and the voltage of the inspection can be applied to each electronic component of the wafer by using each inspection device. The current value produced. In addition, in recent years, in order to improve the inspection speed of electronic components of wafers, the apparatus for inspecting and classifying the characteristics of electronic components for wafers has been conventionally arranged such that the tip end portion of the electrode terminal is fixedly disposed with the transporting disc and the transporting circle. The surface of the disk is in a close state, and the tip end portion of the electrode terminal is rubbed against the electrodes of the electronic component of the wafer which are sequentially moved by the rotation of the carrier disk, and the electrical characteristics are measured.

In the case where an inspector for electrostatic capacitance inspection using a wafer capacitor is used as an inspector, a test voltage having a predetermined frequency is applied from a checker to a wafer capacitor (wafer electronic component). Then, by using the inspector, the current value of the current generated in the wafer capacitor due to the application of the voltage for inspection is detected, and the current value of the voltage for the inspection and the current value of the measured current are used as the inspection target. Inspection (measurement) of the electrostatic capacitance of the chip capacitor. As an inspector for the electrostatic capacitance of the wafer capacitor, for example, a commercially available electrostatic capacitance measuring device can be used (for example, a capacitance meter: E4981A, Agilent Technologies (Company)) system. In the case of an inspector for leak current inspection using a wafer capacitor, the same as the inspection of the electrostatic capacitance, the DC voltage for inspection is applied to the wafer capacitor from the inspector, and the flow of the wafer capacitor is detected (measured) by the inspector. The method of DC current. As the inspector for the leakage current of the wafer capacitor, for example, a commercially available insulation resistance tester (for example, a high resistance meter: 4349B, manufactured by Agilent Technologies, Inc.) can be used.

Patent Document 1 proposes a circuit component processor that tests (checks) a plurality of circuit components (for example, chip electronic components) and classifies the circuit components based on the test results. The circuit component processor includes a disk test plate (wafer electronic component holding plate), and a plurality of component tables (through holes); an upper contact and a lower contact (a pair of electrode terminals) are disposed in Each part table of the test board is in an approximate position; and a tester (inspector) is electrically connected to each contact. In the test plate, four component stages are arranged in a row at a distance between the center and the outer peripheral edge in the radial direction, and 72 rows are provided in the circumferential direction. In the state in which the test piece was rotated and the circuit component was housed in the component table (through hole), the circuit component was tested as a group of a plurality of circuit components housed in the respective stages. As the electrode terminal of the component processor, a leaf spring-shaped electrode terminal is used, and the contact with the electrode of the wafer electronic component in the moving state can be simultaneously rubbed.

Patent Document 2 discloses a device for inspecting electrical characteristics of a wafer-shaped electronic component (wafer electronic component), and classifying the wafer-shaped electronic component based on the inspection result, wherein The contact member for inspection of gas characteristics is a brush electrode formed by bundling a plurality of thin wires composed of an alloy of palladium, silver, platinum, and gold, or a thin wire coil composed of the above alloy. A roller electrode attached to a roller of an insulating material. According to the description of the patent document, it is possible to reduce the terminal electrode (the electrode provided in the opposite end faces of the wafer electronic component) and the inspection contact member of the wafer electronic component by using the inspection contact member including the electrode. Contact damage (scratch) of the surface of the terminal electrode caused by the contact. Further, the brush electrode specifically described in the patent document is a brush having a wire shape of 0.2 mm and having an alloy wire made of palladium, silver, platinum, and gold arranged in a line along the plane of the plate of the brush mounting plate. Electrode.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 2000-501174

[Patent Document 2] JP-A-2006-194831

In the apparatus for inspecting the electrical characteristics of the electronic components of the wafer and classifying the electronic components of the wafer based on the inspection results, the brush electrode or the roller electrode composed of the material described in Patent Document 2 is used as the use. Inspecting the contact for inspection of the electrical characteristics, the electrode of the electronic component of the wafer to be inspected is connected to the contact for inspection. The contact damage caused by the contact on the surface of the electrode.

However, when the wafer electronic component to be inspected is formed into a very small size as described above (for example, a size of 0.2 mm × 0.2 mm × 0.4 mm which is called a 0402 wafer), the electrode surface of the electronic component of the wafer is generated. The area of the contact damage with respect to the surface of the electrode becomes large and there is a problem that it is easy to become conspicuous. Since the wafer electronic component of the electrode having the above-mentioned contact damage is not good in appearance, and the solder wettability is lowered when the electrode of the electronic component of the wafer has a large contact damage, it is mounted on various substrates. I am afraid that it will be the cause of the problem.

Accordingly, an object of the present invention is to provide an apparatus for inspecting and classifying characteristics of a wafer electronic component, which is capable of inspecting a wafer electronic component of a very small size such as a wafer of 0402 or an electrical characteristic of a chip electronic component that is smaller. Further reducing because the electrodes of the electronic component of the wafer are in contact with the contact for inspection (the contact for inspection is in contact with the electrode of the electronic component of the wafer held by the electronic component holding plate of the wafer under high-speed rotation or in a running state) The occurrence of contact damage (scratches) on the electrode surface of the wafer electronic component.

In order to solve the above problems, the inventors of the present invention have found that the device for inspecting and classifying the characteristics of the wafer electronic component (hereinafter referred to as a wafer electronic component inspection device or a wafer electronic component inspection and classification device) is used. Contact for inspection (electrode end) By using a bundled Young's modulus in the range of 140 to 1000 GPa, a Vickers hardness of 7000 MPa or more, and a volume resistivity of 200 μΩcm or less (any one is measured at 20 ° C). An electrode terminal formed by superposing a conductive fiber in a two-dimensional direction (a two-dimensional direction on a plane intersecting the longitudinal direction of the fiber) or by using a bundle of conductive amorphous alloy material fibers The above problems can be solved by superposing the electrode terminals formed in the two-dimensional direction.

Therefore, the apparatus of the present invention is an apparatus for inspecting and classifying characteristics of a wafer electronic component, comprising: a wafer electronic component holding plate for temporarily accommodating two or more wafer electronic components each having an electrode on opposite end faces; The through holes are formed at positions close to each other; the pair of electrode terminals are disposed at positions close to the two openings of the respective through holes of the electronic component holding plate of the wafer; and the inspectors are electrically connected to the pair of electrode terminals, respectively a controller, electrically connected to the inspector for supplying the inspector with a signal regarding electrical characteristics of the inspection object of the electronic component of the chip; and a classification system, according to the inspection of the electrical characteristics of the inspection The electronic components of the wafer are sorted and housed, and by bringing the pair of electrode terminals into contact with the respective electrodes of the electronic component of the wafer, the voltage for inspection transmitted from the inspector to the electrode terminal is applied to the electronic component of the wafer accommodated in the through hole, by application The voltage for inspection can be used to measure the current value generated in each electronic component of the chip by using each inspector, and is characterized by the above At least one of the pair of electrode terminals has a Young's modulus of 140 to 1000 GPa (preferably 140 to 500 GPa), a Vickers hardness of 7000 MPa or more, and a volume resistivity of 200 μΩcm or less (any one is at 20 ° C). Under test The conductive fibers of the respective values are superposed on the electrode terminals formed in the two-dimensional direction. Further, the Vickers hardness is preferably 12,000 MPa or less.

Further, the apparatus for inspecting and classifying the characteristics of the electronic component of the wafer of the present invention includes a wafer electronic component holding plate for temporarily accommodating two or more through holes of the wafer electronic component each having an electrode on the opposite end faces. Formed at positions close to each other; a pair of electrode terminals are disposed at positions close to the two openings of the through holes of the electronic component holding plate of the wafer; and the inspectors are electrically connected to the pair of electrode terminals; a controller electrically connected to the inspector for supplying the inspector with a signal regarding electrical characteristics of the inspection object of the electronic component of the chip; and a classification system for classifying the inspected electronic component of the wafer according to the checked electrical characteristic And accommodating, by bringing the pair of electrode terminals into contact with the respective electrodes of the chip electronic component, the inspection voltage transmitted from the inspection device to the electrode terminal is applied to the wafer electronic component housed in the through hole via the pair of electrode terminals, By applying the voltage for inspection, it is possible to measure the current value generated in each of the electronic components of the wafer by using each of the inspectors. It is characterized in that at least one of the pair of electrode terminals has a bundle bundle average diameter of 10 to 200 μm, a Young's modulus of 140 to 1000 GPa, a Vickers hardness of 7000 MPa or more, and a volume resistivity of 200 μΩcm or less. The amorphous alloy material fibers are respectively laminated on the electrode terminals formed in the two-dimensional direction.

In the present specification, the bundled conductive fibers (or the conductive amorphous alloy material fibers) are formed by superposing them in a two-dimensional direction, respectively, by bundling a plurality of fibers so that the fibers are along the fibers. Longitudinal direction It is formed by overlapping planes and overlapping in two dimensions. Therefore, at least 4 fibers are required.

A preferred aspect of the wafer electronic component inspection and sorting apparatus of the present invention is as follows.

(1) The average diameter of the conductive fiber or the conductive amorphous alloy material fiber is in the range of 10 to 200 μm.

(2) The conductive fiber or the conductive amorphous alloy material fiber has an average diameter of 120 μm or less.

(3) The conductive fiber or the conductive amorphous alloy material fiber has an average diameter of 50 μm or less.

(4) A conductive fiber or a conductive amorphous alloy material fiber having a cross section of a perfect circle, an ellipse, a convex lens shape, or a rectangular shape.

(5) A fiber of a conductive fiber-based amorphous alloy material.

(6) The amorphous alloy material is a Co-Fe-Cr-Si-B alloy system or a Co-Fe-Cr-Mo-Si-B alloy system.

(7) The conductive fiber or the conductive amorphous alloy material fiber is bundled in a state in which it is riveted by a conductive material.

(8) The conductive fiber or the conductive amorphous alloy material fiber is disposed in contact with the surface of the electrode layer of the wafer electronic component by an angle of 30 degrees or less perpendicular or perpendicular.

In the present specification, the average diameter of the fibers means the average of the width (or thickness) of the fibers. In the case where the cross section of the fiber is not a perfect circle or a substantially perfect circle, it means the maximum diameter of each of the two dimensions (thickness direction). Average.

By using the wafer electronic component inspection sorting apparatus of the present invention, even a wafer electronic component of a very small size such as a 0402 wafer (0.2 mm × 0.2 mm × 0.4 mm) which has become mainstream in recent years, or a chip electronic component of a smaller size, When it is inspected, it is also possible to effectively suppress the occurrence of contact damage of the electrode surface of the electronic component of the wafer due to contact with the inspection contact of the apparatus. Further, in order to improve the durability of the inspection contact member used in the wafer electronic component inspection and classification device of the present invention, it is possible to carry out long-term (that is, a plurality of times of continuous) wafer electronic parts with high reliability. Check the operation. Therefore, compared with the prior art, the continuous use time of the inspection contact member (the time until the inspection contact member must be exchanged due to abrasion or mechanical damage) can be lengthened (extended).

10‧‧‧Chip electronic component inspection and classification device (inspection device or inspection and classification device)

11‧‧‧ wafer electronic parts holding board

11a‧‧‧through hole

12a, 12b‧‧‧electrode terminals (contacts for inspection)

14a, 14b‧‧‧ inspector

15‧‧‧ Controller

15a‧‧‧Control system

19‧‧‧Wafer capacitors (wafer electronic parts)

19a, 19b, 19c‧‧‧ wafer capacitors (wafer electronic parts)

19d, 19e, 19f‧‧‧ wafer capacitors (wafer electronic parts)

21‧‧‧ Capacitor body

22a, 22b‧‧‧ electrodes

23a, 23b‧‧‧Switch

31‧‧‧Whip electronic parts storage unit (housing area)

32‧‧‧Whip electronic parts inspection department (inspection area)

33‧‧‧Distribution of chip electronic parts (discharge area)

41‧‧‧Abutment

42‧‧‧ center axis

43‧‧‧Rotary drive

44‧‧‧ wafer electronic parts holding cover

45‧‧‧Substrate

45a‧‧‧ gas discharge path

45b‧‧‧ gas supply path

46‧‧‧ gas discharge device

47‧‧‧Whip electronic component supply device (part supply device)

49‧‧‧ indicates the direction of rotation of the electronic component holding plate of the wafer

51‧‧‧Cylinder

53‧‧‧Electrode terminal support plate

51‧‧‧Direct drive

61‧‧‧ Pipe support cover

61a‧‧‧through hole

62‧‧‧ Pipe fittings

63‧‧‧ Pressurized gas supply device

64‧‧‧Whip electronic parts storage container

71‧‧‧Electrode terminal (contact for inspection)

72‧‧‧Rives

73‧‧‧Electrode terminal holder

74‧‧‧Inspection electrode unit

75‧‧‧ Conductive connecting plate

76‧‧‧ pin jack

Fig. 1 is a perspective view showing a structural example of a wafer electronic component (for example, a wafer capacitor) to be inspected.

Fig. 2 is a front elevational view showing an example of the structure of the wafer electronic component inspection and classification device of the present invention.

3 is a wafer electronic component of the wafer electronic component inspection sorting device 10 of FIG. 2 along the circumferential direction of the wafer electronic component holding plate 11. An enlarged cross-sectional view of the accommodating portion (wafer electronic component housing region) 31 is cut.

Fig. 4 is an enlarged cross-sectional view showing the wafer electronic component inspection unit (wafer electronic component inspection region) 32 of the wafer electronic component inspection and sorting device 10 of Fig. 2 cut along the diameter direction of the wafer electronic component holding plate 11.

Fig. 5 is an enlarged cross-sectional view showing the wafer electronic component discharge portion (wafer electronic component discharge region) 33 of the wafer electronic component inspection and sorting device 10 of Fig. 2 cut along the diameter direction of the wafer electronic component holding plate 11.

Fig. 6 is a block diagram schematically showing an electrical connection state of the electronic component inspection and sorting device 10 of the wafer of Fig. 2;

Fig. 7 is a perspective view showing a structural example of an electrode terminal (inspection contact member) used in the present invention.

Fig. 8 is a front view of the electrode terminal of Fig. 7.

Fig. 9 is a left side view of the electrode terminal of Fig. 7.

Fig. 10 is an inspection electrode unit to which the electrode terminal of Fig. 7 is attached.

Fig. 11 is a view showing a state in which the electrical characteristics of the electronic components of the wafer housed in the electronic component holding sheet of the wafer are measured using the inspection electrode unit of Fig. 10.

Hereinafter, the present invention will be described with reference to the attached drawings. A structural example of a wafer electronic component inspection sorting device. In addition, the wafer electronic component inspection and classification device of the present invention is improved in comparison with the inspection contact member (electrode terminal) provided in the various chip electronic component inspection and classification devices used in the conventional technology. The following descriptions other than the description of the (electrode terminal) will be described using a representative structure of the wafer electronic component inspection and classification device used in the prior art.

Fig. 1 is a perspective view showing a structural example of a wafer electronic component (for example, a wafer capacitor) to be inspected. The chip electronic component 19 of Fig. 1 is composed of a capacitor body 21 composed of a dielectric body and a pair of electrodes 22a and 22b provided to face opposite ends thereof. The wafer capacitor 19 is a wafer ceramic capacitor using ceramic as a dielectric. In addition, the electrode surface of a typical wafer electronic component forms a solder layer for mounting the wafer electronic component.

Fig. 2 is a front elevational view showing a configuration example of a wafer electronic component inspection and sorting apparatus of the present invention. Fig. 3 is an enlarged cross-sectional view showing the wafer electronic component housing portion 31 of the apparatus 10 of Fig. 2 cut along the circumferential direction of the wafer electronic component holding plate 11 (in a state in which the wafer electronic component 19 is housed). Fig. 4 is an enlarged cross-sectional view showing the wafer electronic component inspection unit 32 of the apparatus 10 of Fig. 2 cut along the diameter direction of the wafer electronic component holding plate 11. Fig. 5 is an enlarged cross-sectional view showing the wafer electronic component discharge portion 33 of the apparatus 10 of Fig. 2 cut along the diameter direction of the wafer electronic component holding plate 11. Fig. 6 is a block diagram schematically showing the electrical connection state of the device 10 of Fig. 2.

Inspection of wafer electronic parts as shown in Figures 2 to 6 The device 10 is configured by a wafer electronic component holding plate 11 in which two or more through holes 11a capable of temporarily accommodating a wafer electronic component (for example, a wafer capacitor) are formed on each other in a disk-shaped material. The pair of electrode terminals 12a and 12b are disposed at positions close to the two opening portions of the respective through holes 11a of the wafer electronic component holding plate 11; the inspectors 14a and 14b are respectively paired with the pair of electrode terminals 12a. 12b is electrically connected; and the controller 15 is electrically connected to the inspector for supplying the inspector with a signal regarding the inspection process.

The signal supplied from the controller 15 to the inspector is a signal for the inspection voltage applied to each of the wafer capacitors by the inspector, and as a representative example, a signal for instructing the start of application of the voltage for inspection.

The signal relating to the inspection process supplied from the controller 15 to the inspector is a signal relating to the inspection of the electrical characteristics of the wafer capacitor by the inspector, as an example of the representative example: for instructing the start of detection by application from the inspection The signal of the current value of the current generated by the capacitors in each of the wafer capacitors is checked.

The wafer electronic component inspection and sorting device 10 is configured such that wafer electronic components housed in the two or more through holes 11a are respectively received from the inspectors 14a and 14b via the electrode terminals 12a and 12b at predetermined timings (for example, as shown in FIG. 4). The wafer capacitors 19a, 19b, 19c, 19d, 19e, and 19f) apply a predetermined inspection voltage, and the inspector detects the current value generated in the wafer electronic component by applying the inspection voltage.

In the wafer electronic component inspection and sorting device 10, the inspectors 14a and 14b which are respective electrical characteristics of the wafer electronic components are, for example, An inspector that uses an electrostatic capacitor (electrical characteristics).

In the chip electronic component inspection and sorting apparatus 10, the controller 15 is provided with a control system 15a for controlling the period of application of the inspection voltage to the wafer electronic components housed in the two or more through holes 11a of the wafer electronic component holding plate 11. .

The above-mentioned "control system" means "a computer including a program recorded therein, which is a period in which a voltage can be applied to control a wafer capacitor of two or more through holes accommodated in the electronic component holding plate of the wafer.

In the wafer electronic component inspection and sorting apparatus 10 shown in Fig. 6, three electronic components (wafer capacitors) are electrically connected to one inspector. The inspector 14a is electrically connected to the three wafer capacitors 19a, 19b, and 19c via the switch 23a. Further, the inspector 14b is electrically connected to the three wafer capacitors 19d, 19e, and 19f via the switch 23b.

Further, the control system including the controller 15 is for controlling the period during which the inspection voltage is applied to the chip electronic component (wafer capacitor) from the inspector.

Representative examples of the electronic component to be inspected by the wafer electronic component inspection and classification device of the present invention include a wafer capacitor, a wafer resistor (including a wafer varistor), and a wafer inductor.

The electrical characteristics of the electronic component inspected by the wafer electronic component inspection and sorting apparatus of the present invention means a voltage which can be applied to the inspection voltage (alternating voltage or direct current voltage) applied to the electronic component of the wafer. The value and the electrical characteristic determined by the current value of the alternating current or direct current flowing through the electronic component of the wafer by applying the voltage for inspection.

Examples of the electrical characteristics examined when the AC voltage is used as the voltage for inspection include electrostatic capacitance (capacitance), inductance, impedance, and admittance. Examples of the electrical characteristics examined when the DC voltage is used as the voltage for inspection include insulation resistance and leakage current.

Further, the type of the chip electronic component to be measured and the electrical characteristics to be measured do not necessarily have to be one-to-one correspondence. For example, it is also possible to measure the electrostatic capacitance of the wafer electronic component other than the above wafer capacitor (specifically, a capacitor representing an equivalent circuit of the wafer electronic component other than the wafer capacitor). For example, the electrostatic capacitance of the wafer varistor can also be measured.

The wafer electronic parts to be inspected are those which have predetermined predetermined electrical characteristics by being manufactured according to the same specifications.

Therefore, although the above-mentioned wafer electronic components to be inspected are manufactured by the same manufacturing lot, a plurality of other wafer electronic components may be mixed in the wafer electronic parts of the same manufacturing lot. However, the wafer electronic parts of the manufacturing lot of each other must be manufactured according to the same specifications and have the same electrical characteristics to each other (usually manufactured to be the same product for the purpose of sale).

For example, the wafer electronic components to be inspected are individually housed in a plurality of through holes 11a of the wafer electronic component holding plate 11 of the wafer electronic component inspection and sorting device 10, and are placed at positions close to each other.

Next, an electrode terminal (inspection contact) used in the wafer electronic component inspection and classification device of the present invention will be described. The electrode terminal used in the present invention is a bundle of a plurality of (at least four or more) Young's modulus in the range of 140 to 1000 GPa, a Vickers hardness of 7000 MPa or more, and a volume resistivity of 200 μΩcm or less, or conductive. The amorphous amorphous material fibers are each formed by superposing on a plane intersecting the longitudinal direction of the fibers in a direction formed in a two-dimensional direction.

7 to 9 are views showing a structural example of an electrode terminal used in the electronic component inspection and classification device for a wafer of the present invention (Fig. 7 is a perspective view of the electrode terminal, and Figs. 8 and 9 are Figure 7 shows the front and left side of the electrode terminals). The electrode terminal 71 illustrated in FIGS. 7 to 9 bundles a plurality of conductive fibers or conductive amorphous alloy material fibers so as to be superposed in a two-dimensional direction, respectively, and by a riveting device 72. Riveted and fixed.

The electrode terminal 71 which is riveted by the caulking tool 72 shown in Fig. 7 is held by the electrode terminal holder 73 as shown in Fig. 10 to be the inspection electrode unit 74. That is, the rear end portion of the rivet 72 is attached to the electrode terminal holder 73 in a state of being electrically connected to the conductive connecting plate 75, and then the conductive connecting plate 75 is connected to the connecting device as an inspection device. The pin jacks 76 are electrically connected to form the inspection electrode unit 74.

In the inspection electrode unit 74 of Fig. 10, as shown in Fig. 11, the front end portion of the electrode terminal 71 is on the surface of the wafer electronic component holding plate in a state of being connected to the inspector via the pin insertion hole (usually Is a position near the surface side (or the front side) (that is, a position in contact with the electrode surface of the wafer electronic component that is rotated in a state of being accommodated in the through hole of the wafer electronic component holding plate), and is preferably configured Forming: contact with the electrode surface of the electronic component of the wafer housed on the electronic component holding plate of the wafer by an angle of 30 degrees or less from the vertical or from the vertical.

The conductive fiber constituting the electrode terminal of the present invention is preferably a fiber of an amorphous alloy material. The amorphous alloy material is preferably a Co-Fe-Cr-Si-B alloy system or a Co-Fe-Cr-Mo-Si-B alloy system. The fiber made of the above amorphous alloy material is sold under the trade name "UNITIKA". (BOLFUR) is selling.

The conductive fiber or the conductive amorphous alloy material fiber constituting the electrode terminal of the present invention preferably has an average diameter (diameter) of 200 μm or less, more preferably 120 μm or less, and particularly preferably 50 μm or less. Further, although the average diameter of the conductive fiber or the conductive amorphous alloy material fiber has no lower limit, a fiber of 10 μm or more is usually used. The cross-sectional shape of the conductive fiber or the conductive amorphous alloy material fiber is not particularly limited, and for example, a fiber having a substantially perfect circular cross section, an elliptical shape, a convex lens shape, or a rectangular shape is used. In addition, the average diameter of the fibers refers to the average of the width (or thickness) of the fibers. In the case where the cross section of the fiber is not a perfect circle or a substantially perfect circle, it means an average value of the respective maximum diameters in the two-dimensional direction. When the cross section of the fiber is a rectangle, it is made into an approximately perfect circle, and the diameter of the perfect circle is determined as the average diameter.

Next, a preferred aspect of the wafer electronic component inspection and sorting apparatus of the present invention will be described in detail.

The wafer electronic component holding plate 11 included in the electronic component inspection and sorting apparatus 10 shown in FIG. 2 is not particularly limited in shape, but is generally formed into a disk shape.

The two or more through holes 11a of the chip electronic component holding plate 11 are disposed on the surface of the chip electronic component holding plate, and the concentric circles are equally divided at a plurality of concentric circles.

The wafer electronic component inspection apparatus 10 shown in the drawings is a method of arranging six wafer electronic components each having a total of six through holes arranged in the diameter direction between the center and the periphery of the electronic component holding plate 11 of the wafer. Inspection of the electrical characteristics of the wafer capacitor. The number of the through holes arranged in the radial direction between the center and the periphery of the wafer electronic component holding plate 11 is preferably in the range of 2 to 20, more preferably 4 to 12.

The disk-shaped wafer electronic component holding plate 11 is rotatably provided (fixed) to the base 41 via the substrate 45 and the center shaft 42, and is actuated by the rotation driving device 43 disposed on the back side thereof. The rotation is intermittently around the center shaft 42. Further, the "internal rotation of the wafer electronic component holding plate 11" means that each of the two through holes adjacent to each other in the rotational direction (rotational circumferential direction) of the electronic component holding plate 11 of the wafer is in contact with the electronic component holding plate of the wafer. The angle (an acute angle) formed by the two straight lines connected by the rotation center position of 11 is rotated.

Each of the through holes of the wafer electronic component holding plate 11 temporarily accommodates a wafer capacitor (wafer electronic component) to be inspected in the chip electronic component housing portion 31 for inspection of electrical characteristics thereof.

As shown in FIG. 3, the chip electronic component housing portion 31 is attached to A wafer electronic component holding cover 44 is provided on the front surface side of the wafer electronic component holding plate 11 or the front side of the device (the left side in FIG. 3). The substrate 45 is provided on the inner surface side of the wafer electronic component holding plate 11 or on the rear side of the device (the right side in FIG. 3). The substrate 45 is formed with a plurality of gas discharge passages 45a which are open on the surface of the wafer electronic component holding plate 11 side. Each of the gas discharge passages is connected to a gas discharge device (representative example: vacuum pump) 46. When the gas discharge device 46 is actuated, the gas is exhausted from the gas discharge passage 45a, so that a gap between the wafer electronic component holding plate 11 and the substrate 45 is decompressed (formed as a pressure smaller than atmospheric pressure).

Thereafter, while the wafer electronic component holding plate 11 is intermittently rotated in the direction indicated by the arrow 49 shown in FIG. 3, the wafer capacitor 19 is supplied to the chip electronic component by the chip electronic component supply device (Fig. 2: 47). The inside of the outer cover 44 is held, and the gas discharge device 46 is actuated to form a gap between the wafer electronic component holding plate 11 and the substrate 45 in a reduced pressure state. Thereby, the wafer capacitors are temporarily housed in the respective through holes 11a of the wafer electronic component holding plate 11. Further, since the gap between the wafer electronic component holding plate 11 and the substrate 45 is formed in a reduced pressure state, even the wafer electronic component 19 housed in the wafer electronic component holding plate 11 is moved to the uppermost gas discharge path than in FIG. In the case where the 45a is located further above, there is no possibility that the chip electronic component 19 is escaping from the through hole 11a and falling.

The wafer that is accommodated in the through hole of the electronic component holding plate of the wafer by the intermittent rotational movement of the wafer electronic component holding plate 11 The capacitor is transported to the chip electronic component inspection unit 32 of the wafer electronic component inspection and sorting device 10 shown in Figs. 2 and 4 .

As shown in FIG. 4, since the wafer capacitor is electrically connected to the inspector having electrical characteristics, a pair of electrode terminals 12a and 12b are disposed at positions close to the two openings of the through hole 11a of the wafer electronic component holding plate.

The electrode terminal 12a is fixed to the substrate 45 via a cylindrical body 51 of an electrical insulator disposed around the electrode terminal. The surface of the electrode terminal 12a and the substrate 45 on the side of the wafer electronic component holding plate 11 is formed into a smooth flat surface by, for example, polishing.

The electrode terminal 12b is fixed to the electrode terminal support plate 53. The electrode terminal support plate 53 is fixed to the direct drive device (54 of Fig. 2).

When the electrode terminal support plate 53 is moved to the wafer electronic component holding plate 11 side by the operation of the direct drive device, the electrode terminal 12b supported by the electrode terminal support plate 53 is moved to the wafer electronic component holding plate 11 side. Thus, the wafer capacitor is held between the electrode terminals 12a, 12b. Next, the electrode 22a of the wafer capacitor is electrically connected to the electrode terminal 12a, and the electrode 22b is electrically connected to the electrode terminal 12b. Thereby, the wafer capacitor is electrically connected to the inspector via the pair of electrode terminals 12a and 12b.

In addition, the two open portions of the respective through holes of the wafer electronic component holding plate in which the pair of electrode terminals are disposed are "close to each other" when the chip electronic components are accommodated in the respective through holes, and the respective electrode terminals and the respective wafers Electricity When the electrodes of the sub-parts are electrically connected to each other or when the electrode terminals are configured to be movable, the positions of the electrodes of the electronic components of the wafer can be electrically connected by moving the respective electrode terminals.

After that, the wafer electronic component inspection unit 32 performs predetermined electrical operations on the six wafer capacitors 19a, 19b, 19c, 19d, 19e, and 19f that are arranged in a row in the radial direction of the wafer electronic component holding plate 11. Inspection of characteristics.

The wafer capacitors after the electrical characteristics are inspected are transported to the wafer electronic parts of the wafer electronic component inspection and sorting device 10 shown in FIGS. 2 and 5 by intermittent rotational movement by the wafer electronic component holding plate 11. The discharge portion 33.

As shown in Fig. 5, the chip electronic component discharge portion 33 is provided with a tube supporting cover 61 in which a plurality of through holes 61a are formed on the front surface side of the wafer electronic component holding plate 11 or the front side of the device (the left side in Fig. 5). . The through holes 61a of the tube support housing 61 are each connected to a tube member 62 constituting a passage of a wafer capacitor (for example, the wafer capacitor 19a). However, in Fig. 2, only a part of the tube member 62 which is connected to each of the through holes 61a of the tube supporting outer cover 61 is shown.

Further, the substrate 45 disposed on the back side of the wafer electronic component holding board 11 or the rear side of the apparatus (on the right side in FIG. 5) is formed with a plurality of gas supply passages 45b on the side of the wafer electronic component holding plate 11 The surface is open. Each of the gas supply passages 45b is connected to the pressurized gas supply device 63.

When the pressurized gas supply device 63 is actuated, it will be pressurized The gas is supplied to the gas supply path 45b, for example, by injecting pressurized gas into the wafer capacitor 19a accommodated in the through hole 11a of the wafer electronic component holding plate 11. Thereby, the wafer capacitor is discharged to the tube member 62.

For example, the wafer capacitor 19a passes through a total of ten through holes 61a which are formed on the outermost peripheral side of the plurality of through holes 61a of the tube supporting cover 61 shown in Fig. 2 . The ten through holes 61a are connected to the chip electronic component storage container 64 via the tube member 62, respectively.

Therefore, the wafer capacitor 19a is accommodated in the wafer electronic device for sorting and accommodating through a total of ten tubes 62 connected to the ten through holes 61a of the tube supporting cover 61 in response to the electrical characteristics after the inspection. The component housing container 64.

[Examples] [Comparative example]

An alloy based on palladium, silver, platinum, or gold described in Japanese Patent Laid-Open Publication No. Hei. No. 2006-194831 (palladium: silver: platinum: gold: copper + zinc = 35%: 30%: 10%) : 10%: 15%) The wire (wire diameter: 0.2 mm, Vickers hardness: about 300 MPa, Young's coefficient: 119 GPa) was used as the electrode terminal (brush electrode terminal), and the electrode terminal was used as the upper terminal. An apparatus mounted on the electronic component inspection and sorting apparatus of the wafer shown in FIG. 2 was produced, and the electrical characteristics of the wafer electronic component (0402 wafer) were inspected by the apparatus. Providing the upper electrode end of the electrode for accommodating (temporarily mounting) the electronic component of the wafer carrying the disk The contact pressure of the sub-system was made 30 g.

After continuously inspecting the inspection of 600,000 electronic components of the wafer, the surface of the electrode of the electronic component of the wafer after the inspection was observed by a microscope, and the contact mark with the electrode terminal of the groove was observed. Further, although the state of the tip end portion of the brush electrode terminal was also observed visually, no particularly conspicuous wear was observed.

[Examples]

Bundle of conductive amorphous alloy material (BOLFUR sold by UNITIKA (alloyed with Co, Fe, Cr, Si, B as the main component, Vickers hardness: about 8720MPa, Young's coefficient: 157 GPa, wire diameter: 30 μm) is used as an electrode terminal (brush electrode terminal), and the electrode terminal is used as an upper terminal to fabricate the device mounted on the electronic component inspection and classification device shown in FIG. 2, and The electrical characteristics of the wafer electronic component (0402 wafer) were examined using the device under the same conditions as in the comparative example.

After continuously inspecting the inspection of 600,000 electronic components of the wafer, the surface of the electrode of the electronic component of the wafer after the above inspection was observed by a microscope, and no contact mark with the electrode terminal was observed. Further, although the state of the tip end portion of the brush electrode terminal was also observed visually, no particularly conspicuous wear was observed.

Claims (8)

An apparatus for inspecting and classifying characteristics of a chip electronic component, comprising: a wafer electronic component holding plate, wherein two or more through holes of a wafer electronic component each having an electrode on an opposite end surface are formed in close proximity to each other a position is formed; a pair of electrode terminals are disposed at positions close to the two opening portions of the through holes of the electronic component holding plate of the wafer; and the inspectors are electrically connected to the pair of electrode terminals; the controller, and the controller The inspector is electrically connected to the inspector for supplying electrical signals related to the electrical characteristics of the inspection object of the electronic component of the chip; and a sorting system for classifying the electronic components of the wafer that have been inspected according to the difference in the electrical characteristics of the inspection and In the case of accommodating, the pair of electrode terminals are brought into contact with the respective electrodes of the electronic component of the wafer, so that the voltage for inspection transmitted from the inspector to the electrode terminal is applied to the electronic component of the wafer accommodated in the through hole, and the voltage for the inspection can be utilized. The inspector measures the current value generated in each of the electronic components of the chip, and is characterized in that: at least one of the pair of electrode terminals One of the conductive fibers having a Young's modulus in the range of 140 to 1000 GPa, a Vickers hardness of 7,000 MPa or more, and a volume resistivity of 200 μΩcm or less is bundled so as to be superposed on the two ends from the base portion to the front end portion of the fiber. The electrode terminal formed by the direction. An apparatus for inspecting and classifying characteristics of a wafer electronic component according to the first aspect of the invention, wherein the conductive fiber has an average diameter of 10 to 200 μm. A device for inspecting and classifying characteristics of a chip electronic component according to the first aspect of the invention, wherein the conductive fiber is electrically conductive The material is bundled in a state where it is riveted. The apparatus for inspecting and classifying the characteristics of the electronic component of the wafer according to the first aspect of the invention, wherein the conductive fiber is disposed at an angle of 30 degrees or less from the vertical or from the electrode of the electronic component of the wafer. Surface contact. The apparatus for inspecting and classifying the characteristics of the electronic component of the wafer according to any one of the first to fourth aspects of the invention, wherein the conductive fiber is a fiber made of a conductive amorphous alloy material. An apparatus for inspecting and classifying characteristics of a chip electronic component, comprising: a wafer electronic component holding plate, wherein two or more through holes of a wafer electronic component each having an electrode on an opposite end surface are formed in close proximity to each other a position is formed; a pair of electrode terminals are disposed at positions close to the two opening portions of the through holes of the electronic component holding plate of the wafer; and the inspectors are electrically connected to the pair of electrode terminals; the controller, and the controller The inspector is electrically connected to the inspector for supplying electrical signals related to the electrical characteristics of the inspection object of the electronic component of the chip; and a sorting system for classifying and accepting the inspected electronic components of the wafer according to the checked electrical characteristics, By bringing the pair of electrode terminals into contact with the respective electrodes of the chip electronic component, the inspection voltage transmitted from the inspection device to the electrode terminal is applied to the wafer electronic component housed in the through hole via the pair of electrode terminals, and the inspection is performed by applying the inspection The voltage can be used to measure the current value generated in each chip electronic component by using each inspector, which is characterized by: At least one of the pair of electrode terminals has an average diameter of 10 to 200 μm, a Young's modulus of 140 to 1000 GPa, a Vickers hardness of 7000 MPa or more, and The conductive amorphous alloy material fiber having a volume resistivity of 200 μΩcm or less is bundled into electrode terminals each of which is superposed on the two-dimensional direction from the base portion to the tip end portion of the fiber. The apparatus for inspecting and classifying the characteristics of the electronic component of the wafer according to the sixth aspect of the invention, wherein the conductive amorphous alloy material fiber is disposed at an angle of 30 degrees or less from a vertical or a vertical direction. The electrode surface of the electronic component of the wafer is in contact. The apparatus for inspecting and classifying characteristics of a wafer electronic component according to the sixth or seventh aspect of the invention, wherein the conductive amorphous alloy material fiber is in a state of being riveted by a conductive material. Bundle underneath.