JP6866097B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP6866097B2 JP6866097B2 JP2016193731A JP2016193731A JP6866097B2 JP 6866097 B2 JP6866097 B2 JP 6866097B2 JP 2016193731 A JP2016193731 A JP 2016193731A JP 2016193731 A JP2016193731 A JP 2016193731A JP 6866097 B2 JP6866097 B2 JP 6866097B2
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- JP
- Japan
- Prior art keywords
- grinding
- vibration
- unit
- wafer
- power generation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000227 grinding Methods 0.000 title claims description 173
- 238000010248 power generation Methods 0.000 claims description 36
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Images
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
21 保持手段
24 保持テーブル
25 支持柱
31 研削送り手段
41 研削手段
46 研削ホイール
48 研削砥石
50 位置付け手段
52 移動基台
60 振動送信手段
61 発電部
62 送信部
70 制御部
71 判断部
72 受信部
C 警戒値(設定値)
L 限界値(設定値)
W ウエーハ
Claims (1)
- ウエーハを保持する保持手段と、研削砥石を環状に配設する研削ホイールを回転可能に装着して該保持手段が保持するウエーハを研削する研削手段と、該研削手段を該保持手段に対して接近および離間する研削送り手段と、を備える研削装置であって、
研削加工時の振動を検知して該研削装置の受信部に振動を送信する振動送信手段を備え、
該振動送信手段は、該保持手段もしくは該研削手段に配設し、該研削砥石がウエーハを研削加工して発生した振動により発電する発電部と、該発電部により発電された電圧値を該発電部より発電した電力を利用して該受信部に無線で送信する送信部と、を備え、
研削加工で発生した振動で該発電部が発電し、該発電部が発電した該電圧値を該発電部より発電した電力を利用して該送信部から該受信部に送信し、予め設定された設定値と該送信部が送信して該受信部が受信した該電圧値とを比較して研削送り手段を制御する制御部を備える研削装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016193731A JP6866097B2 (ja) | 2016-09-30 | 2016-09-30 | 研削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016193731A JP6866097B2 (ja) | 2016-09-30 | 2016-09-30 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018051723A JP2018051723A (ja) | 2018-04-05 |
JP6866097B2 true JP6866097B2 (ja) | 2021-04-28 |
Family
ID=61834878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016193731A Active JP6866097B2 (ja) | 2016-09-30 | 2016-09-30 | 研削装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6866097B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7154910B2 (ja) * | 2018-09-21 | 2022-10-18 | 株式会社ディスコ | 加工装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3466374B2 (ja) * | 1995-04-26 | 2003-11-10 | 富士通株式会社 | 研磨装置及び研磨方法 |
JP6153323B2 (ja) * | 2012-12-20 | 2017-06-28 | 株式会社ディスコ | 研削装置及び研削方法 |
JP6403601B2 (ja) * | 2015-02-16 | 2018-10-10 | 株式会社ディスコ | 加工装置 |
-
2016
- 2016-09-30 JP JP2016193731A patent/JP6866097B2/ja active Active
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JP2018051723A (ja) | 2018-04-05 |
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