TWI665755B - Isolation device and method - Google Patents

Abstract

The separation device (10) includes a plurality of holding means (20) for holding the bonding sheet (AS) by a plurality of holding members (25), and each holding means (20) is moved to apply tension to the bonding sheet (AS). The tensioning means and the holding means (20) are configured to move the plurality of holding members (25) in an intersecting direction that intersects with the direction in which the tensioning means moves the holding means (20). (AS) Tension is applied in the aforementioned crossing direction.

Description

Isolation device and method

The present invention relates to a separation device and a separation method.

Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes referred to simply as a "wafer") is cut into a predetermined shape and a predetermined size and singulated into a plurality of semiconductor wafers (hereinafter referred to simply as " "Wafer"), after widening the space between the individual wafers, the wafers are mounted on a load such as a lead frame or a substrate.

As a method of widening the space between wafers (sheet-like bodies), a protective tape (adhesive sheet) to which a wafer (plate-like member) is adhered and held on a mounting platform is known to fix the inner diameter side. The stage is used to move each of the expanded suction sections divided into four on the outer diameter side in the outer diameter direction (see, for example, Document 1: Japanese Patent Application Laid-Open No. 2001-223186). In the method of widening the interval between the wafers as described above, for example, four directions of + X-axis direction, -X-axis direction, + Y-axis direction, and -Y-axis direction are applied to the bonding sheet, and the sensing means senses For example, if the wafer located at the outermost periphery has reached a predetermined position, the action of widening the interval is completed.

However, in the conventional method described in Document 1, the sheet system In addition to the above 4 directions, for example, the composite directions, such as the composite direction of + X axis direction and + Y axis direction, the composite direction of + X axis direction and -Y axis direction, -X axis direction and + Tension is applied to the combined direction of the Y-axis direction, and the combined direction of the -X-axis direction and the -Y-axis direction. As a result, there is a difference in the interval between the wafers on the inner side and the wafer. However, the difference between the gaps shown above is extremely small. Therefore, each chip is set to have an evenly widened gap, and based on the position derived from the calculation (hereinafter sometimes referred to as "theoretical position"), It is conveyed by conveyance means, such as a conveyance device and a pick-up device, and it is loaded on a to-be-loaded object, and a manufactured object is formed. As a result, the relative positional relationship between the wafer and the object in the manufactured product may be slightly shifted, the connection position of the wire bonding may be shifted, or the positions of the terminals of the wafer and the object may be shifted. And other conduction, a disadvantage that the yield of the manufactured product is reduced.

In addition, as a result of applying tension to the bonding sheet, not only the interval between the wafers, but also the entire adhesion area on the bonding sheet provided with each wafer may be shifted from the theoretical position, which may also be caused by the conveyance method. The adverse situation caused by transportation.

Among them, these problems are not only related to the manufacture of semiconductor devices, but also occur in, for example, dense mechanical parts or fine ornaments.

An object of the present invention is to provide a separation device and a separation method capable of preventing the position of each sheet body from being shifted from the theoretical position as much as possible when the interval between a plurality of sheet bodies formed by a plate-shaped member is widened.

In order to achieve the foregoing object, the separation device of the present invention adopts a structure in which a plate-like member attached to a sheet is provided with tension in at least two directions to widen the interval between a plurality of sheet-like bodies formed by the plate-like member. The separating device includes a plurality of holding means for holding the bonding sheet by a plurality of holding members, and a tension applying means for moving the holding means in at least two directions to apply tension to the bonding sheet, and the holding means. When the holding member is moved in an intersecting direction crossing the direction in which the tensioning means moves the holding means, tension can be applied to the adhesive sheet in the intersecting direction.

In this case, in the separation device of the present invention, it is preferable that each of the holding means includes: a first moving means for moving each of the plurality of holding members in the crossing direction; and the holding means by the tension applying means. The moving direction is a plurality of second moving means for moving the plurality of holding members.

Further, in the separation device of the present invention, it is preferable to have a measuring means for measuring the mutual distance between the sheet-like bodies, and the plurality of holding members are provided so that tension can be imparted based on the measurement results of the measuring means.

On the other hand, the separation method of the present invention adopts a configuration in which a plate-like member attached to a sheet is provided with tension in at least two directions to widen the interval between a plurality of sheet-like bodies formed by the plate-like member. The separation method includes a process of holding the bonding sheet by a plurality of holding means including a plurality of holding members, and a process of applying tension to the holding means by moving the holding means in at least two directions and applying tension to the bonding sheet. ; And moving the holding means with the tension applying means A process in which the holding member is moved in an intersecting direction in which the directions intersect, and tension is applied to the bonding sheet in the intersecting direction.

According to the present invention as described above, the holding means is moved by the tension applying means, and then the sheet is given tension, and the holding member is given tension in an intersecting direction crossing the direction in which the holding means is moved by the tension applying means. This can adjust the interval between the plurality of sheet-like bodies formed by the plate-like members, and can prevent the position of each sheet-like body from being shifted from the theoretical position as much as possible.

In this case, if the holding means includes the first moving means and the second moving means, the distance between the sheet-like bodies can be adjusted more densely.

In addition, if the plurality of holding members are provided so that tension can be provided based on the measurement results of the mutual distance between the sheet-like bodies, the plate-like members can be temporarily adhered to each of the integrated bodies of the sheet to prevent as much as possible the individual sheet-like bodies. The position shifts from the theoretical position.

10‧‧‧ separation devices

20‧‧‧ means of retention

21‧‧‧The first linear motor

22‧‧‧ Slide

23‧‧‧ 2nd linear motor

24‧‧‧ Slide

25‧‧‧ holding member

Supporting members under 26‧‧‧

27‧‧‧Rotating motor

27A‧‧‧Output shaft

28‧‧‧up support components

30‧‧‧ Linear Motor

31‧‧‧ Slide

40‧‧‧Measurement method

AC‧‧‧ Surrounded Area

AL‧‧‧Stretching area

AP‧‧‧Top

AS‧‧‧thin sheet

AW‧‧‧ adhered to the body

CP‧‧‧Chip

CT‧‧‧ Center Point

CU‧‧‧No interference incision

WF‧‧‧ Wafer

WK‧‧‧One

FIG. 1 is a side view of a separation device according to an embodiment of the present invention.

FIG. 2 is a plan view of the separation device of FIG. 1. FIG.

FIG. 3A is a view showing a state of a bonding sheet provided with tension by the separation device of FIG. 1. FIG.

FIG. 3B is a view showing a state of the adhesive sheet applied with tension by the separation device of FIG. 1.

An embodiment of the present invention will be described below with reference to the drawings.

Among them, in this embodiment, the X-axis, Y-axis, and Z-axis systems are orthogonal to each other, the X-axis and Y-axis systems are formed as axes in a predetermined plane, and the Z-axis system is formed to be positive with the predetermined plane. Intersecting axes. In addition, in this embodiment, if the display direction is viewed from the forward direction in FIG. 1 parallel to the Y axis as the reference, "up" is the direction of the arrow on the Z axis, and "down" is the opposite direction. "Left" is the direction of the arrow on the X axis, "Right" is the direction of the arrow, and "front" is the direction of the arrow on the Y axis. In Figure 1, the forward direction is orthogonal to the paper surface, and "back" is the opposite direction.

In FIG. 1 and FIG. 2, the separation device 10 is a quadrangular wafer WF as a plate-like member on the bonding sheet AS in the + X-axis direction, + Y-axis direction, -X-axis direction, and -Y-axis direction. (Refer to FIG. 3A) A device for applying tension in four directions and widening the interval between wafers CP as a plurality of sheet bodies formed from the wafer WF includes four holding members 25 each holding the bonding sheet AS. 4 holding means 20; driving means for supporting each holding means 20 with their respective sliders 31 and moving each holding means 20 in the aforementioned 4 directions to apply tension to the sheet AS, that is, 4 means for applying tension Linear motor 30; and measuring means 40 such as an optical sensor or a camera that measures the distance between the wafers CP. Among them, the holding means 20 and the linear motor 30 are provided around the center point CT, and are provided at the front, back, left, and right. In addition, the wafer WF can be singulated into wafers by wafer cutting means such as a cutter or pressurized water, or singulated into wafers by means of wafer fragility such as laser light or chemical liquid. The CP is temporarily adhered to the sheet AS to form the integrated body WK. In addition, The sheet AS is formed by extending each of the top APs of the polygonal enclosing region AC (see FIG. 2) that surrounds the adhered area AW to which the wafer WF is adhered, so as to prevent the enclosing region. The non-interfering notch CU that applies tension in the combined direction of the directions of each of the ACs is formed with stretches extending in the + X-axis direction, -X-axis direction, + Y-axis direction, and -Y-axis direction from each side of the surrounding area AC Area AL.

The holding means 20 is provided with a driving device that moves each of the plurality of holding members 25 in an intersection direction that intersects the direction in which the linear means 30 moves the holding means 20, that is, the first linear motor 21 as the first moving means; Four driving machines supported by the slider 22 of the first linear motor 21 and moving the holding member 25 in the direction in which the linear motor 30 moves the holding means 20, that is, the second linear motor 23 as the second moving means; and The holding member 25 is supported by the slider 24 of the second linear motor 23.

The holding member 25 is provided with a lower support member 26 supported by the slider 24 of the second linear motor 23, a rotary motor 27 supported by the lower support member 26, and an output shaft 27A supported by the rotary motor 27 ( Through shaft) upper support member 28.

With the configuration as described above, the holding means 20 moves the holding member 25 in an intersecting direction that intersects the direction in which the holding means 20 moves with the tension applying means. Way. Among these, the holding means 20 is provided so that a tension | tensile_strength can be provided based on the measurement result of the measuring means 40.

In the above separation device 10, a procedure for widening the mutual intervals of the plurality of wafers CP formed by the wafer WF will be described.

First, with respect to the separating device 10 shown by the solid line in FIG. 1 in which each member is waiting at an initial position, an integrated object WK is conveyed by an unillustrated conveying means such as a manual or articulated robot or a belt conveyor, and the integrated object The WK is placed so as to be placed on each of the lower supporting members 26. At this time, the measurement means 40 operates in conjunction with a positioning means (not shown) of the movable integrated body WK to perform positioning of the wafer WF and each holding member 25. Thereafter, each holding means 20 drives the rotation motor 27. As shown in FIG. 2, the lower support member 26 and the upper support member 28 are sandwiched between the sheet AS.

Next, the tension applying means drives the linear motor 30 to move each of the holding members 25 in four directions of the + X-axis direction, the + Y-axis direction, the -X-axis direction, and the -Y-axis direction, as shown in FIG. 3A. Thereby, the enclosing area AC in the adhesive sheet AS is given tension in four directions of + X-axis direction, + Y-axis direction, -X-axis direction, and -Y-axis direction, and the interval between the wafers CP is expanded. Next, if the measuring means 40 senses that the wafer CP located at the outermost periphery has reached a predetermined position, that is, the predetermined positions facing the two sides in the wafer WF (the wafer CP group whose distance is extended from each other) is expanded by individualization. (When the predetermined position facing the two sides is hereinafter referred to as the "reference position"). When the wide width becomes the predetermined width, the tension applying means stops the driving of the linear motor 30, and the measuring means 40 measures the chip CP. Spaced from each other.

Here, the non-interfering notch CU is formed in the AS sheet. Therefore, it is possible to suppress the situation where the tension in the combined direction of the tension directions is applied to the surrounding area AC as much as possible. However, subtle production still occurs at the interval between the wafer CPs. However, there is a case where each chip CP cannot be arranged at a theoretical position. Among them, the theoretical position of each chip CP refers to the The width of the reference position of the wafer WF that has been expanded and expanded is subtracted from the width of the reference position of the wafer WF before the expansion, and each is divided by the number of space lines formed between the plurality of wafers CP in the reference position. The subsequent values make the position of each wafer CP when each wafer CP is evenly expanded.

Therefore, based on the measurement result of the measurement means 40, each first moving means drives each first linear motor 21, and as shown in FIG. 3B, each holding member 25 is moved in the front-rear direction or left-right direction to adjust the interval between the holding members 25. In this way, the interval between the chips CP can be adjusted. In addition, each second moving means drives the second linear motor 23 and moves each holding member 25 in the left-right direction or the front-rear direction. The linear motor 30 applies tension in the direction in which the holding means 20 moves, thereby making it possible to adjust more densely. The wafers CP are spaced from each other. Thereby, each wafer CP is arrange | positioned at a theoretical position (the space | interval of each wafer CP should be made as uniform as possible).

Among them, when the mutual distance between the wafers CP is adjusted by the driving of the first linear motor 21 and the second linear motor 23, at least one of the holding members 25 can be moved, and the moving distances and directions of these can be the same. It can also be different.

Thereafter, a transporting means (not shown) such as a transporting device or a pick-up device holds and conveys each wafer CP based on a theoretical position, and loads the wafers CP on a load such as a lead frame or a substrate. Thereafter, when the transfer of all the wafers CP is completed, each of the holding means 20, the first and second moving means, and the tension applying means drives each driving device, and after returning each constituent member to the initial position, the transfer means recovers the wafer CP and is unloaded After the lower body WK is lowered, the same operation as above is repeated.

According to the embodiment described above, the holding means 20 is moved by the tension applying means to apply tension to the adhesive sheet AS, and the holding member 25 is used to apply the tension applying means in a direction intersecting with the direction in which the holding means 20 is moved. The tension can adjust the interval between the plurality of wafers CP formed by the wafer WF, and can prevent the positions of the wafers CP from shifting from the theoretical position as much as possible.

As shown above, the best configuration and method for implementing the present invention have been disclosed in the foregoing description, but the present invention is not limited to this. That is, the present invention is mainly illustrated and described with respect to specific embodiments, but does not depart from the scope of the technical idea and purpose of the present invention. For the above-mentioned embodiments, the shape, material, number, and other details are detailed. In the constitution, those skilled in the art can apply various deformations. In addition, the descriptions limiting the shapes, materials, etc. disclosed above are exemplified for easy understanding of the present invention, and are not intended to limit the present inventors. Therefore, they are not part or all of the names of members that are limited by such shapes, materials, etc. The description is included in the present invention.

The holding means 20 may be a holding means such as a mechanical chuck or a chuck cylinder, a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum aspirator, or a structure that supports the integrated body WK with an adhesive or magnetic force.

The holding means 20 may be two or three, and may be five or more.

The holding means 20 may include two or three holding members, or five or more holding members. The number of holding members 20 may be the same or different.

The intersecting direction in which each holding member 25 is moved may also be a line through a line. The direction of movement of the linear motor 30 and the holding means 20 is orthogonal, or may be an obliquely crossing direction. At this time, the crossing direction of at least one holding member may be an orthogonal direction, and the foregoing holding directions of other holding members may be orthogonal. The crossing direction is an oblique direction.

Each of the first moving means may first fix at least one of the holding members 25 so that the other holding members are moved in an orthogonal direction relative to the direction in which the holding means 20 is moved by the linear motor 30. At this time, it may not be provided. The first moving means for moving the fixed holding member.

The second moving means may first fix at least one of the holding members 25, and move the other holding members in the direction in which the holding means 20 is moved by the linear motor 30. At this time, there may be no provision for moving the fixed holding members. 2nd moving means.

The holding means 20 may not include the second moving means.

The tension applying means may first fix at least one of the holding means 20 and move the other holding means. At this time, the tension applying means may not be provided to move the fixed holding means.

The means for applying tension may be two or three, and may be five or more.

The measurement means 40 may not be provided. At this time, it is also possible to adjust the interval between the wafer CPs by adjusting the distance between the wafer CPs by different operators operating the holding means 20 and the tension applying means. Tension is applied under the same conditions.

Then, the shape of the sheet AS is shown as a two-dot chain line in FIG. 2, FIG. 3A, and FIG. 3B, and may be a quadrangle, an octagon, or other shapes.

The direction of the tension applied to the wafer WF may be 2 or 3 directions, or may be 5 or more directions. The holding means and the tension applying means may be provided in accordance with the number of the directions.

The shape of the plate-like member or the sheet-like body may be other shapes such as a circle, an oval, a triangle, or a polygon having a pentagon or more.

The material, type, shape, and the like of the adhesive sheet AS in the present invention are not particularly limited. For example, the subsequent sheet AS may also have other shapes such as a circle, an oval, a triangle, or a polygon having a pentagon or more. In addition, the adhesive sheet AS may be, for example, a single layer having only an adhesive layer, an intermediate layer between the base material and the adhesive layer, a three or more layers including a coating layer on the base material, or the like. The so-called two-sided adhesive sheet with the substrate peeled off from the adhesive layer may be a single-layered or multi-layered intermediate layer or a single-layered or multi-layered layer without an intermediate layer. In addition, in terms of plate-like members, for example, semiconductor wafers such as silicon semiconductor wafers or compound semiconductor wafers, circuit substrates, information recording substrates such as optical discs, glass plates, steel plates, ceramics, wooden boards, or resin plates Articles and the like can also be used as objects, and the sheet-like body may be one that has been fragmented. Among them, if the sheet AS is changed to read functionally or in terms of use, it may be, for example, any sheet, film, or tape such as a protective sheet, a dicing tape, a die attach film, or a sticky crystal tape.

As long as the means and processes in the present invention can achieve the actions, functions, or processes described with respect to these means and processes, there are no restrictions, and they are not completely limited to the one shown in the foregoing embodiments. The situation of the components or works. For example, if Those who hold the number holding means in at least two directions and give tension to the subsequent sheet are compared with the technical common sense at the time of application. If it is within the technical scope, there is no limitation (the description of other means and engineering is omitted).

In addition, in the foregoing embodiment, the driving machine may be a rotary motor, a direct-acting motor, a linear motor, a single-axis robot, a multi-joint robot, and other electric machines, air cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders. It is also possible to use a combination of actuators and the like directly or indirectly (there is also overlap with those exemplified in the embodiment).

Claims (4)

A separation device comprising a plate-shaped member attached to a sheet, which is provided with tension in at least two directions, and a separation device that widens the space between a plurality of sheet-like bodies formed by the plate-shaped member, comprising: : Each of a plurality of holding means for holding the adhesive sheet with a plurality of holding members; and a tension applying means for moving each of the holding means in the at least two directions to apply tension to the adhesive sheet, the holding means is set to be the same as the The tension applying means moves the holding member in an intersecting direction in which the direction in which the holding means moves crosses, thereby applying tension to the adhesive sheet in the intersecting direction. For example, in the first range of the patent application, each of the holding means includes: a first moving means for moving each of the plurality of holding members in the crossing direction; and moving the holding means with the tension applying means. The direction is a plurality of second moving means for moving the plurality of holding members. For example, if there is a separation device in the first or second scope of the patent application, there is a measuring means for measuring the interval between the sheet-like bodies, and the plurality of holding members are configured to provide tension based on the measurement results of the measuring means. And set. A separation method in which a plate-like member on an adhesive sheet is provided with tension in at least two directions to widen the interval between a plurality of sheet-like bodies formed by the plate-like member, and is characterized in that: : A process of holding the bonding sheet by a plurality of holding means including a plurality of holding members; a process of applying tension to the holding sheet by moving the holding means in at least two directions by a tension applying means; and applying a tension to the bonding sheet; A method of moving the holding member in a crossing direction in which the moving direction of the holding means intersects and moving the holding member to thereby apply tension to the bonding sheet in the crossing direction.