TWI677555B - 導電性黏著薄片 - Google Patents
導電性黏著薄片 Download PDFInfo
- Publication number
- TWI677555B TWI677555B TW104128148A TW104128148A TWI677555B TW I677555 B TWI677555 B TW I677555B TW 104128148 A TW104128148 A TW 104128148A TW 104128148 A TW104128148 A TW 104128148A TW I677555 B TWI677555 B TW I677555B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- conductive layer
- conductive
- resin
- mass
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-173715 | 2014-08-28 | ||
JP2014173715 | 2014-08-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201621012A TW201621012A (zh) | 2016-06-16 |
TWI677555B true TWI677555B (zh) | 2019-11-21 |
Family
ID=55399676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104128148A TWI677555B (zh) | 2014-08-28 | 2015-08-27 | 導電性黏著薄片 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6500906B2 (ko) |
KR (1) | KR102389424B1 (ko) |
CN (1) | CN106661398A (ko) |
TW (1) | TWI677555B (ko) |
WO (1) | WO2016031788A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI595059B (zh) * | 2016-09-06 | 2017-08-11 | High conductive tape and its preparation method | |
JP6831725B2 (ja) * | 2017-03-17 | 2021-02-17 | リンテック株式会社 | ワーク加工用粘着シートおよびその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005017012A1 (en) * | 2003-08-06 | 2005-02-24 | World Properties, Inc. | Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof |
WO2009060686A1 (ja) * | 2007-11-08 | 2009-05-14 | Nitto Denko Corporation | 検査用粘着シート |
WO2011093214A1 (ja) * | 2010-01-26 | 2011-08-04 | 日東電工株式会社 | 導電性粘着テープ |
CN102399505A (zh) * | 2010-09-13 | 2012-04-04 | 日东电工株式会社 | 切割/芯片接合薄膜 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001172582A (ja) | 1999-12-14 | 2001-06-26 | Suzuki Sogyo Co Ltd | 導電性粘着剤および該導電性粘着剤層を有する導電性複合材 |
US8048690B2 (en) * | 2007-11-08 | 2011-11-01 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet and process for producing semiconductor device having same |
WO2009060687A1 (ja) * | 2007-11-08 | 2009-05-14 | Nitto Denko Corporation | 粘着シート及びそれを用いた半導体装置の製造方法 |
JP5060249B2 (ja) * | 2007-11-08 | 2012-10-31 | 日東電工株式会社 | 検査用粘着シート |
JP5396073B2 (ja) * | 2008-12-12 | 2014-01-22 | リンテック株式会社 | 導電性粘着シートおよびその製造方法 |
JP2012007093A (ja) * | 2010-06-25 | 2012-01-12 | Nitto Denko Corp | 導電性粘着テープ |
US9159940B2 (en) * | 2010-09-30 | 2015-10-13 | Lintec Corporation | Conductive adhesive composition, electronic device, positive electrode laminate, and method for manufacturing electronic device |
JP2014001297A (ja) * | 2012-06-18 | 2014-01-09 | Dic Corp | 導電性粘着テープ |
JP6376741B2 (ja) * | 2013-10-11 | 2018-08-22 | アキレス株式会社 | 熱剥離性粘着フィルム |
-
2015
- 2015-08-24 CN CN201580045647.9A patent/CN106661398A/zh active Pending
- 2015-08-24 JP JP2016545533A patent/JP6500906B2/ja active Active
- 2015-08-24 WO PCT/JP2015/073767 patent/WO2016031788A1/ja active Application Filing
- 2015-08-24 KR KR1020177004812A patent/KR102389424B1/ko active IP Right Grant
- 2015-08-27 TW TW104128148A patent/TWI677555B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005017012A1 (en) * | 2003-08-06 | 2005-02-24 | World Properties, Inc. | Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof |
WO2009060686A1 (ja) * | 2007-11-08 | 2009-05-14 | Nitto Denko Corporation | 検査用粘着シート |
WO2011093214A1 (ja) * | 2010-01-26 | 2011-08-04 | 日東電工株式会社 | 導電性粘着テープ |
CN102399505A (zh) * | 2010-09-13 | 2012-04-04 | 日东电工株式会社 | 切割/芯片接合薄膜 |
Also Published As
Publication number | Publication date |
---|---|
JP6500906B2 (ja) | 2019-04-17 |
KR20170046660A (ko) | 2017-05-02 |
CN106661398A (zh) | 2017-05-10 |
KR102389424B1 (ko) | 2022-04-21 |
TW201621012A (zh) | 2016-06-16 |
JPWO2016031788A1 (ja) | 2017-06-15 |
WO2016031788A1 (ja) | 2016-03-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI678408B (zh) | 導電性黏著薄片 | |
US20150191636A1 (en) | Pressure-sensitive adhesive sheet | |
WO2014097757A1 (ja) | 基材レス両面粘着シート | |
TW201132732A (en) | Surface protective film | |
TWI677555B (zh) | 導電性黏著薄片 | |
TWI683871B (zh) | 導電性黏著薄片 | |
TWI740935B (zh) | 黏著薄片 | |
JP2017057256A (ja) | 導電性粘着シート | |
JP6470944B2 (ja) | 導電性粘着剤組成物及び導電性粘着シート | |
US20220013748A1 (en) | Surface protective film and method for manufacturing organic light-emitting electronic device by using same | |
JP2021015953A (ja) | 粘着テープおよび粘着テープ用基材 | |
WO2018101335A1 (ja) | 両面粘着シート、及び両面粘着シートの製造方法 | |
WO2016051829A1 (ja) | 導電性粘着シート | |
TWI673337B (zh) | 導電性黏著薄片 | |
JP2013166281A (ja) | 表面層を有する伸長性有機基材 |