JP2019067916A - Lithography apparatus and method of manufacturing article - Google Patents

Abstract

To provide a lithography apparatus that can reduce adhesion of particles to a mold or a substrate.SOLUTION: A lithography apparatus for forming a pattern formed on a mold on a substrate, includes: a mold holding unit for holding the mold; a mold transport unit for transporting the mold; a charging unit disposed around the mold holding unit and attracting particles by electrostatic force; and an attracting unit for attracting particles. The mold transport unit transports the attracting unit to a position facing the charging unit, and the attracting unit attracts particles separated from the charging unit at the position.SELECTED DRAWING: Figure 4

Description

  FIELD The present invention relates to a lithographic apparatus and a method of manufacturing an article.

  Demand for miniaturization of semiconductor devices and MEMS advances, and in addition to conventional photolithography technology, attention is focused on microfabrication technology for forming an imprint material on a substrate with a mold and forming a pattern of the imprint material on a substrate I'm collecting. This technique is also called imprint technique, and can form a fine structure of several nanometers on the substrate. For example, as one of the imprint techniques, there is a light curing method. In the imprint apparatus adopting this photo-curing method, first, a photo-curable imprint material is applied to a shot area which is an imprint area on the substrate. Next, while the pattern portion of the mold (original plate) and the shot area are aligned, the pattern portion of the mold and the imprint material are brought into contact (imprinting), and the imprint material is filled in the pattern portion. Then, light is irradiated to cure the imprint material, and then the pattern portion of the mold and the imprint material are separated to form a pattern of the imprint material in a shot area on the substrate.

  In the imprint apparatus, since a process of forming a minute structure on the substrate is performed, adhesion of particles to the mold or the substrate may cause a pattern defect, breakage of a pattern portion of the mold, or the like. In addition, the substrate and the mold are charged by bringing the pattern portion of the mold and the imprint material into contact with each other and separated, and particles adhering to the surface of the member or unit in the imprint apparatus may adhere to the mold or the substrate. .

  Patent Document 1 discloses a configuration in which a foreign matter capture area is set on the upstream side of the transport direction of the substrate with respect to the area having the pattern portion of the mold to capture particles. The foreign matter trapping area is charged by bringing the foreign matter trapping area into contact with or peeling off the charge generation member. The foreign matter trapping region sucks particles present in the space and particles attached to the substrate.

JP, 2014-175340, A

  In Patent Document 1, particles attracted to the foreign matter trapping region may be detached from the foreign matter trapping region due to external stimuli such as vibration or air flow, and the detached particles may be attached to the pattern portion of the mold, the surface of the substrate, or the like.

  SUMMARY OF THE INVENTION It is an object of the present invention to provide a lithographic apparatus that can reduce the adhesion of particles to a mold or substrate.

  A lithographic apparatus according to one aspect of the present invention for solving the above-mentioned problems is a lithographic apparatus for forming a pattern formed on a mold on a substrate, comprising: a mold holding unit for holding the mold; A charging unit that is disposed around the mold holding unit and that adsorbs particles by electrostatic force; and an adsorption unit that adsorbs particles, and the mold conveyance unit faces the adsorption unit to the charging unit. The adsorption unit adsorbs the particles separated from the charging unit at the position.

  According to the present invention, it is possible to provide a lithographic apparatus capable of reducing the adhesion of particles to a mold or a substrate.

It is the figure which showed the imprint apparatus. FIG. 6 is a diagram showing a power supply for applying a voltage to a charging unit. FIG. 5 is a diagram showing a voltage applied to a charging unit. It is the figure which showed the type | mold conveyance part provided with the adsorption | suction part. It is a figure which shows a charging part, a power supply, an adsorption | suction part etc. FIG. 6 is a diagram showing a voltage applied to the charging unit at the time of cleaning of the charging unit. It is the flowchart which showed the imprint process and the cleaning process. It is a figure which shows a charging part, a 2nd power supply, an adsorption | suction part etc. FIG. It is the figure which showed the voltage applied to an adsorption part. It is the figure which showed the voltage of the square wave. It is the figure which showed the voltage of the sine wave. It is the figure which showed the voltage of the triangular wave. It is a figure for demonstrating the manufacturing method of articles | goods.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments, an example using an imprint apparatus as a lithography apparatus will be described. In the drawings, the same members are denoted by the same reference numerals, and redundant description will be omitted.

  FIG. 1 is a view showing an imprint apparatus. First, a typical configuration of the imprint apparatus will be described with reference to FIG. The imprint apparatus 10 brings the imprint material supplied on the substrate 101 into contact with the mold 100 and applies energy for curing to the imprint material, thereby a pattern of a cured product to which the concavo-convex pattern of the mold 100 is transferred. Are devices that form

  Here, as the imprint material, a curable composition (sometimes referred to as an uncured resin) which is cured by receiving energy for curing is used. As energy for curing, electromagnetic waves, heat, etc. are used. Examples of the electromagnetic wave include light such as infrared light, visible light, and ultraviolet light whose wavelength is selected from the range of 150 nm to 1 mm.

  The curable composition is a composition which is cured by irradiation of light or by heating. Among these, the photocurable composition which is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a nonpolymerizable compound or a solvent as required. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component and the like.

  The imprint material is applied in the form of a film on a substrate by a spin coater or a slit coater. Alternatively, the liquid jet head may apply droplets or in the form of islands or films formed by connecting a plurality of droplets onto the substrate. The viscosity (the viscosity at 25 ° C.) of the imprint material is, for example, 1 mPa · s or more and 100 mPa · s or less.

  Glass, ceramics, metals, resins, etc. are used for the substrate, and if necessary, a member made of a material different from the substrate may be formed on the surface. Specific examples of the substrate include a silicon wafer, a compound semiconductor wafer, and a glass wafer containing quartz as a material.

  The mold has a rectangular outer peripheral shape, and has a pattern portion provided with a three-dimensionally formed pattern (an uneven pattern to be transferred to the substrate 101 such as a circuit pattern) on the surface (pattern surface) facing the substrate . The mold is made of a material capable of transmitting light, such as quartz.

  In the present embodiment, the imprint apparatus 10 is described as adopting a photo-curing method in which the imprint material is cured by light irradiation. Furthermore, in the following, a direction parallel to the optical axis of light to be applied to the imprint material on the substrate is taken as the Z-axis direction, and two directions orthogonal to each other in a plane perpendicular to the Z-axis direction are the X-axis direction and Y Axial direction.

  The imprint apparatus 10 can include a liquid supply unit 111. The liquid supply unit 111 supplies the imprint material onto the substrate 101 based on supply amount information set in advance. In addition, the supply amount (that is, supply amount information) of the imprint material supplied from the liquid supply unit 111 is, for example, the thickness of the pattern of the imprint material formed on the substrate 101 (the thickness of the residual film) It is set according to the density of the pattern of the printing material and the like.

  The imprint apparatus 10 can include a substrate drive unit SDM that positions the substrate 101. The substrate driving unit SDM can include, for example, a substrate holding unit 160, a fine adjustment mechanism 114, a coarse adjustment mechanism 115, and a base structure 116. The substrate holding unit 160 includes a substrate suction unit 102 that suctions the substrate 101 and a substrate peripheral unit 113 disposed around the substrate suction unit 102. The substrate suction unit 102 sucks the substrate 101 by, for example, a method such as vacuum suction or electrostatic suction. The substrate peripheral portion 113 is disposed around the area where the substrate 101 is disposed. The substrate suction portion 102 and the substrate peripheral portion 113 are electrically connected and can be maintained at the same voltage (potential).

  The fine adjustment mechanism 114 is a mechanism for finely driving the substrate 101 by finely driving the substrate holding unit 160. The coarse movement mechanism 115 is a mechanism that roughly drives the fine movement mechanism 114 to roughly drive the substrate 101. The base structure 116 supports the coarse movement mechanism 115, the fine movement mechanism 114, and the substrate holding unit 160. The substrate drive unit SDM can be configured to drive the substrate 101 about a plurality of axes (for example, three axes of the X axis, the Y axis, and the θZ axis). The position of a portion (a fine movement stage) integrated with the substrate holding unit 160 in the fine movement mechanism 114 is measured by a measuring instrument 117 such as an interferometer.

  The imprint apparatus 10 includes a mold driving unit MDM for positioning the mold 100, and the mold driving unit MDM may include a mold suction unit 110 (mold holding unit), a mold driving mechanism (not shown), and a mold peripheral portion 161. The mold peripheral portion 161 is arranged around the area in which the mold 100 is arranged. The mold drive MDM may be supported by a support structure 108. The mold suction unit 110 can hold the mold 100 by suction (for example, vacuum suction, electrostatic suction) or mechanical means. The mold driving mechanism drives the mold 100 by driving the mold suction unit 110. For example, the mold driving unit MDM can be configured to drive the mold 100 about a plurality of axes (for example, six axes of X axis, Y axis, Z axis, θX axis, θY axis, θZ axis).

  The imprint apparatus 10 can include a curing unit 104 that cures the imprint material by irradiating the imprint material on the substrate 101 with light such as UV light. The imprint apparatus 10 can also include a camera 103 for observing the state of imprint. The light emitted from the curing unit 104 can be reflected by the mirror 105, transmitted through the mold 100, and applied to the imprint material. The camera 103 can be configured to observe the state of imprinting through the mold 100 and the mirror 105, for example, the contact state between the imprint material and the mold 100.

  The imprint apparatus 10 can include alignment scopes 107 a and 107 b for detecting the relative position of the mark of the substrate 101 and the mark of the mold 100. The alignment scopes 107 a, 107 b may be disposed on the upper structure 106 supported by the support structure 108. The imprint apparatus 10 can include an off-axis scope 112 for detecting the positions of a plurality of marks on the substrate 101. Off-axis scope 112 may be supported by support structure 108.

  The imprint apparatus 10 can include one or more air supply units 118. The air supply unit 118 may be disposed around the die suction unit 110 so as to surround the die suction unit 110. The air supply unit 118 forms an air curtain by supplying air to the space between the substrate 101 and the mold 100. The air curtain suppresses the penetration of particles into the space between the substrate 101 and the mold 100. The air supply 118 may be supported by the support structure 108, for example.

  The imprint apparatus 10 can include a control unit 127. The control unit 127 is configured by a computer including a CPU, a memory, and the like, and controls the entire imprint apparatus 10 in accordance with a program stored in the memory. Further, the control unit 127 controls an imprint process of forming a pattern on the substrate 101 by controlling the operation, adjustment, and the like of each unit of the imprint apparatus 10. In addition, the control unit 127 may be configured integrally with other parts of the imprint apparatus 10 (within a common housing), or separately from other parts of the imprint apparatus 10 (in a separate housing) ) May be configured. Further, the control unit 127 may be configured to include a plurality of computers.

  The imprint apparatus 10 can include a charging unit 109 capable of generating an electric field between itself and the substrate peripheral portion 113 by applying a voltage. The charging portion 109 is disposed on the lower surface of the mold peripheral portion 161. Thus, the charging unit 109 faces the substrate peripheral portion 113. The imprint apparatus 10 can also include a power source 130 (first power source) described later for applying a voltage to the charging unit 109. In addition, the control unit 127 can control the voltage that the power supply 130 applies to the charging unit 109. In addition, the charging unit 109 is disposed such that the lower surface of the charging unit 109 has substantially the same height as the surface of the mold suction unit 110 that holds the mold. The electrodes of the charging unit 109 are made of a conductor such as copper foil, and the surface of the charging unit 109 is covered with a film of an insulator such as polyimide in order to suppress discharge or the like when a high voltage is applied.

  Here, in the imprint apparatus 10, particles 150 may be generated due to mutual friction between mechanical elements such as a drive unit, friction between the mechanical elements and the substrate 101 or the mold 100, or the like. The particles 150 may adhere to the surfaces of members such as the substrate peripheral portion 113 and the mold peripheral portion 161. In particular, the particles 150 are likely to adhere to the substrate peripheral portion 113 located below the mold peripheral portion 161. The particles 150 have various particle sizes, shapes, materials, and the like. Therefore, the adhesion of the particles 150 to the upper surface of the substrate peripheral portion 113 also varies. The particles 150 having weak adhesion to the upper surface of the substrate peripheral portion 113 can be easily detached from the upper surface of the substrate peripheral portion 113 by external stimulation (vibration, air flow, static electricity) or the like.

  Since the mold 100 can be charged through the imprint process, an electric field can be formed between the substrate perimeter 113 and the mold 100. The electrostatic force acts on the particles 150 on the substrate peripheral portion 113 by the electric field. Therefore, the particles 150 attached to the upper surface of the substrate peripheral portion 113 with weak adhesion may be detached from the upper surface of the substrate peripheral portion 113 and attached to the mold 100 or attached to the substrate 101. For this reason, it may become a cause of a pattern defect, a damage of the pattern part of a type | mold, etc.

  Therefore, a voltage is applied to the charging unit 109 in order to adsorb the particles 150 to the charging unit 109 by electrostatic force. The charging unit 109 and the power source 130 will be described with reference to FIG. FIG. 2 is a diagram showing a power supply 130 for applying a voltage to the charging unit 109. As shown in FIG. The imprint apparatus 10 can include a power supply 130 that applies a voltage between the substrate peripheral portion 113 and the charging unit 109. In the example shown in FIG. 2, the substrate peripheral portion 113 is grounded, and a voltage is applied to the charging portion 109 from the power source 130. Further, although in the example of FIG. 2 the potential of the substrate peripheral portion 113 is the ground potential, a voltage may be applied to the substrate peripheral portion 113 so as to be a potential different from the ground potential.

  For example, when the mold 100 is negatively charged with respect to the ground potential during the imprint process, an electric field E0 is generated in the + Z-axis direction in the space between the mold 100 and the substrate peripheral portion 113. Therefore, a negative voltage is applied to the charging unit 109 by the power supply 130 to generate an electric field E1 in the + Z-axis direction. By charging the charging portion 109 so that the electric field E1 is larger than the electric field E0, the particles 150 attached to the upper surface of the substrate peripheral portion 113 with weak adhesion can be adsorbed by the charging portion 109. When the particles 150 enter and float in the space between the mold driving unit MDM and the substrate driving unit SDM, the particles 150 may be attracted to the charging unit 109. Since the surface of the charging unit 109 is covered with a film of an insulator such as polyimide, the charge of the particles 150 attached to the charging unit 109 can be held.

  Further, although the charging unit 109 is disposed on the left side of the die suction unit 110 in the example of FIG. 2, the charging unit 109 may be disposed on the right side or both sides of the die suction unit 110. Further, the charging portion 109 may be disposed on the entire surface of the mold peripheral portion 161. When the area of the charging unit 109 is smaller than that of the substrate peripheral portion 113, the substrate driving unit SDM may be driven to pass the entire surface of the substrate peripheral portion 113 below the charging unit 109. As a result, the particles 150 can be attracted by the charging unit 109 over the entire surface of the substrate peripheral portion 113.

  Next, the voltage applied to the charging unit 109 will be described with reference to FIG. FIG. 3 is a diagram showing a voltage applied to the charging unit 109. As shown in FIG. In order to cause the particles 150 to be attracted to the charging portion 109, it is necessary to make the electric field E1 between the charging portion 109 and the substrate peripheral portion 113 larger than the electric field E0 between the mold 100 and the substrate peripheral portion 113 as described above. is there. Therefore, for example, when the voltage V 0 of the mold 100 is −3 kV, the voltage V 1 of −3 kV or less is applied to the charging unit 109. Thus, the polarity (first polarity) of the voltage V0 of the mold 100 charged and the voltage V1 applied to the charging portion 109 is the same, and the absolute value of the voltage V1 applied to the charging portion 109 is charged. It is necessary to make the absolute value of the voltage V0 of the mold 100 larger than the absolute value. The voltage V0 of the mold 100 may be measured by providing a voltage measurement unit (not shown) in the imprint apparatus 10, or may be obtained in advance by experiment, simulation or the like.

  Here, in a state where particles 150 are attached by applying a voltage to the charging unit 109, if the particles 150 receive an external stimulus (vibration, air flow, static electricity), the particles 150 may separate from the charging unit 109. Then, the separated particles 150 may adhere to the mold 100 or adhere to the substrate 101. Therefore, the imprint apparatus 10 can include an adsorption unit that adsorbs the particles 150 separated from the charging unit 109.

  Here, the return type conveyance unit 301 will be described with reference to FIG. The imprint apparatus 10 can include a die conveyance unit 301 that carries the die 100 into and out of the die suction unit 110. The die conveyance unit 301 can include an arm drive unit (not shown), an arm unit 302 driven by the arm drive unit, and a hand unit 303 attached to the arm unit 302 and holding the die 100. In addition, the control unit 127 can control the mold conveyance unit 301 to cause the mold conveyance unit 301 to convey the mold 100. The arm driving unit can convey the mold 100 by rotationally driving the arm unit 302 along the XY plane and linearly driving in the Z-axis direction. The arm unit 302 and the hand unit 303 may be integrally configured.

  Here, when the mold conveyance unit 301 carries the mold 100 into the mold suction unit 110, the arm drive unit drives the arm unit 302 in a state where the hand unit 303 holds the mold 100. As a result, the mold 100 is moved to a position where the mold 100 held by the hand unit 303 and the mold suction unit 110 face each other. Then, the die suction unit 110 or the hand unit 303 is moved in the Z-axis direction to a position where the die suction unit 110 and the die 100 contact, and the die suction unit 110 holds the die 100. Further, when the mold conveyance unit 301 carries the mold 100 out of the mold suction unit 110, the hand unit 303 moves to a position where the hand unit 303 and the mold 100 face each other with the mold suction unit 110 holding the mold 100. Then, the die suction unit 110 or the hand unit 303 moves in the Z-axis direction, and the hand unit 303 holds the die 100.

  In addition, the die conveyance unit 301 can include an adsorption unit 162 that adsorbs the particles 150 attached to the charging unit 109. Here, with reference to FIG. 4, the mold conveyance unit 301 provided with the suction unit 162 will be described. FIG. 4 is a view showing a die transfer unit 301 provided with a suction unit 162. As shown in FIG. When the arm drive unit drives the arm unit 302, the hand unit 303 moves to a position where the hand unit 303 and the mold suction unit 110 face each other. At that time, the suction unit 162 is attached to the arm unit 302 so that the suction unit 162 moves to a position where the suction unit 162 and the charging unit 109 face each other. Further, although in the present embodiment, the arm driving unit rotationally drives the arm 302 along the XY plane, the arm driving unit may linearly drive the arm 302 along the XY plane. In addition, the suction unit 162 may be removable from the mold conveyance unit 301.

  Next, cleaning of the charging unit 109 by the suction unit 162 will be described with reference to FIG. FIG. 5 is a view showing the charging unit 109, the power supply 130, the suction unit 162, and the like. The power source 130 can adjust the magnitude (absolute value) of the voltage applied to the charging unit 109. Also, the power supply 130 can switch the polarity of the voltage applied to the charging unit 109. Further, FIG. 5 shows a state where the mold 100 held by the hand unit 303 and the mold suction unit 110 face each other when the mold conveyance unit 301 carries the mold 100 into the mold suction unit 110. Further, in this state, the suction unit 162 is at a position facing the charging unit 109. Here, the adsorbing portion 162 is formed of a conductor held at the ground potential of the imprint apparatus 10, and the surface thereof is covered with a film of an insulator such as polyimide. Thus, the suction unit 162 holds the ground potential.

  With the mold 100 at a position facing the mold suction unit 110, the mold suction unit 110 or the hand unit 303 moves in the Z-axis direction, and the mold suction unit 110 holds the mold 100. Here, in a state where the mold suction unit 110 and the mold 100 are in contact with each other, the suction unit 162 and the charging unit 109 are configured such that the suction unit 162 and the charging unit 109 are spaced apart from each other. In this state, a voltage having a second polarity opposite to the first polarity of the voltage applied to cause the particles 150 to be adsorbed to the charging unit 109 is applied to the charging unit 109 by the power supply 130. For example, when a negative voltage is applied to cause the particles 150 to be attracted to the charging unit 109, as shown in FIG. 6, a positive voltage V1 having a negative opposite polarity to the charging unit 109 is applied to the charging unit 109. . As a result, a repulsive force is generated between the particles 150 held in the positive charge and adsorbed to the charging unit 109 and the charging unit 109, and the particles 150 are separated from the charging unit 109. Then, since the electric field E is generated in the −Z-axis direction between the adsorption portion 162 and the charging portion 109 held at the ground potential, the particles 150 holding the positive charge are in the −Z-axis direction. It moves and adsorbs to the adsorption unit 162. Then, after the transfer of the mold 100 is completed, the arm driving unit drives the arm unit 302 to retract the suction unit 162 having the particles 150 suctioned from the position facing the charging unit 109. As described above, it is possible to adsorb the particles 150 detached from the charging unit 109 during conveyance of the mold 100 to clean the charging unit 109.

  Moreover, in order to adsorb | suck the particle 150 more firmly to the surface of the adsorption | suction part 162, you may be covered with the adhesive material (adhesive material). In this case, the charging unit 109 and the suction unit 162 may be configured such that the lower surface of the charging unit 109 and the upper surface of the suction unit 162 are in contact with each other when the mold suction unit 110 and the mold 100 are in contact. As a result, the particles 150 can be more easily adsorbed to the adsorbing portion 162.

  Next, imprint processing and cleaning processing will be described using FIG. 7. FIG. 7 is a flowchart showing imprint processing and cleaning processing. When the imprint process is started, in step 201, the mold transport unit 301 carries the mold 100 into the mold suction unit 110. Further, at a position where the adsorbing portion 162 and the charging portion 109 face each other, a voltage of a second polarity having a polarity opposite to the first polarity of the voltage applied for causing the charging portion 109 to adsorb the particles 150 is applied. Thereby, the particles 150 adsorbed to the charging unit 109 are adsorbed to the adsorption unit 162. Then, the die conveyance unit 301 retracts to a position where there is no problem in the imprint process. Specifically, the die conveyance unit 301 retracts to a position where the die conveyance unit 301 does not interfere with the die drive unit MDM and the substrate drive unit SDM. Then, a voltage of the first polarity is applied to the charging unit 109.

  In step 202, the substrate 101 is carried into the substrate holding unit 160. The transferred substrate 101 is held by the substrate suction unit 102. In step 203, the substrate driving unit SDM moves the substrate 101 under the liquid supply unit 111, and the liquid supply unit 111 supplies the imprint material onto the substrate 101. In step 204, the mold driving unit MDM moves the mold 100 to bring the mold 100 into contact (imprinting) with the imprint material on the substrate 101. Then, the curing unit 104 irradiates the imprint material with light to cure the imprint material. Then, when the mold driving unit MDM moves the mold 100, the mold 100 and the imprint material on the substrate 101 are separated (mold release). In step 205, the substrate 101 is unloaded from the substrate holding unit 160. In step 206, the control unit 127 determines whether the imprint process has been completed for a predetermined number of substrates 101. If not completed, the process returns to step 202. If it is completed, the process proceeds to step 207.

  At step 207, the mold 100 is carried out of the mold suction unit 110 by the mold conveyance unit 301. Further, a voltage of the second polarity is applied to the charging unit 109 at a position where the attraction unit 162 and the charging unit 109 face each other. Thereby, the particles 150 adsorbed to the charging unit 109 are adsorbed to the adsorption unit 162. Then, the die conveyance unit 301 retracts to a position where there is no problem in the imprint process. Then, the first voltage is applied to the charging unit 109.

  Here, the cleaning of the charging unit 109 may be performed by applying a voltage of the second polarity to the suction unit 162 in either step 201 or step 207. In addition, while the mold conveyance unit 301 conveys the mold 100, the suction unit 162 may be conveyed to a position facing the charging unit 109 to clean the charging unit 109. In this case, the movement of the suction unit 162 may be stopped at a position facing the charging unit 109 to clean the charging unit 109, or the cleaning of the charging unit 109 may be performed while the suction unit 162 moves. . In addition, the charging unit 109 may be cleaned during maintenance as well as during transportation of the mold 100. In addition, when cleaning is performed at the time of maintenance, the conveyance of the mold 100 may not be required.

  As described above, the imprint apparatus according to the present embodiment can reduce the adhesion of particles to the mold or the substrate. In addition, since particles detached from the charging unit can be adsorbed during the transport of the mold, it is not necessary to interrupt the imprint process to clean the charging unit, and the reduction in throughput can be reduced.

  An imprint apparatus according to a second embodiment will be described. In addition, the matter which is not mentioned here can follow the description of Example 1. FIG. 8 is a view showing the charging unit 109, the power supply 163 (second power supply), the adsorption unit 162 and the like. The difference of the first embodiment from FIG. 5 is that a power supply 163 for applying a voltage to the suction unit 162 is configured. The power source 163 can apply a voltage to the adsorption unit 162. In addition, the power supply 163 can adjust the magnitude of the voltage applied to the adsorption unit 162 and switch the polarity of the voltage. With the adsorbing portion 162 facing the charging portion 109, the power supply 163 generates a voltage of a first polarity opposite to the second polarity of the voltage applied to separate the particles 150 from the charging portion 109. The pressure is applied to the suction unit 162. For example, as shown in FIG. 9, when a positive voltage is applied to separate the particles 150 from the charging unit 109, a negative voltage V 2 is applied to the adsorption unit 162.

  Here, if the polarity of the voltage of the mold 100 is the first polarity, the particles 150 may be attracted to the mold 100. Therefore, the power supply 163 may adjust the voltage applied to the adsorption portion 162 so that the absolute value of the voltage V2 is larger than the absolute value of the voltage V0 of the mold 100. As a result, since the attraction portion 162 attracts the particles 150 more than the attraction force of the particles 150 to the mold 100, the adhesion of the particles 150 separated from the charging portion 109 to the mold 100 can be reduced.

  As described above, the imprint apparatus according to the present embodiment can reduce the adhesion of particles to the mold or the substrate. In addition, since particles detached from the charging unit can be adsorbed during the transport of the mold, it is not necessary to interrupt the imprint process to clean the charging unit, and the reduction in throughput can be reduced. In addition, by applying a voltage to the adsorption unit to attract the particles attached to the charging unit, the particles can be easily adsorbed from the charging unit.

  An imprint apparatus according to a third embodiment will be described. In addition, the matter which is not mentioned here can follow the description of Example 1. In the first embodiment, the voltage applied to the charging unit 109 to separate the particles 150 from the charging unit 109 is a DC voltage as shown in FIG. On the other hand, in the present embodiment, the voltage applied to the charging unit 109 is an alternating voltage. In FIG. 10, an example in which a rectangular wave is used as the waveform of the voltage applied to the charging unit 109 is shown. The waveform of the voltage applied to the charging unit 109 shown in FIG. 10 is a rectangular wave that fluctuates in the range of 0 (V) to V1 (V) every ΔT (seconds). Further, FIG. 11 shows an example in which a sine wave is used as the waveform of the voltage applied to the charging unit 109. The waveform of the voltage applied to the charging unit 109 shown in FIG. 11 is a sine wave that fluctuates in the range of 0 (V) to V1 (V) every 2ΔT (seconds). Further, FIG. 12 shows an example in which a triangular wave is used as the waveform of the voltage applied to the charging unit 109. The waveform of the voltage applied to the charging unit 109 shown in FIG. 12 is a triangular wave that fluctuates in the range of 0 (V) to V1 (V) every ΔT (seconds). In addition, although an example of a rectangular wave, a sine wave, and a triangular wave has been described as the waveform of the voltage applied to the charging unit 109, the waveform of the voltage applied to the charging unit 109 includes an alternating current component whose voltage fluctuates with time. It may be a waveform of voltage.

  As described above, the imprint apparatus according to the present embodiment can reduce the adhesion of particles to the mold or the substrate. In addition, since particles detached from the charging unit can be adsorbed during the transport of the mold, it is not necessary to interrupt the imprint process to clean the charging unit, and the reduction in throughput can be reduced. Further, by varying the voltage applied to the charging unit, it is possible to apply vibration to the particles adsorbed to the charging unit, and the particles can be easily adsorbed from the charging unit.

(Product manufacturing method)
The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles or temporarily for manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. The mold may, for example, be a mold for imprinting.

  The pattern of the cured product is used as it is as a component member of at least a part of the article or temporarily used as a resist mask. After etching, ion implantation, or the like is performed in the substrate processing step, the resist mask is removed.

  Next, a specific method of manufacturing an article will be described. As shown in FIG. 13 (a), a substrate 1z such as a silicon substrate or the like on which the workpiece 2z such as an insulator is formed is prepared, and subsequently, the surface of the workpiece 2z is exposed by the inkjet method or the like. Apply the printing material 3z. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto a substrate is shown.

  As shown in FIG. 13B, the mold 4z for imprint is faced with the side on which the concavo-convex pattern is formed facing the imprint material 3z on the substrate. As shown in FIG. 13C, the substrate 1z provided with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the imprint material 3z is cured.

  As shown in FIG. 13D, after the imprint material 3z is cured, when the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. In the pattern of the cured product, the concave portions of the mold correspond to the convex portions of the cured product, and the concave portions of the mold correspond to the convex portions of the cured product, that is, the uneven pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

  As shown in FIG. 13 (e), when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the workpiece 2z which has no cured material or remains thin is removed, and the groove 5z is removed. Become. As shown in FIG. 13F, when the pattern of the cured product is removed, it is possible to obtain an article having grooves 5z formed on the surface of the workpiece 2z. Although the pattern of the cured product is removed here, it may be used, for example, as a film for interlayer insulation included in a semiconductor element or the like, that is, as a component of an article without removing it even after processing.

  Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the present invention. Although an imprint apparatus for forming a pattern on a substrate by molding an imprint material on a substrate with a mold has been described as an example of the lithography apparatus, the present invention is not limited to the imprint apparatus.

  As an example of the lithography apparatus, an apparatus such as a drawing apparatus which forms a pattern on a substrate by drawing on a substrate with a charged particle beam (electron beam, ion beam or the like) via a charged particle optical system may be used. In addition, as an example of the lithography apparatus, an exposure apparatus that performs pattern formation by exposing a substrate may be used. In addition, in the manufacture of an article such as a device, such as a coating device for coating a photosensitive medium on the surface of a substrate, a developing device for developing a substrate on which a pattern is transferred, steps performed by devices such as the above-described imprint device The manufacturing apparatus which implements the process other than can also be included.

  The first to third embodiments can be performed not only independently but also in a combination of at least two of the first to third embodiments.

Claims (11)

A lithographic apparatus for forming a pattern formed on a mold on a substrate, comprising:
A mold holding unit that holds the mold;
A mold transport unit for transporting the mold;
A charging unit disposed around the mold holding unit and adsorbing particles by electrostatic force;
And an adsorption unit for adsorbing particles;
The lithography apparatus, wherein the mold transport unit transports the adsorption unit to a position facing the charging unit, and the adsorption unit adsorbs particles separated from the charging unit at the position. The lithographic apparatus of claim 1, wherein the suction unit is attached to the mold carrier. The said type | mold conveyance part has the hand part holding the said type | mold, and the arm part to which the said hand part was attached, The said adsorption | suction part is attached to the said arm part, It is characterized by the above-mentioned. A lithographic apparatus according to item 2. The apparatus according to any one of claims 1 to 3, wherein the suction unit is at a position facing the charging unit in a state where the mold transported by the mold transport unit and the mold holding unit are in contact with each other. Lithographic apparatus according to item 1. The charging unit has a first power supply that applies a voltage, and when the charging unit adsorbs particles, the first power supply applies a voltage of a first polarity to the charging unit, and the adsorption unit adsorbs particles. 5. The charging device according to claim 1, wherein the first power supply applies a voltage of a second polarity, which is opposite to the first polarity, to the charging unit. 5. Lithographic apparatus as described. A second power supply for applying a voltage to the adsorption unit, wherein the second power supply applies a voltage of the first polarity to the adsorption unit when the adsorption unit adsorbs particles. 6. A lithographic apparatus according to item 5.   The polarity of the voltage of the said type | mold is said 1st polarity, The absolute value of the voltage which the said 2nd power supply applies to the said adsorption part is characterized by being larger than the absolute value of the voltage of the said type | mold. Lithographic apparatus.   The lithography apparatus according to claim 6, wherein the voltage applied to the adsorption unit by the second power source includes an alternating current component.   The lithography apparatus according to any one of claims 1 to 8, wherein the adsorption unit includes an adhesive that adsorbs particles.   The lithography apparatus according to any one of claims 1 to 9, wherein a surface of the suction unit is covered with an insulator. Forming a pattern on a substrate using a lithographic apparatus according to any of the preceding claims.
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article, comprising producing an article using the treated substrate.

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