TW201729979A - Imprint device, operating method for same, and method for manufacturing article - Google Patents

Abstract

Provided is an imprint device that forms a pattern on a substrate by curing imprint material in a state in which the imprint material on the substrate is in contact with a mold, wherein the imprint device is provided with: a substrate chuck having a substrate holding area for holding the substrate; a peripheral member disposed so as to surround the side surfaces of the substrate held by the substrate chuck; and a control unit for controlling a cleaning process for cleaning at least part of an area of the peripheral member using a cleaning member that includes a charged unit. The cleaning process includes an operation for moving the cleaning member relative to the peripheral member in a state in which the charged unit faces the at least part of the area of the peripheral member so that particles in the area are adsorbed by the charged unit.

Description

Imprinting device and its operating method and article manufacturing method

The present invention relates to an imprint apparatus, an operation method thereof, and an article manufacturing method.

An imprint technique for curing an imprint material in a state in which a mold is brought into contact with an imprint material placed on a substrate to form a pattern on the substrate is attracting attention. In the mold, a pattern formed by the concave portion is formed, and when the mold is brought into contact with the imprint material on the substrate, the imprint material is filled in the concave portion due to the capillary phenomenon. In order to promote the filling of the embossed material into the concave portion or to prevent the curing of the embossed material due to air (oxygen), a space between the substrate and the mold is supplied with the purge gas. At the time when the concave portion is sufficiently filled with the imprint material, energy such as light or heat is applied to the imprint material. According to this, the embossed material is cured, and the pattern formed by the concave portion formed in the mold is transferred onto the embossed material on the substrate. The mold is separated from the imprinted material after the imprint material has cured.

The mold is charged when the mold is separated from the cured imprint material on the substrate. The electric field formed by this charging causes an electrostatic force (Coulomb force) to act on the particles, whereby the particles are attracted to the mold and attached to the mold. Particles sometimes invade from the outside of the chamber of the imprinting device, sometimes in the cavity The chamber is generated by mutual friction of mechanical elements, friction of mechanical elements with the substrate or the master, and the like. Alternatively, in order to discharge the embossed material from the discharge port when the uncured embossed material is placed on the substrate, mist of the embossed material may be generated, and the embossed material may be solidified to generate particles.

Japanese Laid-Open Patent Publication No. 2014-175340 discloses that a foreign matter trapping region is provided in a mold to charge the foreign matter capturing region, and is present in the ambient gas and/or the substrate when transporting the substrate to the transfer position. Foreign matter on the removal. Japanese Patent Publication No. 2015-149390 discloses that a pattern portion and a first conductive film are provided on a first surface of a mold, and a second conductive film is provided on a second surface to store electric charges in the first conductive film and second. The conductive film thereby attracts particles in the vicinity of the pattern portion to the first conductive film.

When the particles are attached to the mold and the mold is brought into contact with the imprint material on the substrate to form a pattern, a pattern having defects is formed, or the substrate and/or the mold may be damaged. On the other hand, in order to efficiently supply the purge gas to the space between the substrate and the mold, it is reviewed that the peripheral member is disposed so as to surround the side surface of the substrate. By providing the peripheral member, the volume of the space below the mold can be reduced, and the purge gas can be effectively maintained in the space.

However, when the peripheral member is disposed, when the substrate is moved after the mold is separated from the imprint material on the substrate, the peripheral member is opposed to the mold at a short distance. The electrostatic force is inversely proportional to the square of the distance, so the electrostatic force of the particles acting on the peripheral member is considerably larger than the electrostatic force acting on the substrate holding portion without the peripheral member. In the week The edge member will adhere to the particles after being processed by a plurality of substrates. Among the particles, the particles adhering to the peripheral member with weak adhesion are easily detached from the peripheral member due to the electrostatic force acting on the particles, and adhere to the mold.

The present invention provides a technique advantageous in terms of pattern defects, damage to a substrate and/or a mold, and the like which are caused by the particles which are easily detached from the peripheral member.

An embodiment of the present invention relates to an imprint apparatus for curing a stamped material in a state in which a mold is brought into contact with an imprint material on a substrate to form a pattern on the substrate, and a substrate holding region having a holding substrate The substrate member and the peripheral member disposed so as to surround the side surface of the substrate held by the substrate holder are cleaned by cleaning the region of at least a portion of the peripheral member using the cleaning member including the charging portion. a control unit that controls the cleaning process to move the cleaning member relative to the peripheral member in a state in which the charging portion and at least a portion of the peripheral member are opposed to each other to cause the region to be The action of the particles being adsorbed on the charging unit.

IMP‧‧‧ Imprinting device

100‧‧‧Mold

101‧‧‧Substrate

102‧‧‧Substrate fixture

113‧‧‧ Peripheral members

131‧‧‧Support

132-135‧‧‧Power Department

150‧‧‧ granules

170‧‧‧Clean members

Fig. 1 is a view schematically showing a configuration of a part of an imprint apparatus according to an embodiment of the present invention.

Fig. 2 is a view schematically showing an imprint apparatus of one embodiment of the present invention; The composition is shown in the figure.

[Fig. 3A] A diagram illustrating a cleaning member.

[Fig. 3B] A diagram illustrating a cleaning member.

[Fig. 3C] A diagram illustrating a cleaning member.

Fig. 4 is a view for explaining a holding portion for holding a cleaning member.

Fig. 5 is a view illustrating a peripheral member.

FIG. 6A is a view illustrating a cleaning process of a peripheral member.

FIG. 6B is a view illustrating a cleaning process of the peripheral member.

FIG. 6C is a view illustrating a cleaning process of the peripheral member.

[Fig. 6D] A diagram illustrating a cleaning process of a peripheral member.

Fig. 7 is a view illustrating a cleaning procedure of a peripheral portion.

FIG. 8 is a view illustrating a cleaning process of a substrate holder.

FIG. 9 is a view illustrating a cleaning procedure of a substrate holder.

FIG. 10 is a view schematically showing a configuration of an imprint apparatus according to a second embodiment of the present invention.

Fig. 11 is a view showing a configuration example of a cleaning member.

Fig. 12 is a view showing the operation of the imprint apparatus according to the second embodiment of the present invention.

FIG. 13 is a view illustrating a configuration of another cleaning member.

Fig. 14 is a view illustrating the configuration of another cleaning member.

Fig. 15A is a view for explaining cleaning of a peripheral member which is passed through the cleaning member shown in Fig. 14.

Fig. 15B is a view for explaining cleaning of a peripheral member which is passed through the cleaning member shown in Fig. 14.

Fig. 16A is a view showing the static elimination of the mold according to the third embodiment of the present invention.

Fig. 16B is a view showing the static elimination of the mold according to the third embodiment of the present invention.

Hereinafter, an exemplary embodiment of the imprint apparatus and the operation method thereof according to the present invention will be described with reference to the drawings.

Fig. 2 shows a configuration of an imprint apparatus IMP according to an embodiment of the present invention. The imprint apparatus IMP transfers the pattern of the mold 100 to the substrate 101 by imprinting. In other words, the imprint apparatus IMP is an imprint material (transferred material) that is transferred onto the substrate 101 by imprinting the pattern of the mold 100. Embossing means that the mold is brought into contact with the imprinted material and the imprinted material is cured. The mold 100 has a pattern formed by a concave portion. The mold 100 is brought into contact with the imprint material (uncured resin) on the substrate 101 so that the imprint material is filled in the concave portion of the pattern. In this state, the embossed material is given an energy to be cured, so that the embossed material is cured. According to this, the pattern of the mold 100 is transferred to the imprint material, and a pattern formed of the cured imprint material is formed on the substrate 101.

The embossed material is a curable composition that is cured by the energy to be cured. The embossed material sometimes indicates a state of solidification, and sometimes indicates an uncured state. For the energy for curing, for example, electromagnetic waves, heat, and the like are used. The electromagnetic wave is, for example, a light whose wavelength is selected from a range of 10 nm or more and 1 mm or less (for example, infrared rays, visible rays, ultraviolet rays). line).

The curable composition is, in general, a composition which is cured by light irradiation or by heating. Among these, the photocurable composition which is cured by light may contain at least a polymerizable compound and a photopolymerization initiator. Further, the photocurable composition may additionally contain a non-polymerizable compound or a solvent. The non-polymerizable compound may be, for example, at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal addition type release agent, a surfactant, an antioxidant, and a polymer component.

The present specification and the drawings show directions in an XYZ coordinate system in which the direction parallel to the surface of the substrate 101 is an XY plane. The directions of the X-axis, the Y-axis, and the Z-axis, which are respectively parallel to the XYZ coordinate system, are the X direction, the Y direction, and the Z direction, and the rotation around the X axis, the rotation around the Y axis, and the rotation around the Z axis are respectively θ X . , θ Y, θ Z. The control or drive of the X-axis, the Y-axis, and the Z-axis respectively indicates control or drive with respect to a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis. Further, the control or drive of the θ X axis, the θ Y axis, and the θ Z axis respectively represents rotation about an axis parallel to the X axis, rotation about an axis parallel to the Y axis, and an axis parallel to the Z axis. The rotation of the control or drive. Further, the position is based on the information determined by the coordinates of the X-axis, the Y-axis, and the Z-axis, and the posture is information that can be determined with respect to the relative rotation of the θ X-axis, the θ Y-axis, and the θ Z-axis. Positioning means controlling the position and/or posture.

The imprint apparatus IMP includes a substrate driving mechanism SDM for positioning the substrate 101, and the substrate driving mechanism SDM may include, for example, a substrate jig 102, a peripheral member 113, a micro-motion mechanism 114, a coarse motion mechanism 115, and a substrate. Structure 116. The substrate holder 102 has a substrate holding region for holding the substrate 101, and can hold the substrate 101 by adsorption (for example, vacuum adsorption or electrostatic adsorption). The micro-motion mechanism 114 may include a micro-motion stage that supports the substrate holder 102 and the peripheral member 113, and a drive mechanism that drives the micro-motion stage. The peripheral member 113 is disposed around the region where the substrate 101 is disposed so as to surround the side surface of the substrate 101. The peripheral member 113 may have a surface above the height of the upper surface of the substrate 101. The peripheral member 113 can also be divided into a plurality of members. Further, all or a part of the plurality of members may be disposed to be isolated from each other or may be disposed in contact with each other.

The micro-motion mechanism 114 is a mechanism that micro-drives the substrate holder 102 to micro-drive the substrate 101. The coarse motion mechanism 115 is a mechanism that coarsely drives the micro motion mechanism 114 to coarsely drive the substrate 101. The base structure 116 supports the coarse motion mechanism 115, the micro motion mechanism 114, the substrate holder 102, and the peripheral member 113. The substrate drive mechanism SDM is configured to drive the substrate 101 for a plurality of axes (for example, three axes of the X axis, the Y axis, and the θ Z axis). The position of the portion (micro-motion stage) of the micro-motion mechanism 114 that is integrated with the substrate holder 102 is monitored by passing through a measuring instrument 117 such as an interferometer.

The imprint apparatus IMP is provided with a mold driving mechanism MDM for positioning the mold 100, and the mold driving mechanism MDM may include a mold jig 110, a driving mechanism 109, and a peripheral member 151. The peripheral member 151 is disposed around the region where the mold 100 is disposed so as to surround the side surface of the mold 100. The mold driving mechanism MDM and the peripheral member 151 can be Supported by the support structure 108. The mold jig 110 holds the mold 100 by adsorption (for example, vacuum adsorption, electrostatic adsorption). The drive mechanism 109 drives the mold 100 by driving the mold clamp 110. The mold driving mechanism MDM can be configured, for example, to drive the mold 100 for a plurality of axes (for example, the X axis, the Y axis, the Z axis, the θ X axis, the θ Y axis, and the θ Z axis 6 axes).

The substrate drive mechanism SDM and the mold drive mechanism MDM constitute a drive unit that performs relative positioning of the substrate 101 and the mold 100. The drive unit adjusts the relative position of the substrate 101 and the mold 100 in relation to the Z-axis in addition to the relative positions of the substrate 101 and the mold 100 in the X-axis, the Y-axis, the θ-X-axis, the θ-axis, and the θ-Z axis. The adjustment of the relative position of the Z-axis substrate 101 and the mold 100 includes an operation of contacting and separating the imprint material on the substrate 101 from the mold 100.

The imprint apparatus IMP may be provided with a dispenser (supply portion) 111 for coating, arranging or supplying an uncured imprint material on the substrate 101. The dispenser 111 can be configured, for example, to arrange the imprint material on the substrate 101 in the form of a plurality of droplets. The dispenser 111 can be supported by the support structure 108.

The imprint apparatus IMP may include a curing unit 104 that irradiates the imprint material on the substrate 101 with light such as UV light to cure the imprint material. The imprint apparatus IMP may additionally have a camera 103 for use in observing the imprint. The light emitted from the curing unit 104 is reflected by the mirror 105, and is transmitted through the mold 100 to be irradiated onto the imprint material. The camera 103 can be configured to observe the embossing via the mold 100 and the mirror 105, for example, observation The contact state of the imprinted material with the mold 100, and the like.

The imprint apparatus IMP may include alignment range displays 107a and 107b for detecting the relative positions of the marks of the substrate 101 and the marks of the mold 100. The alignment range displays 107a and 107b can be disposed on the upper structure 106 supported by the transmission support structure 108. The imprint apparatus IMP may include an off-axis detector 112 for detecting a plurality of marked positions of the substrate 101. The off-axis detector 112 can be supported by the support structure 108.

The imprint apparatus IMP may be provided with one or a plurality of purge gas supply units 118a and 118b. The purge gas supply portions 118a and 118b are disposed around the mold jig 110 so as to surround the mold jig 110. The purge gas supply units 118a and 118b supply the purge gas to the space between the substrate 101 and the mold 100. The purge gas supply units 118a and 118b can be supported by, for example, the support structure 108. As the gas to be purified, a gas which does not hinder the curing of the imprint material can be used, and for example, a gas containing at least one of helium gas, nitrogen gas, and a coagulation gas (for example, pentafluoropropane (PFP)) can be used. The configuration of the peripheral members 113 and 151 is advantageous in that the space between the substrate 101 and the mold 100 is effectively filled with the purge gas.

The imprint apparatus IMP is provided with a chamber 190, and each of the above-described constituent elements can be disposed in the chamber 190. The imprint apparatus IMP may further include a main control unit (control unit) 126, an imprint control unit 120, an illumination control unit 121, a display control unit 122, a distributor control unit 123, a purge gas control unit 124, and a substrate control unit 125. . Main control unit 126, The imprint control unit 120, the illumination control unit 121, the display control unit 122, the distributor control unit 123, the purge gas control unit 124, and the substrate control unit 125 are controlled. The imprint control unit 120 controls the mold driving mechanism MDM. The irradiation control unit 121 controls the curing unit 104. The display control unit 122 controls the alignment range displays 107a and 107b and the off-axis detector 112. The distributor control unit 123 controls the distributor 111. The purge gas control unit 124 controls the purge gas supply units 118a and 118b. The substrate control unit 125 controls the substrate drive mechanism SDM.

In Fig. 1, a portion of the imprint apparatus IMP of Fig. 2 is schematically shown. In the interior space of the chamber 190, it is possible to invade the particles 150. Further, in the chamber 190, the particles 150 may be generated due to mutual friction of mechanical elements, friction of mechanical elements with the substrate or the master, and the like. Alternatively, the dispenser 111 generates a mist of the imprint material when discharging the imprint material from the discharge port in order to dispose the uncured imprint material on the substrate 101, and the imprint material is solidified so that the particles 150 may be generated.

The particles 150 may adhere to the upper surface of the peripheral member 113 or the like. The strength of adhesion of the particles 150 attached to the peripheral member 113 is various. When the particles 150 attached to the peripheral member 113 are not detached from the peripheral member 113, pattern defects due to adhesion of the particles 150 to the substrate 101 or the mold 100, damage of the substrate and/or the mold, and the like do not occur. On the other hand, when the particles 150 attached to the peripheral member 113 are detached from the peripheral member 113, they may adhere to the substrate 101 or the mold 100 or may be sandwiched between the substrate 101 and the mold 100.

The mold 100 is made from the cured imprint material on the substrate 101 The mold 100 is charged when separated. The electric field formed by this charging causes an electrostatic force (Coulomb force) to act on the particles 150, whereby the particles 150 are attracted to the mold 100 to be attached to the mold 100. The upper surface of the peripheral member 113 has the same height as the upper surface of the substrate 101, so the distance between the mold 100 and the upper surface of the peripheral member 113 is relatively small. The electrostatic force is inversely proportional to the square of the distance, so that the electrostatic force of the particles acting on the peripheral member 113 is a member that acts on the substrate holder 102 and the periphery thereof in the absence of the peripheral member 113. The electrostatic force is quite large. In the peripheral member 113, a plurality of particles 150 may be attached due to the processing of a plurality of substrates 101.

Therefore, in the imprint apparatus IMP, a cleaning process of cleaning an area of at least a portion of the peripheral member 113 using the cleaning member 170 including the charging portion is performed. In the cleaning process, the main control unit (control unit) 126 controls the driving of the cleaning member 170 including the charging unit. The cleaning process may include an operation of moving the cleaning member 170 relative to the region in a state where the charged portion of the cleaning member 170 is opposed to at least a portion of the peripheral member 113 to make the region The particles 150 are adsorbed to the charging portion. Here, the particles 150 adhering to the peripheral member 113 with a weak adhesion force are attached to the charging portion because the cleaning member 170 including the charging portion faces each other and is detached from the peripheral member 113 by electrostatic force. In the general case, the cleaning process is performed in a state where the imprint material is not present on the substrate 101, and the dispenser 111 does not supply the imprint material on the substrate 101 during the cleaning process.

In FIG. 1, it is shown that the substrate 101 is present in the substrate holder. The cleaning process is performed in the state in which the substrate holding region 1021 of 102 is performed, but the cleaning process may be performed in a state where the substrate 101 does not exist on the substrate holding region 1021. The substrate holding region 1021 may be a region in which the entirety thereof is in contact with the substrate 101, or a region in which a part thereof is in contact with the substrate 101. In the latter aspect, a portion in contact with the substrate 101 may have a pin and/or a ring.

Here, as an example, a case where the mold 100 is separated from the solidified imprint material on the substrate 101 and the mold 100 is charged to -3 KV is considered. The peripheral member 113 is grounded to have a ground potential. The gap between the peripheral member 113 and the mold 100 is 1 mm. The direction of the electric field in this case is upward (positive direction of the Z axis), and the intensity of the electric field is 3 kV/mm. In this case, it is preferable that the charging portion is charged such that the potential V of the charging portion of the cleaning member 170 becomes a potential lower than -3 kV (V < -3 kV). In the cleaning process, the charging portion of the cleaning member 170 is charged, and the cleaning member 170 is relatively moved with respect to the region in a state where the charging portion is opposed to at least a portion of the peripheral member 113. Due to this cleaning treatment, the particles 150 adhering to the region with weak adhesion are separated from the region, pulled to the charged portion, and captured by the charged portion.

The gap between the peripheral member 113 in the cleaning process and the charging portion of the cleaning member 170 is reduced, so that the electric field between the peripheral member 113 and the charging portion can be increased, and the effect of the cleaning process can be improved. For example, the gap between the mold 100 and the peripheral member 113 when the substrate 101 is moved to supply the imprint material to the substrate 101 through the dispenser 111 is GN, and the gap between the peripheral member 113 and the charging portion in the cleaning process is GC. When set to GN> GC. The gap between the peripheral member 113 in the cleaning process and the charging portion of the cleaning member 170 can be, for example, 0.8 mm or less.

The cleaning member 170 can be held by the holding portion 119. The holding portion 119 may have a structure capable of holding the cleaning member 170. For example, the movable member may be a movable member such as a robot arm, or may be a fixed member, and the mold holder 110 may be replaced.

3A to 3C, an example of the cleaning member 170 is shown. In the first example shown in FIG. 3A, the cleaning member 170 includes a support 131 and a charging portion 132 supported by the support 131. The charging unit 132 can be prepared by, for example, charging a dielectric member made of quartz or the like. The dielectric member is charged by contacting the dielectric member with an imprint material disposed on a dummy substrate, and curing the imprint material through the curing portion 104 to separate the dielectric member from the imprint material. Thereby completed. The dummy substrate is a substrate placed on the substrate holder 102 instead of the substrate 101. The support body 131 and the charging portion 132 can be configured of the same material.

The surface area in contact with the embossed material can increase the amount of charge, so that the charging portion 132 can have a pattern (concavity and convexity) on the surface. The cleaning member 170 including the support body 131 and the charging portion 132 may be, for example, an unused article of the mold 100 (for example, a mold other than the specification or the specification). Alternatively, the cleaning member 170 including the support body 131 and the charging portion 132 may be a member having a density higher than that of the mold 100 for manufacturing an article, which is advantageous for the increase in the amount of charge (for example, for the imprinting device IMP). Check the unused items of the mold used.) In addition, items that are not used are items that are not used for the purpose of the original.

In the second example shown in FIG. 3B, the cleaning member 170 includes a support body 131 and an electret 133 supported by the support body 131. The electret is a substance that continuously forms an electric field, and is formed, for example, by fixing a charge to a dielectric material such as a polymer material. In the method of implanting the electric charge to the electret, there is a method of curing the polymer material by applying a high voltage between the electrodes sandwiching the molten polymer material, a method of transmitting the corona discharge, and a permeation ion. Implantation methods, etc. In the method of applying a voltage between the electrodes, the surface of the electret system connected to each electrode is charged with positive and negative polarities respectively, and in the method of transmitting corona discharge, the electret system is charged with a negative polarity, and the ion implantation is carried out. In terms of method, the electret system is generally charged with a positive polarity.

In the first example, since the excess charge is distributed on the surface of the dielectric member constituting the charging portion 132, the amount of charge is reduced by the environment. On the other hand, in the electret used in the second example, the charge is implanted in the dielectric material, so that the charge can be held semi-permanently. In the example shown in FIG. 3B, the electret 133 is provided over the entire area of the lower surface of the support 131, but the electret 133 may be provided only on a part of the lower surface. Further, as described in the first example, the electret may be disposed on the lower surface of the unused article of the mold.

Examples of the material of the electret include an inorganic material such as (a) a polymer material such as an acrylic resin, a nylon or a fluororesin, or (b) an SiO ₂ or SiO ₂ /Si _x N _y laminated film. In the fluororesin, the organic electret film which can be formed by the spin coating is Teflon AF (registered trademark, manufactured by DuPon Co., Ltd.), CYTOP (registered trademark, manufactured by Asahi Glass Co., Ltd.), and the like. In particular, CYTOP has such a characteristic that the surface charge density is high.

As for the charging portion, a member that covers the electrode with a dielectric can also be used. When the particles are made of a metal, the particles adhering to the charging portion become the same polarity as the electrodes due to charge exchange, and are detached by the repulsive force, so that they cannot be captured by the charging portion. Therefore, the electrode is covered with a dielectric body so that even if it is a metal particle, charge exchange can be prevented and it can be captured by the charging portion.

In the third example shown in FIG. 3C, the cleaning member 170 includes a support 131, a negative charging portion 134 supported by the transmission support 131, and a positive charging portion 135. In the negative electrode charging portion 134 and the positive electrode charging portion 135, the electret described in the second example can be used. By providing the negative polarity charging portion 134 that is charged with a negative polarity and the positive electrode charging portion 135 that is charged positive, the particles adhering to the peripheral member 113 can be removed without depending on the polarity of the particles.

The holding portion 119 for holding the cleaning member 170 is supplemented with reference to FIG. The holding portion 119 may hold the cleaning member 170 as described above, and may be, for example, a movable member such as a robot arm, or may be a fixed member, and the mold holder 110 may be replaced.

In an example, the holding portion 119 may be a component of the maintenance unit 136. The maintenance unit 136 may be, for example, a unit for removing and mounting the substrate holder 102. The substrate holder 102 is in contact with the substrate 101 so as to be contaminated or worn, so that it is exchanged using the maintenance unit 136. The maintenance unit 136 has a holding mechanism for holding the substrate holder 102, and the holding mechanism is used as the holding portion 119. Not with Zhou The cleaning process of the edge member 113 simultaneously exchanges the substrate holder 102. Therefore, there is no particular disadvantage in that the cleaning process is performed by the maintenance unit 136 to maintain the cleaning member 170. Further, the cleaning process is performed by the maintenance unit 136 to hold the cleaning member 170, which contributes to simplification of the configuration of the imprint apparatus IMP.

When the cleaning member 170 is held by the mold jig 110 and the cleaning process is performed, the cleaning member 170 is conveyed to the mold jig 110 by using the conveying mechanism that conveys the mold 100 to the mold jig 110.

FIG. 5 is a plan view of the peripheral member 113, and FIG. 5 illustrates the shape of the peripheral member 113. In the example shown in Fig. 5, the outer peripheral member 113 has a quadrangular shape, but this is merely an example, and the peripheral member 113 may have various outer shapes. The peripheral member 113 has an opening that surrounds the side surface of the substrate 101, and the shape of the opening is modeled on the outer periphery of the substrate 101.

The peripheral member 113 has a continuous portion having a smooth surface and a discontinuous portion having a non-smooth surface. For the peripheral member 113, for example, a reference mark for measuring the relative position between the mold 100 and the reference of the imprint apparatus IMP is disposed. Further, when light is used for the energy for curing, a photometer for measuring the illuminance of light can be disposed in the peripheral member 113. Therefore, there may be a groove, a step, or the like between the member or the unit and the peripheral member 113 as represented by the reference mark and the photometer. Further, when the peripheral member 113 is composed of a plurality of divided members, there may be a groove, a step, or the like between the members. In addition, It is possible to form a groove, a step, or the like due to the fastening portion for fastening the peripheral member 113 to the micro-motion mechanism 114. Such a groove, a step, or the like is an example of a discontinuous portion having a non-smooth surface. On the other hand, the flat upper surface is an example of a smooth continuous portion. The main control unit 126 is configured to make the total time ratio of the charging portion of the cleaning member 170 and the discontinuous portion per unit area to the total length of the charging portion of the cleaning member 170 and the continuous portion per unit area. The way to control the cleaning process.

In the imprint apparatus IMP, in order to form a pattern with an imprint material for a plurality of press regions of the substrate 101, an imprint process (pattern forming method) configured by a plurality of imprint cycles is performed. Each embossing cycle may include a program for arranging the embossed material on the substrate 101 through the dispenser 111, a program for bringing the mold 100 into contact with the embossed material, a procedure for curing the embossed material, and separating the mold 100 from the cured embossed material. program of.

FIG. 5 illustrates a positional relationship between the peripheral member 113, the mold 100, and the dispenser 111 in a case where a certain pressing region of the substrate 101 is placed through the dispenser 111. The pattern area of the mold 100 (the area having the pattern to be transferred to the substrate 101) is located on the peripheral member 113.

During the execution of the imprint process, the region 140 is a region that faces the pattern region of the mold 100 during the period in which the pattern is formed on each of the plurality of press regions of the substrate. The region 140 is a region in the entire region of the upper surface of the peripheral member 113 which is likely to become a supply source of particles to the pattern region of the mold 100 in the imprint process. Therefore, the object of the cleaning process is limited to a part of the area instead of the entire surface of the peripheral member 113. In the case of a zone, the cleaning process should be performed on the zone containing at least the zone 140.

In one example, the mold driving mechanism MDM that drives the mold 100 is located in the first orientation (the negative direction of the X-axis) when viewed from the dispenser 111. Further, the region 140 is located in a region on the side closer to the first orientation than the side surface on the side of the first orientation of the substrate 101 held by the transmission substrate holder 102 among the upper surfaces of the peripheral members 113.

6A-6D illustrate a cleaning process for relatively moving the cleaning member 170 relative to the region in a state where the charging portion of the cleaning member 170 is opposed to the region of at least a portion of the peripheral member 113. In the example shown in Fig. 6A, the main control portion 126 controls the cleaning process in such a manner that the region 140 in the peripheral member 113 is selectively cleaned. Such a cleaning process is advantageous in order to shorten the time required for it. In the example shown in Fig. 6B, the main control unit 126 controls the cleaning process in such a manner that the entire area of the peripheral member 113 is cleaned. The relative movement of the charging portion of the cleaning member 170 with respect to the peripheral member 113 in the cleaning process is, for example, illustrated in FIGS. 6A and 6B, and may be a continuous repetition of a predetermined operation unit. The operation unit may include, for example, a relative movement in a direction parallel to the first direction (for example, the X-axis direction) and a relative movement in a second direction (for example, the Y-axis direction) intersecting the first direction.

In the example shown in FIG. 6C, the path of relative movement of the charging portion with respect to the cleaning member 170 of the peripheral member 113 includes a plurality of loops surrounding the substrate holding region 1021. Here, the plurality of loops are different from each other in the distance from the substrate holding region 1021. Shown in Figure 6C For example, the path does not pass through the substrate holding area 1021, but the path may pass through the substrate holding area 1021.

In the example shown in FIG. 6D, the peripheral member 113 has discontinuous portions 141, 142, and 143 such as grooves and/or steps, and a continuous portion other than the discontinuous portions 141, 142, and 143. The particles are more easily trapped by the discontinuous portions 141, 142, and 143 than the continuous portions, so that a larger number of particles are present in the discontinuous portions 141, 142, and 143 than the continuous portions. The main control unit 126 is configured such that the charged portion of the cleaning member 170 and the discontinuous portions 141, 142, and 143 of the unit area are opposed to each other such that the charged portion of the cleaning member 170 and the continuous portion per unit area are paired. The cleaning process is controlled in a manner that is the total length of time.

The main control unit 126, for example, issues a command to execute the imprint process in which the pattern is formed on the substrate by imprinting, and then performs a cleaning process before executing the imprint process in response to the command. Alternatively, it may be performed when the main control unit 126 does not manufacture the idleness of the article. Alternatively, the main control unit 126 may perform cleaning processing every time the set number of substrates are processed, or may perform cleaning processing every time one substrate is processed. Further, the main control unit 126 may perform a cleaning process by, for example, forming a pattern every time in the pressing region.

Further, an evaluation for confirming the necessity of performing the cleaning process may be performed, and the cleaning process may be performed based on the result. For example, a pattern (first sample) is formed by embossing one or a plurality of pressure-sensitive areas by using a mold for evaluation, and the peripheral member 113 is moved in a state where the mold is opposed to the peripheral member 113 after the mold is charged. . And, using the mold, a pattern is formed by embossing one or a plurality of pressing regions (the second sample) Product). By comparing the number of defects of the first sample and the second sample, the state of the peripheral member 113 can be evaluated.

In FIG. 7, the cleaning procedure of the peripheral member 113 is exemplified. This cleaning procedure is controlled by the main control unit 126. In the program S201, the main control unit 126 commands a transport mechanism (not shown) to hold the holding unit 119 with the cleaning member 170. In the program S202, the main control unit 126 determines the type of the cleaning member 170. The type of the cleaning member 170 is determined, for example, by the identifier given to the cleaning member 170. Alternatively, the type of the cleaning member 170 is measured by the measuring device that measures the surface potential, and the amount of charge of the charging portion of the cleaning member 170 is measured, and is determined based on the result.

A type that is charged by contact and separation with respect to a dielectric member of an imprint material as exemplified in Fig. 3A is referred to as a non-continuous type. Further, the type in which the electret is used as illustrated in FIGS. 3B and 3C is referred to as a continuous type. In the case where it is determined in the program S202 that the cleaning member 170 is in the non-continuous type, the process proceeds to the process S203, and when it is determined that the cleaning member 170 is in the continuous type, the process proceeds to the process S206.

In the program S203, the main control unit 126 commands a transfer mechanism (not shown) to transfer the dummy substrate to the substrate holder 102. In the program S204, the main control unit 126 controls the substrate drive mechanism SDM and the distributor 111 such that the imprint material is placed on the dummy substrate. In the program S205, the main control unit 126 controls the virtual imprinting, the dummy member of the cleaning member 170 is brought into contact with the imprint material on the dummy substrate, and the imprinting material is cured by the curing portion 104. Electroformed material from cured stamp Separation of materials. The dielectric member is charged by this virtual imprint to prepare the charging portion. In the case of the continuous cleaning member 170, the processing for charging as in the procedures S203 to S205 is not required.

In the program S206, the main control unit 126 performs the cleaning process of the peripheral member 113. Specifically, the main control unit 126 relatively moves (scans) the cleaning member 170 with respect to the region in a state where the charging portion of the cleaning member 170 faces at least a portion of the peripheral member 113. Thereby, the particles 150 of the region are detached from the region and adsorbed to the charging portion, so that the region is cleaned.

In the program S207, the main control unit 126 commands the transport mechanism (not shown) to carry out the cleaning member 170. Here, in the case where the dedicated holding portion 119 for holding the cleaning member 170 is provided, the processes S201 and S207 are not required, and the state in which the cleaning member 170 is held by the holding portion 119 is maintained.

The above-described cleaning treatment can be applied to a cleaning process for removing particles from the substrate holder 102 (substrate holding region 1021), as exemplified in FIG. The substrate holding region 1021 of the substrate holder 102 has pins and/or rings for the support substrate 101. When the particles are attached to the pins and/or the rings, the substrate 101 is deformed, which may cause defects in the formed pattern.

Therefore, the main control unit 126 can be configured to control the cleaning process of the substrate holder 102 (substrate holding area 1021). In the cleaning process, the cleaning member 170 is relatively moved relative to the substrate holder 102 in a state where the charging portion of the cleaning member 170 is opposed to the substrate holder 102. The particles 150 of the substrate holder 102 are adsorbed to the charging portion.

In FIG. 9, the cleaning procedure of the substrate holder 102 is exemplified. This cleaning procedure is controlled by the main control unit 126. In the case where the substrate 101 is provided on the substrate holder 102 in the program S211, the main control unit 126 commands a transfer mechanism (not shown) to carry out the substrate 101. In the program S212, the main control unit 126 commands a transport mechanism (not shown) to hold the holding unit 119 with the cleaning member 170. In the program S213, the main control unit 126 determines the type of the cleaning member 170. In the case where it is determined in the procedure S213 that the cleaning member 170 is in the non-continuous type, the process proceeds to the routine S214, and when it is determined that the cleaning member 170 is in the continuous type, the process proceeds to the routine S218.

In the program S214, the main control unit 126 commands a transport mechanism (not shown) to transfer the dummy substrate to the substrate holder 102. In the program S215, the main control unit 126 controls the substrate drive mechanism SDM and the distributor 111 such that the imprint material is placed on the dummy substrate. In the program S216, the main control unit 126 controls the virtual imprinting, the dielectric member of the cleaning member 170 is brought into contact with the imprint material on the dummy substrate, and the imprinting material is cured by the curing portion 104. The electroformed material is separated from the cured imprinted material. The dielectric member is charged by this virtual imprint to prepare the charging portion. In step S217, the main control unit 126 commands a transport mechanism (not shown) to carry out the dummy substrate from the substrate holder 102. In the case of the continuous cleaning member 170, the processing for charging as in the procedures S214 to S217 is not required.

In the program S218, the main control unit 126 executes the substrate holder With 102 cleaning treatment. Specifically, the main control unit 126 relatively moves (scans) the cleaning member 170 with respect to the substrate holder 102 in a state where the charging portion of the cleaning member 170 faces at least a portion of the substrate holder 102. Thereby, since the particles 150 of the region of the substrate holder 102 are detached from the substrate holder 102 and adsorbed to the charging portion, the region of the substrate holder 102 is cleaned.

In the program S219, the main control unit 126 commands the transport mechanism (not shown) to carry out the cleaning member 170. Here, in the case where the dedicated holding portion 119 for holding the cleaning member 170 is provided, the processes S212 and S219 are not required, and the state in which the cleaning member 170 is held by the holding portion 119 is maintained.

The main control unit 126 is, for example, a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), or an ASIC (abbreviation of Application Specific Integrated Circuit), or a general-purpose computer incorporated in the program, or such a computer. All or a part of the combination is constructed. The other control units 120 to 125 are also the same, and a PLD such as an FPGA or an ASIC, or a general-purpose computer incorporated in the program, or a combination of all or a part thereof.

Hereinafter, a method of manufacturing the article will be described. Here, as an example, a manufacturing method (a semiconductor integrated circuit element, a liquid crystal display element, or the like) as an article manufacturing method will be described. The article manufacturing method includes a program for forming a pattern on a substrate (wafer, glass plate, or film substrate) by the above-described imprint apparatus. Furthermore, the method of fabrication may include a process of processing (eg, etching) a patterned substrate. In addition, manufacturing rules In the case of patterned media (recording media), other articles such as optical components, the manufacturing method may replace other processes including processing to form a patterned substrate. The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to the conventional method.

(Second embodiment)

The cleaning process described above is performed after (a) performing the imprint process, or (b) when the imprint apparatus is in an idle state, or (c) setting a number of substrates. In the following description, the charging unit is disposed at a specific position of the imprint apparatus IMP so that the cleaning processing can be performed in parallel with a series of imprinting operations without setting the time for the cleaning process.

Fig. 10 shows a configuration of an imprint apparatus IMP according to a second embodiment of the present invention. The cleaning member 170 is disposed in such a manner that the mold 100 is positioned between the cleaning member 170 and the dispenser 111. The cleaning member 170 is held, for example, by being transmitted through the peripheral member 151 disposed around the periphery of the mold jig 110. As illustrated in FIG. 11, the cleaning member 170 has a charging portion 171.

In the second embodiment, the cleaning member 170 is disposed such that the mold 100 is positioned between the cleaning member 170 and the dispenser 111. Thereby, the pressing region of the imprinting object is moved below the dispenser 111, and then moved to the program below the mold 100, and a portion of the region 140 shown in FIG. 5 is cleaned against the cleaning member 170. . Performing such a procedure sequentially for a plurality of pressing regions causes the entire region of the region 140 to be cleaned through The member 170 is cleaned. Therefore, the time required for the cleaning of the peripheral member 113 is reduced. This contributes to an increase in the throughput of the embossed pattern formation.

Here, from the viewpoint of the efficiency of cleaning, it is preferable that the width L2 of the charging portion 171 in the direction orthogonal to the direction in which the cleaning member 170, the mold 100, and the dispenser 111 are arranged is a pattern of the mold 100. The width L1 of the portion 160 is large.

Fig. 12 is an illustration showing the operation of the imprint apparatus IMP of the second embodiment. Here, the charging portion 171 of the cleaning member 170 is charged and charged to be in a charged state, and is subjected to an operation for removing electricity to be in an uncharged state. However, the charging unit 171 that does not require such an operation can be used. In this case, the programs S201 and S205 described below are not required. In a simple example, the charging unit 171 can be configured as a conductor, and the charging unit 171 is supplied with electric charge to be in a charged state, and the electric charge is extracted from the charging unit 171 to be in an uncharged state.

First, in the routine S221, the main control unit 126 causes the charging unit 171 to be in a charged state. Next, in the program S222, the main control unit 126 controls the dispenser 111 and the substrate drive mechanism SDM so that the imprint material is placed in the pressing region of the imprint target. At this time, the pressing area of the imprinted object is disposed under the dispenser 111. Next, in the routine S223, the main control unit 126 controls the substrate drive mechanism SDM such that the pressing region of the imprint target is placed under the mold 100. In the procedures S222 and S223, the area facing the charging portion 171 of the cleaning member 170 among the surfaces of the peripheral member 113 is cleaned.

Next, in step S224, the main control unit 126 first controls the mold driving mechanism MDM so that the imprint material on the pressing region of the imprinting object comes into contact with the mold 100. In the routine S024, the main control unit 126 controls the curing unit 104 such that the imprint material is cured, and then controls the mold driving mechanism MDM so that the cured imprint material is separated from the mold 100. Next, in step S225, the main control unit 126 causes the charging unit 171 to be in a non-powered state.

Next, in step S226, the main control unit 126 determines whether or not the imprint of the entire press region of the substrate is completed, and if there is a press region that has not been imprinted, the process returns to the routine S221, and the other press regions are repeatedly processed. On the other hand, in the case where the embossing of the all-pressure region is completed, the main control unit 126 determines whether or not the embossing for the entire substrate is completed in the step S227. Further, when there is a pressure-sensitive area that has not been embossed, the main control unit 126 returns to the routine S201 and repeats the processing on the other substrates.

To clean a wider area of the peripheral member 113 through the cleaning member 170, as illustrated in Figure 13, the use of a wider area of the cleaning member 170 is beneficial. The cleaning member 170 illustrated in Fig. 13 has a shape in which the mold 100 is entirely surrounded in all directions.

However, various mechanisms are disposed around the mold 100. In this case, it is difficult to employ the cleaning member 170 such as the mold 100 in all directions. Examples of the mechanism that can be disposed around the mold 100 include a mechanism that biases the side surface of the mold 100 to deform the mold 100, a mechanism that adjusts the inclination of the mold 100, a mechanism that forms a part of the mold driving mechanism MDM, and the like.

FIG. 14 shows an example in which additional cleaning members 180, 181 are provided in addition to the cleaning member 170. That is, in Fig. 14, an example in which a plurality of cleaning members 170, 180, 181 are provided is shown. As illustrated in FIG. 15A, the cleaning member 180 is a region 300 that cleans a portion of the peripheral member 113, as illustrated in FIG. 15B, and the cleaning member 181 cleans other regions 310 among the peripheral members 113. By arranging a plurality of cleaning members in such a manner as to share the area cleaned by the plurality of cleaning members, it is possible to suppress an increase in size of the imprinting apparatus IMP. Here, the cleaning member 170 is used to clean the surrounding member 113 in parallel with the imprinting of the plurality of pressing regions of the substrate 101. On the other hand, the cleaning members 180 and 181 are used in a dedicated cleaning program executed during maintenance, during idle time, or the like, without performing imprinting on the substrate 101.

(Third embodiment)

The imprint apparatus IMP preferably includes a neutralization mechanism for removing the electric power of the mold 100 that is charged when the mold 100 is separated from the cured imprint material. For example, the static elimination of the mold 100 is performed using an ion generator. In terms of the ion generator, there are various types such as a corona discharge method and an energy ray irradiation method (for example, an X-ray irradiation method or an α-ray irradiation method). The corona discharge method is generally a factor in the generation of particles. Therefore, it is necessary to remove the electricity of the mold 100 while maintaining the cleanliness, and it is suitable for the X-ray irradiation method or the α-ray irradiation method. Since the space between the mold 100 and the substrate 101 is a very narrow space, it is difficult to arrange an ion generator around the space, and the X-ray or the α-line is directly irradiated to the mold 100. For mode In addition to the method in which 100 directly irradiates the X-ray or the α-line, there is a method in which an X-ray or an α-line is irradiated to a gas to ionize the gas, and the ionized gas is supplied to a space below the mold 100. However, the ionized gas does not decrease in the mold 100 during the period in which it passes through the pipe and the nozzle, and during the passage from the nozzle to the space between the mold 100 and the substrate 101. Maintain sufficient ion concentration in the space below. In this case, it becomes impossible to effectively remove the mold 100.

Therefore, in the present embodiment, the gas for removing electricity is supplied from the purge gas supply unit 118. The gas for removing electricity may be supplied from a gas supply unit that is separate from the purge gas supply unit 118. As shown in Fig. 16A, the gas for removing electricity is preferably filled in a space around the mold 100 before the pattern portion 160 of the mold 100 is separated from the cured imprint material. The supply of the static eliminating gas through the purge gas supply unit 118 is such that the space around the mold 100 is sufficiently filled with the gas for removing electricity, and can be stopped before the separation of the pattern portion 160, or can be continuously supplied during the separation. As a result, as shown in FIG. 16B, the surrounding static elimination gas in the program for separating the pattern portion 160 from the cured imprint material is introduced into the gap between the pattern portion 160 and the substrate 101 and replaced.

The gas for removing electricity is required to contain a gas having an average free path with respect to electrons longer than air. Specifically, it is preferable to use a gas which is a monoatomic molecule, and particularly preferably a ruthenium having the longest average free path among the rare gases. The electrons present in the electric field are transported to the anode side by the electric field, and collide with the gas molecules in the middle. In this case, the electrons are sufficiently accelerated to have the ionization energy of the gas. In the state of energy, when it collides with gas molecules, it causes ionization, and an electron-cation pair is generated. The generated electrons are also accelerated by an electric field to ionize the gas molecules. As such, the phenomenon that ionization is caused one after another such that a large number of electron-cation pairs are generated is called an electron avalanche. With respect to the gas having an average free path length of electrons, the electrons in the acceleration do not collide with the gas molecules in the middle, and are accelerated to a high energy state. Therefore, the gas having a longer average free path with respect to electrons is more likely to cause electron avalanche in a lower electric field than air, and can be neutralized before a large voltage is accumulated in the mold 100.

Further, since the gas for removing electricity is generally highly diffusible, when the imprint material is filled in the pattern portion 160, it can be used as a purge gas for the imprint space. Here, the voltage of the charging portion 171 in the case where the electrification portion 171 passing through the cleaning member 170 generates an electric field between the peripheral members 113 and performs the cleaning treatment on the peripheral member 113 is discussed. When the gas for electric power enters the gap between the charging portion 171 to which the voltage is applied and the peripheral member 113, and causes electron avalanche, a large amount of electrons or cations are supplied to the surface of the charging portion 171, so that the voltage of the charging portion 171 is lowered, and the cleaning effect is reduced. Therefore, the voltage of the charging unit 171 needs to be set such that the electric field intensity generated between the charging unit 171 and the peripheral member 113 becomes equal to or lower than the electric field intensity caused by the discharge gas. Therefore, the voltage control unit 172 that controls the voltage applied to the charging unit 171 can be provided. The voltage control unit 172 sets the voltage applied to the charging unit 171 so that the electric field intensity generated between the charging unit 171 and the peripheral member 113 becomes equal to or lower than the electric field intensity caused by the discharge gas. Whether or not an electron avalanche is caused between the charging portion 171 and the peripheral member 113 depends on the electric field strength and the static elimination. The type of the gas is used, and the value of the voltage applied to the charging unit 171 may be determined depending on the distance between the charging unit 171 and the peripheral member 113 and the type of the gas for removing electricity. In other words, the value of the voltage applied to the charging unit 171 differs depending on the type of the gas for removing electricity, the distance between the charging portion 171 and the peripheral member 113, and the like.

The voltage of the mold 100 is passed through the gas for removing electricity, and is maintained at a voltage lower than the voltage caused by the gas for removing electricity after being separated from the cured imprint material. Therefore, the cleaning process of the peripheral member 113 is performed with the cleaning member 170 that sets the charging portion 171 to the above-described voltage, so that adhesion to the particles 150 of the mold 100 can be prevented.

Further, while the gas for removing electricity is not supplied from the purge gas supply unit 118, the voltage applied to the charging unit 171 may be set such that the electric field intensity generated between the charging unit 171 and the peripheral member 113 is higher than that of the gas for removing electricity. And the value of the electric field strength causing the discharge is high. For example, during the period in which the imprint process is not performed, the charging unit 171 may be set to have a higher voltage than the imprint process, and the cleaning process may be performed. In the imprinting process, the voltage of the charging unit 171 can also be increased to improve the cleaning effect while the gas for removing electricity is not supplied.

The present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the spirit and scope of the invention. Therefore, in order to disclose the scope of the present invention, the following claims are attached.

101‧‧‧Substrate

102‧‧‧Substrate fixture

113‧‧‧ Peripheral members

119‧‧‧ Keeping Department

150‧‧‧ granules

170‧‧‧Clean members

1021‧‧‧Substrate holding area

Claims (29)

An embossing device for curing a embossed material in a state in which a mold is brought into contact with an embossed material on a substrate to form a pattern on the substrate, the embossing device comprising: a substrate holder having a substrate holding area for holding the substrate; a peripheral member disposed to be passed through a side surface of the substrate held by the substrate holder; and a control portion for controlling a cleaning process of cleaning at least a portion of the peripheral member by using a cleaning member including the charging portion; The cleaning process includes moving the cleaning member relative to the peripheral member in a state in which the charging portion and at least a portion of the peripheral member are opposed to each other, thereby adsorbing particles in the region. The operation of the charging unit. The imprint apparatus according to claim 1, wherein the relative movement of the charging unit with respect to the peripheral member includes an repetition of an operation unit including a direction parallel to the first direction. Relative movement and relative movement in the second direction intersecting the first direction. The imprint apparatus according to claim 1, wherein the path of the relative movement of the charging portion with respect to the peripheral member includes a plurality of loops surrounding the substrate holding region, and the plurality of loops The distances from the aforementioned substrate holding regions are different from each other. The imprint apparatus of claim 1, further comprising: a supply portion for supplying an imprint material on the substrate, and a mold driving for driving the mold In the mechanism, the mold driving mechanism is located in the first orientation when viewed from the supply unit, and the region includes the first orientation of the substrate that is held by the substrate holder. The side of the side faces the region on the side of the first orientation. The imprinting apparatus of claim 4, wherein the cleaning process is performed in a state where the imprint material is not present on the substrate, and the supply portion does not supply pressure to the substrate during the cleaning process. Printing materials. The imprinting apparatus according to claim 1, wherein the control unit issues a command to perform an imprint process in which the pattern is formed on the substrate by imprinting, and then performs the imprint process in response to the instruction. , performing the aforementioned cleaning process. The imprinting apparatus according to claim 1, wherein the peripheral member has a continuous portion having a smooth surface and a discontinuous portion having a non-smooth surface, and the control portion is configured to cause the electrification portion and the unit area per unit area. The total time of the discontinuity is opposite to the total length of time between the charging portion and the continuous portion per unit area. The imprint apparatus according to claim 1, further comprising: a mold jig for holding the mold; and a holding portion for holding the cleaning member, wherein the control unit is executed while the cleaning member is held by the holding portion The aforementioned cleaning treatment. The imprint apparatus of claim 1, wherein the cleaning process is performed in a state where the cleaning member is held by a mold jig that holds the mold. The imprint apparatus of claim 1, wherein a gap between the charging portion and the peripheral member in the cleaning process is a mold and a mold when the substrate is moved to supply an imprint material to the substrate. The gap between the peripheral members is small. The imprint apparatus according to claim 1, wherein the cleaning treatment is performed by setting a gap between the electrification portion and the peripheral member to 0.8 mm or less. The imprint apparatus of claim 1, wherein the electrification part comprises a charged dielectric member. The imprint apparatus of claim 1, wherein the electrification part comprises an electret. The imprint apparatus according to claim 1, wherein the electrification portion includes an electret that maintains a positive electric charge and an electret that retains a negative electric charge. The imprinting apparatus according to claim 1, wherein the control unit controls the substrate to be moved relative to the substrate holder while the substrate is not held by the substrate holder. The particles are adsorbed to the action of the charging unit. An operation method of an imprint apparatus that operates an imprint apparatus, wherein the imprint apparatus includes a substrate holder that holds a substrate and a side surface that surrounds a substrate that is held by the substrate holder The peripheral member configured to be configured to include a cleaning process for cleaning a region of at least a portion of the peripheral member using a cleaning member including a charging portion; and maintaining the substrate through the substrate holder a process of supplying an imprint material on a substrate, and curing the imprint material in a state in which the mold is brought into contact with the imprint material to form a pattern on the substrate; wherein the cleaning process is performed to cause the charging portion and the peripheral structure In a state where at least a part of the material is opposed to each other, the cleaning member is relatively moved with respect to the peripheral member, and the particles of the region are adsorbed to the charging portion. An article manufacturing method comprising: a program for forming a pattern on a substrate using an imprint apparatus as claimed in claim 1; and a program for processing a substrate on which the pattern is formed. An article manufacturing method comprising: a program for operating an imprint apparatus by an operation method of claim 16 of the patent application, a pattern for forming a pattern on a substrate by the imprint apparatus; and a program for processing a substrate on which the pattern is formed. The imprint apparatus of claim 1, wherein the cleaning member is disposed in such a manner that a mold is disposed between the dispenser that supplies the imprint material on the substrate and the cleaning member. The imprint apparatus according to claim 19, wherein the control unit is configured to provide the charging unit of the cleaning member as a belt Control for electrical or non-charged states. The imprint apparatus according to claim 20, wherein the control unit causes the charging unit to be in a charged state before the supply of the imprint material to the substrate through the dispenser. The imprint apparatus according to claim 19, wherein a width of the charging portion in a direction orthogonal to a direction in which the cleaning member and the distributor are arranged is larger than a width of a pattern region of the mold. The imprint apparatus according to claim 1, further comprising: a gas supply unit that supplies a gas for removing the mold; and a voltage control unit that controls a voltage applied to the charging unit. The imprinting apparatus according to claim 23, wherein the voltage control unit sets a voltage applied to the charging unit so that an electric field intensity generated between the charging unit and the peripheral member passes through the gas. The electric field strength causing the discharge is below. The imprint apparatus according to claim 24, wherein the voltage applied to the charging unit differs depending on a type of the gas or a distance between the charging unit and the peripheral member. The imprinting apparatus according to claim 23, wherein the gap between the mold and the imprinted material separated from the cured imprinted material is replaced by the gas to perform static elimination of the mold. The imprint apparatus of claim 23, wherein the gas comprises a gas having an average free path with respect to electrons longer than air. An imprint apparatus as claimed in claim 23, wherein the foregoing The gas system contains helium. The imprinting apparatus according to claim 23, wherein the voltage control unit sets a voltage applied to the charging unit to the charging unit and the peripheral structure while the gas supply unit is not supplying the gas. The electric field intensity generated between the materials is higher than the electric field strength caused by the gas passing through the gas.