TWI649569B - Method for checking the continuity of electrical characteristics of electronic components of wafers - Google Patents

Abstract

Provided is a method for reducing the inspection accuracy which is found when the inspection method which can suppress the continuity of the electrical characteristics of the electronic components of the wafer without the extension of the inspection process.

A method for inspecting electrical characteristics of a wafer electronic component using a wafer electronic component transporting disk in which three or more rows of through holes are formed concentrically on the surface, which is a method of assembling the following operation: Measuring the electrical characteristics of one of the electronic components of the wafer contained in the electronic components of the wafers arranged in a row in the radial direction of the electronic component handling disk of the wafer, and contacting one or more other electronic components of the wafer A direct current is applied to the electrode terminal to remove the oxide film formed at the front end of the electrode terminal.

Description

Method for checking the continuity of electrical characteristics of electronic components of wafers

The present invention relates to a method for inspecting the electrical characteristics of a large number of wafer electronic parts at high speed and continuously using an automated wafer electronic part inspection sorting apparatus.

With the increase in the production of small electronic products such as mobile phones, smart phones, LCD TVs, and electronic game machines, the production of tiny chip electronic components assembled in such electronic products has increased significantly. Most of the electronic components of the wafer are composed of a body portion and electrodes respectively provided on opposite end faces of the body portion. Examples of the wafer electronic component thus constituted include a wafer capacitor (also referred to as a wafer capacitor), a wafer resistor (including a wafer varistor), and a chip inductor.

In recent years, in response to the miniaturization of electronic products for assembling electronic components of wafers, and the increase in the number of electronic components of wafers assembled in electronic products, electronic components of wafers have become extremely small. For example, for wafer capacitors, capacitors having a very small size (for example, a size called 0402 wafer, 0.2 mm × 0.2 mm × 0.4 mm) have been used in recent years. Such tiny chip electronic parts are produced in large quantities, ranging from tens of thousands to hundreds of thousands in batches. The unit comes to production.

In electronic products in which electronic components for wafers are assembled, in order to reduce the defective rate of electronic products due to defects in electronic components of the wafers, it is common to perform a total inspection of a large number of electronic components for wafers. For example, for the wafer capacitor, inspection of electrical characteristics such as electrostatic capacitance or leakage current is performed for all of the wafer capacitors.

In the inspection of the electrical characteristics of a large number of electronic components of a chip, it is necessary to perform the inspection of the high-speed inspection automatically. In recent years, a wafer electronic component carrying disk having a plurality of through holes is generally used ( The electronic component of the wafer electronic component temporarily holds the electrical characteristics of the wafer electronic component and the automated device for sorting (ie, the wafer electronic component inspection sorting device). The wafer electronic component transporting disk is usually formed in a state in which a plurality of through holes for temporarily holding the electronic components of the wafer to be inspected are arranged in a plurality of rows of three or more rows along the circumference. Moreover, when the wafer electronic component inspection sorting device is used, the through hole of the wafer electronic component transporting disk in the rotating state temporarily accommodates the electronic component of the wafer, and is held in the electronic component carrying disk of the wafer. a chip electronic component, a pair of electrode terminals (inspection contact terminals) attached along a rotation path of the wafer electronic component transporting disk are in contact with respective electrodes of the chip electronic component to measure a specific electrical characteristic of the electronic component of the chip Then, according to the measurement result, the electronic component of the wafer is discharged from the through hole of the wafer electronic component transporting disk to be stored in a specific container, and the sorting (or sorting) operation is performed.

That is, the most recent inspection of the electronic components of the wafer The sorting device may be referred to as an electronic component inspection sorting device including: a base, a wafer electronic component transporting disc rotatably pivotally supported on the base (however, the electronic component handling disc on the wafer) And three or more rows of through holes formed in the opposite end faces of the wafer electronic components having electrodes, and the wafer electronic circuits are sequentially disposed along the rotation path of the electronic component carrying disks of the wafers The chip is supplied with a chip electronic component supply accommodating portion (supply accommodating region) that is accommodated in the through hole of the wafer electronic component transporting disk, and an electronic component electrical property inspection unit (inspection region) for performing electrical property inspection of the electronic component of the wafer. There is a wafer electronic component classification section (classification area) for classifying the electronic components of the wafer to be inspected based on the inspection result.

For example, in the inspection of the electrostatic capacitance of the wafer capacitor, the electrical property inspection unit holds the wafer capacitor from the inspection electrode terminal (the electrical property measuring device) included in the wafer electronic component inspection sorting device. The voltage for inspection at a specific frequency. Further, by the application of the voltage for inspection, the inspector detects the current value of the current generated in the wafer capacitor, and performs the inspection of the electrostatic capacitance of the wafer capacitor to be inspected based on the detected current value and the voltage value of the inspection voltage. .

An example of the wafer electronic component inspection sorting apparatus is the apparatus described in Patent Document 1. In the patent document 1, a method for improving the electrical characteristics of the electronic component of the wafer is described, and the method includes the following steps: using the electronic component inspection and sorting device of the above-described configuration, and respectively, according to the same specification The electronic components of the wafer that are manufactured to indicate the specific electrical characteristics of the same are closely arranged to each other. In the state, the through hole of the electronic component transporting disk of the wafer is received, and then the inspector is electrically connected to the electronic component of the chip, and then the inspection voltage is applied to the electronic component of the chip from the inspection device, and the inspection is performed by the inspection device. With the application of voltage, the inspector detects the current value generated on the electronic components of each wafer.

Further, Patent Document 2 discloses that a high-resistance impurity such as an oxide film formed on an electrode surface of an electronic component is reduced in order to reduce the accuracy of resistance measurement when the resistance measurement of the electronic component is performed, and a voltage is applied to the DC current to the DC current. The method of oxidizing the film has an effect.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] WO2014/010623A1

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-30131

When performing the inspection and classification operation of the electronic component of the wafer using the wafer electronic component inspection and sorting apparatus having the above various configurations, the wafer electronic component transporting disk is first intermittently rotated, and the disk electronic component carrying disk is rotated. During the cessation period, the chip electronic component is housed in the accommodating portion, and the chip electronic component is housed in the through hole of each row of the chip electronic component transporting disk, and then the intermittent rotation of the disk electronic component transporting disk is performed. The electronic components of the wafer that are housed in the through holes of each column are moved to In the electrical property inspection unit, the electrode terminals electrically connected to the electrical property measuring device (inspector) are brought into contact with the respective chip electronic components housed in the through holes of the respective columns, and in the contact state And automatically performing an operation of sequentially measuring electrical characteristics of the wafer electronic component of the through hole adjacent to the radial direction of the wafer electronic component transporting disk, and then repeatedly performing the rotation of the wafer electronic component carrying disk and in the stopped state The operation of accommodating the electronic components of the wafer to the through-hole and measuring the electrical characteristics.

The inventors of the present invention have conducted a study to examine the continuity of the electrical characteristics of the electronic components of the wafers of the wafer sorting apparatus described herein, and note that the measurement of electrical characteristics occurs when such inspections are continued for a long period of time. A study to investigate the cause of the decrease in the accuracy of the value. Moreover, based on the results of the research, the inventors have found that the reason for the decrease in the accuracy of the measurement of the electrical characteristics is for the measurement, at the front end of the electrode terminal (probe) which is in high speed and repeated contact with a large number of wafer electronic parts. The oxide film is formed, and the contact failure between the front end of the electrode terminal and the electrode surface of the chip electronic component due to the formation of the oxide film is generated.

In general, in order to remove the oxide film formed on the electrode surface of the electronic component, a method of applying a voltage to the oxide film by a direct current can be disclosed in Patent Document 2 described above. Therefore, the inventors of the present invention have removed the oxide film formed at the front end of the electrode terminal (probe) by applying a voltage to the electrode terminal with a direct current. That is, the research has improved the following methods: before the measurement of the electrical characteristics of the electronic components of the wafer to be inspected, or after the measurement, the electrode terminals are made. A voltage is applied in contact with the electrode surface of the electronic component of the wafer, thereby removing the oxide film at the front end of the electrode terminal. Further, according to the results of the study, the inventors have confirmed that the oxide film formed at the front end of the desired electrode terminal can be removed by adding a process for removing the oxide film at the front end of the electrode terminal.

However, it has also been confirmed that the removal of the above oxide film in the process of the continuity inspection method for the electrical characteristics of the electronic components of the wafer causes problems. In other words, the inspection method using the continuity of the electrical characteristics of the electronic components of the wafers of the above-described inspection sorting apparatus is developed for the purpose of performing inspection of a large number of electronic components of the wafer at a high speed, and therefore, the inspection is performed. The addition of the oxide film of the electrode terminal to the operation inevitably leads to an increase in the time required for the inspection. Therefore, the industrial implementation of the automated inspection of the electronic component of the wafer is disadvantageous.

Therefore, the inventors have further studied the results of finding a wafer electronic component in the electrode terminal that is accommodated in each of the through holes adjacent to the radial direction of the wafer electronic component carrying disk, and a wafer electronic component in the contact electrode terminal. During the electrical characteristics, a direct current is applied to the electrode terminals that are in contact with one or more other chip electronic components (wafer electronic components that are standby for measurement of electrical characteristics), and the oxide film at the front end of the electrode terminal is applied. In addition, the inspection time of the electronic component of the wafer is not prolonged, and the method of checking the continuity of the electrical characteristics of the electronic component of the wafer is incorporated into the electrode film before the electrode terminal. The present invention is based on the invention accomplished by the novel findings discovered by the inventors of the present invention.

Therefore, the present invention is a wafer electronic component handling in which at least three rows of through holes are formed concentrically on the surface and pivotally supported on the base at the center of the concentric circle so as to be intermittently rotatable. The disk is intermittently rotated, and while the rotation of the electronic component transporting disk of the wafer is stopped, the electronic component supply portion of the wafer is housed in the through hole of each row of the electronic component carrying disk of the wafer, and then By intermittently rotating the wafer electronic component transporting disk, the electronic components of the wafer accommodated in the through holes of the respective rows are moved to the electrical property inspection portion, and the electrical property inspection portion is electrically connected to the electrical characteristic measurement. The electrode terminals of the device are in contact with the electronic components of the wafers that are accommodated in the through holes arranged in the radial direction of each column, and in the contact state, the sequential measurement is arranged in a row arranged in the radial direction of the electronic component carrying disk of the wafer. The electrical characteristics of the through-hole wafer electronic component, and then repeated implementation of the wafer electronics in the rotating and stopped state of the wafer electronic component handling disk The device is accommodated in the through hole and has electrical characteristics. The method for checking the electrical characteristics of the electronic component of the chip is characterized in that: by measuring a row arranged in a radial direction of the disk of the electronic component of the wafer During the electrical characteristics of the chip electronic component of one of the wafer electronic components of the hole, a direct current is applied to the electrode terminal that is in contact with the other one or more of the chip electronic components, and the oxide film formed at the front end of the electrode terminal is removed. .

The preferred embodiment of the method for inspecting the electrical characteristics of the electronic components of the wafer of the present invention is as follows.

(1) The chip electronic component is a column-shaped chip electronic component having electrode faces at the top and the bottom, and the electrode terminal is respectively connected to the chip electronic The electrode surface at the top of the part and the electrode surface of the bottom are in contact with at least one pair of probes.

(2) The electrode terminal is composed of four probes electrically connected to respective terminals of Hcur, Hpot, Lcur, and Lpot of the electrical property measuring device.

By using the continuous inspection method of the electrical characteristics of the electronic component of the wafer of the present invention, the accumulation of contaminants such as an oxide film at the front end of the electrode terminal, which causes a decrease in the measurement accuracy of the electrical characteristics, can be automatically avoided. The high-speed and high-precision inspection sorting function of the electrical characteristics of the microchip electronic components.

10‧‧‧Whip electronic parts inspection and sorting device

11‧‧‧ wafer electronic parts handling disc

11a‧‧‧through hole

Electrode terminals of 12a, 12b, 12c, 12d, 12e, 12f‧‧‧

13a, 13b, 13c, 13d, 13e, 13f‧‧‧ the other electrode terminal

14a, 14b‧‧‧ inspector (capacitance meter)

15‧‧‧ Controller

19‧‧‧Whip electronic parts (wafer capacitors)

19a, 19b, 19c‧‧‧ Chip electronic parts (wafer capacitors)

19d, 19e, 19f‧‧‧ wafer electronic parts (wafer capacitors)

21‧‧‧ Capacitor body

22a, 22b‧‧‧ electrodes

31‧‧‧ Chip electronic parts supply port

32‧‧‧ hopper

33‧‧‧ next door

41‧‧‧Abutment

42‧‧‧ center axis

43‧‧‧Rotary drive

45‧‧‧Substrate (reference table)

101‧‧‧Whip electronic parts supply and storage unit (supply storage area)

102‧‧‧Electronic characteristics inspection department for wafer electronic parts (inspection area)

103‧‧‧Whip electronic parts electronic parts classification department (classification area)

Fig. 1 is a perspective view showing a configuration of a wafer electronic component to be inspected by an example of a wafer capacitor.

Fig. 2 is a front elevational view showing an example of the overall configuration of a wafer electronic component inspection sorting apparatus.

3 shows a wafer electronic component transporting disk of a wafer electronic component inspection sorting device, and a wafer electronic component supply accommodating portion (supply receiving region) in which the rotational path of the wafer electronic component transporting disk is sequentially arranged along the rotational direction thereof. , electronic component inspection unit (inspection area) of chip electronic parts Chip Electronic Parts Classification Department (Classification Area).

4 is a front elevational view of the wafer electronic component handling disk, and a cross-sectional view of the wafer electronic component handling disk and the support structure behind it.

Fig. 5 is a front view and a side view showing the electronic component supply and storage portion of the wafer. Further, the broken line is drawn to indicate the internal structure of the chip electronic component supply and storage unit.

6 is a view showing an internal structure of a hopper provided in a chip electronic component supply and storage unit, wherein (a) is a front view showing the internal structure of the hopper, and (b) is a side cross-sectional view showing the hopper. Further, the side cross-sectional view of the latter hopper also shows a cross section of the side surface of the substrate (reference table) provided behind the wafer electronic component transfer disk and the wafer electronic component transfer disk.

7 is a cross-sectional view showing a state in which a wafer electronic component supply accommodating portion supplies a through hole to a wafer electronic component transporting disk and accommodates a wafer electronic component, and shows that the wafer electronic component carrying disk is arc-shaped along a circumference. The through holes arranged in series are arranged to accommodate the electronic components of the wafer and are in a state of being transported. The arrow indicates the direction of rotation of the wafer electronic component handling disk (the direction of movement of the through hole).

Fig. 8 is a cross-sectional view showing a state in which the inspection unit checks the electrical characteristics of the electronic components of the wafer housed in the through holes of the wafer electronic component transporting disk.

FIG. 9 is a view showing a state in which the through-holes of the wafer electronic component transporting disk are accommodated in the sorting section and the electronic components of the wafer are completed after the inspection of the inspection section is completed.

Figure 10 shows the continuity of electrical characteristics of the electronic components of the wafer of the present invention. A circuit diagram of an example of an electrical system in which an inspector (capacitance meter) is connected to an electrode terminal (four terminals) used in the inspection method.

Fig. 11 is a circuit diagram showing an example of an electrical system from an inspector (capacitance meter) connected to an electrode terminal (two terminals) used in the method for inspecting the electrical characteristics of the electronic component of the wafer of the present invention.

First, a configuration example of a wafer electronic component inspection sorting apparatus which is used for the implementation of the continuity inspection method for the electrical characteristics of the wafer electronic component of the present invention will be described with reference to the attached drawings.

1 is a perspective view showing a configuration of a wafer electronic component to be inspected by taking a general wafer capacitor as an example. The chip electronic component (wafer capacitor) 19 is formed by a capacitor body 21 composed of a dielectric body and opposite ends thereof. One of the counter electrodes 22a and 22b is provided. A typical wafer capacitor 19 is a wafer ceramic capacitor using ceramic as a dielectric. Moreover, the surface of the electrode of the usual chip electronic component is provided with a solder layer for mounting the chip electronic component to various substrates.

Representative examples of the wafer electronic component to be inspected by the wafer electronic component inspection sorting apparatus of the present invention include a wafer capacitor, a wafer resistor (including a wafer varistor), and a wafer inductor.

The wafer electronic parts to be inspected are manufactured in accordance with the same specifications in such a manner as to indicate specific electrical characteristics.

Therefore, although the wafer electronic parts to be inspected are the same in the same manufacturing lot, even if they are manufactured in the same manner It is also possible to mix additional batches of wafer electronic components in batch wafer electronic parts. However, the wafer electronic parts of the manufacturing lot of the two are generally manufactured in accordance with the same specifications so that they are manufactured in the same manner (generally, they are manufactured for the purpose of selling products having the same product).

2 is a front view showing a configuration example of a wafer electronic component inspection sorting apparatus, and FIG. 3 is a view showing a wafer electronic component transporting disk of the wafer electronic component inspection sorting device and a rotation path of the electronic component carrying disk of the wafer rotating along the wafer The wafer electronic component supply storage portion (supply storage region), the wafer electronic component electrical property inspection portion (inspection region), and the wafer electronic component classification portion (classification region) are sequentially arranged. The wafer electronic component inspection sorting apparatus of Fig. 2 is a device in which a wafer electronic component carrying disk is arranged with a plurality of rows of through holes arranged along the circumference thereof. Further, in order to simplify the wafer electronic component transporting disk of Fig. 3, the wafer electronic component transporting disk is represented by a plurality of through holes arranged in three rows along the circumference thereof. Fig. 4 (a) is a front view of the wafer electronic component carrying disk shown in Fig. 3, and Fig. 4 (b) is a cross-sectional view showing the wafer electronic component carrying disk and the supporting structure behind it.

In the wafer electronic component inspection and sorting apparatus 10 shown in FIG. 2, two or more wafer electronic components (for example, wafer capacitors) can be temporarily accommodated by arranging on the surface of the disk-shaped material along the circumference. The wafer electronic component transporting disk 11 of the through hole 11a is pivotally supported by the base 41 so as to be rotatable along the plane of the disk. The rotation path of the wafer electronic component handling disk 11 is as shown in FIG. In general, a supply accommodating portion (supply accommodating region) 101 for a wafer electronic component, an inspection portion (inspection region) 102 for electrical characteristics of a wafer electronic component, and a classification portion (classification region) 103 for a chip electronic component are provided. In the inspection unit 102, electrode terminals for measuring electrical characteristics are provided at positions close to the openings of the respective through holes 11a of the respective rows of the wafer electronic component transporting disks 11. The inspectors 14a and 14b are electrically connected to the electrode terminals, and the controller 15 is electrically connected to the inspector so as to supply a signal related to the inspection process to the inspector. Then, the electronic component of the wafer to be inspected is placed in the funnel 47, and is supplied from the wafer electronic component supply port 31 to the through hole of the wafer electronic component transporting disk 11 via the hopper (see FIGS. 5 and 6).

The through hole 11a of the wafer electronic component carrying disk 11 is usually placed on the surface of the wafer electronic component carrying disk in a plurality of concentric circles, and is disposed at a position where the concentric circles are equally divided.

In the wafer electronic component inspection sorting apparatus 10 shown in the attached drawing, a total of six through holes arranged in the diameter direction are provided between the center and the periphery of the wafer electronic component transporting disk 11 so as to be accommodated in each Each of the six electronic components of the through hole is inspected for electrical characteristics of the electronic components of the wafer. The number of through holes arranged in the diameter direction between the center and the periphery of the wafer electronic component carrying disk 11 is preferably in the range of 3 to 20, more preferably in the range of 3 to 12.

The wafer electronic component transporting disk 11 is rotatably provided (fixed) to the base 41 via, for example, a substrate (reference table) 45 and a center shaft 42, and is driven by rotation on the back side thereof. The operation 43 is performed to intermittently rotate the periphery of the center shaft 42.

In the through hole 11a of the wafer electronic component transporting disk 11, the electronic component of the wafer to be inspected by the chip electronic component supply and storage unit 101 is inspected for electrical characteristics, and is temporarily accommodated.

The detailed configuration of the wafer electronic component supply accommodating portion 101 is shown in Figs. 5 and 6 . The chip electronic component supply accommodating portion 101 is referred to as a hopper portion, and is used for accommodating the wafer electronic component supplied from the outside from the wafer electronic component supply port 31 through the hopper 32 to the through hole 11a of the wafer electronic component conveying disk 11. region. In FIGS. 5 and 6, the hopper 32 is formed by separating the groove portions of the three rows of the electronic components of the wafer in three rows by the partition walls 33, and is disposed as a pair of wafer electronic component transporting discs. The through-hole group of 11 columns and 3 columns (in order to simplify the same as FIG. 3) is supplied to the wafer electronic component. The wafer electronic component supply port 31 is supplied, and the wafer electronic component descending along the partition wall 33 inside the hopper 32 is near the bottom of the hopper 32, and is borrowed by the gas suction passage 45a formed on the substrate (reference table) 45. The through hole 11a is also attracted to the through hole 11a of the wafer electronic component transporting disk 11 and is attracted to the through hole 11a. Further, the suction of the chip electronic component to the through hole 11a of the wafer electronic component transporting disk 11 is usually performed while the wafer electronic component transporting disk is in a stationary state.

Fig. 7 shows a state in which the chip electronic component is sucked and housed in the through hole 11a of the wafer electronic component carrying disk 11. That is, the wafer electronic component 19 in the vicinity of the bottom of the hopper 32 is formed in the gas suction path 45a formed in the substrate (reference table) 45 by also on the wafer electron The through hole 11a of the component carrying disk 11 brings a strong attraction force and is sucked and accommodated in the through hole 11a. Further, when the wafer electronic component 19 near the bottom of the hopper 32 is sucked into the through hole 11a, air is blown from the outside near the bottom of the hopper 32 to generate an air flow, so that the chip electronic component 19 floats while stirring. It is preferable to smoothly carry out the attraction and reception of the electronic components of the wafer. Thus, blowing air from the outside to the vicinity of the bottom of the hopper 32 can be performed, for example, by the air blowing 37 shown in FIG.

As described above, the substrate 45 is disposed on the back side of the wafer electronic component transporting disk 11 or on the rear side of the device (on the right side of FIG. 7). A plurality of gas suction passages 45a that are open on the surface of the side of the wafer electronic component transporting disk 11 are formed on the substrate 45. Each of the gas suction passages is connected to a gas suction device 46 that supplies a strong attraction to the through holes. When the gas suction device 46 is operated, the gas in the gas suction passage 45a is attracted by the strong suction force, and the gap formed between the wafer electronic component conveying disk 11 and the substrate 45 is in a decompressed state.

While the wafer electronic component carrying disk 11 is intermittently rotated in the direction indicated by the arrow shown in FIG. 7, the wafer electronic component is supplied to the wafer electronic component handling circle through the chip electronic component supply port 31 and the hopper 32. When the gas suction device 46 is operated on the surface of the disk and the gap between the wafer electronic component transporting disk 11 and the substrate 45 is decompressed, the wafer electronic components are sucked and received in the respective through holes 11a of the wafer electronic component transporting disk 11. 19.

Through the intermittent rotational movement of the wafer electronic component transporting disk 11, the through hole of the electronic component transporting disk 11 of the wafer is received. The wafer electronic component 19 of 11a is then sent to the inspection unit 102 shown in FIGS. 2 and 3. Further, the gap between the wafer electronic component transporting disk 11 and the substrate 45 is such that after the wafer electronic component 19 is housed in the through hole 11a, the wafer electronic component carrying disk 11 is rotated, and the chip electronic component housed in the through hole 11a is mounted. 19 moves to the inspection unit 102 and reaches the classification unit 103 again, and is in a weakly decompressed state. Therefore, the wafer electronic component 19 accommodated in the through hole 11a of the wafer electronic component transporting disk 11 in the wafer electronic component supply and storage unit 101 is rotated by the wafer electronic component transporting disk 11 and then passed through the inspection unit 102. The classification unit 103 does not fall off from the through hole 11a.

As shown in FIG. 8, the inspection unit is disposed at a position close to the opening of the through hole 11a of the wafer electronic component transporting disk 11 in order to electrically connect the electronic component of the chip to the inspector having electrical characteristics. A pair of electrode terminals 12a, 13a, 12b, 13b, 12c, 13c, 12d, 13d, 12e, 13e, 12f, 13f are formed.

One of the electrode terminals (12a, others) is fixed to the substrate 45 via an electrically insulating cylindrical body disposed around the electrode terminal. The surface of the electrode terminal and the wafer electronic component transporting disk side of the substrate 45 is usually a smooth plane by polishing or the like.

The other electrode terminal (13a, others) is fixed to the electrode terminal support plate 53.

By moving the electrode terminal support plate 53 to the side of the wafer electronic component transporting disk 11, the electrode terminal (13a, other) supported by the electrode terminal supporting plate 53 also moves the wafer electronic component carrying disk 11 side. By the movement of the electrode terminals (13a, others), the electronic components of the wafer are sandwiched between the pair of electrode terminals (12a, 13a, and others) to be in a contact state. Therefore, the electrode 22a of the chip electronic component is electrically connected to the electrode terminal (12a, others), and the electrode 22b is electrically connected to the electrode terminal (13a, others). Accordingly, the chip electronic component is electrically connected to the inspector via a pair of electrode terminals (12a, 13a, and others).

Further, the "close position" between the two openings of the through-holes of the wafer electronic component transporting disk in which the pair of electrode terminals are disposed means that the electrode terminals are electrically connected when the through-holes contain the chip electronic components. When the electrodes are connected to the positions of the electrodes of the electronic components of the wafer or when the electrode terminals are movable, the positions of the electrodes of the electronic components of the wafer are electrically connected by moving the respective electrode terminals.

In the inspection unit 102, specific electrical characteristics are performed for each of the six wafer electronic components 19a, 19b, 19c, 19d, 19e, and 19f that are arranged in a row in the diameter direction of the wafer electronic component transporting disk 11. an examination.

The electronic component of the wafer inspecting the electrical characteristics is then sent to the sorting unit 103 of the electronic component of the wafer shown in FIGS. 2 and 3 by intermittent rotational movement of the wafer electronic component transporting disk 11.

As shown in FIG. 9, the sorting unit 103 is provided with a tube support cover 61 on which a plurality of through holes 61a are formed on the front side of the wafer electronic component transporting disk 11 or on the front side of the apparatus (the left side in FIG. 9). The through-holes 61a of the tube supporting cover 61 are connected to constitute the chip electronic component 19a. The tube 62 of the discharge passage. Further, in Fig. 2, only the tube member connected to one of the tubes 62 of the respective through holes 61a of the tube support cover 61 is shown.

Further, the substrate 45 disposed on the back side of the wafer electronic component transporting disk 11 or on the rear side of the device (on the right side in FIG. 9) is formed in the region of the sorting portion 103, and is formed in the wafer electronic component carrying disk. A plurality of gas supply passages 45b having a surface opening on the side of 11. Each of the gas supply passages 45b is connected to the pressurized gas supply device 63.

When the pressurized gas supply device 63 is operated, the pressurized gas is supplied to the gas supply path 45b, and the pressurized gas is ejected to the wafer electronic component 19a accommodated in the through hole 11a of the wafer electronic component transporting disk 11. Accordingly, the wafer electronic parts are discharged to the tube member 62.

The chip electronic component 19a is formed in a plurality of through holes 61a of the pipe support cover 61 as shown in FIG. 2, and has a total of ten through holes 61a on the outermost peripheral side. The ten through holes 61a are connected to the wafer electronic component storage container 64 via the tube member 62, respectively.

Therefore, the wafer electronic component discharged through the through hole in the classifying portion 103 is connected to the total of ten pipe members 62 connected to the ten through holes 61a of the pipe support cover 61, and the electricity is proved according to the result of the inspection. The characteristics are stored in a predetermined electronic component storage container 64.

Next, the operation of removing the oxide film at the front end of the electrode terminal which is characteristically operated in the continuous inspection method for the electrical characteristics of the electronic component of the wafer of the present invention will be described in detail with reference to FIG.

Figure 10 shows the electrical characteristics of the electronic component of the wafer of the present invention. A circuit diagram of an example of an electrical system (using a four-terminal method) connected from an inspector to an electrode terminal used in the continuity inspection method. 10 is a circuit diagram of the application of a direct current to an inspector (eg, a capacitance meter) 14a shown in FIG. 2 for applying a wafer electronic component handling circle as shown in FIG. Inspection of electronic components of the wafers of the three sets of 19a, 19b, 19c (through holes accommodated in the radial direction of the wafer electronic component transporting disc) in the electronic components of the through-hole of the disk (measurement of electrical characteristics) And removing the oxide film at the front end of the electrode terminal that is in contact with the electrodes of the electronic components of the wafer, the circuit is shown to be capable of contacting the two pairs of electrode terminals (ie, four terminals) in each of the chip electronic components 19a, 19b, and 19c. In the state, an electric circuit for applying a direct current is sequentially applied, and the direct current is applied to measure the electrical characteristics of the electronic component of the wafer and remove the oxide film at the front end of the electrode terminal. That is, the electrical circuit can be configured as a circuit for applying a DC current through a connection switch in a measurement circuit of each chip electronic component, such as a measurement circuit for electrical characteristics of a four-terminal method of a wafer electronic component. (Connect the circuit to the external power supply terminal + DCV and terminal - DCV).

In Fig. 10, an inspector (capacitance meter) 14a is provided with four terminals (Hcur, Hpot, Lcur, Lpot) that can be electrically connected to four electrode terminals that are in contact with the wafer electronic components via a connection switch.

Next, an operation of measuring the electrical characteristics of the electronic component of the wafer and an operation of removing the oxide film at the front end of the electrode terminal using the electrical circuit shown in Fig. 10 will be described. Arranged in the radial direction of the wafer electronic component transporting disc and housed in the through hole of the wafer electronic component transporting disc In the state in which the chip electronic components 19a, 19b, and 19c are in contact with the electrode terminals, first, the switching operation is connected, and the four electrode terminals that are in contact with the chip electronic component 19a are electrically connected to the inspector 14a, and the electrical characteristics of the wafer electronic component 19a are measured. In addition, during the measurement of the electrical characteristics of the electronic component 19a of the wafer, the DC circuit (the circuit connecting the terminal + DCV and the terminal-DCV) is connected to the wafer electronic component 19b and the wafer by the operation of the connection switching switch. The electrode terminals connected to either or both of the electronic components 19c are applied with a direct current. By the application of the direct current, the oxide film at the front end of the electrode terminal connected to either or both of the chip electronic component 19b and the chip electronic component 19c is removed.

Next, by connecting the switching switches, the four electrode terminals that are in contact with the wafer electronic component 19b are electrically connected to the inspector 14a, and the electrical characteristics of the wafer electronic component 19b are measured. In addition, during the measurement of the electrical characteristics of the electronic component 19b of the wafer, the DC circuit (the circuit connecting the terminal + DCV and the terminal-DCV) is connected to the wafer electronic component 19c and the wafer by the operation of the connection switching switch. The electrode terminals connected to either or both of the electronic components 19a are applied with a direct current. By the application of the direct current, the oxide film at the front end of the electrode terminal connected to either or both of the chip electronic component 19c and the chip electronic component 19a is removed. Further, an electrode terminal for performing an operation of removing the oxide film by applying a DC current to an electrode terminal that is in contact with another chip electronic component, which has been subjected to measurement of electrical characteristics of the chip electronic component 19a, and which is performed at the same time, It is also possible to omit re-application of DC current.

Further, by connecting the switching switches, the four electrode terminals that are in contact with the chip electronic component 19c are electrically connected to the inspector 14a, and the electrical characteristics of the chip electronic component 19c are measured. Further, during the measurement of the electrical characteristics of the electronic component 19c of the wafer, the DC circuit (the circuit of the connection terminal + DCV and the terminal-DCV) is connected to the wafer electronic component 19a and the wafer by the operation of the connection switching switch. The electrode terminals connected to either or both of the electronic components 19b are applied with a direct current. The oxide film formed at the front end of the electrode terminal connected to either or both of the wafer electronic component 19a and the chip electronic component 19b is removed by the application of the DC current. Further, the measurement of the electrical characteristics of the wafer electronic component 19a or the wafer electronic component 19b and the application of the direct current to the electrode terminals in contact with the other wafer electronic components during the same period are performed to remove the oxide film. The electrode terminals that are operated may also omit the re-application of DC current.

As described above, when the continuity check method of the electrical characteristics of the electronic component of the wafer of the present invention is carried out, the electrical characteristics of one of the electronic components of the wafer which are accommodated in the radial direction of the wafer electronic component transporting disk are measured. The oxide film formed at the front end of the electrode terminal is removed by applying a direct current to the electrode terminal that is in contact with the electrode of one or more other electronic components of the wafer. Therefore, the application operation for removing the direct current that generates the oxide film at the front end of the electrode terminal can be performed without causing an extension of the inspection time.

Further, in the method for inspecting the continuity of electrical characteristics of the electronic component of the wafer of the present invention, the oxide film at the tip end portion of the electrode terminal is removed, that is, After measuring the electrical characteristics of the electronic component of the wafer using the electrode terminal, it is also possible to apply a direct current to the electrode terminal. That is, the method for inspecting the electrical characteristics of the electronic components of the wafer of the present invention is performed at high speed and continuously using an automated inspection apparatus, and is used for measurement of electrical characteristics of a wafer electronic component, followed by application of direct current. The electrode terminals whose current is removed by the oxide film are used as they are for the measurement of the electrical characteristics of the next wafer electronic component housed in the same column of the through holes.

In Fig. 10, there is shown a circuit diagram for carrying out a method of measuring an electrical characteristic of a wafer electronic component by a four-terminal method, and performing an oxide film on the front end of the electrode terminal, and removing an oxide film at a front end of the electrode terminal according to the present invention. The method can also be implemented by a circuit in which a circuit for applying a direct current is added to a circuit for measuring electrical characteristics of a chip electronic component by a two-terminal method. Figure 11 shows an example of a circuit used to implement such a method.

Further, in the present specification, the description of the configuration of the wafer electronic component inspection sorting apparatus and the method for removing the oxide film of the wafer electronic component provided by the present invention are described in Patent Document 1. The apparatus for operating the wafer electronic component transporting disk in the vertical direction is described as an example. However, the wafer electronic component inspection sorting apparatus used in the method for checking the electrical characteristics of the electronic component of the wafer of the present invention is even in the wafer. It is a matter of course that the electronic component carrying disk is pivotally supported on the base in an inclined state.

Claims (3)

A method for inspecting electrical characteristics of a chip electronic component by forming at least three rows of through holes concentrically on a surface and pivotally supported at a center of a concentric circle in an intermittent manner The wafer electronic component transporting disk formed on the base is intermittently rotated, and during the rotation of the electronic component transporting disk of the wafer, the electronic component is stored in the electronic component supply and the electronic component is stored in the electronic component of the wafer. The through holes of the rows of the discs are then moved by the intermittent rotation of the electronic component transporting discs of the wafers to move the electronic components of the wafers received in the through holes of the respective columns to the electrical property inspection portion, and the electrical characteristics are checked. The electrode terminals electrically connected to the electrical property measuring device are in contact with the respective chip electronic components housed in the through holes arranged in the radial direction of each column, and in the contact state, the sequential measurement is carried in the wafer. The electrical characteristics of the electronic components of the through-holes are arranged in the radial direction of the electronic component handling disk, and then the electronic component handling of the wafer is repeated. The electronic component is accommodated in the through hole and the electrical characteristic is measured in the rotating and stopping state of the disk, and the method for checking the electrical characteristics of the electronic component of the chip is characterized in that the electronic component is accommodated in the chip by measurement A DC current is applied to an electrode terminal that is in contact with one or more other electronic components of the wafer during a period in which the disk is radially aligned with the electrical characteristics of one of the electronic components of the wafer in each of the through holes. An oxide film is formed at the front end of the electrode terminal. A method for inspecting continuity of electrical characteristics of a wafer electronic component as recited in claim 1, wherein The chip electronic component is a column-shaped chip electronic component having electrode faces at the top and the bottom, and the electrode terminal is composed of at least one pair of probes respectively contacting the electrode faces of the top and the bottom of the chip electronic component. . The method for inspecting continuity of electrical characteristics of a chip electronic component according to claim 2, wherein the electrode terminal is four probes electrically connected to respective terminals of Hcur, Hpot, Lcur, and Lpot of the electrical property measuring device. Composition.