TWI680050B - Imprint device, operation method thereof, and article manufacturing method - Google Patents

Abstract

The embossing device solidifies the embossing material in a state where the mold is in contact with the embossing material on the substrate to form a pattern on the substrate. The imprint apparatus includes a substrate holder having a substrate holding area for holding the substrate, a peripheral member disposed so as to surround a side surface of the substrate held by the substrate holder, and a clean member including a charged portion. The control part which controls the cleaning process which cleans the area | region of the said peripheral structure at least one part. The cleaning process includes moving the cleaning member relative to the peripheral member in a state where the charged portion faces at least a part of the peripheral member, so that particles in the region are adsorbed on the charged member. Department of action.

Description

Imprint device, operation method thereof, and article manufacturing method

The present invention relates to an imprint apparatus, an operation method thereof, and an article manufacturing method.

The imprint technique which solidifies an imprint material while making a mold contact the imprint material arrange | positioned on a board | substrate, and forms a pattern on a board | substrate is attracting attention. In the mold, a pattern formed by the concave portion is formed, and when the mold is in contact with the imprint material on the substrate, the imprint material is filled in the concave portion due to a capillary phenomenon. In order to promote the filling of the embossing material into the recessed portion or to prevent the solidification of the embossing material due to air (oxygen), the space between the substrate and the mold is supplied with a purge gas. At the time when the embossed material is sufficiently filled in the recess, energy such as light or heat is applied to the embossed material. As a result, the imprint material is cured, and the pattern formed by the concave portion formed in the mold is transferred to the imprint material on the substrate. After the imprint material is cured, the mold is separated from the imprint material.

The mold is charged when the mold is separated from the cured imprint material on the substrate. The electric field formed by this charging causes electrostatic force (Coulomb force) to act on the particles, whereby the particles are attracted to the mold and adhere to the mold. Particles sometimes invade from the outside of the chamber of the imprint device The chamber is caused by friction between mechanical elements, friction between the mechanical element and the substrate or the substrate, and the like. Alternatively, when the imprinted material is ejected from the discharge port in order to dispose the uncured imprinted material on the substrate, a mist of the imprinted material is generated, and the imprinted material is solidified to generate particles.

In Japanese Patent Laid-Open No. 2014-175340, it is described that a foreign object capturing area is provided in a mold, and the foreign object capturing area is charged, so that it will exist in the ambient gas and / or the substrate when the substrate is transferred to the transfer position. Foreign matter is removed. In Japanese Patent Laid-Open No. 2015-149390, it is described that a pattern portion and a first conductive film are provided on a first surface of a mold, and a second conductive film is provided on a second surface so that charges are accumulated in the first conductive film and the second The conductive film attracts particles in the vicinity of the pattern portion to the first conductive film.

When particles are attached to the mold and a pattern is formed by contacting the mold with the imprint material on the substrate, a defective pattern is formed, or the substrate and / or the mold may be damaged. On the other hand, in order to efficiently supply the purge gas to the space between the substrate and the mold, there is a review of arranging peripheral materials so as to surround the side surfaces of the substrate. By providing a peripheral structure, the volume of the space below the mold can be reduced, and the purge gas can be effectively maintained in the space.

However, if a peripheral member is disposed, when the mold is separated from the imprint material on the substrate and the substrate is moved, the peripheral member faces the mold at a short distance. The electrostatic force is inversely proportional to the square of the distance, so the electrostatic force acting on the particles on the surrounding structure will be considerably larger than the electrostatic force acting on the particles on the substrate holding portion without the surrounding structure. In the week The side members are subjected to the processing of a plurality of substrates and adhere to particles. Among such particles, particles adhered to the peripheral structure with a weak adhesion force are easily detached from the peripheral structure and attached to the mold due to the electrostatic force acting on them.

The present invention provides a technique that is advantageous in terms of reducing pattern defects, breakage of a substrate and / or a mold, and the like, which are caused by particles that are easily detached from a peripheral structure.

One aspect of the present invention relates to an imprint apparatus that solidifies an imprint material on a substrate and forms a pattern on the substrate in a state where the mold is in contact with the imprint material on the substrate, and includes: a substrate holding region having a substrate; A substrate holder, a peripheral member disposed so as to surround a side surface of a substrate held by the substrate holder, and a cleaning process for cleaning at least a part of the peripheral member using a cleaning member including a charged portion. A control unit for controlling; the cleaning process includes moving the cleaning member relative to the peripheral member in a state where the charged portion faces at least a part of the peripheral member, so that the The action of the particles being adsorbed on the charged portion.

IMP‧‧‧ Imprint Device

100‧‧‧mould

101‧‧‧ substrate

102‧‧‧Substrate fixture

113‧‧‧Peripheral structures

131‧‧‧ support

132-135‧‧‧charged department

150‧‧‧ particles

170‧‧‧Clean materials

1 is a diagram schematically illustrating a configuration of a part of an imprint apparatus according to an embodiment of the present invention.

[Fig. 2] An imprint apparatus schematically according to an embodiment of the present invention The composition is shown in the figure.

3A is a view illustrating a cleaning member.

3B is a view illustrating a cleaning member.

3C is a view illustrating a cleaning member.

FIG. 4 is a diagram illustrating a holding portion that holds a cleaning member.

[Fig. 5] A view illustrating a peripheral member.

6A is a view illustrating a cleaning process of a peripheral member.

6B is a view illustrating a cleaning process of a peripheral member.

6C is a view illustrating a cleaning process of a peripheral member.

6D is a view illustrating a cleaning process of a peripheral member.

[Fig. 7] A diagram illustrating a cleaning procedure of a peripheral portion.

[Fig. 8] A diagram illustrating a cleaning process of a substrate holder.

9 A diagram illustrating a cleaning procedure of a substrate holder.

10 is a diagram schematically illustrating a configuration of an imprint apparatus according to a second embodiment of the present invention.

FIG. 11 is a diagram illustrating a configuration example of a cleaning member.

12 is a diagram illustrating an operation of an imprint apparatus according to a second embodiment of the present invention.

13 A diagram illustrating a configuration of another cleaning member.

14 A diagram illustrating a configuration of another cleaning member.

FIG. 15A is a diagram illustrating cleaning through a peripheral member under the cleaning member shown in FIG. 14. FIG.

FIG. 15B is a diagram illustrating cleaning through a peripheral member under the cleaning member shown in FIG. 14.

FIG. 16A is a diagram illustrating static elimination of a mold according to a third embodiment of the present invention. FIG.

FIG. 16B is a diagram illustrating static elimination of a mold according to a third embodiment of the present invention.

Hereinafter, an imprint apparatus and an operation method thereof according to the present invention will be described with reference to the accompanying drawings with reference to the illustrated embodiments.

FIG. 2 illustrates a configuration of an imprint apparatus IMP according to an embodiment of the present invention. The imprint apparatus IMP transfers the pattern of the mold 100 to the substrate 101 through imprinting. In other words, the imprinting device IMP is an imprinting material (a material to be transferred) that transfers the pattern of the mold 100 onto the substrate 101 by imprinting. Imprint means contacting a mold with an imprint material and curing the imprint material. The mold 100 has a pattern formed by a recess. The mold 100 is brought into contact with the imprint material (uncured resin) on the substrate 101 so that the imprint material is filled in the concave portion of the pattern. In this state, energy is given to the imprint material for curing, so that the imprint material is cured. Accordingly, the pattern of the mold 100 is transferred to the imprint material, and the pattern formed by the cured imprint material is formed on the substrate 101.

The embossing material is a curable composition that is cured by being given energy to cure it. The embossed material sometimes indicates a cured state and sometimes indicates an uncured state. For the energy for curing, for example, electromagnetic waves and heat are used. Electromagnetic waves, for example, light having a wavelength selected from a range of 10 nm to 1 mm (for example, infrared rays, visible rays, ultraviolet rays, etc.) line).

The curable composition is generally a composition that is cured by light irradiation or heating. Among these, the photocurable composition cured by light may contain at least a polymerizable compound and a photopolymerization initiator. The photocurable composition may additionally contain a non-polymerizable compound or a solvent. The non-polymerizable compound may be, for example, at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

The present specification and drawings refer to directions in an XYZ coordinate system in which a direction parallel to the surface of the substrate 101 is an XY plane. Let the directions parallel to the X, Y, and Z axes of the XYZ coordinate system be X, Y, and Z directions, and make rotations about the X axis, rotations about the Y axis, and rotations about the Z axis θ X , Θ Y, θ Z. The control or drive of the X-axis, Y-axis, and Z-axis means control or drive of a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis, respectively. In addition, the control or drive of the θ X axis, θ Y axis, and θ Z axis refers to rotation about an axis parallel to the X axis, rotation about an axis parallel to the Y axis, and about an axis parallel to the Z axis, respectively. Control or drive of the rotation. In addition, the position is information that can be determined based on the coordinates of the X-axis, Y-axis, and Z-axis, and the posture can be determined by relative rotation with respect to the θ X-axis, θ Y-axis, and θ Z-axis. Positioning means controlling the position and / or posture.

The imprint apparatus IMP is provided with a substrate driving mechanism SDM for positioning the substrate 101. The substrate driving mechanism SDM may include, for example, a substrate holder 102, a peripheral structure 113, a micro-motion mechanism 114, a coarse-motion mechanism 115 and a substrate 结构 体 116。 Structure 116. The substrate holder 102 has a substrate holding region that holds the substrate 101 and can hold the substrate 101 by adsorption (for example, vacuum adsorption or electrostatic adsorption). The micro-movement mechanism 114 may include a micro-movement stage supporting the substrate holder 102 and the peripheral structure 113 and a driving mechanism for driving the micro-movement stage. The peripheral member 113 is disposed around the area where the substrate 101 is disposed so as to surround the side surface of the substrate 101. The peripheral structure 113 may have an upper surface having the same height as the upper surface of the substrate 101. The peripheral structure 113 may be divided into a plurality of structures. In addition, all or a part of the plurality of structural members may be arranged while being isolated from each other, or may be arranged so as to be in contact with each other.

The micro-movement mechanism 114 is a mechanism for micro-driving the substrate holder 102 and micro-driving the substrate 101. The coarse movement mechanism 115 is a mechanism for coarsely driving the fine movement mechanism 114 to coarsely drive the substrate 101. The base structure 116 supports a coarse movement mechanism 115, a fine movement mechanism 114, a substrate holder 102, and a peripheral structure 113. The substrate driving mechanism SDM is configured, for example, so as to drive the substrate 101 with respect to a plurality of axes (for example, three axes of an X axis, a Y axis, and a θ Z axis). The position of the micro-movement mechanism 114 that is integrated with the substrate holder 102 (micro-motion stage) is monitored by a measuring device 117 such as an interferometer.

The imprint apparatus IMP is provided with a mold driving mechanism MDM for positioning the mold 100. The mold driving mechanism MDM may include a mold clamp 110, a driving mechanism 109, and a peripheral member 151. The peripheral member 151 is arranged around the area where the mold 100 is arranged so as to surround the side surface of the mold 100. The mold driving mechanism MDM and the surrounding structure 151 can be It is supported by the support structure 108. The mold jig 110 is capable of holding the mold 100 by adsorption (for example, vacuum adsorption or electrostatic adsorption). The driving mechanism 109 drives the mold 100 by driving the mold holder 110. The mold driving mechanism MDM may be configured, for example, to drive the mold 100 with respect to a plurality of axes (for example, 6 axes of X axis, Y axis, Z axis, θ X axis, θ Y axis, and θ Z axis).

The substrate driving mechanism SDM and the mold driving mechanism MDM constitute a driving unit that performs relative positioning of the substrate 101 and the mold 100. The driving unit adjusts the relative position of the substrate 101 and the mold 100 with respect to the X axis, the Y axis, the θ X axis, the θ Y axis, and the θ Z axis in addition to the Z axis. The adjustment of the relative position of the substrate 101 and the mold 100 in the Z axis includes the operation of contacting and separating the imprint material on the substrate 101 and the mold 100.

The imprint apparatus IMP may include a dispenser (supply section) 111 for coating, arranging, or supplying an uncured imprint material on the substrate 101. The dispenser 111 may be configured, for example, to arrange the imprint material on the substrate 101 in the form of a plurality of droplets. The distributor 111 is supported by a support structure 108.

The imprint apparatus IMP may include a curing unit 104 that irradiates the imprint material on the substrate 101 with light such as UV light to cure the imprint material. The imprint apparatus IMP may further include a camera 103 for observing the state of imprint. The light emitted from the curing section 104 can be reflected by the mirror 105 and transmitted through the mold 100 to irradiate the imprint material. The camera 103 may be configured to observe the imprint situation through the mold 100 and the mirror 105, for example, to observe The contact state of the imprint material with the mold 100 and the like.

The imprint apparatus IMP may include alignment range displays 107 a and 107 b for detecting a relative position of the mark of the substrate 101 and the mark of the mold 100. The alignment range displays 107 a and 107 b are arranged on the upper structure 106 supported by the support structure 108. The imprint apparatus IMP may include an off-axis detector 112 for detecting a plurality of marked positions on the substrate 101. The off-axis detector 112 is supported by the support structure 108.

The imprint apparatus IMP may include one or a plurality of purge gas supply units 118a and 118b. The purge gas supply portions 118 a and 118 b may be arranged around the mold holder 110 so as to surround the mold holder 110. The purge gas supply units 118 a and 118 b supply a purge gas to a space between the substrate 101 and the mold 100. The purge gas supply portions 118 a and 118 b are supported by the support structure 108, for example. As for the purge gas, a gas that does not hinder the solidification of the imprint material can be used. For example, a gas containing at least one of helium, nitrogen, and a condensable gas (for example, pentafluoropropane (PFP)) can be used. The configuration in which the peripheral members 113 and 151 are provided is advantageous in that the space between the substrate 101 and the mold 100 is effectively filled with purge gas.

The imprint apparatus IMP includes a chamber 190, and each of the above-mentioned constituent elements may be disposed in the chamber 190. The imprint apparatus IMP may further include a main control section (control section) 126, an imprint control section 120, an irradiation control section 121, a display control section 122, a distributor control section 123, a purge gas control section 124, and a substrate control section 125. . Main control unit 126, The system controls the imprint control unit 120, the irradiation control unit 121, the display control unit 122, the dispenser control unit 123, the purge gas control unit 124, and the substrate control unit 125. The imprint control unit 120 controls the mold driving mechanism MDM. The irradiation control unit 121 controls the curing unit 104. The display control unit 122 controls the alignment range displays 107 a and 107 b and the off-axis detector 112. The distributor control unit 123 controls the distributor 111. The purge gas control unit 124 controls the purge gas supply units 118a and 118b. The substrate control unit 125 controls the substrate driving mechanism SDM.

FIG. 1 schematically illustrates a part of the imprint apparatus IMP of FIG. 2. The internal space of the chamber 190 may penetrate the particles 150. In addition, in the chamber 190, particles 150 may be generated due to friction between mechanical elements, friction between the mechanical elements and the substrate or the substrate, and the like. Alternatively, in order to arrange the uncured embossing material on the substrate 101, the dispenser 111 generates a mist of the embossing material when the embossing material is ejected from the discharge port, and solidification of the embossing material may generate particles 150.

The particles 150 may be attached to the upper surface of the peripheral structure 113 and the like. There are various strengths of adhesion of the particles 150 attached to the peripheral structure 113. When the particles 150 adhering to the peripheral structure 113 are not detached from the peripheral structure 113, pattern defects due to the particles 150 adhering to the substrate 101 or the mold 100, and damage to the substrate and / or the mold will not occur. On the other hand, when the particles 150 attached to the peripheral structure 113 are detached from the peripheral structure 113, they may adhere to the substrate 101 or the mold 100 or be sandwiched between the substrate 101 and the mold 100.

Make the mold 100 from the solidified imprint material on the substrate 101 The mold 100 is charged during separation. The electric field formed by this charging causes an electrostatic force (Coulomb force) to act on the particles 150, and accordingly the particles 150 are attracted to the mold 100 and adhere to the mold 100. The upper surface of the peripheral structure 113 has the same height as the upper surface of the substrate 101, so the distance between the mold 100 and the upper surface of the peripheral structure 113 is relatively small. The electrostatic force is inversely proportional to the square of the distance. Therefore, the electrostatic force acting on the particles on the surrounding structure 113 is more effective than the substrate fixture 102 and the structure existing around it without the surrounding structure 113. The electrostatic force is considerable. Since the peripheral structure 113 is processed by the plurality of substrates 101, a plurality of particles 150 may adhere to the peripheral structure 113.

Therefore, in the imprint apparatus IMP, a cleaning process for cleaning an area of at least a part of the peripheral structure 113 using the cleaning structure 170 including a charged portion is performed. The cleaning process is performed by the main control section (control section) 126 controlling the driving of the cleaning member 170 including the charging section. The cleaning process may include the following operation: in a state where the electrification part of the cleaning member 170 and at least a part of the peripheral member 113 face each other, the cleaning member 170 is relatively moved relative to the region to make the region The particles 150 are adsorbed on the charged portion. Here, the particles 150 that adhere to the peripheral structure 113 with a weak adhesive force are attached to the charged portion due to the electrostatic force detached from the peripheral structure 113 because the cleaning structure 170 including the charged portion faces each other. In general, the cleaning process is performed in a state where the imprint material is not present on the substrate 101, and the dispenser 111 does not supply the imprint material to the substrate 101 during the cleaning process.

In FIG. 1, the substrate 101 is shown in the substrate holder. The cleaning process may be performed in a state where the substrate holding region 1021 of 102 is performed. However, the cleaning process may be performed in a state where the substrate 101 is not present on the substrate holding region 1021. The substrate holding region 1021 may be a region in which the entire substrate is in contact with the substrate 101 or a region in which a portion thereof is in contact with the substrate 101. In the latter aspect, a part in contact with the substrate 101 may have a pin and / or a ring.

Here, as an example, consider a case where the mold 100 is separated from the solidified imprint material on the substrate 101 and the mold 100 is charged to -3KV. The peripheral member 113 is grounded to a ground potential. The gap between the peripheral structure 113 and the mold 100 is 1 mm. The direction of the electric field in this case is upward (positive direction of the Z axis), and the intensity of the electric field is 3 kV / mm. In this example, it is preferable to charge the charged portion of the cleaning member 170 such that the potential V of the charged portion of the cleaning member 170 becomes lower than -3 kV (V <-3 kV). In the cleaning process, the charging portion of the cleaning member 170 is charged, and the cleaning member 170 is relatively moved with respect to the region in a state where the charging member faces at least a part of the peripheral member 113. Due to this cleaning process, the particles 150 attached to the area with a weak adhesion force are separated from the area, are drawn close to the charged part, and are captured through the charged part.

The gap between the surrounding structure 113 and the charged portion of the cleaning structure 170 during the cleaning process is reduced, so that the electric field between the surrounding structure 113 and the charged portion can be increased, and the effect of the cleaning process can be improved. For example, the gap between the mold 100 and the surrounding structure 113 when the substrate 101 is moved to supply the embossed material to the substrate 101 through the dispenser 111 is set to GN, and the gap between the surrounding structure 113 and the charged portion during cleaning is set to GC Set to GN> GC. The clearance between the peripheral member 113 and the electrified portion of the cleaning member 170 during the cleaning process can be, for example, 0.8 mm or less.

The cleaning member 170 can be held by the holding portion 119. The holding portion 119 is only required to have a structure capable of holding the clean structural member 170. For example, the holding portion 119 may be a movable structural member such as a robot arm, or a fixed structural member, and the mold jig 110 may be replaced.

An example of the cleaning member 170 is shown in FIGS. 3A to 3C. In the first example shown in FIG. 3A, the cleaning member 170 includes a support body 131 and a charging portion 132 supported by the support body 131. The charging section 132 is prepared by, for example, charging a dielectric structural material made of quartz or the like. The charging of the dielectric structure material is to contact the dielectric structure material with an imprint material disposed on a dummy substrate, and to cure the imprint material through the curing part 104 to separate the dielectric structure material from the imprint material. Thereby. The dummy substrate is a substrate placed on a substrate holder 102 instead of the substrate 101. The support body 131 and the charging portion 132 can be made of the same material.

A larger surface area in contact with the imprint material can increase the amount of charge, so the charged portion 132 can have a pattern (concavity and convexity) on the surface. The cleaning member 170 including the support body 131 and the electrified portion 132 may be an unused article such as the mold 100 (for example, a used or out-of-specification mold). Alternatively, the cleaning member 170 including the support 131 and the charging portion 132 may be a member having a higher pattern density than the mold 100 for manufacturing articles, which is advantageous for increasing the amount of charge (for example, for the imprint device IMP Unused items of the mold used for inspection). In addition, unused items are items that are not used for their original purpose.

In the second example shown in FIG. 3B, the cleaning member 170 includes a support 131 and an electret 133 supported by the support 131. An electret is a substance that continuously forms an electric field. For example, an electret is formed by immobilizing a charge into a dielectric such as a polymer material. As for the method of implanting the electric charge into the electret, there are a method of solidifying the polymer material by applying a high voltage between the electrodes sandwiching the polymer material in a molten state, a method of transmitting a corona, and a method of transmitting ions. Implantation methods, etc. In terms of the method of applying a voltage between the electrodes, the electret system connected to each electrode is charged with positive and negative polarity, and in the method of corona discharge, the electret system is charged with negative polarity. In terms of methods, in general, the electret system is charged with positive polarity.

In the first example, since the excessive charge is distributed on the surface of the dielectric structural material constituting the charging section 132, the amount of charge is reduced due to the environment. On the other hand, in the electret used in the second example, since the charges are implanted in the dielectric material, the charges can be held semi-permanently. In the example shown in FIG. 3B, the electret 133 is provided on the entire area of the lower surface of the support 131, but the electret 133 may be provided on only a part of the lower surface. In addition, as explained in the first example, an electret may be disposed on the lower surface of an unused article of the mold.

Examples of the material of the electret include (a) polymer materials such as acrylic resin, nylon, and fluororesin; (b) inorganic films such as SiO ₂ and SiO ₂ / Si _x N _y laminated films. In the case of fluororesins, Teflon AF (registered trademark, manufactured by DuPon), CYTOP (registered trademark, manufactured by Asahi Glass Co., Ltd.), and the like are organic electret films that can be formed by spin coating. In particular, CYTOP has such a feature that the surface charge density is high.

In the charging section, a structure in which the electrode is covered with a dielectric may be used. It is composed of an electrode exposed by the charged part. When the particles are metal, the particles attached to the charged part have the same polarity as the electrode due to charge exchange, and are separated by the repulsive force, so they cannot be captured through the charged part. Therefore, the electrode is covered with a dielectric body, so that even if it is a metal particle, charge exchange can be prevented and trapped through the charged portion.

In the third example shown in FIG. 3C, the cleaning member 170 includes a support 131, a negatively charged portion 134 and a positively charged portion 135 supported by the support 131. As for the negative polarity charged portion 134 and the positive polarity charged portion 135, the electret described in the second example can be used. The provision of the negative-polarity charging portion 134 which is negatively charged and the positive-polarity charging portion 135 which is positive-polarity allows particles attached to the peripheral structure 113 to be removed regardless of the polarity of the particles.

The holding portion 119 for holding the cleaning member 170 is supplemented with reference to FIG. 4. As described above, the holding portion 119 may hold the clean structural member 170. For example, the holding member 119 may be a movable structural member such as a robot arm, or may be a fixed structural member. The mold clamp 110 may be replaced.

In one example, the holding unit 119 may be a constituent element of the maintenance unit 136. The maintenance unit 136 may be, for example, a unit for removing and mounting the substrate holder 102. The substrate holder 102 is contaminated or worn due to the contact with the substrate 101, so the maintenance unit 136 is used for replacement. The maintenance unit 136 includes a holding mechanism for holding the substrate holder 102, and the holding mechanism is used as the holding portion 119. Not with the week The cleaning process of the side member 113 is performed while the substrate holder 102 is exchanged. Therefore, there is no particular disadvantage caused by the cleaning process by holding the cleaning member 170 through the maintenance unit 136. In addition, the cleaning process is performed by holding the cleaning member 170 through the maintenance unit 136, which facilitates simplification of the structure of the imprinting device IMP.

When the cleaning member 170 is held by the mold jig 110 and the cleaning process is performed, the cleaning member 170 is transferred to the mold jig 110 using a transfer mechanism for transferring the mold 100 to the mold jig 110.

FIG. 5 is a plan view of the peripheral structure 113, and FIG. 5 illustrates the shape of the peripheral structure 113. In the example shown in FIG. 5, the outline of the peripheral structure 113 is a quadrangle, but this is only an example. The peripheral structure 113 may have various outline shapes. The peripheral member 113 has an opening portion surrounding the side surface of the substrate 101, and the shape of the opening portion is similar to the outline of the substrate 101.

The peripheral member 113 has a continuous portion with a smooth surface and a discontinuous portion with a non-smooth surface. A reference mark for measuring the relative position between the mold 100 and the reference of the imprint apparatus IMP is arranged on the peripheral member 113, for example. When light is used for energy for curing, a photometer for measuring the illuminance of light may be disposed in the peripheral structure 113. Therefore, there may be a groove, a step, and the like between the structure or unit represented by the reference mark and the photometer and the surrounding structure 113. In addition, when the peripheral member 113 is composed of a plurality of divided members, there may be a groove, a step, or the like between the members. In addition, also A groove, a step, or the like may be formed due to a fastening portion for fastening the peripheral member 113 to the micro-movement mechanism 114. Such grooves and steps are examples of discontinuities with non-smooth surfaces. On the other hand, the flat upper surface is an example where the surface is a smooth continuous portion. The main control unit 126 is such that the total time that the charged portion of the cleaning member 170 faces the discontinuous portion per unit area is longer than the total time that the charged portion of the cleaning member 170 faces the continuous portion per unit area. Way to control the cleaning process.

In the imprint apparatus IMP, in order to form a pattern with an imprint material for a plurality of imprint areas of the substrate 101, an imprint program (pattern forming method) configured by a plurality of imprint cycles is executed. Each embossing cycle may include a procedure for arranging the embossing material on the substrate 101 through the dispenser 111, a procedure for contacting the mold 100 with the embossing material, a procedure for curing the embossing material, and separating the mold 100 from the cured embossing material. program of.

In FIG. 5, the positional relationship between the peripheral structure 113, the mold 100, and the distributor 111 when an imprint material is arranged through the distributor 111 to a certain pressing area of the substrate 101 is illustrated. The pattern region (the region having a pattern to be transferred to the substrate 101) of the mold 100 is located on the peripheral member 113.

While the imprint process is being performed, that is, while a pattern is being formed on each of the plurality of pressing regions of the substrate, the region 140 is a region facing the pattern region of the mold 100. The area 140 is an area that is easily a source of supply of particles to the pattern area of the mold 100 in the entire area of the upper surface of the peripheral structure 113 during the imprinting process. Therefore, the object of the cleaning process is limited to a part of the area rather than the entire surface of the upper surface of the peripheral structure 113. In the case of an area, a cleaning process should be performed on an area including at least the area 140.

In one example, the mold driving mechanism MDM that drives the mold 100 is located in the first orientation (negative direction of the X axis) when viewed from the dispenser 111. In addition, the region 140 is a region located on the side closer to the first orientation than the side of the first orientation of the substrate 101 held by the substrate holder 102 among the upper surfaces of the peripheral members 113.

In FIGS. 6A to 6D, a cleaning process in which the charged part of the cleaning member 170 and at least a part of the peripheral member 113 face each other in a state where the cleaning member 170 is relatively moved with respect to the region is illustrated. In the example shown in FIG. 6A, the main control unit 126 controls the cleaning process in such a manner that the region 140 in the peripheral structure 113 is selectively cleaned. Such a cleaning process is advantageous in order to shorten the time required for it. In the example shown in FIG. 6B, the main control unit 126 controls the cleaning process so that the entire area of the peripheral structure 113 is cleaned. The relative movement of the charged portion of the cleaning member 170 relative to the peripheral member 113 during the cleaning process is illustrated in FIGS. 6A and 6B as an example, and may be a continuous repetition of a predetermined operation unit. The operation unit may include, for example, a relative movement in a direction parallel to the first direction (for example, the X-axis direction) and a relative movement in a second direction (for example, the Y-axis direction) that intersects the first direction.

In the example shown in FIG. 6C, the path of the relative movement of the charged portion of the cleaning member 170 relative to the peripheral member 113 includes a plurality of loops surrounding the substrate holding region 1021. Here, the plurality of loops are different from each other in distance from the substrate holding region 1021. In Figure 6C For example, the path does not pass through the substrate holding region 1021, but the path may pass through the substrate holding region 1021.

In the example shown in FIG. 6D, the peripheral structure 113 has discontinuous portions 141, 142, and 143 such as grooves and / or steps, and other continuous portions. The particles are easier to be captured by the discontinuous portions 141, 142, and 143 than the continuous portions, so there are more particles in the discontinuous portions 141, 142, and 143 than the continuous portions. The main control unit 126 is such that the total time ratio between the charged portion of the cleaning member 170 and the discontinuous portions 141, 142, and 143 per unit area is opposite to the charged portion of the cleaning member 170 and the continuous portion per unit area. Control the cleaning process in a total length of direction.

The main control unit 126, for example, issues a command to execute an imprint process in which a pattern is formed on a substrate by imprinting, and then executes a cleaning process before executing an imprint process in response to the command. Alternatively, it may be performed when the main control unit 126 does not manufacture articles. Alternatively, the main control unit 126 may perform cleaning processing after processing a set number of substrates at a time, or may perform cleaning processing after processing one substrate at a time. In addition, the main control unit 126 may perform a cleaning process, for example, each time a pattern is formed in the pressing area.

In addition, an evaluation for confirming the necessity of performing the cleaning process may be performed, and the cleaning process may be performed based on the result. For example, using a mold for evaluation, a pattern (first sample) is formed by embossing one or a plurality of pressing areas to charge the mold, and the peripheral structure 113 is moved in a state where the mold faces the peripheral structure 113. . Then, a pattern is formed by embossing one or a plurality of pressing areas using this mold (second sample) 品). By comparing the number of defects of the first sample and the second sample, the state of the peripheral structure 113 can be evaluated.

In FIG. 7, a cleaning process of the peripheral structure 113 is illustrated. This cleaning procedure is controlled by the main control unit 126. In step S201, the main control unit 126 instructs a transport mechanism (not shown) to hold the holding unit 119 to the cleaning member 170. In step S202, the main control unit 126 determines the type of the cleaning member 170. The type of the cleaning member 170 is determined by, for example, an identifier given to the cleaning member 170. Alternatively, the type of the cleaning member 170 is determined based on the result of measuring the charge amount of the charged portion of the cleaning member 170 using a measuring device that measures the surface potential.

As shown in FIG. 3A, a type charged by contact and separation of a dielectric structure with respect to an imprint material is referred to as a non-persistent type. The type using an electret as illustrated in FIGS. 3B and 3C is referred to as a continuous type. In step S202, when it is judged that the cleaning member 170 is non-continuous, it proceeds to step S203, and when it is judged that the cleaning member 170 is continuous, it proceeds to step S206.

In step S203, the main control unit 126 instructs a transfer mechanism (not shown) to transfer the dummy substrate to the substrate holder 102. In program S204, the main control unit 126 controls the substrate driving mechanism SDM and the distributor 111 so that the imprint material is arranged on the dummy substrate. In program S205, the main control unit 126 controls the virtual imprint. The virtual imprint contacts the dielectric structural material of the cleaning structure 170 with the imprint material on the dummy substrate, and solidifies the imprint material through the curing unit 104. Electrical materials from cured embossing 材 离。 Material separation. Through this virtual imprint, the dielectric structural material is charged to prepare a charged portion. In the case of the continuous cleaning member 170, the processes for supplying electricity such as the procedures S203 to S205 are not required.

In step S206, the main control unit 126 executes cleaning processing of the peripheral structure 113. Specifically, the main control unit 126 moves (scans) the cleaning member 170 relative to the area in a state where the charged portion of the cleaning member 170 and at least a part of the peripheral member 113 face each other. Thereby, the particles 150 in the region are detached from the region and adsorbed on the charged portion, so that the region is cleaned.

In step S207, the main control unit 126 instructs a transport mechanism (not shown) to carry out the cleaning member 170. Here, when a dedicated holding portion 119 for holding the cleaning member 170 is provided, procedures S201 and S207 are not necessary, and the state in which the cleaning member 170 is held by the holding portion 119 is maintained.

The above-mentioned cleaning process is illustrated in FIG. 8 as an example, and can also be applied to a cleaning process for removing particles from the substrate holder 102 (substrate holding area 1021). The substrate holding region 1021 of the substrate holder 102 includes a pin and / or a ring for supporting the substrate 101. When particles adhere to the pins and / or rings, the substrate 101 is deformed, and defects may be generated in the formed pattern.

Therefore, the main control unit 126 may be configured to control the cleaning process of the substrate holder 102 (the substrate holding area 1021). In this cleaning process, the cleaning member 170 is relatively moved with respect to the substrate holder 102 in a state where the charged portion of the cleaning member 170 faces the substrate holder 102. The particles 150 of the substrate holder 102 are attracted to the charged portion.

FIG. 9 illustrates a cleaning procedure of the substrate holder 102. This cleaning procedure is controlled by the main control unit 126. In the step S211, when the substrate 101 is provided on the substrate holder 102, the main control unit 126 instructs a transfer mechanism (not shown) to carry out the substrate 101. In step S212, the main control unit 126 instructs a conveyance mechanism (not shown) to hold the holding unit 119 to the cleaning member 170. In step S213, the main control unit 126 determines the type of the cleaning member 170. In step S213, when it is determined that the cleaning member 170 is non-continuous, the routine proceeds to step S214, and when it is determined that the cleaning member 170 is continuous, the routine proceeds to step S218.

In step S214, the main control unit 126 instructs a transfer mechanism (not shown) to transfer the dummy substrate to the substrate holder 102. In program S215, the main control unit 126 controls the substrate driving mechanism SDM and the distributor 111 so that the imprint material is arranged on the dummy substrate. In program S216, the main control unit 126 controls the virtual imprint. The virtual imprint contacts the dielectric structural material of the cleaning structure 170 with the imprint material on the dummy substrate, and cures the imprint material through the curing unit 104. The electrical component is separated from the cured embossed material. Through this virtual imprint, the dielectric structural material is charged to prepare a charged portion. In step S217, the main control unit 126 instructs a transfer mechanism (not shown) to carry out the dummy substrate from the substrate holder 102. In the case of the continuous cleaning member 170, the processes for supplying electricity such as the procedures S214 to S217 are not required.

In program S218, the main control unit 126 executes the substrate clamping Cleaning tool 102. Specifically, the main control unit 126 moves (scans) the cleaning member 170 relative to the substrate holder 102 in a state where the charged portion of the cleaning member 170 faces at least a part of the region of the substrate holder 102. Thereby, the particles 150 in this area of the substrate holder 102 are detached from the substrate holder 102 and adsorbed to the charged portion, so that the area of the substrate holder 102 is cleaned.

In step S219, the main control unit 126 instructs a transport mechanism (not shown) to carry out the cleaning member 170. Here, when a dedicated holding portion 119 for holding the cleaning member 170 is provided, procedures S212 and S219 are not required, and the state in which the cleaning member 170 is held by the holding portion 119 is maintained.

The main control unit 126 is, for example, a PLD (abbreviation of Programmable Logic Device) such as FPGA (abbreviation of Field Programmable Gate Array), or an ASIC (abbreviation of Application Specific Integrated Circuit), a general-purpose computer incorporated in a program, or the like All or part of them are combined. The same applies to the other control units 120 to 125, and includes a PLD such as an FPGA, an ASIC, a general-purpose computer incorporating a program, or a combination of all or a part of these.

Hereinafter, a method for manufacturing the article will be described. Here, as an example, an article manufacturing method using a manufacturing apparatus (semiconductor integrated circuit element, liquid crystal display element, etc.) as an article will be described. The article manufacturing method includes a process of forming a pattern on a substrate (wafer, glass plate, film substrate) using the above-mentioned imprint apparatus. The manufacturing method may include a process of processing (for example, etching) a patterned substrate. In addition, manufacturing rules In the case of other items such as patterned media (recording media) and optical elements, this manufacturing method can be used instead of etching and other processes including processing a patterned substrate. The article manufacturing method of this embodiment is more advantageous than conventional methods in at least one of performance, quality, productivity, and production cost of the article.

(Second Embodiment)

The above-mentioned cleaning process is performed before (a) the imprint process is performed, or (b) when the imprint apparatus is in an idle state, or (c) after a set number of substrates are processed. The following is an example of arranging the charging section at a specific position of the imprint apparatus IMP so that the cleaning process can be performed in parallel with a series of imprinting operations without setting a time for the cleaning process.

FIG. 10 illustrates a configuration of an imprint apparatus IMP according to a second embodiment of the present invention. The cleaning member 170 is arranged so that the mold 100 is located between the cleaning member 170 and the dispenser 111. The cleaning member 170 is, for example, held by a peripheral member 151 disposed around the periphery of the mold jig 110. As shown in FIG. 11 for example, the cleaning member 170 has a charging portion 171.

In the second embodiment, the cleaning member 170 is disposed so that the mold 100 is located between the cleaning member 170 and the dispenser 111. Thereby, in the process of moving the pressing area of the imprinting object under the dispenser 111 and then moving it under the mold 100, a part of the area 140 shown in FIG. 5 faces the cleaning member 170 and is cleaned. . Such procedures are sequentially performed for a plurality of pressing areas, so that the entire area of area 140 is cleaned through. The member 170 is cleaned. Therefore, the time required for cleaning the peripheral member 113 is reduced. This system contributes to an increase in the throughput of pattern formation through imprinting.

Here, from the viewpoint of efficiency of cleaning, it is preferable that the width L2 of the charged portion 171 in a direction orthogonal to the direction in which the cleaning member 170, the mold 100, and the dispenser 111 are aligned is more than the pattern of the mold 100 The width L1 of the portion 160 is large.

FIG. 12 exemplarily shows the operation of the imprint apparatus IMP of the second embodiment. Here, the charging portion 171 of the cleaning member 170 is charged to a charged state, and is charged to a non-charged state. However, the charging section 171 that does not require such an operation may be used. In this case, the procedures S201 and S205 described below are unnecessary. In a simple example, the charging portion 171 may be configured by a conductive body, and the charge may be supplied to the charging portion 171 to be in a charged state, and the charge may be drawn from the charging portion 171 to be in a non-charged state.

First, in step S221, the main control unit 126 causes the charging unit 171 to be charged. Next, in step S222, the main control unit 126 controls the dispenser 111 and the substrate driving mechanism SDM so that the imprint material is disposed in the imprint area of the imprint target. At this time, the impact area of the imprint target is arranged below the dispenser 111. Next, in step S223, the main control unit 126 controls the substrate driving mechanism SDM so that the impact area to be imprinted is disposed under the mold 100. In the procedures S222 and S223, an area of the surface of the peripheral structure 113 facing the charging portion 171 of the cleaning structure 170 is cleaned.

Next, in step S224, the main control unit 126 first controls the mold driving mechanism MDM so that the imprint material on the imprinting area of the imprint target contacts the mold 100. In program S024, the main control unit 126 then controls the curing unit 104 to cure the imprint material, and then controls the mold drive mechanism MDM to separate the cured imprint material from the mold 100. Next, in routine S225, the main control unit 126 sets the charging unit 171 to a non-charged state.

Next, in step S226, the main control unit 126 determines whether or not the imprinting of the entire imprinting area of the substrate is completed. When there is an imprinting area that has not yet been imprinted, it returns to the routine S221 and repeats the processing for other imprinting areas. On the other hand, when the imprinting of the full-impact area is completed, in step S227, the main control unit 126 determines whether the imprinting of the entire substrate is completed. In addition, when there is an impact area that has not been embossed, the main control unit 126 returns to the routine S201 and repeats processing on other substrates.

To clean a wider area of the surrounding structure 113 through the cleaning structure 170, as shown in FIG. 13, the use of the cleaning structure 170 having a wide area is beneficial. The cleaning member 170 illustrated in FIG. 13 has a shape that completely surrounds the mold 100 in all directions.

However, various mechanisms are arranged around the mold 100. In this case, it may be difficult to adopt the cleaning member 170 that surrounds the mold 100 in all directions. Examples of the mechanism that can be arranged around the mold 100 include a mechanism that deforms the mold 100 by applying force to the side surface of the mold 100, a mechanism that adjusts the tilt of the mold 100, and a mechanism that forms part of the mold drive mechanism MDM.

FIG. 14 shows an example in which additional cleaning members 180 and 181 are provided in addition to the cleaning member 170. That is, FIG. 14 shows an example in which a plurality of cleaning members 170, 180, and 181 are provided. As shown in FIG. 15A, the cleaning member 180 is a part of the area 300 among the surrounding members 113, and as shown in FIG. 15B, the cleaning member 181 is the other area 310 among the surrounding members 113. By providing a plurality of cleaning members in this manner, sharing the area to be cleaned by the plurality of cleaning members makes it possible to suppress the enlargement of the imprint apparatus IMP. Here, the cleaning member 170 is used to clean the surrounding members 113 in parallel with the imprint of the plurality of pressing regions on the substrate 101. On the other hand, the cleaning members 180 and 181 are used during a period when the substrate 101 is not embossed, for example, during a dedicated cleaning procedure performed during maintenance, idle time, or the like.

(Third Embodiment)

It is preferable that the imprint apparatus IMP is provided with a static elimination mechanism that removes electricity from the mold 100 that is charged when the mold 100 is separated from the solidified imprint material. For example, static elimination of the mold 100 is performed using an ion generator. In the ion generator, there are various types such as a corona discharge method, an energy ray irradiation method (for example, an X-ray irradiation method, an α-ray irradiation method, and the like). The corona discharge method is, in general, likely to be a factor in the generation of particles. Therefore, to maintain the cleanliness while removing the power from the mold 100, an X-ray irradiation method or an α-ray irradiation method is appropriate. The space between the mold 100 and the substrate 101 is a very narrow space. Therefore, it is difficult to arrange an ion generator around the space, and the mold 100 is directly irradiated with X-rays or α-rays. For modules In addition to the method of directly irradiating X-rays or α-rays with the tool 100, there are methods for irradiating X-rays or α-rays to a gas to ionize the gas, and supplying the ionized gas to a space below the mold 100. However, the ionized gas has a reduced ion concentration while passing through a pipe and a nozzle, and during a path passing from the nozzle to the space between the mold 100 and the substrate 101, so it may not be able to pass through the mold 100. Sufficient ion concentration is maintained in the space below. In this case, it becomes impossible to effectively remove the power of the mold 100.

Therefore, in this embodiment, the gas for removing electricity is supplied from the purge gas supply unit 118. The gas for removing electricity may be supplied from a separate gas supply section from the purge gas supply section 118. As shown in FIG. 16A, it is preferable that the space around the mold 100 is filled in advance before the pattern portion 160 of the mold 100 is separated from the solidified imprint material. The supply of the static electricity gas through the purge gas supply unit 118 may be stopped before the separation pattern portion 160 as long as the space around the mold 100 is sufficiently filled with the static electricity gas, or the supply may be continued during separation. As a result, as shown in FIG. 16B, in the process of separating the pattern portion 160 from the cured imprint material, the surrounding static elimination gas is introduced into the gap between the pattern portion 160 and the substrate 101 and replaced.

The gas for static elimination needs to include a gas having an average free diameter with respect to electrons longer than that of air. As for the gas for static elimination, specifically, a rare gas which is a monoatomic molecule is preferable, and helium which has the longest average free diameter among rare gas is especially preferable. The electrons existing in the electric field are transported to the anode side through the electric field, and collide with gas molecules in the middle. In this case, the electrons are sufficiently accelerated and the When it collides with gas molecules in the state of energy above, it causes ionization and generates electron-cation pairs. The generated electrons are also accelerated by an electric field, which ionizes gas molecules. In this way, the phenomenon of successively causing ionization to generate a large number of electron-cation pairs is called an electron avalanche. With respect to a gas having an average free path length relative to the electrons, the accelerating electrons did not collide with the gas molecules in the middle, and were accelerated to a high-energy state. Therefore, a gas with a long average free path relative to electrons is more likely to cause avalanche of electrons in a low electric field than air, and can be neutralized before a large voltage is accumulated in the mold 100.

In addition, since the gas for static elimination is generally highly diffusive, when the imprint material is filled in the pattern portion 160, it can also be used as a purge gas for the imprint space. Here, the voltage of the charging portion 171 in a case where an electric field is generated between the surrounding members 113 through the charged portion 171 of the cleaning member 170 and the surrounding member 113 is cleaned is discussed. When the gas for static elimination enters the gap between the charged portion 171 and the surrounding structure 113 to which a voltage is applied, and when an avalanche of electrons is caused, a large amount of electrons or cations are supplied to the surface of the charged portion 171 so that the voltage of the charged portion 171 is reduced and the cleaning effect is reduced. Therefore, the voltage of the charging section 171 needs to be set so that the electric field strength generated between the charging section 171 and the surrounding structure 113 is equal to or lower than the electric field strength caused by the discharge gas. Therefore, a voltage control section 172 that controls the voltage applied to the charging section 171 may be provided. The voltage control unit 172 sets the voltage applied to the charging unit 171 so that the electric field strength generated between the charging unit 171 and the surrounding structure 113 is equal to or lower than the electric field strength caused by the discharge of the static elimination gas. Whether or not an electron avalanche is caused between the charged part 171 and the surrounding structure 113 depends on the electric field strength and static elimination. Since the type of gas is used, the value of the voltage to be applied to the charging section 171 may be determined depending on the distance between the charging section 171 and the surrounding structure 113 and the type of the static elimination gas. That is, the value of the voltage applied to the charging section 171 varies depending on the type of the static elimination gas, the distance between the charging section 171 and the peripheral member 113, and the like.

The voltage of the mold 100 is passed through the process of separating the solidified embossed material through the process of passing the gas for static elimination, and the voltage of the mold 100 is maintained below the voltage caused by the discharge of the gas for static elimination. Therefore, the cleaning processing of the peripheral structure 113 is performed with the cleaning structure 170 having the charged portion 171 set to the above-mentioned voltage, so that the adhesion of the particles 150 to the mold 100 can be prevented.

In addition, the voltage applied to the charging section 171 while the static elimination gas is not being supplied from the purge gas supply section 118 may be set such that the electric field intensity ratio generated between the charging section 171 and the surrounding structure 113 passes the static elimination gas. On the other hand, the electric field intensity causing the discharge is high. For example, during the period when the imprinting process is not performed, a higher voltage may be set to the charging section 171 than in the imprinting process to perform a cleaning process. In the embossing process, even when the gas for removing electricity is not supplied, the voltage of the charging section 171 can be increased to improve the cleaning effect.

The present invention is not limited to those described above, and various changes and modifications can be made without departing from the spirit and scope of the present invention. Therefore, in order to disclose the scope of the present invention, the following claims are attached.

Claims (29)

An imprint apparatus is a person who solidifies the imprint material to form a pattern on the substrate in a state where the mold is in contact with the imprint material on the substrate. The imprint device is provided with a substrate holder which is disposed on The mobile stage has a substrate holding area that holds the substrate. The peripheral structure is disposed on the mobile stage so as to surround the side surface of the substrate held by the substrate holder. The mold holder holds the mold. The holding portion holds the substrate. The cleaning member including the charging section is held at a position separated from the mobile station; and the control section controls the cleaning process to hold the cleaning member through the holding section at a position separated from the mobile station and the mold jig. In a state, the area of at least a portion of the peripheral structure is cleaned using the cleaning member; wherein the cleaning process includes the following operation: the electrified portion is placed on the peripheral member and on at least a portion of the peripheral member. In a state where the regions face each other, the cleaning structure is made opposite to the surrounding structure above the surrounding structure. So that the movement of the particles adsorbed to the charging area portion. For example, the embossing device of the first scope of the patent application, wherein the relative movement of the charged part with respect to the peripheral structure includes a repetition of an action unit that includes a movement in a direction parallel to the first direction. Relative movement, relative movement in a second direction intersecting the first direction. For example, the embossing device of the first patent application range, wherein the path of the relative movement of the charged portion with respect to the peripheral structure includes a plurality of loops surrounding the substrate holding area, and the plurality of loops The distances from the aforementioned substrate holding regions are different from each other. For example, the imprint apparatus according to the first patent application scope further includes a supply unit for supplying an imprint material to the substrate, a mold driving mechanism for driving the mold, and the mold driving mechanism is located in the first position when viewed from the supply unit. The above-mentioned area refers to an area on the upper surface of the peripheral structure that includes a side located closer to the side of the first orientation than the side of the first orientation of the substrate held by the substrate holder. For example, the embossing device of the fourth scope of the patent application, wherein the cleaning process is performed in a state where the embossing material does not exist on the substrate, and the supply unit does not supply embossing on the substrate during the cleaning process. Printing materials. For example, the imprinting device of the first patent application range, wherein the aforementioned control unit issues an instruction for the execution of the imprinting process of forming a pattern on the substrate by imprinting, and then executes the aforementioned imprinting processing in response to the aforementioned instruction , Perform the aforementioned cleaning process. For example, the embossing device of the first patent application range, wherein the peripheral structure has a continuous portion with a smooth surface and a discontinuous portion with a non-smooth surface, and the control portion instructs the charging portion and the foregoing per unit area. The total time that the discontinuous portions face each other is longer than the total time that the charged portion opposes the continuous portions per unit area. For example, the imprinting device of the scope of application for a patent, wherein the control unit controls a second cleaning process to use the second cleaning member in a state where the second cleaning member is held by a mold holder holding a mold. An area of at least a part of the peripheral structure is cleaned. For example, the embossing device of the scope of application for a patent, wherein the clearance between the charging section and the peripheral structure in the cleaning process is compared with the mold when the substrate is moved to supply the embossing material to the substrate. The gap between the surrounding structures is small. For example, the embossing device according to the first scope of the patent application, wherein the cleaning process is performed with a gap of 0.8 mm or less between the charged part and the peripheral structure. For example, the imprint apparatus according to the first patent application range, wherein the charging section includes a charged dielectric structural material. For example, the imprint apparatus according to the first patent application range, wherein the aforementioned charging section includes an electret. For example, the imprint apparatus according to the first patent application range, wherein the aforementioned charging section includes an electret that maintains a positive charge and an electret that maintains a negative charge. For example, the imprint apparatus according to the first patent application range, wherein the charging section includes an electrode and a dielectric body covering the electrode. For example, the imprint apparatus according to the first patent application range, wherein the control unit controls the relative movement of the charged part with respect to the substrate clamp in a state where the substrate is not held through the substrate clamp, so that the substrate clamp The particles are adsorbed to the action of the charging section. For example, the embossing device of the scope of application for a patent, wherein the aforementioned cleaning structure is arranged such that a mold is positioned between the dispenser for supplying the embossing material on the substrate and the aforementioned cleaning structure. For example, in the imprint apparatus according to claim 16, the control unit performs control for bringing the charged part of the cleaning member into a charged state or a non-charged state. For example, the imprinting device according to item 17 of the scope of the patent application, wherein the control unit makes the charging unit into a charged state before supplying the imprint material to the substrate through the distributor. For example, the embossing device of claim 16 in which the width of the charged portion in a direction orthogonal to the direction in which the cleaning member and the dispenser are arranged is larger than the width of the pattern area of the mold. For example, the imprint apparatus according to claim 1 further includes a gas supply unit that supplies a gas for removing electricity from the mold, and a voltage control unit that controls a voltage applied to the charging unit. For example, the embossing device of claim 20, wherein the voltage control unit sets the voltage applied to the charging unit so that the electric field strength generated between the charging unit and the surrounding structure passes through the gas. The electric field intensity causing the discharge is below. For example, the embossing device according to claim 21, wherein the voltage applied to the charged portion varies depending on the type of the gas or the distance between the charged portion and the peripheral structure. For example, the imprinting device according to claim 20 of the application, wherein the gap between the mold and the imprinted material separated from the solidified imprinted material is replaced with the gas to perform static elimination of the mold. For example, the embossing device of claim 20 in the patent application range, wherein the aforementioned gas includes a gas having an average free diameter with respect to electrons longer than that of air. For example, the embossing device of the scope of application for patent No. 20, wherein the aforementioned gas system includes helium. For example, in the imprinting device of claim 20, wherein the voltage control section is a period during which the gas supply section is not supplying the gas, the voltage applied to the charging section is set to be between the charging section and the peripheral structure. The strength of the electric field generated between the materials is higher than the strength of the electric field caused by the discharge caused by the gas. An article manufacturing method includes the following steps: forming a pattern on a substrate using an imprinting device such as item 1 of the scope of patent application; and processing the substrate on which the aforementioned pattern is formed. An operation method of an imprint apparatus, which is an operation method of operating an imprint apparatus. The imprint apparatus includes a substrate holder arranged on a moving stage that moves a substrate and holding the substrate, and surrounding the substrate held by passing through the substrate holder. The operation method includes a procedure for cleaning at least a part of an area of the peripheral structure using a cleaning structure including a charged part, and the mold fixture holding the mold. The charging unit is disposed at a position separated from the mobile station, and an imprint material is supplied to the substrate held by the substrate holder, and the imprint material is cured while the mold is in contact with the imprint material. A pattern is formed on the substrate, wherein the cleaning process includes the following operations: disposing the cleaning member at a position separated from the moving stage and the mold jig, and placing the charged portion of the cleaning member on the peripheral member and on the peripheral member. In a state in which at least a part of the peripheral structure faces, the cleaning structure is placed on the surface On the side member with respect to the configuration of the peripheral girders are relatively moved, so that the particles adsorbed to the charging area portion. An article manufacturing method includes the following procedures: operating an imprint apparatus through an action method such as the 28th item of the patent application, forming a pattern on a substrate using the imprint apparatus; and processing the substrate on which the pattern is formed.