TWI661928B - 光學顯示裝置之生產系統 - Google Patents

光學顯示裝置之生產系統 Download PDF

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Publication number
TWI661928B
TWI661928B TW103115928A TW103115928A TWI661928B TW I661928 B TWI661928 B TW I661928B TW 103115928 A TW103115928 A TW 103115928A TW 103115928 A TW103115928 A TW 103115928A TW I661928 B TWI661928 B TW I661928B
Authority
TW
Taiwan
Prior art keywords
bonding
sheet
optical
optical display
liquid crystal
Prior art date
Application number
TW103115928A
Other languages
English (en)
Chinese (zh)
Other versions
TW201444670A (zh
Inventor
土岡達也
陳廷槐
Original Assignee
住友化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友化學股份有限公司 filed Critical 住友化學股份有限公司
Publication of TW201444670A publication Critical patent/TW201444670A/zh
Application granted granted Critical
Publication of TWI661928B publication Critical patent/TWI661928B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/42—Polarizing, birefringent, filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/162—Cleaning
TW103115928A 2013-05-17 2014-05-05 光學顯示裝置之生產系統 TWI661928B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013105585 2013-05-17
JP2013-105585 2013-05-17

Publications (2)

Publication Number Publication Date
TW201444670A TW201444670A (zh) 2014-12-01
TWI661928B true TWI661928B (zh) 2019-06-11

Family

ID=51898088

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103115928A TWI661928B (zh) 2013-05-17 2014-05-05 光學顯示裝置之生產系統

Country Status (5)

Country Link
JP (1) JP5724152B1 (ja)
KR (1) KR102098431B1 (ja)
CN (1) CN105210135B (ja)
TW (1) TWI661928B (ja)
WO (1) WO2014185100A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101398102B1 (ko) * 2014-01-27 2014-05-28 한동희 패널 부착장치
NL2020364B1 (en) 2018-01-31 2019-08-07 Airborne Int B V Device and method for handling sheets of fiber reinforced material
NL2020362B1 (en) * 2018-01-31 2019-08-07 Airborne Int B V Manufacturing layered products
NL2020361B1 (en) 2018-01-31 2019-08-07 Airborne Int B V Tape sectioning system and method of sectioning tape
JP2020167256A (ja) * 2019-03-29 2020-10-08 日本電産サンキョー株式会社 パネル搬送装置およびパネル搬送システム
KR102507268B1 (ko) * 2021-04-26 2023-03-07 (주)에스티아이 라미네이션 시스템
CN114483740A (zh) * 2022-01-27 2022-05-13 京东方科技集团股份有限公司 用于框贴的全自动贴合装置、贴合方法及显示装置
CN114677926A (zh) * 2022-03-11 2022-06-28 武汉精立电子技术有限公司 一种微显示器的贴合系统及贴合方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1470890A (zh) * 2002-06-28 2004-01-28 ��ʿ��Ƭ��ʽ���� 偏振片粘合方法及装置

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Publication number Priority date Publication date Assignee Title
JPS4723045Y1 (ja) 1968-07-23 1972-07-25
JP3666820B2 (ja) * 1994-09-19 2005-06-29 株式会社大久保製作所 偏光板の貼り付け装置
JP2004271785A (ja) * 2003-03-07 2004-09-30 Takatori Corp 液晶パネルへの偏光板貼り付け装置および偏光板貼り付け方法
JP2008191438A (ja) * 2007-02-06 2008-08-21 Hitachi High-Technologies Corp 光学フィルム貼付け方法、光学フィルム貼付け装置、及び表示用パネルの製造方法
WO2009128115A1 (ja) * 2008-04-15 2009-10-22 日東電工株式会社 光学フィルム積層体ロールならびにその製造方法および装置
KR101420308B1 (ko) * 2008-06-04 2014-07-17 동우 화인켐 주식회사 액정표시패널의 제조방법 및 그 제조방법이 구현된 시스템
JP4503691B1 (ja) * 2009-10-13 2010-07-14 日東電工株式会社 液層表示素子の連続製造方法及び装置
JP2011257463A (ja) * 2010-06-07 2011-12-22 Yodogawa Medec Co Ltd 偏光板貼付け装置及び該装置を用いた偏光板貼付け方法
JP4723045B1 (ja) * 2010-06-24 2011-07-13 日東電工株式会社 液晶表示パネルの連続製造システムおよび液晶表示パネルの連続製造方法
KR101267243B1 (ko) * 2011-09-01 2013-05-23 주식회사 성진하이메크 피씨비 본딩 장치 및 피씨비 본딩 방법
KR101318179B1 (ko) * 2012-03-30 2013-10-16 주식회사 에스에프에이 릴투패널 편광필름 부착 장치 및 그 방법

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1470890A (zh) * 2002-06-28 2004-01-28 ��ʿ��Ƭ��ʽ���� 偏振片粘合方法及装置

Also Published As

Publication number Publication date
CN105210135B (zh) 2017-12-19
KR102098431B1 (ko) 2020-04-07
TW201444670A (zh) 2014-12-01
JP5724152B1 (ja) 2015-05-27
CN105210135A (zh) 2015-12-30
JPWO2014185100A1 (ja) 2017-02-23
WO2014185100A1 (ja) 2014-11-20
KR20160009561A (ko) 2016-01-26

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