TWI672192B - 加工裝置 - Google Patents

加工裝置 Download PDF

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Publication number
TWI672192B
TWI672192B TW104144458A TW104144458A TWI672192B TW I672192 B TWI672192 B TW I672192B TW 104144458 A TW104144458 A TW 104144458A TW 104144458 A TW104144458 A TW 104144458A TW I672192 B TWI672192 B TW I672192B
Authority
TW
Taiwan
Prior art keywords
vibration
signal
processing
vibration signal
tool
Prior art date
Application number
TW104144458A
Other languages
English (en)
Chinese (zh)
Other versions
TW201703928A (zh
Inventor
內田文雄
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201703928A publication Critical patent/TW201703928A/zh
Application granted granted Critical
Publication of TWI672192B publication Critical patent/TWI672192B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
TW104144458A 2015-02-16 2015-12-30 加工裝置 TWI672192B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-027480 2015-02-16
JP2015027480A JP6403601B2 (ja) 2015-02-16 2015-02-16 加工装置

Publications (2)

Publication Number Publication Date
TW201703928A TW201703928A (zh) 2017-02-01
TWI672192B true TWI672192B (zh) 2019-09-21

Family

ID=56695750

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104144458A TWI672192B (zh) 2015-02-16 2015-12-30 加工裝置

Country Status (4)

Country Link
JP (1) JP6403601B2 (ko)
KR (1) KR102422909B1 (ko)
CN (1) CN105881194B (ko)
TW (1) TWI672192B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741705B (zh) * 2020-07-28 2021-10-01 國立中興大學 主軸之外電源供應器

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6814579B2 (ja) * 2016-09-20 2021-01-20 株式会社ディスコ 研削ホイール及び研削装置
JP6866097B2 (ja) * 2016-09-30 2021-04-28 株式会社ディスコ 研削装置
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
JP7162513B2 (ja) * 2018-12-07 2022-10-28 株式会社ディスコ 加工装置
DE102019209191A1 (de) 2019-06-25 2020-12-31 Sauer Gmbh Verfahren und vorrichtung zum steuern einer ultraschall-werkzeugeinheit für die spanende bearbeitung an einer werkzeugmaschine
JP7339811B2 (ja) * 2019-08-27 2023-09-06 株式会社荏原製作所 リテーナリングに局所荷重を伝達するローラーの異常検出方法および研磨装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676360A (en) * 1979-11-14 1981-06-23 Toshiba Corp Detector for tool failure
JPS5796772A (en) * 1980-12-06 1982-06-16 Toyota Motor Corp Internal grinder with detector for vibration of grinding wheel spindle
JPS63174850A (ja) * 1987-09-26 1988-07-19 Osaka Kiko Co Ltd Ａｅ波による切削工具の損傷検出装置
JPH0435865A (ja) * 1990-05-30 1992-02-06 Noritake Co Ltd 砥石車
JP2002066879A (ja) * 2000-09-04 2002-03-05 Bosch Automotive Systems Corp 工作機械用アコースティック・エミッション検出装置
US20050193819A1 (en) * 2004-03-08 2005-09-08 Balance Systems S.R.L. Precision sensor assembly for rotating members in a machine tool
WO2007080699A1 (ja) * 2006-01-12 2007-07-19 Tokyo Seimitsu Co., Ltd. 加工システム、接触検出方法及びａｅ接触検出装置
JP2007287722A (ja) * 2006-04-12 2007-11-01 Disco Abrasive Syst Ltd 切削装置
JP2008290203A (ja) * 2007-05-25 2008-12-04 Nissan Diesel Motor Co Ltd 研削加工監視システム及び研削加工監視方法
JP2013084795A (ja) * 2011-10-11 2013-05-09 Tokyo Seimitsu Co Ltd ウェーハ面取り装置、および面取り用砥石の表面状態または面取り用砥石によるウェーハの加工状態の検出方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128900A (ja) * 1974-09-06 1976-03-11 Ajinomoto Kk Kokaseihoriehokisaidososeibutsu
JPH0499946A (ja) * 1990-08-20 1992-03-31 Sanko Control Kk 砥石の切れ味測定方法及び装置
JPH05154833A (ja) * 1991-12-09 1993-06-22 Nikko Kyodo Co Ltd ダイシングマシン
JP4908143B2 (ja) * 2006-10-12 2012-04-04 株式会社ディスコ 切削ブレードの振幅計測装置
JP2011143516A (ja) 2010-01-15 2011-07-28 Disco Abrasive Syst Ltd 加工装置
JP2012024885A (ja) * 2010-07-23 2012-02-09 Disco Corp バイト工具を備えた加工装置
JP5619559B2 (ja) * 2010-10-12 2014-11-05 株式会社ディスコ 加工装置
JP5742312B2 (ja) * 2011-03-10 2015-07-01 株式会社ジェイテクト びびり振動検出方法
JP5732325B2 (ja) * 2011-06-16 2015-06-10 オークマ株式会社 振動判別方法、及び振動判別装置
JP5308599B1 (ja) * 2013-01-16 2013-10-09 三重電子株式会社 加工装置
CN104015098B (zh) * 2014-04-29 2016-08-03 天津大学 用于机加工中刀杆振动信号的实时监测装置及其监测方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676360A (en) * 1979-11-14 1981-06-23 Toshiba Corp Detector for tool failure
JPS5796772A (en) * 1980-12-06 1982-06-16 Toyota Motor Corp Internal grinder with detector for vibration of grinding wheel spindle
JPS63174850A (ja) * 1987-09-26 1988-07-19 Osaka Kiko Co Ltd Ａｅ波による切削工具の損傷検出装置
JPH0435865A (ja) * 1990-05-30 1992-02-06 Noritake Co Ltd 砥石車
JP2002066879A (ja) * 2000-09-04 2002-03-05 Bosch Automotive Systems Corp 工作機械用アコースティック・エミッション検出装置
US20050193819A1 (en) * 2004-03-08 2005-09-08 Balance Systems S.R.L. Precision sensor assembly for rotating members in a machine tool
WO2007080699A1 (ja) * 2006-01-12 2007-07-19 Tokyo Seimitsu Co., Ltd. 加工システム、接触検出方法及びａｅ接触検出装置
JP2007287722A (ja) * 2006-04-12 2007-11-01 Disco Abrasive Syst Ltd 切削装置
JP2008290203A (ja) * 2007-05-25 2008-12-04 Nissan Diesel Motor Co Ltd 研削加工監視システム及び研削加工監視方法
JP2013084795A (ja) * 2011-10-11 2013-05-09 Tokyo Seimitsu Co Ltd ウェーハ面取り装置、および面取り用砥石の表面状態または面取り用砥石によるウェーハの加工状態の検出方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741705B (zh) * 2020-07-28 2021-10-01 國立中興大學 主軸之外電源供應器
US11949226B2 (en) 2020-07-28 2024-04-02 National Chung Hsing University External power supply system for spindle

Also Published As

Publication number Publication date
CN105881194B (zh) 2019-05-31
KR102422909B1 (ko) 2022-07-21
CN105881194A (zh) 2016-08-24
KR20160100844A (ko) 2016-08-24
TW201703928A (zh) 2017-02-01
JP2016150394A (ja) 2016-08-22
JP6403601B2 (ja) 2018-10-10

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