KR102391849B1 - Chip electronic component inspection sorting device - Google Patents

Abstract

(Summary) A novel connection switching system is provided in place of the connection switching system between an inspection electrode terminal and an inspection machine used in a conventional chip electronic component inspection and sorting device.
(Solution) A MOS FET housed in a case is used as a relay switch means of a connection switching system between an inspection electrode terminal set consisting of a fixed electrode terminal and a movable electrode terminal of a chip electronic component inspection and sorting device, and a tester, and the MOS FET is The housed case is disposed adjacent to each of the fixed electrode terminal for inspection and the movable electrode terminal, and a MOS FET is connected to the fixed electrode terminal and the movable electrode terminal via a connector.

Description

CHIP ELECTRONIC COMPONENT INSPECTION SORTING DEVICE

[0001] The present invention relates to an improvement of a chip electronic component inspection and sorting device used for high-speed and continuous inspection of electrical characteristics of a large number of chip electronic components.

BACKGROUND ART With the increase in production of small electric products such as cellular phones, smart phones, liquid crystal televisions, and electronic game machines, the production of micro-chip electronic components mounted on such electric products is remarkably increased. Most of the chip electronic components are formed of a main body made of an insulating material and electrodes provided on opposite end surfaces of the main body. Examples of the chip electronic component having such a configuration include a chip capacitor (also called a chip capacitor), a chip resistor (including a chip varistor), and a chip inductor.

In recent years, with the further miniaturization of electrical products on which chip electronic components are mounted and the increase in the number of chip electronic components mounted on electrical products, chip electronic components are becoming extremely small. For example, for chip capacitors, recently, capacitors having a very small size (eg, a size of 0.2 mm × 0.2 mm × 0.4 mm called 0402 chip) have come to be generally used. Such microchip electronic components are mass-produced in units of tens of thousands to hundreds of thousands of pieces per lot.

In electrical products to which chip electronic components are mounted, in order to reduce the defective rate of electrical products resulting from defects in the chip electronic components, it is common to perform total burst scanning on chip electronic components manufactured in large quantities. For example, electrical characteristics, such as electrostatic capacitance and leakage current, are tested for the total number of chip capacitors.

Therefore, it is necessary to perform the inspection of the electrical characteristics of a large number of chip electronic components at high speed, and as a device for automatically performing the high-speed inspection, in recent years, a conveyance disk (chip electronic component temporary holding plate) having a large number of perforations formed therein is required. ), an automated apparatus (ie, chip electronic component inspection and selection apparatus) for inspection and selection of electrical characteristics of chip electronic components is generally used. In this conveyance disk, a plurality of perforations for temporarily receiving and holding the chip electronic component to be inspected are usually formed in a state in which three or more rows are arranged in a plurality of rows along the circumference. And, in the use of this chip electronic component inspection and sorting apparatus, after temporarily receiving and holding a chip electronic component in the hole of the conveyance disk in a rotating state, in the chip electronic component hold|maintained by the conveyance disk, the conveyance disk A pair of electrode terminal sets (inspection contact) comprising a plurality of sets of fixed electrode terminals and movable electrode terminals laid along a rotation path are brought into contact with each electrode of the chip electronic component, and predetermined electrical characteristics of the chip electronic component are measured. Then, based on the measurement result, the operation of sorting (or sorting) the chip electronic component by discharging it from the hole of the conveyance disc so as to be accommodated in a predetermined container (sorting container) is performed.

That is, the recent automated chip electronic component inspection and sorting apparatus is a base and a chip electronic component conveyance disk rotatably supported on the base (however, in the chip electronic component conveyance disk, a chip having an electrode on each of its opposing end surfaces) Three or more rows of perforations capable of temporarily accommodating electronic components are formed along the circumference), and chip electronics for supplying and accommodating chip electronic components in the perforations of the conveying disk, which are sequentially formed along the rotation path of the conveying disk A component supply receiving unit (supply receiving area), a chip electronic component electrical property inspection unit (inspection area) that inspects the electrical characteristics of chip electronic components, and a chip electronic component classification that classifies the tested chip electronic components based on the inspection results It can be said that it is a chip electronic component inspection and sorting apparatus including a part (classification area).

For example, in the case of testing the capacitance of the chip capacitor, in the electrical characteristic inspection unit, a predetermined value is applied to the chip capacitor from an inspection machine (electrical characteristic measuring device) provided in the chip electronic component inspection and sorting device through the electrode terminal for inspection. A test voltage having a frequency of is applied. Then, the tester detects the current value of the current generated in the chip capacitor by the application of the test voltage, and based on the detected current value and the voltage value of the test voltage, the test of the capacitance of the chip capacitor to be inspected is performed. is carried out

As an example of a chip electronic component inspection and sorting apparatus, the apparatus described in patent document 1 is mentioned. That is, in Patent Document 1, using the chip electronic component inspection and sorting apparatus having the above-described configuration, the chip electronic components to be inspected, each manufactured based on the same standard and exhibiting predetermined and identical electrical characteristics, are brought close to each other on the conveyance disc. Temporarily accommodated and held in each of the through holes arranged in a plurality of rows and then electrically connected to each of the chip electronic components, and then a voltage for inspection is applied from the inspection machine to each chip electronic component, A chip electronic component inspection and sorting apparatus for continuously inspecting electrical characteristics of a chip electronic component including a step of detecting a current value generated in each chip electronic component by application by an inspection machine is disclosed.

In the conventionally used chip electronic component inspection and sorting apparatus, fixed electrode terminals are provided on each electrode of both ends of the chip electronic component arranged along the radial direction of the conveying disk in the chip electronic component accommodated in a plurality of rows of through holes formed along the circumference of the conveying disk; Electrical characteristics of each chip electronic component are inspected (measured) by sequentially applying a current (or voltage) to each chip electronic component in a state where a set of electrode terminals for inspection made of movable electrode terminals are brought into contact at the same time. The sequential application of current to the plurality of chip electronic components and the extraction of inspection values are performed using a tester (eg, a capacitance measuring instrument), but since it is necessary to simplify the structure of the inspection and sorting device, each chip electronic component is used. The tester for application of current and extraction of test values is not prepared for each set of test electrode terminals, but one set of testers is usually provided for a plurality of sets of test electrode terminal sets of 2 to 4 sets. Ready. Then, the plurality of sets of test electrode terminal sets and the tester are connected via a connection switching device (relay switch means), and the connection between each chip electronic component and the tester is sequentially switched at high speed using this relay switch means. has been

(Citation 1) WO 2014/010623 Al

Although it is not specifically described in patent document 1, in the chip|tip electronic component inspection and sorting apparatus used conventionally, the mercury relay switch which can stably switch is generally used as a switching device (relay switch means). However, as described above, since the chip electronic components that are being measured recently are very small, the size of the electrode terminal set for inspection is also very miniaturized, whereas the mercury relay switch has a relatively large volume, A mercury relay switch cannot be placed in close proximity to a set of electrode terminals for inspection. For this reason, the mercury relay switch is arranged at a position away from each of the fixed electrode terminal and the movable electrode terminal of the test electrode terminal set, and each is a coaxial cable composed of a test current application cable and an inspection value extraction cable. It is usually connected.

The mercury relay switch used as a connection switching means between the electrical property measurement tester and the test electrode terminal set in the conventional chip electronic component inspection and sorting device is an excellent connection switching means because it enables reliable connection switching (switching). However, since it is a mechanical connection switching means, there are problems such as an insufficient service life, a limit in speeding up connection switching, and environmental risks resulting from the use of mercury.

For this reason, the inventor of this invention searched for the connection switching means which will replace the mercury relay switch. And as a result, by using MOS FET which is one of the semiconductor switch elements, it discovered that high-speed connection switching was attained without using mercury, and extension of the service life was also implement|achieved.

However, as a result of further research, it was also found that when a MOS FET (and its driving circuit) was used instead of the mercury relay switch as the connection switching means, the accuracy of the measurement result of the electrical characteristics was lowered. For example, using a conventional chip electronic component inspection and sorting device (a mercury relay switch is used as a connection switching means, and this mercury relay switch is connected to a set of electrode terminals for inspection by a coaxial cable of about 1 meter) , measure the capacitance (Cp) and loss factor (Df) of a capacitor (capacitor) with a capacitance of 1 pF, and find their standard deviation, the standard deviation of Cp is about 0.000250 pF, and the standard deviation of Df is about It becomes 0.000043. On the other hand, the electrode terminal set for inspection and the switching means including the MOS FET are connected by a coaxial cable of the same length, and the capacitance and loss factor of the capacitor having a capacitance of 1 pF are measured similarly, and their standard deviation As a result of finding , the standard deviation of Cp is about 0.0000455 pF, and the standard deviation of Df is about 0.000082. Since both the standard deviation of the capacitance and the standard deviation of the loss factor are approximately doubled, the precision of the measurement data is can be seen to decrease.

The inventor of the present invention conducted research for the cause of the increase in the standard deviation of the electrostatic capacity and the standard deviation of the loss coefficient, which occur when a MOS FET is used as the connection switching means in consideration of the above measurement results. And, in the course of the study, as a result of investigating the effect of the length of the coaxial cable connecting the electrode terminal set for inspection and the connection switching means, as shown as a graph in FIG. Each standard deviation of the loss capacitance and loss coefficient has a strong correlation with the length of the coaxial cable, and when the length of the coaxial cable is set to 0 meters (that is, when a coaxial cable is not used), MOS FETs as a connection switching means It was found that using in place of the mercury relay switch showed little difference for any standard deviation of capacitance and dissipation factor.

The present inventors, based on the above new knowledge, use a MOS FET as a connection switching means, while obtaining high-accuracy measurement data that is not inferior to that in the case of using a mercury relay switch. The installation method was further reviewed. Then, as a result of the examination, the MOS FET was housed in a case, the case accommodating the MOS FET was placed adjacent to each of the fixed electrode terminal and the movable electrode terminal of the test electrode terminal set, and then the MOS FET ( and its driving circuit) are directly connected to the fixed electrode terminal and the movable electrode terminal through a connector, so that the use of a coaxial cable connecting the MOS FET and the test electrode terminal set can be avoided, and as a result, the chip electronics The present invention was reached by discovering that a MOS FET can be used as a connection switching means between a tester for electrical property measurement and an electrode terminal set for test in a parts test and sorting device without any practical problems.

Accordingly, the present invention relates to a base and a chip electronic component conveyance disc rotatably supported on the base, provided that the chip electronic component conveying disc can temporarily accommodate a chip electronic component having an electrode on each of its opposite end surfaces. A plurality of perforations are formed in a plurality of rows along the circumference thereof, and are sequentially formed along the rotational path of the conveyance disk, and a chip electronic component supply receiving unit for supplying and accommodating chip electronic components in the through holes of the conveying disk; Includes an electrical property inspection unit having a plurality of sets of electrode terminal sets for inspection comprising fixed electrode terminals and movable electrode terminals for inspecting electrical characteristics of components, and a classification unit for classifying chip electronic components that have been inspected based on inspection results and an electrical characteristic tester connected to each of the fixed electrode terminal and the movable electrode terminal via a relay switch means, wherein a MOS FET housed in a case is used as the relay switch means, and the MOS FET (and its driving circuit) are disposed adjacent to each of the fixed electrode terminal and the movable electrode terminal of the test electrode terminal set, and the MOS FET is connected to the fixed electrode terminal and the movable electrode terminal via a connector. It is a chip electronic component inspection and sorting apparatus characterized by being connected.

In the chip electronic component inspection and sorting device of the present invention, the connector is preferably provided on the end face of the case, and the MOS FET is preferably a MOS FET having an ON resistance of 500 mΩ or less and an OFF capacitance of 20 pF or less. Do.

In the chip electronic component inspection and sorting device of the present invention, a semiconductor switch element MOS FET and its driving circuit are used instead of the mercury relay switch as a connection means between the electrode terminal set for inspection and the electrical characteristic tester, so the use of the mercury relay switch It is possible to avoid the problems caused by the use of mercury, namely, insufficient service life, the limitation of speeding up connection switching, and the risk to the environment due to the use of mercury.

In addition, in the chip electronic component inspection and sorting apparatus of the present invention, the connection operation of the electrical property inspection tool for measuring the electrical characteristics of the chip electronic component and the electrode terminal set for inspection becomes very easy, and the installation and repair of the electrode terminal set for inspection, etc. There is also the advantage of simplifying the operation of That is, in the conventional chip electronic component inspection and sorting apparatus, for example, when three sets of electrode terminal sets and three sets of mercury relay switches are connected with a coaxial cable, each set of fixed electrode terminals and movable electrode terminals The total number of coaxial cables connecting 3 sets of mercury relay switches is 6 pieces. And when a problem arises in an electrode terminal set, once a coaxial cable is removed from an electrode set, it is necessary to repair or replace, and complicated operation|work is required. Further, since the electrode terminal set is small in size as described above, when removing the coaxial cable from a pair of electrode terminal sets, it is often necessary to remove the coaxial cable also from the electrode terminal set adjacent thereto. , for this reason, the operation of replacing or repairing the electrode terminal set tends to be more complicated. In addition, such a complicated operation is, of course, also required at the time of mounting the electrode terminal set for inspection to the selector and connecting the coaxial cable. In the chip electronic component inspection and sorting apparatus of the present invention, since it is not necessary to use a coaxial cable to connect the electrode terminal set for inspection and the connection switching means (means for switching the electrical connection between the electrode terminal set and the inspection machine), it is not necessary to use a coaxial cable. Since one operation becomes unnecessary, there is also an advantage that the assembly operation and repair operation of the chip electronic component inspection and sorting device become very simple.

1 is a perspective view illustrating a configuration of a chip electronic component to be inspected using a chip capacitor as an example;
Fig. 2 is a front view showing an example of the overall configuration of a chip electronic component inspection and sorting device;
3 is a chip electronic component conveyance disk of the chip electronic component inspection and sorting device, a chip electronic component supply receiving unit (supply receiving area), and a chip electronic component electrical characteristic inspection unit arranged sequentially along the rotational direction in the rotation path of the conveying disk; (Inspection area) and a diagram showing a chip electronic component classification unit (classification area).
Fig. 4 is a front view of the chip electronic component conveyance disc, and a cross-sectional view of the conveying disc and a support structure behind it;
5 is a view showing a front view and a side view of a chip electronic component supply receiving unit. In addition, the broken line is additionally drawn to indicate the internal structure of the chip electronic component supply receiving unit.
6 is a view showing the internal structure of a bucket provided in a chip electronic component supply receiving unit, (a) is a front view showing the internal structure of the bucket, (b) is a side cross-sectional view of the bucket. Moreover, the cross-sectional view of the side surface of the conveyance master and the base plate (standard stand) provided behind the conveyance master and the back of the conveyance master is shown in the sectional side surface sectional drawing of the latter bucket.
Fig. 7 is a cross-sectional view showing the supply and accommodation state of the chip electronic component through the hole of the transfer disk in the chip electronic component supply receiving section, and the chip electronic component is placed in the hole arranged in an arc along the circumference on the transfer disk. A drawing showing the state of being accommodated and conveyed. An arrow indicates the rotational direction of the conveyance disk (the movement direction of the hole).
Fig. 8 is a cross-sectional view showing a state in which an inspection unit inspects electrical characteristics of a chip electronic component accommodated in a hole in a conveyance disk;
Fig. 9 is a view showing a state in which the chip electronic component accommodated in the hole of the conveying disk and the inspection by the inspection unit is completed is discharged from the sorting unit;
Fig. 10 is a circuit diagram showing a wiring system including a mercury relay used as a switching means in a known chip electronic component;
Fig. 11 is a circuit diagram showing an example of a wiring system including MOS FETs housed in a case and used as switching means in the chip electronic component of the present invention;
Fig. 12 is a schematic diagram showing a combination of a case (with connector) for accommodating a MOS FET used in a chip electronic component of the present invention and a test electrode set;
Fig. 13 is a schematic view showing a state in which the case (accommodating a MOS FET) shown in Fig. 12 is mounted on a test electrode set;
Fig. 14 is a schematic diagram showing a state in which the chip electronic component is inspected using the inspection electrode set to which the case (which houses the MOS FET) shown in Fig. 13 is mounted;
Fig. 15 is a graph showing the relationship between the length of a coaxial cable connecting a MOS FET and an electrode terminal set for inspection in a chip electronic component inspection and sorting device, and the precision (expressed in standard deviation) of electrical characteristic measurement values;

EMBODIMENT OF THE INVENTION Hereinafter, the typical structure of the chip|tip electronic component inspection and sorting apparatus of this invention is demonstrated, referring FIGS. 1-14 which are accompanying drawings. Moreover, since this invention is an improvement regarding the connection switching structure containing the connection switching means (relay switch) of a well-known chip electronic component inspection and sorting apparatus, since it is clear from the description given so far, it is a well-known chip electronic component first. A typical configuration of the test screening device will be described.

1 is a perspective view showing the configuration of a chip electronic component to be inspected using a chip capacitor as an example, wherein a chip electronic component (chip capacitor) 19 is formed opposite to a capacitor body 21 made of a dielectric and both ends thereof It is comprised by a pair of electrodes 22a, 22b. The normal chip capacitor 19 is a chip ceramic capacitor using ceramic as a dielectric. Moreover, the solder layer for mounting to the various board|substrates of a chip electronic component is laid on the electrode surface of a normal chip electronic component.

Fig. 2 is a front view showing a configuration example of a chip electronic component inspection and sorting apparatus, and Fig. 3 is a chip electronic component conveyance disk of the chip electronic component inspection and selection apparatus and a rotation path of the conveyance disk are sequentially arranged along the rotational direction. Indicates the chip electronic component supply receiving section (supply receiving area), the chip electronic component electrical characteristic inspection section (inspection area), and the chip electronic component classification section (sorting area). The chip electronic component inspection and sorting apparatus of FIG. 2 is an apparatus of arrangement|positioning in which many perforation|holes were arranged in 6 rows along the circumference on a conveyance disk. In addition, for the simplification of illustration, the conveyance master of FIG. 3 has shown the conveyance master by the structure in which many through-holes were arranged in 3 rows along the circumference|surroundings. Fig.4 (a) is a front view of the chip electronic component conveyance master shown in FIG. 3, (b) is sectional drawing which shows the conveyance master and the support structure behind it.

In the chip electronic component inspection and sorting apparatus 10 shown in Fig. 2, a plurality of through holes 11a capable of temporarily accommodating chip electronic components (eg, chip capacitors) on the surface of the disk-shaped material are arranged along the circumference. A chip electronic component conveyance disk (hereinafter, sometimes simply referred to as a conveyance disk) 11 formed with In the rotational path of the conveyance disk 11, as shown in FIG. 3, a supply accommodation part (supply accommodation area) 101 of a chip electronic component, an inspection part (inspection area) 102 of the electrical characteristics of a chip electronic component, and A classification unit (classification area) 103 of the chip electronic component is set. In the inspection part 102, the electrode terminal for electrical characteristic measurement is provided in the position adjacent to both opening part of each through hole 11a of each row|line|column of the conveyance master 11. As shown in FIG. The electrode terminal is provided with a controller 15 to which the testers 14a and 14b are electrically connected, and which is electrically connected to the tester so as to supply a signal related to the inspection process to the tester. Moreover, the chip electronic component which is an inspection object is put into the hopper 47, and is supplied to the hole of the conveyance master 11 through the bucket (refer FIGS. 5 and 6) from the chip electronic component supply port 31. As shown in FIG.

The through hole 11a of the chip electronic component conveyance master 11 is normally arrange|positioned on the surface of a conveyance master at the position which divided this concentric circle into equal parts on several concentric circles.

In the device 10 shown in FIG. 2 , six perforations are formed in total arranged in a radial direction between the center and the peripheral edge of the conveyance disk 11, and for every six chip electronic components accommodated in each perforation. , the inspection of the electrical characteristics of the chip electronic components is carried out. The number of through holes arranged in a radial direction between the center and the peripheral edge of the conveyance disk 11 is preferably in the range of 3 to 20, more preferably in the range of 3 to 12.

The conveyance master 11 is rotatably installed (fixed) on the base 41 via, for example, a base plate (reference table) 45 and the central shaft 42, and is arrange|positioned on the back side. By operating the formed rotation drive device 43, it intermittently rotates around the central axis 42.

The chip electronic component to be inspected is temporarily accommodated in the through hole 11a of the conveyance master 11 in the chip electronic component supply receiving section 101 in order to inspect the electrical characteristics thereof.

The detailed structure of the chip electronic component supply accommodation part 101 is shown in FIG.5 and FIG.6. The chip electronic component supply accommodating part 101 is also called a bucket part, and receives the chip electronic component supplied from the chip electronic component supply port 31 from the outside in the through hole 11a of the conveyance disk 11 through the bucket 32. This is an area for making 5 and 6, the bucket 32 is a configuration for supplying chip electronic components to a hole group of three rows (shown in three rows for simplicity similarly to FIG. 3) formed on the conveyance master 11. 3 rows of grooves for lowering the chip electronic component in an arc shape in 3 rows are separated by the partition wall 33 and are formed. The chip electronic component supplied from the chip electronic component supply port 31 and descended along the partition wall 33 inside the bucket 32, near the bottom of the bucket 32, is placed on a base plate (reference table) ( 45), through the gas suction passage 45a formed in , the strong suction force generated in the through hole 11a of the conveyance disk 11 is sucked into the through hole 11a. In addition, the suction accommodation to the through-hole 11a of the conveyance master 11 of this chip electronic component is normally performed by making the conveyance master into a temporarily stopped state.

7 : shows the state in which a chip electronic component is sucked-in by the through-hole 11a of the conveyance master 11. As shown in FIG. That is, the electronic chip components 19 integrated in the vicinity of the bottom of the bucket 32 pass through the hole ( It is sucked and accommodated in the through hole 11a by the strong suction force generated in 11a). In addition, at the time of suction and accommodation of the chip electronic component 19 integrated in the vicinity of the bottom of the bucket 32 into the through hole 11a, air is blown into the vicinity of the bottom of the bucket 32 from the outside to generate an airflow. It is preferable to make the chip electronic component 19 float in a stirred state in order to smoothly advance the suction and acceptance of the chip electronic component. Blowing air from the outside in the vicinity of the bottom of the bucket 32 as described above can be performed, for example, by using the air blowing 37 shown in FIG. 6 .

As mentioned above, the base plate 45 is arrange|positioned on the back side of the chip|tip electronic component conveyance master 11, or the rear side (the right side in FIG. 7) of an apparatus. The base plate 45 is provided with a plurality of gas suction passages 45a each opened from the surface on the conveyance master 11 side. Each gas suction passage is connected to a gas suction device 46 that supplies a strong suction force to the through hole. When the gas suction device 46 is actuated, the gas in the gas suction passage 45a is sucked by a strong suction force, and the gap formed between the conveyance master 11 and the base plate 45 becomes a pressure-reduced state.

While intermittently rotating the conveyance disk 11 in the direction indicated by the arrow written in FIG. 7, the chip electronic component is supplied to the surface of the conveying disk through the chip electronic component supply port 31 and the bucket 32, and the base When the suction device 46 is actuated to reduce the gap between the conveyance master 11 and the base plate 45 to a reduced pressure state, the chip electronic component 19 is sucked and accommodated in each of the through holes 11a of the conveyance master 11. .

By the intermittent rotational movement of the conveyance master 11, the chip electronic component 19 accommodated in the through hole 11a of the conveyance master 11 is then sent to the inspection part 102 shown in FIGS. lose In addition, in the clearance gap between the conveyance master 11 and the base plate 45, after accommodation in the hole 11a of the chip electronic component 19 is completed, the conveyance master 11 rotates, and the through hole 11a Until the chip electronic component 19 accommodated in the unit moves to the inspection unit 102 and reaches the flow dividing unit 103 , it is in a weak decompression state. For this reason, the chip electronic component 19 accommodated in the through-hole 11a of the conveyance master 11 in the chip electronic component supply accommodation part 101, by the subsequent rotation of the conveyance master 11, the inspection part 102 It does not fall off from the through hole 11a until it arrives at the dividing part 103 via way.

In the inspection section, as shown in Fig. 8 , in order to electrically connect the chip electronic component to the inspection machine having the electrical characteristics thereof, at positions adjacent to both openings of the through holes 11a of the conveyance disk 11, 12a constituted in pairs, respectively and 13a (the former is a fixed electrode terminal and the latter is a movable electrode terminal, hereinafter the same), a combination of 12b and 13b, a combination of 12c and 13c, a combination of 12d and 13d, a combination of 12e and 13e, and a combination of 12f and 13f combinations are placed.

As mentioned above, one electrode terminal 12a, the other is being fixed to the base plate 45 through the electrically insulating cylinder arrange|positioned and formed in the periphery. The surface on the side of the conveyance disk of the electrode terminal and the base plate 45 turns into a smooth plane by grinding|polishing etc. normally. The other electrode terminal 13a (other) is a movable electrode, and is supported by the electrode terminal support plate 53 so that forward-backward movement is possible.

By moving the electrode terminal support plate 53 to the conveyance disk 11 side, the movable electrode terminals 13a and others supported by the electrode terminal support plate 53 also move to the conveyance disk 11 side. By the movement of the movable electrode terminals 13a and others, the chip electronic component is sandwiched between the paired electrode terminals 12a, 13a, and others to be in contact. For this reason, the electrode 22a of the chip electronic component is electrically connected to the electrode terminal 12a, others, and the electrode 22b is electrically connected to the electrode terminal 13a, others. Thereby, the chip electronic component is electrically connected to the tester via the paired electrode terminals 12, 13a and others.

In addition, when a chip electronic component is accommodated in each hole, the "position adjacent" to both openings of each through hole of the conveyance disk in which the paired electrode terminals are arranged means that each electrode terminal is electrically connected to the electrode of each chip electronic component. When the position to be connected or the electrode terminal is configured to be movable, it means a position that can be electrically connected to the electrode of the chip electronic component by moving the electrode terminal.

Then, in the inspection unit 102 , predetermined electrical characteristics are obtained for each of the six electronic chip components 19a , 19b , 19c , 19d , 19e and 19f that are accommodated and arranged so as to be arranged in a line in the radial direction of the conveyance disk 11 . are inspected

The chip electronic component whose electrical characteristics were inspected is then sent to the chip electronic component sorting unit 103 shown in FIGS. 2 and 3 by intermittent rotational movement of the conveyance disk 11 .

As shown in FIG. 9, the tube support cover 61 in which the several through hole 61a was formed in the front side of the conveyance master 11 or the front side (left in FIG. 9) of an apparatus is arrange|positioned in the dividing part 103 as shown in FIG. is formed A tube 62 constituting a discharge passage for the chip electronic component 19a is connected to each of the through holes 61a of the tube support cover 61 . In addition, in FIG. 2, only a part of the tube of the tube 62 connected to each through hole 61a of the tube support cover 61 is shown.

Further, on the base plate 45 disposed on the back side of the conveyance master 11 or on the rear side (the right side in Fig. 9) of the apparatus, in the region of the dividing part 103, from the surface on the conveyance master 11 side, respectively. A plurality of gas supply passages 45b to be opened are formed. Each gas supply passage 45b is connected to the pressurized gas supply device 63 .

When the pressurized gas supply device 63 is operated, the pressurized gas is supplied to the gas supply passage 45b, and the pressurized gas is injected to the chip electronic component 19a accommodated in the through hole 11a of the conveyance disk 11. . Thereby, the chip electronic component is discharged to the tube 62 .

The chip electronic component 19a passes through the ten through-holes 61a in total in the outermost peripheral side among the several through-holes 61a formed in the tube support cover 61 shown in FIG. 2, for example. Each of these ten through holes 61a is connected to the chip electronic component container 64 via a tube 62 .

Therefore, the electronic component of the chip discharged from the hole in the flow dividing unit 103 passes through any of the ten tubes 62 in total connected to the ten holes 61a of the tube support cover 61, and the electrical Based on the characteristics, it is accommodated in a predetermined chip electronic component accommodating container 64 .

Next, although the relay means (switching device) used by the chip electronic component inspection and sorting apparatus of this invention is demonstrated, arrangement|positioning of the mercury relay in the previously well-known chip electronic component inspection and selection apparatus is demonstrated.

About arrangement of the mercury relay in a chip electronic component inspection and sorting apparatus, although outline can be understood from description of patent document 1 and FIG. 7, a more detailed structure is shown in FIG. 10 which is an accompanying drawing of this specification. In Fig. 10, a combination of three sets of fixed electrode terminals 12a, 12b, 12c and movable electrode terminals 13a, 13b, and 13c according to the four-wire method is performed via a mercury relay switch 20, respectively, in the tester 14a. It is a circuit diagram showing a system that can be electrically connected to In the tester 14a, four terminals (Hcur, Hpot, Lcur, Lpot) which are electrically connected to each electrode terminal in contact with each of the chip electronic components 19a, 19b, 19c via a mercury relay switch 20 ) is provided.

Each mercury relay switch 20 switches the electrical connection between the tester 14a and each electrode terminal in accordance with instructions transmitted from the tester 14a and the controller 15 . Although information regarding the arrangement of the mercury relay switch 20 in the chip electronic component inspection and sorting device is not obtained from FIG. 10, as described above, since the mercury relay switch has a large size, the position is It is not in the vicinity of , but is disposed in the vicinity of the tester 14a away from the electrode terminal set, and it is common to connect each electrode terminal and the mercury relay switch with a coaxial cable.

Next, the MOS FET accommodated in the case used in the present invention and its arrangement will be described with reference to Figs.

11, the MOS FET 24 accommodated in the case 23 is connected to the tester 14a at one end thereof, and a connector protruding outside of the case 23 at the other end (with an electrode terminal). It can be understood that it is connected to the connector for connection) 25 . In addition, you may lay a connector in the recessed part formed in the end surface of the case.

MOS FET is a relay switch classified into a semiconductor switch element, and the structure and characteristic are already known. As a MOS FET used as a switching device (relay switch) of the chip electronic component inspection and sorting device of the present invention, a MOS FET having an ON resistance of 500 mΩ or less and an OFF capacity of 20 pF or less is preferable.

As is clear from Fig. 12, the case 23 housing the MOS FET is provided with a coaxial cable for connecting to the inspection machine on the left end surface of the drawing, and the connector 25 is provided on the right end surface. Each of the connectors 25 is configured such that electrical connection with each electrode terminal of the electrode terminal unit 26 (as an integrated electrode terminal set, a movable electrode terminal unit is shown in this figure) is possible.

Fig. 13 shows a state in which a case 23 accommodating the MOS FET shown in Fig. 12 and an electrode terminal unit (movable electrode terminal unit) 26 are connected via a connector. This movable electrode terminal unit 26 is provided with six electrode terminals, and therefore, in combination with a corresponding fixed electrode terminal unit having the same six fixed electrode terminals, a connection switching mechanism using the MOS FET 24 . can measure the electrical characteristics of six chip electronic components sequentially at high speed.

14 is a case in which the case 23 accommodating the MOS FET shown in FIG. 13 and the unit to which the movable electrode terminal unit is connected via a connector (the movable electrode terminal unit) also accommodate the MOS FET ( 23) and a unit to which the fixed electrode terminal unit is connected via a connector (fixed electrode terminal side unit) is accommodated in the conveyance disk 11 for measurement of electrical characteristics of the chip electronic component 19 It is a schematic diagram showing the state in contact with the electrode terminal.

In addition, in this specification, although description of the structure of a chip electronic component inspection and sorting apparatus was demonstrated taking as an example the apparatus which the chip electronic component conveyance disk described in patent document 1 is arrange|positioned in a vertical direction and operates, the chip electronic component of this invention It goes without saying that the component inspection and sorting apparatus may be an apparatus in which the chip electronic component conveyance master is pivotally supported in a state inclined to the base.

10: chip electronic component inspection and sorting device
11: chip electronic component conveyance disk
11a: hole
12a, 12b, 12c, 12d, 12e, 12f: fixed electrode terminals
13a, 13b, 13c, 13d, 13e, 13f: movable electrode terminals
14a, 14b: checker
15: controller
19: chip electronic components (chip capacitors)
19a, 19b, 19c: Chip Electronic Components (Chip Capacitors)
19d, 19e, 19f: Chip Electronic Components (Chip Capacitors)
20: mercury relay switch
21: capacitor body
22a, 22b: electrode
23: Case (for electrode terminal connection)
24: MOS FET
25 : connector
26: electrode terminal unit (movable electrode terminal unit)
31: chip electronic component supply port
32 : Bucket
33: partition wall
41 : Expectation
42: central axis
43: rotary drive device
45: base plate (standard stand)
101: chip electronic component supply receiving unit (supply receiving area)
102: chip electronic component electrical characteristic inspection unit (inspection station)
103: chip electronic component electronic component classification unit (classification area)

Claims (3)

A base and a chip electronic component conveyance disc rotatably supported on the base, wherein the chip electronic component conveying disc has a plurality of through holes capable of temporarily accommodating a chip electronic component having electrodes on opposite end surfaces, respectively, on the circumference thereof. The chip electronic component conveyance disk, which is formed in a plurality of rows, and the chip electronic component supply receiving unit for supplying and accommodating the chip electronic component in the through holes of the conveying disk formed sequentially along the rotation path of the conveying disk, the chip electronic component Includes an electrical property inspection unit provided with a plurality of sets of electrode terminal sets for inspection comprising fixed electrode terminals and movable electrode terminals for inspecting electrical characteristics of components, and a classification unit for classifying electronic components on the basis of inspection results and an electrical characteristic tester connected to each of the fixed electrode terminal and the movable electrode terminal via a relay switch means,
using, as the relay switch means, a MOS FET having an ON resistance of 500 mΩ or less and an OFF capacitance of 20 pF or less, accommodated in a case; the case being provided with a connector for connecting to the output circuit of the MOS FET; a fixed electrode terminal and a movable electrode terminal of the test electrode terminal set are respectively connected to the connector so that they can be removed or inserted; and the case is disposed adjacent to each of the fixed electrode terminal and the movable electrode terminal. The method of claim 1,
The connector is provided on the end face of the case, chip electronic component inspection and sorting device. delete

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