TWI671831B - 半導體元件的製造方法 - Google Patents

半導體元件的製造方法 Download PDF

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Publication number
TWI671831B
TWI671831B TW105127758A TW105127758A TWI671831B TW I671831 B TWI671831 B TW I671831B TW 105127758 A TW105127758 A TW 105127758A TW 105127758 A TW105127758 A TW 105127758A TW I671831 B TWI671831 B TW I671831B
Authority
TW
Taiwan
Prior art keywords
temporary adhesive
adhesive layer
temperature
group
mass
Prior art date
Application number
TW105127758A
Other languages
English (en)
Chinese (zh)
Other versions
TW201724294A (zh
Inventor
加持義貴
中村敦
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW201724294A publication Critical patent/TW201724294A/zh
Application granted granted Critical
Publication of TWI671831B publication Critical patent/TWI671831B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW105127758A 2015-09-30 2016-08-30 半導體元件的製造方法 TWI671831B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-195159 2015-09-30
JP2015195159 2015-09-30

Publications (2)

Publication Number Publication Date
TW201724294A TW201724294A (zh) 2017-07-01
TWI671831B true TWI671831B (zh) 2019-09-11

Family

ID=58423883

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105127758A TWI671831B (zh) 2015-09-30 2016-08-30 半導體元件的製造方法

Country Status (3)

Country Link
JP (1) JP6490825B2 (ja)
TW (1) TWI671831B (ja)
WO (1) WO2017057355A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019181716A1 (ja) * 2018-03-20 2019-09-26 富士フイルム株式会社 仮接着剤組成物が充填された仮接着剤組成物入り容器、その充填保存方法および製造方法
WO2020255904A1 (ja) * 2019-06-20 2020-12-24 富士フイルム株式会社 仮接着剤組成物が充填された仮接着剤組成物入り容器、仮接着剤組成物の保存方法、および仮接着剤組成物入り容器の製造方法
JP7447493B2 (ja) 2020-01-07 2024-03-12 株式会社レゾナック 仮固定用の樹脂組成物と樹脂フィルム及び半導体装置の製造方法
CN113497174B (zh) * 2020-03-20 2023-05-23 东莞市中麒光电技术有限公司 小间距led显示屏模组及其制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118183A (en) * 1996-12-19 2000-09-12 Texas Instruments Incorporated Semiconductor device, manufacturing method thereof, and insulating substrate for same
US20090075429A1 (en) * 2005-04-27 2009-03-19 Lintec Corporation Sheet-Like Underfill Material and Semiconductor Device Manufacturing Method
US20110057332A1 (en) * 2009-09-07 2011-03-10 Renesas Electronics Corporation Semiconductor chip with conductive adhesive layer and method of manufacturing the same, and method of manufacturing semiconductor device
US20130078770A1 (en) * 2011-09-28 2013-03-28 Nitto Denko Corporation Method for producing semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012069919A (ja) * 2010-08-25 2012-04-05 Toshiba Corp 半導体装置の製造方法
JP2012129326A (ja) * 2010-12-14 2012-07-05 Sumitomo Bakelite Co Ltd 電子装置の製造方法および電子装置パッケージの製造方法
JP6140441B2 (ja) * 2012-12-27 2017-05-31 富士フイルム株式会社 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
JP6188495B2 (ja) * 2013-08-30 2017-08-30 富士フイルム株式会社 積層体及びその応用

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118183A (en) * 1996-12-19 2000-09-12 Texas Instruments Incorporated Semiconductor device, manufacturing method thereof, and insulating substrate for same
US20090075429A1 (en) * 2005-04-27 2009-03-19 Lintec Corporation Sheet-Like Underfill Material and Semiconductor Device Manufacturing Method
US20110057332A1 (en) * 2009-09-07 2011-03-10 Renesas Electronics Corporation Semiconductor chip with conductive adhesive layer and method of manufacturing the same, and method of manufacturing semiconductor device
US20130078770A1 (en) * 2011-09-28 2013-03-28 Nitto Denko Corporation Method for producing semiconductor device
US20130288428A1 (en) * 2011-09-28 2013-10-31 Nitto Denko Corporation Method for producing semiconductor device

Also Published As

Publication number Publication date
WO2017057355A1 (ja) 2017-04-06
TW201724294A (zh) 2017-07-01
JPWO2017057355A1 (ja) 2018-06-14
JP6490825B2 (ja) 2019-03-27

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