TWI679728B - 調整移動晶片設備的方法及該移動晶片設備 - Google Patents

調整移動晶片設備的方法及該移動晶片設備 Download PDF

Info

Publication number
TWI679728B
TWI679728B TW107143957A TW107143957A TWI679728B TW I679728 B TWI679728 B TW I679728B TW 107143957 A TW107143957 A TW 107143957A TW 107143957 A TW107143957 A TW 107143957A TW I679728 B TWI679728 B TW I679728B
Authority
TW
Taiwan
Prior art keywords
wafer
adjusting
mobile
force
fixed machine
Prior art date
Application number
TW107143957A
Other languages
English (en)
Other versions
TW202022982A (zh
Inventor
宋政宏
Cheng-Hung Song
曾生斗
Sheng-Tou Tseng
陳炳谷
Ping-Ku Chen
林家緯
Chia-Wei Lin
劉金城
Chin-Cheng Liu
曾仁棟
Jentung Tseng
莊木謹
Mu-Chin Chuang
徐坤基
Kun-Chi Hsu
巫勤達
Chin-Ta Wu
Original Assignee
力成科技股份有限公司
Powertech Technology Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 力成科技股份有限公司, Powertech Technology Inc. filed Critical 力成科技股份有限公司
Priority to TW107143957A priority Critical patent/TWI679728B/zh
Priority to CN201811546120.6A priority patent/CN111293064A/zh
Priority to KR1020180167708A priority patent/KR102136937B1/ko
Priority to JP2019008247A priority patent/JP6722783B2/ja
Application granted granted Critical
Publication of TWI679728B publication Critical patent/TWI679728B/zh
Publication of TW202022982A publication Critical patent/TW202022982A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Manipulator (AREA)

Abstract

本發明為一種調整移動晶片設備的方法及該移動晶片設備，其設置荷重感測器於機械手臂上。由荷重感測器可獲得晶片在被移動離開固定機台的過程中的力量與時間圖，並透過該力量與時間圖調整移動晶片設備上的零件。藉此可找出最適合用來將各種晶片移動脫離固定機台的零件及參數的組合，進而避免批量製造時，晶片在被移動離開固定機台的過程中產生異常或毀損。

Description

調整移動晶片設備的方法及該移動晶片設備
本發明主要為一種調整移動晶片設備的方法及該移動晶片設備，係關於一種用以移動晶片的設備，及量測移動晶片過程中之受力進而調整的方法。
在半導體製程中，會需要將晶片在機台之間移動，在某些製程中，會採用吸嘴吸取晶片，配合機台上的頂針推頂晶片，來將晶片由固定用的黏晶膠上剝離，進而移動至下一處。
然而，在吸嘴吸取、頂針推頂、以及剝離黏晶膠的動作中，均會各自產生一定的力施加於晶片上，若該些施力無法平衡，則容易因應力分佈不均，而造成晶片的部份區域受到較大應力，進而產生超出預期的形變，如此將導致晶片異常或毀損。
有鑑於此，本發明係創作一種調整移動晶片設備的方法及該移動晶片設備，以在移動晶片時，同時量測其表面受力，進而針對不同受力加以改善。
為達到前述之發明目的，本發明提供一種調整移動晶片設備的方法，該移動晶片設備包含一固定機台以及一機械手臂，該固定機台上設有一固定件，該固定機台內設有一推抵件，且該機械手臂末端固定有一持取裝置，其中該機械手臂設有一荷重感測器，該方法包括以下步驟：(a)提供一晶片，該晶片透過該固定件暫時固定於該固定機台上；(b)以該機械手臂的該持取裝置持取該晶片，且該推抵件推抵該晶片，使該晶片脫離該固定件而移離該固定機台；(c)由該荷重感測器獲得該晶片由該固定件脫離該固定機台的脫離過程中的一第一力量與時間圖；(d)根據該第一力量與時間圖的曲線平滑程度，調整該移動晶片設備的零件。
再一方面，本發明提供另一種調整移動晶片設備的方法，該移動晶片設備包含一固定機台以及一機械手臂，該固定機台上設有一固定件，該固定機台內設有一推抵件，且該機械手臂末端固定有一持取裝置，其中該機械手臂設有一荷重感測器，該方法包括以下步驟：(a)提供一晶片，該晶片透過該固定件暫時固定於該固定機台上；(b)以該機械手臂的該持取裝置持取該晶片，且該推抵件推抵該晶片，使該晶片脫離該固定件而移離該固定機台；(c)由該荷重感測器獲得該晶片由該固定件脫離該固定機台的脫離過程中的一第一力量與時間圖；(d)調整該移動晶片設備的零件，再重新執行步驟a及b後，由該荷重感測器獲得該晶片由該固定件脫離該固定機台的脫離過程中的一第二力量與時間圖； (e)比較該第一及該第二力量與時間圖，判斷是否需要再調整該移動晶片設備的零件，若是，則重新執行步驟d，若否，則結束量測。
又一方面，本發明係提供一種移動晶片設備，其包含有一固定機台及一機械手臂，該固定機台上設有一固定件用以暫時固定一晶片，該固定機台內設有一推抵件，且於該機械手臂末端固定有一持取裝置，其中該機械手臂設有一荷重感測器，當該機械手臂的該持取裝置持取該晶片且該推抵件推抵該晶片，而使該晶片脫離該固定件進而脫離該固定機台時，由該荷重感測器獲得該晶片由該固定件脫離該固定機台的脫離過程中之力量與時間圖。
本發明的優點在於，藉由荷重感測器來即時獲得抓取該晶片時，該晶片上的受力情況，再藉由更換變更不同零件或調整參數的組合，來找出最適合用來將各種晶片移動離開該固定機台的零件及參數的組合，進而避免後續在對相同的晶片進行相同製程時，該晶片在被移動離開該固定機台的過程中產生異常或毀損。
10‧‧‧機台
11‧‧‧推抵件
20‧‧‧機械手臂
21‧‧‧持取裝置
22‧‧‧荷重感測器
30‧‧‧晶片
31‧‧‧固定件
圖1為晶片設置於本發明之設備的示意圖。
圖2為本發明之方法的第一動作示意圖。
圖3為本發明之方法的第二動作示意圖。
圖4為本發明之方法的第一實施例之流程圖。
圖5為圖3之部份區域放大圖。
圖6為實施本發明之方法後所得之一力量與時間圖。
圖7為本發明之方法的第二實施例之流程圖。
圖8為實施本發明之方法後所得之另一力量與時間圖。
以下配合圖式及本發明之實施例，進一步闡述本發明為達成預定發明目的所採取的技術手段。
請參閱圖1至圖3所示，本發明之移動晶片設備包含有一固定機台10及一機械手臂20，該機械手臂20設置於該固定機台10之上方，該機械手臂20之底端設有一持取裝置21，一晶片30置於該固定機台10上，該晶片30係透過一固定件31暫時固定於該固定機台10上，該固定機台10中設有一推抵件11，該推抵件11相對位於該晶片30置放處之下方，於該機械手臂20上，套設有一荷重感測器22。在一實施例中，該持取裝置21可為一吸嘴。在一實施例中，該固定件31可為一黏晶膠(Die attach film,DAF)。在一實施例中，該推抵件11可為一頂針組件。在一實施例中，該荷重感測器22會與一數據處理裝置連接，用以運算該晶片30所承受的應力值，進而紀錄該晶片30所承受的力量與時間的關係。
請參閱圖4所示，本發明之調整移動晶片設備的方法包含以下步驟：提供一晶片(S10)(配合參閱圖1所示)：提供一晶片30，其係透過該固定件31暫時固定於該機台10上。
使該晶片脫離該固定機台(S20)(配合參閱圖2及圖3所示)：該機械手臂20將該持取裝置21移動至該晶片30的上方，使該持取裝置21對應該晶片30位置，再延伸該機械手臂20使得該持取裝置21接觸到該晶片30之表面，此時，該機械手臂20收回並同時配合該推抵件11向上頂出，而使該晶片30脫離該固定件31並脫離該固定機台10表面。
以該荷重感測器紀錄該晶片脫離過程中的力量與時間圖(S30)(配合參閱圖5所示)：在該晶片30脫離該固定機台10表面的過程中，該晶片30 表面受到來自不同來源的力，如該持取裝置21所施加上拉晶片30的第一力量F1、該推抵件11所施加上推該晶片30的第二力量F2、以及該固定件31所施加抵抗該晶片30脫離該固定件31之下拉的第三力量F3，該些力量F1、F2、F3對該晶片30表面所構成的應力，將使得晶片30表面產生一定的應變，而該荷重感測器22在此過程中，量測該晶片30所受到之力量與時間圖。
調整該移動晶片設備的零件(S40)：根據所紀錄的力量與時間圖，來調整該移動晶片設備的零件。在一實施例中，調整該移動晶片設備的零件係指更換該機械手臂20之該持取裝置21、調整該機械手臂20的該持取裝置21之持取力、更換該推抵件11、調整該推抵件11之向上推抵力、更換該固定件31中的其中至少之一。其中更換該推抵件11係可為更換具有不同形狀之頂針組件。
請參閱圖6所示，由荷重感測器22的測量結果，推算出在將該晶片30持取離開該固定機台10表面的過程中，各時間點所承受的力量值，由圖6中可明顯看出，在某些特定的時間區段T11、T21、T31、T41、T51中，可看到多個轉折所形成的波峰或波谷，此處代表當下急遽的力量變化，無論是力量瞬間由正轉負(即合力方向的改變)、或是力量值的瞬間變化，都會對該晶片30表面產生瞬間的應變變化，急遽變化的次數越多越容易導致該晶片30異常或毀損，因此，由力量與時間圖中曲線的平滑程度，可以判斷出該種零件配置下對該晶片30受力的影響。
而為了降低該晶片30在持取離開該固定機台10的過程中產生異常或毀損的機率，透過調整該移動晶片設備的零件，來找出對移動該晶片30時較佳的零件配置。
請參閱圖7所示，在另一實施例中，本發明之調整移動晶片設備的方法包含以下步驟： 提供一晶片(S10A)(配合參閱圖1所示)：提供一晶片30，其係透過該固定件31暫時固定於該機台10上。
使該晶片脫離該固定機台(S20A)(配合參閱圖2及圖3所示)：該機械手臂20將該持取裝置21移動至該晶片30的上方，使該持取裝置21對應該晶片30位置，再延伸該機械手臂20使得該持取裝置21接觸到該晶片30之表面，此時，該機械手臂20收回並同時配合該推抵件11向上頂出，而使該晶片30脫離該固定件31並脫離該固定機台10表面。
以該荷重感測器紀錄該晶片脫離過程中的力量與時間圖(S30A)(配合參閱圖5所示)：在該晶片30脫離該固定機台10表面的過程中，該晶片30表面受到來自不同來源的力，而該荷重感測器22在此過程中，紀錄該晶片30所受到之力量與時間圖。根據力量與時間圖，判斷是否需要調整該移動晶片設備的零件(S31A)：由力量與時間圖中曲線的平滑程度，可以判斷出該種零件配置下對該晶片30受力的影響，如判斷須調整零件，則繼續進行步驟S40A來調整該移動晶片設備的零件；如判斷不須調整零件，則結束步驟。
在進行步驟S40A後，重新回到步驟S10A，則當繼續執行至步驟S31A時，基於已調整零件而至少具有二以上的力量與時間圖，則於後續執行步驟S31A時，係比較在不同零件配置下的各力量與時間圖，來判斷是否需要調整該移動晶片設備之零件。
當嘗試多種組合後，可在有限的組合中尋找出如圖8所示之效果，亦即在與圖6之時間區段T11、T21、T31、T41、T51對應之時間區段T12、T22、T32、T42、T52中，波峰或波谷的數量明顯減少，代表力量的值或方向的瞬間變化次數顯著減少，則意謂著此種元件及參數組合用來在持取該晶片30時，對該晶片30的應力分佈較均勻，而可採用該種元件及參數組合來持取該晶片30，將有效降低在製程中使該晶片30產生異常或毀損的機率。
因此，使用者可透過前述之本發明的方法及設備，對不同種類的晶片測試出最適合將其取離機台的元件及參數組合。
以上所述僅是本發明的實施例而已，並非對本發明做任何形式上的限制，雖然本發明已以實施例揭露如上，然而並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明技術方案的範圍內，當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例，但凡是未脫離本發明技術方案的內容，依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾，均仍屬於本發明技術方案的範圍內。

Claims (9)

  1. 一種調整移動晶片設備的方法，該移動晶片設備包含一固定機台以及一機械手臂，該固定機台上設有一固定件，該固定機台內設有一推抵件，且該機械手臂末端固定有一持取裝置，其中該機械手臂設有一荷重感測器，該方法包括以下步驟：(a)提供一晶片，該晶片透過該固定件暫時固定於該固定機台上；(b)以該機械手臂的該持取裝置持取該晶片，且該推抵件推抵該晶片，使該晶片脫離該固定件而移離該固定機台；(c)由該荷重感測器獲得該晶片由該固定件脫離該固定機台的脫離過程中的一第一力量與時間圖；以及(d)根據該第一力量與時間圖的曲線平滑程度，調整該移動晶片設備的零件。
  2. 如請求項1所述之調整移動晶片設備的方法，其中於步驟d中，調整該移動晶片設備的零件係為更換該機械手臂之該持取裝置，隨後再重新執行步驟a至c，並獲得一第二力量與時間圖。
  3. 如請求項1所述之調整移動晶片設備的方法，其中於步驟d中，調整該移動晶片設備的零件係為調整該機械手臂之該持取裝置的持取力，隨後再重新執行步驟a至c，並獲得一第三力量與時間圖。
  4. 如請求項1所述之調整移動晶片設備的方法，其中於步驟d中，調整該移動晶片設備的零件係為更換該推抵件，隨後再重新執行步驟a至c，並獲得一第四力量與時間圖。
  5. 如請求項1所述之調整移動晶片設備的方法，其中於步驟d中，調整該移動晶片設備的零件係為調整該推抵件之向上推抵力，隨後再重新執行步驟a至c，並獲得一第五力量與時間圖。
  6. 如請求項1所述之調整移動晶片設備的方法，其中於步驟d中，調整該移動晶片設備的零件係為更換該固定件，隨後再重新執行步驟a至c，並獲得一第六力量與時間圖。
  7. 一種調整移動晶片設備的方法，該移動晶片設備包含一固定機台以及一機械手臂，該固定機台上設有一固定件，該固定機台內設有一推抵件，且該機械手臂末端固定有一持取裝置，其中該機械手臂設有一荷重感測器，該方法包括以下步驟：(a)提供一晶片，該晶片透過該固定件暫時固定於該固定機台上；(b)以該機械手臂的該持取裝置持取該晶片，且該推抵件推抵該晶片，使該晶片脫離該固定件而移離該固定機台；(c)由該荷重感測器獲得該晶片由該固定件脫離該固定機台的脫離過程中的一第一力量與時間圖；(d)調整該移動晶片設備的零件，再重新執行步驟a及b後，由該荷重感測器獲得該晶片由該固定件脫離該固定機台的脫離過程中的一第二力量與時間圖；以及(e)比較該第一及該第二力量與時間圖，判斷是否需要再調整該移動晶片設備的零件，若是，則重新執行步驟d，若否，則結束量測。
  8. 如請求項7所述之調整移動晶片設備的方法，其中在執行步驟d時，調整該移動晶片設備的零件之步驟包括更換該機械手臂之該持取裝置、調整該機械手臂的該持取裝置之持取力、更換該推抵件、調整該推抵件之向上推抵力、更換該固定件中的其中至少之一。
  9. 如請求項7或8所述之調整移動晶片設備的方法，其中在執行步驟e時，係透過比較該第一及該第二力量與時間圖中的曲線之平滑程度，來判斷是否需要再調整該移動晶片設備的零件。
TW107143957A 2018-12-06 2018-12-06 調整移動晶片設備的方法及該移動晶片設備 TWI679728B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW107143957A TWI679728B (zh) 2018-12-06 2018-12-06 調整移動晶片設備的方法及該移動晶片設備
CN201811546120.6A CN111293064A (zh) 2018-12-06 2018-12-17 调整移动芯片设备的方法及该移动芯片设备
KR1020180167708A KR102136937B1 (ko) 2018-12-06 2018-12-21 칩 이동 기기의 조정 방법 및 그 칩 이동 기기
JP2019008247A JP6722783B2 (ja) 2018-12-06 2019-01-22 チップ移動設備の調整方法及びチップ移動設備

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107143957A TWI679728B (zh) 2018-12-06 2018-12-06 調整移動晶片設備的方法及該移動晶片設備

Publications (2)

Publication Number Publication Date
TWI679728B true TWI679728B (zh) 2019-12-11
TW202022982A TW202022982A (zh) 2020-06-16

Family

ID=69582409

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107143957A TWI679728B (zh) 2018-12-06 2018-12-06 調整移動晶片設備的方法及該移動晶片設備

Country Status (4)

Country Link
JP (1) JP6722783B2 (zh)
KR (1) KR102136937B1 (zh)
CN (1) CN111293064A (zh)
TW (1) TWI679728B (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010092905A (ja) * 2008-10-03 2010-04-22 Renesas Technology Corp 半導体チップのピックアップ方法および半導体装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335592A (ja) * 1994-06-14 1995-12-22 Toshiba Corp ダイシング装置とその方法およびダイシング用チャッキング装置
JPH0936147A (ja) * 1995-07-19 1997-02-07 Toshiba Corp 半導体製造装置
JP4592235B2 (ja) * 2001-08-31 2010-12-01 株式会社東芝 生産装置の故障診断方法及び生産装置の故障診断システム
KR101039858B1 (ko) * 2009-05-29 2011-06-09 미래산업 주식회사 반도체 소자 수납장치, 테스트 트레이, 및 테스트 핸들러
CN102956436B (zh) * 2011-08-23 2015-05-27 和舰科技(苏州)有限公司 机台调机时机械手臂存取晶片相对位置的监测装置及其监测方法
US20140208850A1 (en) * 2013-01-29 2014-07-31 Geun-Woo Kim Apparatus and method of detecting a defect of a semiconductor device
JP3205044U (ja) * 2016-04-20 2016-06-30 リンテック株式会社 ピックアップ装置
TWI614100B (zh) * 2016-09-06 2018-02-11 國立臺北科技大學 機械手臂的教導系統及其控制方法
JP6840158B2 (ja) * 2016-09-28 2021-03-10 株式会社Ｆｕｊｉ ダイ実装装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010092905A (ja) * 2008-10-03 2010-04-22 Renesas Technology Corp 半導体チップのピックアップ方法および半導体装置の製造方法

Also Published As

Publication number Publication date
KR102136937B1 (ko) 2020-07-23
JP2020092247A (ja) 2020-06-11
CN111293064A (zh) 2020-06-16
JP6722783B2 (ja) 2020-07-15
KR20200070053A (ko) 2020-06-17
TW202022982A (zh) 2020-06-16

Similar Documents

Publication Publication Date Title
US9123582B2 (en) Methods of in-situ measurements of wafer bow
TWI550755B (zh) 處理設備及裝置製造方法
US11842905B2 (en) Stacked substrate manufacturing method, stacked substrate manufacturing apparatus, stacked substrate manufacturing system, and substrate processing apparatus
US10421219B2 (en) Imprint apparatus and method of manufacturing article
US20160155721A1 (en) Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
US10788759B2 (en) Prediction based chucking and lithography control optimization
JP2005055330A (ja) 半導体装置への加圧装置
TWI679728B (zh) 調整移動晶片設備的方法及該移動晶片設備
US7169019B2 (en) Method of monitoring surface status and life of pad by detecting temperature of polishing interface during chemical mechanical process
JP2007333697A (ja) 電子部品試験装置のキャリブレーション方法
JP2006237413A (ja) プローブ針のクリーニング方法、これに用いるウエハおよびウエハプローバ装置
US8309465B2 (en) System and method for producing devices including a semiconductor part and a non-semiconductor part
KR102556329B1 (ko) 반도체 기판을 지지하는 진공척
JP6564345B2 (ja) 電気検査方法及び電気検査装置
CN108695182B (zh) 缺陷检测机台检测精度的校验方法及产品晶圆
WO2016201289A1 (en) Shaping of contact structures for semiconductor test, and associated systems and methods
JP6782001B2 (ja) 電気検査装置
US9726719B2 (en) Semiconductor automatic test equipment
US9915699B2 (en) Integrated fan-out pillar probe system
TWI509681B (zh) Method and apparatus for processing on wafers
TWI669514B (zh) Mechanism for testing semiconductor products using electrostatic carriers
KR102158819B1 (ko) 반도체 패키지 픽업 장치
Tsai et al. Thin IC Chip Pickup Process Risk Analysis via Experiments in conjunction with Numerical Approach
JP5179276B2 (ja) 回路基板検査装置
KR102252739B1 (ko) 테스트 핸들러

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees