TWI598598B - Chip electronic components inspection methods and inspection equipment - Google Patents

Description

Chip electronic component inspection method and inspection device

The present invention relates to a method and apparatus for inspecting a large number of wafer electronic components at high speed.

With the increase in the production of electrical products represented by mobile phones, liquid crystal televisions, and game machines, the production of electronic components of wafers assembled into electrical products as shown above has significantly increased. In the case of chip electronic components, chip capacitors (also referred to as chip capacitors), chip resistors (including wafer varistors), and wafer sensors are well known.

Chip electronic components such as wafer capacitors have extremely small sizes, and tens of thousands to hundreds of thousands of wafer capacitors are produced in a single manufacturing process.

In order to reduce the defective product rate due to defects in the electronic components of the wafer in which the electronic component of the wafer is assembled, it is generally performed for the mass-produced wafer electronic component. For example, for wafer capacitors, electrical characteristics such as electrostatic capacitance are checked for all of them.

Used to check a large number of wafer electronic parts at high speed. In the method of electrical characteristics, a method of inspecting a chip electronic component using an inspection of electrical characteristics of each of the electronic components of the wafer to be inspected in the following process is employed: a method of displaying predetermined predetermined electrical characteristics in accordance with the same specification In the state in which the electronic components of the two or more inspection objects to be manufactured are arranged in close proximity to each other, the mutually independent inspection device and the electronic components of the wafer are electrically connected; and then the respective wafers are respectively used for the respective wafers. The parts are applied with voltages for inspection having the same or substantially the same frequency, and each of the inspectors detects the current value generated in each of the electronic components of the wafer by the application of the voltage for inspection. When performing this inspection method, for example, a wafer electronic component inspection apparatus including a disk (wafer electronic component holding plate) in which a plurality of through holes are formed is generally used. A plurality of through holes for accommodating the electronic components of the wafer to be inspected are provided on the disk. Adjacent through holes of the disc are formed in close proximity to each other. Rotating the disk to accommodate the chip electronic components in the respective through holes. In this state, a plurality of chip electronic components arranged in the diameter direction of the disk are formed into a group, and the chip electronic components are inspected by the inspector. Electrical characteristics.

The inspection device for electronic parts of wafers generally consists of the following a disk (a chip electronic component holding plate); a pair of electrode terminals disposed at a position close to both opening portions of each of the through holes of the disk; and an inspector electrically connected to each of the pair of electrode terminals; And a controller electrically connected to each of the inspectors in a manner that supplies signals to the inspectors regarding electrical energy and inspection processing. Then, the inspector transmits an inspection voltage to each of the electronic components of the wafer accommodated in the through holes through the electrode terminal, and each of the inspectors detects that the voltage is applied to each of the wafers by the application of the inspection voltage. The current value generated by the sub-parts is used to check the electrical characteristics of the electronic components of the respective wafers to be inspected.

For example, if the electrostatic capacitance of a wafer capacitor is used When each of the inspectors is used, each of the inspectors applies an inspection voltage having the same or substantially the same frequency to each of the wafer capacitors (wafer electronic components), and each of the inspectors detects the application of the inspection voltage. On the other hand, the current value of the current generated in each of the wafer capacitors is used to check the electrostatic capacitance (electrical characteristics) of each wafer capacitor to be inspected based on the voltage value of the inspection voltage and the current value of the detected current. Here, the frequencies of the voltages applied to the electronic components of the wafer by the respective inspectors are initially set to be the same as each other. However, if a voltage of the same frequency is applied to the electronic components of the wafer by the multi-checker for the proximity arrangement, interference occurs between the frequencies of the voltages applied to the respective chip electronic components by the respective inspectors, and it is found that the inspection result is easy to occur. Bad situation. Therefore, in recent years, the frequency of the voltage applied to the electronic components of the wafer by the respective inspectors has been slightly shifted (not formed to be the same and formed to be substantially the same). For the inspection of the electrostatic capacitance of the wafer capacitor, for example, a commercially available electrostatic capacitance measuring device (representative example, capacitance meter: E4981A, manufactured by Agilent Technologies, Inc.) can be used.

In Patent Document 1, it is disclosed that most circuit components (for example The chip electronic parts are tested (inspected), and then the circuit part processors of the circuit parts are classified according to the test results. The circuit component processor includes a disk-shaped test plate (wafer electronic component holding plate) provided with a plurality of component tables (through holes), and is disposed on the upper side of a position close to each component table of the test plate. A contact and a lower contact (a pair of electrode terminals) and a tester (inspector) electrically connected to each contact. The test plate has 72 rows of four component stages in the circumferential direction between the center and the outer periphery thereof at intervals in the radial direction. The test piece was rotated, and in the state in which the circuit component was housed in the component table (through hole), the circuit component was tested as a group of a plurality of circuit components housed in the respective parts of each column.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 2000-501174

As described above, in order to check the electrical characteristics of a large number of electronic components of a wafer at a high speed, two or more inspectors are used, and at the same time (in a period of repetition of each other), the inspection is held on the disc-shaped electronic component holding plate. The electrical characteristics of complex wafer electronic components are well known.

However, according to the study by the present inventors, in recent years, inspection of wafer electronic parts which are extremely small (for example, a width of about 0.3 mm and a length of about 0.6 mm or less) is generally used. The electrical characteristics of the plurality of chip electronic components to be closely arranged, using a plurality of checkers, when two or more simultaneous inspections are used, between the frequencies at which the frequency of the voltages applied to the electronic components of the wafers is prevented from being shifted by the respective inspectors In the case of means of interference, it is also clear that electrical characteristics are known. The accuracy of the inspection results will be reduced.

The results of further research by the inventors, as described above, It is found that the reason for the decrease in the inspection accuracy of the electrical characteristics is, for example, in order to detect the electrical characteristics of two or more extremely small-sized wafer electronic components arranged in close proximity to each other, and for each of the wafer electronic components, When voltages for inspection having the same or substantially the same frequency are applied to each other at a time when they overlap each other, noise generated by electric signals (voltage or current) generated in the electronic components of the other wafer adjacent to each other is mixed (in each The electrical signals generated by the electronic components of the chip interfere with each other. The electrical signals (voltage or current) generated by one of the extremely small-sized electronic components of the chip placed in a very close state.

The subject of the present invention is to provide a use of two or two The above-mentioned inspector is a method for checking the electrical characteristics of a large number of wafer electronic parts (especially extremely small-sized wafer parts) with high speed and high precision. Another object of the present invention is to provide an apparatus for inspecting electrical characteristics of a large number of wafer electronic components (especially extremely small-sized wafer components) with high speed and high precision using two or more inspectors.

The present invention relates to a method for inspecting electronic components of a wafer, which comprises the inspection method of a wafer electronic component for inspecting the electrical characteristics of each of the electronic components of the wafer to be inspected: the same electrical power to be displayed in accordance with the same specification In a state in which the electronic components of the two or more inspection objects to be manufactured are in close proximity to each other, the mutual characteristics are An independent electrical connection between the inspector and the electronic components of the wafer; and then, by each inspector, an inspection voltage having the same or substantially the same frequency is applied to the respective chip electronic components, and is inspected by each inspector The process of calculating the current value generated in each of the electronic components of the wafer by the application of the voltage for inspection is characterized in that the inspection voltage is applied to each of the electronic components of the wafer by each of the inspectors at a time when they do not overlap each other.

Preferred aspects of the inspection method of the wafer electronic component of the present invention are as follows.

(1) The chip electronic component is in a state of being held by a group of through holes of a wafer electronic component holding plate that is axially supported on the base so as to be rotatable about a central axis, the chip electronic component holding plate being provided with each other a group of through holes arranged on the disk in such a manner that four or more concentric circles are formed at intervals, wherein the through holes of the respective columns are located on a straight line extending in the radial direction from the central axis, and the wafer electronic parts are inspected for inspection. The voltage system is sequentially performed for a group of through holes located on a straight line extending in the radial direction from the central axis, at a time when they do not overlap each other.

(2) The group of the through holes is arranged on the disc in such a manner as to form six rows of concentric circles, and the inspection of the electronic parts of the wafer held by the group of the through holes close to the outer circumference of the disc is provided by The inspector A of the three pairs of electrode terminals is collectively performed, and then the inspection of the electronic components of the wafer held by the three rows of the through-hole groups close to the central axis of the disk is performed by the inspector B having the total of three pairs of electrode terminals. .

(3) The crystals are arranged on the disc in such a manner that the groups of the through holes form eight rows of concentric circles, and the crystals held by the group of four rows of through holes on the outer circumference of the disc are The inspection of the electronic component is performed by the inspector A having the total of four pairs of electrode terminals, and then the inspection of the electronic components of the wafer held by the four rows of the through-hole groups close to the central axis of the disk is provided by the total The inspector B of the electrode terminal is performed.

(4) by the group of through holes forming twelve columns of concentric circles The inspection of the electronic components of the wafer held by the group of four rows of through holes adjacent to the outer circumference of the disk is performed by an inspector A having a total of four pairs of electrode terminals, which is close to the central axis of the disk. The inspection of the electronic components of the wafer held by the four rows of through-hole groups is performed by an inspector B having a total of four pairs of electrode terminals, and then a group of four rows of through holes close to the outer peripheral side and four groups close to the central axis The inspection of the electronic components of the wafer held by the group of four rows of through holes between the groups of the through-holes is performed by the inspector C having the total of four pairs of electrode terminals.

The group of the through holes may be arranged on the disk in such a manner that nine rows of concentric circles are formed. In this case, the same inspection is performed using three inspectors provided with three pairs of electrode terminals.

(5) The electronic component of the wafer to be inspected is a component having a pair of electrodes on the opposite surface.

(6) The electronic component of the wafer to be inspected is a wafer capacitor.

(7) The electrical characteristics to be inspected are electrostatic capacitance.

In the above-described inspection method of the present invention, the above-described "position of two or more wafer electronic components to be inspected at positions adjacent to each other" means "to include at least two wafer electronic components disposed at positions close to each other" Method, configure the chip electronic zero of the inspection object of two or more Piece."

In addition, the above-mentioned "close-to-close position" means "with Each of the two wafer electronic components is electrically connected to each other (individual) inspectors, and the respective wafer electronic components are subjected to inspections having the same or substantially the same frequency for electrical property inspection at the time of repeating each other. At voltage, the electrical signal (voltage or current) generated in one of the electronic components of the chip is mixed with noise generated by the electrical signal (voltage or current) generated by the electronic component on the other chip (in each chip electronic component) The position where the interference occurs between the electrical signals."

The invention is also a check device for electronic parts of wafers. The method includes a wafer electronic component holding plate in which a plate-shaped material is formed at a position where two or more through holes of the electronic component of the wafer are temporarily accommodated, and is disposed on each of the electronic component holding plates of the chip. a pair of electrode terminals at positions where the two openings of the through hole are in close contact; an inspector electrically connected to each of the pair of electrode terminals; and a method for supplying electrical energy and inspection processing signals to the respective inspectors The inspector is electrically connected to the controller, and each of the inspectors passes through the electrode terminal, and applies inspections having the same or substantially the same frequency to each of the electronic components of the wafer accommodated in the two or more through holes for a predetermined period of time. A voltage electronic device for detecting a current value generated in each of the electronic components of the wafer by the application of the voltage for inspection by each of the inspectors, wherein the controller is provided with a pair of electrons stored in the wafer Controlling the control voltages of the wafer electronic components of the through-holes of the two or more through-holes of the component holding plate without overlapping each other System.

In the above inspection apparatus of the present invention, the above The position in which the two or more through holes are adjacent to each other means that "the above-mentioned two or more through holes are formed at positions where the electronic components of the inspection target two or more of the through holes accommodated in the two or more through holes are arranged close to each other. "."

By carrying out the inspection method of the present invention, two or more inspectors can be used to inspect the electrical characteristics of a large number of wafer electronic parts at high speed (short time) and with high precision.

By using the inspection apparatus of the present invention, it is possible to inspect the electrical characteristics of a large number of wafer electronic parts at high speed (short time) and with high precision using two or more inspection apparatuses.

10‧‧‧Whip electronic parts inspection device

11‧‧‧ wafer electronic parts holding board

11a‧‧‧through hole

12a, 12b‧‧‧ electrode terminals

14a, 14b‧‧‧ inspector

15‧‧‧ Controller

15a‧‧‧Control system

19, 19a, 19b, 19c, 19d, 19e, 19f‧‧‧ wafer capacitors

21‧‧‧ Capacitor body

22a, 22b‧‧‧ electrodes

23a, 23b‧‧‧Switch

24a, 24b, 24c, 24d, 24e, 24f‧‧‧ shutters

25‧‧‧ Controller

31‧‧‧Whip Electronic Parts Storage Department

32‧‧‧Whip Electronic Parts Inspection Department

33‧‧‧ Chip Electronic Parts Discharge Department

41‧‧‧Abutment

42‧‧‧ center axis

43‧‧‧Rotary drive

44‧‧‧ wafer electronic parts retention cover

45‧‧‧floor

45a‧‧‧ gas discharge path

45b‧‧‧ gas supply path

46‧‧‧ gas discharge device

47‧‧‧Whip electronic parts supply device (part feeder)

49‧‧‧ indicates the arrow of the direction of rotation of the electronic component holding plate of the chip

51‧‧‧Cylinder

52‧‧‧electrode support plate

53‧‧‧Electrode terminal support board

54‧‧‧Direct drive

55‧‧‧Power supply

56‧‧‧ voltmeter

57‧‧‧ galvanometer

58‧‧‧Amplifier

59‧‧‧Resistors

61‧‧‧Fitting support cover

61a‧‧‧through hole

62‧‧‧ Pipe fittings

63‧‧‧ Pressurized gas supply device

64‧‧‧Whip electronic parts storage container

80‧‧‧Whip electronic parts inspection device

Fig. 1 is a perspective view showing a configuration example of a wafer capacitor, which is an example of a wafer electronic component to be inspected.

Fig. 2 is a front elevational view showing a configuration example of a wafer electronic component inspection apparatus which can be preferably used in the inspection method for carrying out the invention.

3 is a view showing the arrangement of the group of the through holes of the wafer electronic component holding plate 11 along the circumferential direction of the chip electronic component housing portion 31 of the inspection apparatus 10 of FIG. 2, and holding (accommodating) the wafer in each of the through holes. An enlarged cross-sectional view of the behavior of the electronic component.

4 is a wafer electronic component inspection unit of the inspection apparatus 10 of FIG. 32. The wafer electronic component (19a, 19b) in which the electrodes of the inspector are closely arranged in a group of the through holes that are held (accommodated) on the disk of the wafer electronic component holding plate 11 so as to extend in the diametrical direction An enlarged cross-sectional view showing each of the six (19c, 19d, 19e, and 19f total) states.

Fig. 5 is an enlarged cross-sectional view showing a state in which the wafer electronic component discharge portion 33 of the inspection apparatus 10 of Fig. 2 discharges the inspected wafer electronic component.

Fig. 6 is a view schematically showing the controller 15, the inspectors 14a, 14b, and the disc held (accommodated) in the diametrical direction of the wafer electronic component holding plate 11 in the inspection apparatus 10 of Fig. 2. A block diagram of the electrical connection state of the wafer electronic components (six in total, 19a, 19b, 19c, 19d, 19e, and 19f) of the group of the through holes.

Fig. 7 is a circuit diagram schematically showing the electrical connection state between the respective parts corresponding to the block diagram of Fig. 6.

Fig. 8 is a block diagram schematically showing the electrical connection state of a wafer electronic component inspection apparatus which can be used in the inspection method for carrying out the invention.

Fig. 9 is a view showing a period in which an inspection voltage is applied to each of the electronic components of the wafer by each of the inspectors in the method for inspecting the electronic component of the wafer of the present invention.

Fig. 10 is a view showing a period in which a test voltage is applied to each of the electronic components of the wafer by each of the inspectors in the conventional method of inspecting the electronic components of the wafer.

First, when you refer to the attached illustration, you can use it. A configuration example of an inspection apparatus for carrying out the inspection method of the electronic component of the wafer of the present invention.

Figure 1 shows the wafer capacitor of the inspection object (chip electronics) An oblique view of a configuration example of an example of a part. The wafer capacitor 19 of Fig. 1 is composed of a capacitor body 21 made of a dielectric material and a pair of electrodes 22a and 22b provided at both ends thereof. The wafer capacitor 19 is a wafer ceramic capacitor using ceramic as a dielectric. Capacitor The present system is formed of a ceramic, and is provided therein with a plurality of electrode layers which are alternately and alternately extending in parallel with each other of the electrodes 22a and 22b. The wafer electronic component such as the wafer capacitor 19 which is particularly effective for the inspection of the electronic component of the wafer and the inspection apparatus of the present invention is a wafer electronic component having a width of 0.3 mm or less and an extremely small length of 0.6 mm or less.

Figure 2 shows the inspections that can be used to carry out the invention. A front view of a configuration example of a wafer electronic component inspection apparatus of the method. 3 is an enlarged cross-sectional view showing the chip electronic component housing portion 31 of the inspection apparatus 10 of FIG. 2 along the circumferential direction of the wafer electronic component holding board 11. 4 is an enlarged cross-sectional view showing the wafer electronic component inspection portion 32 of the inspection apparatus 10 of FIG. 2 cut along the diameter direction of the wafer electronic component holding plate 11. Fig. 5 is an enlarged cross-sectional view showing the wafer electronic component discharge portion 33 of the inspection apparatus 10 of Fig. 2 cut along the diameter direction of the wafer electronic component holding plate 11. Fig. 6 is a block diagram schematically showing an electrical connection state of the inspection apparatus 10 of Fig. 2. Next, FIG. 7 is a schematic diagram showing the electrical connection of the inspection apparatus 10 of FIG. The circuit diagram of the connected state.

The wafer electronic component inspection device 10 shown in FIGS. 2 to 7 The wafer electronic component holding plate 11 is formed by forming a plate-shaped material at a position where two or more through holes 11a capable of temporarily accommodating a wafer electronic component (for example, a wafer capacitor) are adjacent to each other; a pair of electrode terminals 12a, 12b at positions where the two openings of the through holes 11a of the electronic component holding plate 11 are close to each other; and an inspector 14a, 14b electrically connected to each of the pair of electrode terminals 12a, 12b; Each of the inspectors supplies a controller 15 for electrically connecting the electrical energy and the inspection process to each of the inspectors.

The controller 15 supplies the electrical energy to each of the inspectors The signal is a signal applied to each of the wafer capacitors for the voltage for inspection by each of the inspectors, and a representative example thereof is a signal indicating the start of voltage application for inspection.

The controller 15 supplies the inspection process to each of the inspectors. The signal is a signal relating to the inspection of the electrical characteristics of the respective chip capacitors by the respective inspectors. For its representative example, the series of indications are generated in the respective chip capacitors by the application of the inspection voltages from the respective inspectors. The current value of the current is detected by the start of the signal.

The wafer electronic component inspection device 10 is configured to be inspected Each of the devices 14a and 14b transmits the chip electronic components (for example, the wafer capacitors 19a, 19b, 19c, 19d, 19e, and 19f shown in FIG. 4) that are accommodated in the two or more through holes 11a through the electrode terminals 12a and 12b. Each of the inspections having the same (or substantially the same) frequency as each other is applied for a predetermined period of time The voltage allows each of the inspectors to detect the current value generated in each of the electronic components of the wafer by the application of the voltage for inspection.

In the inspection device 10, for example, an electrostatic capacitor (electrical The inspector of the characteristics is used as each of the inspectors 14a, 14b of electrical characteristics of, for example, wafer electronic components.

Next, the above-described wafer electronic component inspection device 10 is in the foregoing The controller 15 is characterized in that the control system 15a that controls the application of the inspection voltages to the wafer electronic components accommodated in the through-holes 11a of the wafer electronic component holding plate 11 does not overlap each other.

The above "control system" means "the record can be received. The computer of the program that controls the voltages of the wafer capacitors of the two or more through-holes of the wafer electronic component holding plate so as not to overlap each other.

The wafer electronic component inspection device shown in FIGS. 6 and 7 In 10, three electronic components (wafer capacitors) are electrically connected to one inspector. Three wafer capacitors 19a, 19b, and 19c are electrically connected to the inspector 14a through the switch 23a. Next, the inspector 14b is electrically connected to the three wafer capacitors 19d, 19e, and 19f via the switch 23b.

Next, the control system provided by the controller 15 is Each of the inspectors is controlled such that the time during which the inspection voltage is applied to each of the chip electronic components (wafer capacitors) is not repeated.

Figure 8 is intended for use in the practice of the present invention. The basic configuration of the wafer electronic component inspection apparatus of the inspection method is schematically shown as a block diagram of the electrical connection state.

The composition of the wafer electronic component inspection device 80 shown in FIG. The wafer electronic component (wafer capacitor) is electrically connected to one inspector, and the controller 25 is controlled by only the inspectors (not including the above-mentioned switch). The electronic component inspection device has the same configuration.

In the checker 14a, the switch as described above is not used. A wafer capacitor 19a is electrically connected. Next, a wafer capacitor 19b is electrically connected to the inspector 14b without using the above-described switch.

As shown above, the chip electronic component inspection device can also have The electronic components of the wafer electrically connected to one (individual) inspector are one. However, in order to reduce the number of inspectors used, thereby reducing the manufacturing cost of the inspection apparatus, it is preferable that the number of electronic components of the wafer to be electrically connected to one inspector is two or more.

Next, the method for inspecting the electronic component of the wafer of the present invention The inspection apparatus 10 shown in FIGS. 2 to 7 will be described next, and the inspection of the wafer capacitor 19 shown in FIG. 1 will be described as a representative example.

The method for inspecting the electronic parts of the wafer of the present invention includes The electronic components of the wafers of two or more inspection objects which are manufactured by displaying the same predetermined electrical characteristics by the same specification are disposed at positions close to each other (specifically, for example, arranged in the diameter direction of the disk-shaped wafer electronic holding plate) Wafer capacitors shown in Figures 4, 6, and 7 on a straight line 19a, 19b, 19c, 19d, 19e, 19f), the inspectors 14a, 14b independent of each other, the wafer capacitors 19a, 19b, 19c are inspected by the inspector 14a, and the inspectors 14b inspect the wafer capacitors 19d, 19e, 19f After being electrically connected to each of the wafer capacitors, each of the inspectors applies an inspection voltage having the same or substantially the same frequency to each of the chip electronic components, and each of the inspectors detects the application of the inspection voltage. A method of inspecting the electrical characteristics of each of the electronic components of the wafer to be inspected by the current value generated by each of the electronic components of the wafer.

Next, the inspection method of the electronic component of the wafer of the present invention is The inspection voltage is applied to each of the chip electronic components (wafer capacitors) by the respective inspectors at a time when they do not overlap each other.

Figure 9 is a view showing the inspection of the electronic components of the wafer of the present invention. In the method, a graph of the period during which the inspection voltage is applied to each of the wafer capacitors (wafer electronic components) by each of the inspectors. The horizontal axis indicated in Fig. 9 indicates time. The following description will be made with reference to FIGS. 7 and 9.

Checker lines 14a at time t ₁₁ to the time period t P _{11 12,} a voltage is applied to the wafer inspection capacitor 19a. Further, similarly, the inspector 14a applies the inspection voltage to the wafer capacitor 19b during the period P ₂₁ from the time t ₂₁ to the time t ₂₂ . Next, in the same manner, the inspector 14a applies the inspection voltage to the wafer capacitor 19c during the period P ₃₁ from the time t ₃₁ to the time t ₃₂ .

14b checker _{41 is} tied to the time t ₄₂ to time t P _41, a voltage is applied to the wafer inspection capacitor 19d. Further, similarly, in line 14b checker time t ₅₁ to the time period t P _{51 52,} a voltage is applied to the wafer inspection capacitor 19e. Next, in the same manner, based checker 14b at time t ₆₁ to the time period t P _{61 62,} a voltage is applied to the wafer inspection capacitor 19f.

Then, P _11, 14a is applied to the wafer by the inspection device inspection voltage capacitors 19a to 14a is detected by the inspector checks applied voltage and the current value of the capacitor occurring wafer 19a, whereby the above-described objects during inspection check The electrical characteristics of the wafer capacitor 19a (the electrostatic capacitance is used when the inspection apparatus 10 described above is used).

Similarly, the electrical characteristics (electrostatic capacitance) of each of the wafer capacitors 19b, 19c, 19d, 19e, and 19f are inspected for each of the above periods P ₂₁ , P ₃₁ , P ₄₁ , P ₅₁ , and P ₆₁ .

As shown in FIG. 9, the electronic component of the wafer of the present invention is inspected. In the inspection method, the inspection voltages are applied to the respective wafer capacitors by the inspectors 14a and 14b at a time when they do not overlap each other.

Thus, for example, not in accordance with P ₄₁ is applied during the inspection using the electric signal (voltage or current) voltage of the capacitor 19d of the other wafer occurring noise occurring P ₁₁ is applied mixed into a wafer inspection capacitor voltage during the The electrical signal (voltage or current) that occurs in 19a, that is, the situation in which the electrical signals generated by the individual chip capacitors interfere with each other.

Therefore, the inspection of the electronic components of the wafer by the implementation of the present invention In the inspection method, two or more inspectors can be used to inspect the electrical characteristics of a large number of electronic components of the wafer (for example, the electrostatic capacitance of the chip capacitor) at high speed (short time) and with high precision.

Inspection method (or inspection of the electronic component of the wafer of the present invention) The electronic component to be inspected by the device is preferably a component having a pair of electrodes on the opposite surface.

In the representative example of the electronic parts to be inspected, the series Wafer capacitors, chip resistors (including wafer varistors), and wafer sensors. The electronic components to be inspected are particularly excellent in wafer capacitors.

Inspection method (or inspection of the electronic component of the wafer of the present invention) The electrical characteristics of the electronic component to be inspected means the voltage that can be generated in the electronic component of the wafer according to the voltage value of the inspection voltage (alternating voltage) applied to the electronic component of the wafer, and the voltage applied by the inspection. The electrical characteristics determined by the current value of the (alternating current).

In the representative example of the electrical characteristics shown above, the series Lift electrostatic capacitance (capacitance), inductance, impedance, admittance, etc.

Among them, the types of electronic components of the wafer to be measured And the measured electrical characteristics are not necessarily one-to-one correspondence. For example, regarding the chip electronic component other than the above wafer capacitor (more specifically, the capacitor represented by the equivalent circuit of the chip electronic component other than the wafer capacitor), the electrostatic capacitance can also be measured. For example, the electrostatic capacitance of the wafer varistor can also be determined.

In the case of two or more wafer electronic parts to be inspected, The manufacturer is manufactured according to the same specification in such a manner as to display the predetermined same electrical characteristics.

Therefore, two or more wafer electronic zeros of the above-mentioned inspection object Most of the parts are of the same manufacturing volume, but other batches of wafer electronic parts can also be mixed in the same manufacturing batch of wafer electronic parts as shown above. . However, the wafer electronic parts which are manufactured in batches are manufactured in accordance with the same specifications so as to display the same electrical characteristics to each other (generally, they are manufactured for the purpose of selling each other as the same product).

By charging more than two electronic components of the inspection object For example, each of the two or more through holes 11a of the wafer electronic component holding plate 11 of the inspection apparatus 10 can be disposed at a position close to each other.

As mentioned above, the above "the crystal of two or more inspection objects" The position where the electronic components are arranged in close proximity to each other means "a wafer electronic component in which two or more inspection targets are arranged so as to include at least two wafer electronic components arranged at positions close to each other".

The above "close to each other" is preferably "two checks" The position of the wafer electronic component of the target is 100 mm or less, and the position of the wafer electronic component of the two inspection targets is 50 mm or less is preferable, and the distance between the electronic components of the two inspection targets is 30 mm. The following locations are particularly good. In any of the aspects, it is more preferable that the distance between the electronic components of the wafers of the two inspection objects is 1 mm or more.

In the electronic component of the wafer of two or more inspection objects, Each of the independent (respective) inspectors 14a, 14b is given a voltage for inspection. If the independent checkers (using one checker) are not used, the problem that the electrical signals of the respective chip capacitors detected by the respective checkers interfere with each other (the problem of the present invention) does not occur.

The wafer electronic parts of the inspection object of two or more are each The inspector is applied with an inspection voltage having the same or substantially the same frequency as each other.

Wafer electronic parts applied to two or more inspection objects The voltages for inspection are substantially the same as each other, meaning that the frequency of each of the inspection voltages is higher than the lowest frequency, and is 1.1 times or less, preferably 1.05 times or less.

Wherein, as shown in the FIG. 7 and FIG. 9, the electronic components of the wafer inspection apparatus 10 P _11, 19a may be applied to the wafer during inspection of the capacitor voltage, the controller 15 controls the system as shown in the following it.

First, the controller 15 based on the switch 23a at time t ₀ is supplied indicating off and the wafer capacitor 19a for a shutter 24a is electrically connected to (formed to electrically conducting state), opens the switches 24b, 24c (formed of electrically non- Signal in the on state). Next, the controller 15 is applied based on the inspector checks 14a t ₁₁ is supplied with a signal indicating the start time of the voltage (electrical signal related to energy), and the detection signal indicating the start of the current value of a current chip capacitor 19a occurred (for Check the processed signal).

Further, the controller 15 based on the switch 23b at time t ₀ is supplied indicating off and the wafer capacitor 19d for the shutter 24d is electrically connected to (formed to electrically conducting state), opens the shutter 24e, 24f (formed of electrically non- Signal in the on state). Next, the system controller 15 is supplied with a voltage signal indicative of the start checker 14b checks applied at time t _41, and the detection signal indicating the start of the current value of a current in the capacitor 19d wafer occurred.

Wherein, since the embodiment will not be repeated in each period: P ₁₁ during application of the inspection by the inspection device 14a of the wafer voltage with the capacitor 19a, and the P ₄₁ 14b applied during inspection of the wafer inspection device 19d by the capacitor voltage, so by end 19a is applied to inspection of the wafer by the time the capacitor voltage after the time t ₁₂ after a period D t _41, the wafer inspection starts applying the voltage of the capacitor 19d.

Then, similarly, since the wafer capacitor 19d, the wafer can be Since the capacitor 19b, the chip capacitor 19e, the wafer capacitor 19c, and the wafer capacitor 19f are applied with the inspection voltage, the controller 15 performs the same control as the above control.

Here, the period S ₁ is a period from the supply of the above-described signal to the switch 23a to the time when the shutter 24a is closed (hereinafter referred to as "the shutter operation period"). That is, the shutter 24a is closed system at time t _11, followed by the formation of electrically conductive state. In the same period, S ₂ , S ₃ , S ₄ , S ₅ , and S ₆ are the shutter operation periods of the shutters 24b, 24c, 24d, 24e, and 24f, respectively.

Then in the inspection method of the electronic component of the wafer of the present invention Preferably, after each of the inspectors finish applying an inspection voltage to each of the chip electronic components (for example, a wafer capacitor), the electronic component of the wafer is detected based on the voltage value of the inspection voltage and the application of the inspection voltage. Before the current value of the current determines the electrical characteristics of the electronic component of the wafer, the inspection voltage is applied to the other electronic components other than the above by other inspectors different from the above. Thereby, compared with the case where two or more wafer electronic components are sequentially inspected by one inspector, the time required to inspect all of the electronic components of the wafer to be inspected becomes shorter.

7 and 9, when the electronic component using the above-described wafer inspection apparatus 10, based e.g. 14a checker 19a, beginning at time t ₁₁ is applied to the wafer inspection capacitor voltage, then the time t at the end of the inspection voltage is applied ₁₂ . Then, the checker 14a-based voltage value of the voltage and current applied to the current value of the capacitor 19a of the wafer occurring in the inspection by the inspection according to the voltage, the time t of the wafer ₁₃ decides the capacitance of the capacitor (electrical characteristics ).

As described above, the checker 14a is in the period P ₁₂ (hereinafter referred to as "electrical characteristic inspection period") between the time t ₁₁ and the time t ₁₃ , and is usually between the time t ₁₂ and the time t ₁₃ . The electrostatic capacitance is determined by, for example, data processing (arithmetic processing) based on the voltage value and the current value. Here, the periods P ₂₂ , P ₃₂ , P ₄₂ , P ₅₂ , and P ₆₂ are electrical characteristic inspection periods of the wafer capacitors 19 b , 19 c , 19 d , 19 e , and 19 f , respectively.

Subsequently, as described above, the end 14a t checker ₁₂ is applied at the time of inspection with the wafer after the voltage of the capacitor 19a, to determine the time before the capacitance ₁₃ (electrical characteristics) of the capacitor based on the voltage value and the current value of t, specifically , at time t _41, is different from the start of application of inspecting the other checker 14b on the other is different from the above-described wafer with the voltage of the capacitor 19d.

That is, the end of the capacitor 19a is applied to a wafer inspection time t _{12 is} the voltage, applied to the start of the next wafer inspection capacitor 19d with the time period t of the voltage between lines ₄₁ D _{12 is} preferably the aforementioned time t and the checker 14a The period between the times t ₁₃ at which the electrostatic capacitance of the wafer capacitor 19a is determined is short.

Similarly, the inspection device 14b at time t ₄₂ after the end of the voltage, prior to time t ₄₃ determines the capacitance of the capacitor 19d of the wafer, the wafer inspection is applied particularly in terms of the capacitor 19d starting from the time t ₂₁ is different from the above-described other The inspector 14a applies an inspection voltage to the other wafer capacitors 19b different from the above. Next, the inspection voltage is applied to the wafer capacitor 19e, the wafer capacitor 19c, and the subsequent wafer capacitor 19f in the same order.

Figure 10 is a diagram showing the inspection of conventional electronic components of wafers. In the method, when a total of six chip electronic components 19a, 19b, 19c, 19d, 19e, and 19f are inspected, a time period during which an inspection voltage is applied to each wafer capacitor (wafer electronic component) by each inspector is shown. The horizontal axis indicated in Fig. 10 indicates time.

Checker lines 14a at time t ₁₁ to the time period t P _{11 12,} a voltage is applied to the wafer inspection capacitor 19a. Further, similarly, the inspector 14a applies the inspection voltage to the wafer capacitor 19b during the period P ₂₁ from the time t ₂₁ to the time t ₂₂ . Next, in the same manner, the inspector 14a applies the inspection voltage to the wafer capacitor 19c during the period P ₃₁ from the time t ₃₁ to the time t ₃₂ .

14b checker _{41 is} tied to the time t ₄₂ to time t P _41, a voltage is applied to the wafer inspection capacitor 19d. Further, similarly, the inspector 14b applies the inspection voltage to the wafer capacitor 19e during the period P ₅₁ from the time t ₅₁ to the time t ₅₂ . Subsequently Likewise, checker 14b at time t ₆₁ to the line time period t P _{61 62,} a voltage is applied to the wafer inspection capacitor 19f.

Using the conventional chip electronic parts illustrated in FIG. In the inspection method, the purpose of using two or more inspectors is to apply an inspection voltage to two wafer capacitors (wafer electronic parts) at mutually overlapping times. The electrostatic capacitance of the wafer capacitor is simultaneously checked by each of the two, thereby shortening the inspection time.

For example, _{P. 11} during the period of overlap and applied by the inspector embodiment 14a of the wafer inspection voltage capacitor 19a, and the voltage is ₄₁ 14b applied during inspection by the inspection device P on the wafer capacitors 19d, thereby achieving high speed (short Check under time).

However, as described above, e.g., according to P ₄₁ is applied during the inspection of electrical signals (voltage or current) voltage of the capacitor 19d of the wafer occurring occurring noise may be mixed into P ₁₁ voltage applied during inspection The electrical signal (voltage or current) generated by the chip capacitor 19a. Further, the electric signal generated in the wafer capacitor 19d is also mixed with noise generated in accordance with the electric signal generated at the wafer capacitor 19a. That is, the electrical signals generated in the respective chip capacitors interfere with each other. Similarly, the electrical signals generated at the wafer capacitors 19b, 19e also interfere with each other, and the electrical signals generated at the wafer capacitors 19c, 19f also interfere with each other.

Therefore, in the conventional inspection method of the chip electronic component, two or more inspectors can be used to check the electrical characteristics of two or more wafer capacitors at high speed (short time). For example as shown in FIG. 10, the time t and t ₀ between ₁ (time) wafer inspection capacitor 6 at a time. However, as described above, since the electrical signals generated in the respective wafer capacitors interfere with each other, the inspection accuracy of the electrical characteristics of the respective wafer capacitors is lowered.

In contrast, in a wafer inspection method of the electronic part of the present invention, the system shown in FIG. 9, for example, at time t ₀ and time t (time) during the check of the capacitor 6 between the _two wafers. Therefore, in the inspection method of the electronic component of the wafer of the present invention, the time required for inspection is long (time t ₂ > time t ₁ ) as compared with the above-described inspection method of the wafer electronic component. However, in the method for inspecting the electronic component of the wafer of the present invention, since the inspection voltage is applied to the wafer capacitor to be inspected at a time when the wafer electronic component is not overlapped with each other, as described above, there is no telecommunications generated in each wafer capacitor. The situation where the numbers interfere with each other. Therefore, by performing the inspection method of the present invention, the inspection time is slightly longer than that of the above-described inspection method of the wafer electronic component, but two or more inspection apparatuses can be used for high speed (short time) and high precision. Check the electrical characteristics of a large number of wafer capacitors (wafer electronic parts).

The following detailed description is used to implement the present invention. The configuration of the inspection apparatus for the inspection method of the electronic component of the wafer (the inspection apparatus for the electronic component of the wafer of the present invention) and the preferred embodiment.

The chip electronic component inspection device 10 shown in FIG. 2 is provided The shape of the wafer electronic component holding plate 11 is not particularly limited, but is usually set to a disk shape.

Two or more through holes 11a of the wafer electronic component holding plate 11 It is placed on the surface of the electronic component holding plate of the wafer, and is placed on a plurality of concentric circles at a position where the concentric circles are equally divided.

In the wafer electronic component inspection device 10, the button is received Each of the six wafer electronic components having a total of six through holes arranged in the diameter direction between the center and the periphery of the wafer electronic component holding plate 11 is used to inspect the electrical characteristics of the wafer capacitor. Chip electronic component holding plate The number of through holes arranged in the diameter direction between the center and the periphery of 11 is preferably in the range of 2 to 20, more preferably in the range of 4 to 12.

The chip electronic component holding plate 11 is permeable to, for example, the bottom plate 45 The center shaft 42 is rotated (fixed) on the base 41, and the rotation driving device 43 disposed on the back side thereof is actuated to intermittently rotate the periphery of the center shaft 42. Here, the "discontinuous rotation of the wafer electronic component holding plate 11" means that each of the two through holes adjacent to each other in the rotation direction (rotational circumferential direction) of the wafer electronic component holding plate 11 and the wafer electronic parts are held. Each angle (an acute angle) formed by two straight lines connected by the center position of the rotation of the plate 11 is rotated.

In each of the through holes of the wafer electronic component holding plate 11, In the wafer electronic component housing portion 31, the wafer capacitor (wafer electronic component) to be inspected is temporarily accommodated, and the electrical characteristics thereof are examined.

As shown in FIG. 3, the wafer electronic component housing portion 31 is attached to A wafer electronic component holding cover 44 is disposed on the front side (the left side in FIG. 3) of the wafer electronic component holding plate 11. A bottom plate 45 is disposed on the rear side (the right side in FIG. 3) of the wafer electronic component holding plate 11. In the bottom plate 45, a plurality of gas discharge passages 45a having openings formed on the surface of the wafer electronic component holding plate 11 are formed, respectively. The respective gas discharge passages are connected to a gas discharge device (representatively, a vacuum pump) 46. When the gas discharge device 46 is actuated, the gas is exhausted from the gas discharge passage 45a, and the gap between the wafer electronic component holding plate 11 and the bottom plate 45 is decompressed (a pressure lower than atmospheric pressure).

Next, the wafer electronic component holding plate 11 is on one side as shown in FIG. The direction indicated by the arrow 49 is intermittently rotated, and the wafer capacitor 19 is supplied to the inside of the wafer electronic component holding cover 44 by the chip electronic component supply device (Fig. 2: 47), and the gas discharge device 46 is caused to perform the gas discharge device 46. The gap between the wafer electronic component holding plate 11 and the bottom plate 45 is actuated to be in a reduced pressure state. Thereby, the wafer capacitors are temporarily housed in the respective through holes 11a of the wafer electronic component holding plate 11. Since the gap between the wafer electronic component holding plate 11 and the bottom plate 45 is decompressed, the wafer capacitor 19 accommodated in the chip electronic component holding plate 11 is moved to the gas discharge path which is the uppermost than that in FIG. When the position of 45a is higher, there is no case where the wafer capacitor 19 is dropped by the through hole 11a.

Intermittent by the above-mentioned wafer electronic component holding plate 11 The wafer capacitor that is accommodated in the through hole of the wafer electronic component holding plate is transferred to the wafer electronic component inspection unit 32 of the wafer electronic component inspection device 10 shown in FIGS. 2 and 4 .

As shown in Figure 4, due to the electrical capacitors of each wafer Since the characteristic inspector is electrically connected, a pair of electrode terminals 12a and 12b are disposed at a position close to both opening portions of the through holes 11a of the wafer electronic component holding plate.

The electrode terminal 12a transmits electricity electrically disposed around it The insulating cylinder 51 is fixed to the bottom plate 45. The surface of the electrode terminal 12a and the bottom plate 45 on the side of the wafer electronic component holding plate 11 is subjected to, for example, a polishing process so as to form a smooth plane.

The electrode terminal 12b is fixed to the electrode terminal support plate 53 . The electrode terminal support plate 53 is fixed to the linear motion driving device (Fig. 2: 54).

Actuating the above-mentioned linear driving device and making the electrode terminal branch The holding plate 53 is moved to the side of the wafer electronic component holding plate 11, whereby the electrode terminals 12b supported on the electrode terminal supporting plate 53 are additionally moved to the side of the wafer electronic component holding plate 11. Thereby, each wafer capacitor is sandwiched between the electrode terminals 12a and 12b. Therefore, the electrode 22a of each wafer capacitor is electrically connected to the electrode terminal 12a, and the electrode 22b is electrically connected to the electrode terminal 12b. Thereby, each of the wafer capacitors is electrically connected to each of the inspectors through the pair of electrode terminals 12a and 12b.

Wherein, the chip electronic component is configured with a pair of electrode terminals The "opening position" of the two opening portions of each of the through holes of the holding plate means a position at which the electrode terminals are electrically connected to the electronic components of the respective chips when the electronic components of the chip are accommodated in the respective through holes, or if they are formed as electrodes When the terminal is movable, the electrode terminals can be electrically connected to the electronic components of the wafer by moving the electrode terminals.

Next, in the wafer electronic component inspection unit 32, according to the crystal Each of the six wafer capacitors 19a, 19b, 19c, 19d, 19e, and 19f arranged in a row in the diameter direction of the electronic component holding plate 11 is inspected for electrical characteristics in accordance with the above-described inspection method of the present invention.

The chip electronic component inspection device 10 shown in FIG. 7 is provided The inspectors 14a and 14b are electrostatic capacitance inspectors. The inspectors 14a and 14b are respectively provided with a power source 55, a voltmeter 56, and an ammeter 57. The voltage for inspection generated at the power source 55 is transmitted through the switch 23a or the switch 23b is applied to each wafer capacitor. The voltage value of the voltage for inspection is measured by a voltmeter 56. The current value of the current generated in each wafer capacitor is measured by the ammeter 57 by the application of the voltage for inspection. In order to measure the voltage value and the current value with high precision, an amplifier 58 and a resistor 59 are provided in each of the inspectors.

Among them, the electronic component inspection of the wafer shown in Figure 2 In the circumferential direction of the wafer electronic component inspection unit 32 of the apparatus, a pair of electrode terminals electrically connected to other inspectors (inspectors different from the inspection electrical characteristics of the inspection instruments 14a and 14b) are disposed.

Wafer capacitors for checking electrical characteristics are based on wafer electronics The intermittent rotational movement of the component holding plate 11 is sent to the wafer electronic component discharge portion 33 of the wafer electronic component inspection device 10 shown in FIGS. 2 and 5.

As shown in FIG. 5, the wafer electronic component discharge portion 33 is attached to A tube support cover member 61 in which a plurality of through holes 61a are formed is disposed on the front side (the lower side in FIG. 5) of the wafer electronic component holding plate 11. A tube member 62 constituting a passage of a wafer capacitor (for example, the wafer capacitor 19a) is connected to each of the through holes 61a of the tube support cover member 61. However, in Fig. 2, only a part of the tubes of the tubes 62 connected to the respective through holes 61a of the tube supporting cover member 61 are recorded.

Further, in the wafer electronic component holding plate 11 The bottom plate 45 on the rear side (upper side in FIG. 5) is formed with a plurality of gas supply passages 45b each having an opening formed on the surface of the wafer electronic component holding plate 11. The respective gas supply passages 45b are connected to the pressurized gas supply device 63.

When the pressurized gas supply device 63 is actuated, the pressurized gas is supplied to the gas supply path 45b. For example, the pressurized gas is ejected to the wafer capacitor 19a accommodated in the through hole 11a of the wafer electronic component holding plate 11. Thereby, the wafer capacitor is discharged to the tube member 62.

For example, the wafer capacitor 19a is formed in a plurality of through holes 61a formed by the pipe support cover member 61 shown in Fig. 2, and has a total of ten through holes 61a located on the outermost peripheral side. The ten through holes 61a are connected to the chip electronic component storage container 64 through the tube member 62, respectively.

Therefore, the wafer capacitor 19a is transmitted through one of the total of ten tube members 62 connected to the ten through holes 61a of the tube support cover member 61, and is housed in a wafer electronic component storage container according to the checked electrical characteristics. 64.

14a, 14b‧‧‧ inspector

Claims (6)

A method for inspecting a chip electronic component, comprising: a method of inspecting a chip electronic component for inspecting electrical characteristics of each of the chip electronic components to be inspected in the following process: forming a concentric circle of four or more columns at intervals The arrangement of the through holes in the disc, wherein the through holes of each column are located on a straight line extending from the central axis in a radial direction, and are supported by the base wafer in such a manner as to be rotatable about the central axis The group of the through holes of the electronic component holding plate accommodates the processing of the wafer electronic components of the two or more inspection objects which are manufactured by displaying the same predetermined electrical characteristics according to the same specification; and each of the inspection device and the electronic component of the wafer a process of electrically connecting; then, an inspector applies an inspection voltage having the same or substantially the same frequency to each of the chip electronic components, and the inspector detects the electronic component on each of the wafers by the application of the inspection voltage The engineering of the current value that occurs is characterized by the use of more than two inspectors, for the configuration located at the center axis Extending in the radial direction of the through hole group on a straight line wafer electronic component, between the inspector, are sequentially performed in each examination period does not overlap and applying a voltage to the wafer inspection of electronic parts. The method for inspecting an electronic component for a wafer according to the first aspect of the invention, wherein the group of the through holes is arranged on the disk in a manner of forming six rows of concentric circles, and the group of three rows of through holes near the outer circumference of the disk The inspection of the held electronic parts of the wafer is performed by an inspector A having a total of three pairs of electrode terminals, and then the crystals held by the three rows of through-hole groups close to the central axis of the disk The inspection of the chip electronic components is performed by providing the inspector B having a total of three pairs of electrode terminals. The method for inspecting an electronic component for a wafer according to the first aspect of the invention, wherein the group of the through holes is formed in a manner of forming eight rows of concentric circles on the disk, and the group of four rows of through holes near the outer periphery of the disk is The inspection of the held electronic parts of the wafer is performed by the inspector A having the total of four pairs of electrode terminals, and then the inspection of the electronic components of the wafer held by the four rows of the through-hole groups close to the central axis of the disk is provided. The inspector B of the four pairs of electrode terminals is collectively performed. The method of inspecting a wafer electronic component according to the first aspect of the invention, wherein the electronic component to be inspected is a component having a pair of electrodes on a facing surface. The method for inspecting a chip electronic component according to claim 1, wherein the electronic component to be inspected is a wafer capacitor. An inspection apparatus for a chip electronic component, comprising: a group of through holes arranged on a disk so as to form four or more concentric circles at intervals with each other, wherein each column of the through holes is located at a center a wafer electronic component holding plate axially supported on the base extending in a radial direction and rotatable about the central axis; disposed adjacent to both openings of the through holes of the electronic component holding plate of the wafer a pair of electrode terminals at a position; two or more inspectors electrically connected to the pair of electrode terminals; and a method of supplying electrical energy and inspection processing to each inspector and each inspector The electrically connected controller is passed through the electrode terminal by each inspector, and the pair is placed on the wafer electronic component holding plate located at the central axis Each of the wafer electronic components of the group of the through holes on the straight line extending in the radial direction is sequentially applied with an inspection voltage having the same or substantially the same frequency, and each of the inspectors can detect the application of the voltage for the inspection. A wafer electronic component inspection apparatus for a current value generated in each electronic component of a wafer, characterized in that the controller is provided with a pair of wires which are accommodated in the electronic component holding plate of the wafer and which are located in a radial direction extending from the central axis A control system for controlling the voltage of each of the wafer electronic parts of the group of through holes to be controlled so as not to overlap each other between the inspectors.