TWI661925B - 壓印裝置、壓印方法及物品的製造方法 - Google Patents

壓印裝置、壓印方法及物品的製造方法 Download PDF

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Publication number
TWI661925B
TWI661925B TW106135607A TW106135607A TWI661925B TW I661925 B TWI661925 B TW I661925B TW 106135607 A TW106135607 A TW 106135607A TW 106135607 A TW106135607 A TW 106135607A TW I661925 B TWI661925 B TW I661925B
Authority
TW
Taiwan
Prior art keywords
mold
substrate
gas
platform
peripheral member
Prior art date
Application number
TW106135607A
Other languages
English (en)
Chinese (zh)
Other versions
TW201819153A (zh
Inventor
中川一樹
Original Assignee
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW201819153A publication Critical patent/TW201819153A/zh
Application granted granted Critical
Publication of TWI661925B publication Critical patent/TWI661925B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106135607A 2016-11-18 2017-10-18 壓印裝置、壓印方法及物品的製造方法 TWI661925B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-225375 2016-11-18
JP2016225375A JP6735656B2 (ja) 2016-11-18 2016-11-18 インプリント装置、インプリント方法及び物品の製造方法

Publications (2)

Publication Number Publication Date
TW201819153A TW201819153A (zh) 2018-06-01
TWI661925B true TWI661925B (zh) 2019-06-11

Family

ID=62146147

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106135607A TWI661925B (zh) 2016-11-18 2017-10-18 壓印裝置、壓印方法及物品的製造方法

Country Status (5)

Country Link
US (1) US11333971B2 (enExample)
JP (1) JP6735656B2 (enExample)
KR (1) KR102179737B1 (enExample)
TW (1) TWI661925B (enExample)
WO (1) WO2018092454A1 (enExample)

Cited By (1)

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US20230386849A1 (en) * 2022-05-31 2023-11-30 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article

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Publication number Priority date Publication date Assignee Title
JP7149872B2 (ja) * 2019-02-14 2022-10-07 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
US11181819B2 (en) 2019-05-31 2021-11-23 Canon Kabushiki Kaisha Frame curing method for extrusion control
JP7386742B2 (ja) * 2020-03-24 2023-11-27 株式会社Ｓｃｒｅｅｎホールディングス 露光装置
US12353127B2 (en) * 2021-04-14 2025-07-08 Canon Kabushiki Kaisha Imprint apparatus, imprint method and article manufacturing method
TWI837607B (zh) * 2022-03-10 2024-04-01 永嘉光電股份有限公司 大規模壓印之方法
JP7731831B2 (ja) 2022-03-11 2025-09-01 キオクシア株式会社 インプリント方法、半導体装置の製造方法、及びインプリント装置

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2015115413A (ja) * 2013-12-10 2015-06-22 キヤノン株式会社 インプリント装置及び物品の製造方法

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FR2133154A5 (enExample) 1971-04-09 1972-11-24 Cii
JP2007098779A (ja) 2005-10-05 2007-04-19 Nikon Corp 樹脂の剥離方法及びパターン転写装置
JP5137635B2 (ja) * 2007-03-16 2013-02-06 キヤノン株式会社 インプリント方法、チップの製造方法及びインプリント装置
JP5235506B2 (ja) 2008-06-02 2013-07-10 キヤノン株式会社 パターン転写装置及びデバイス製造方法
JP5868215B2 (ja) * 2012-02-27 2016-02-24 キヤノン株式会社 インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP6123396B2 (ja) * 2013-03-18 2017-05-10 大日本印刷株式会社 インプリント方法およびインプリント装置
JP2016031952A (ja) * 2014-07-25 2016-03-07 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6661397B2 (ja) * 2015-04-22 2020-03-11 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6603678B2 (ja) * 2016-02-26 2019-11-06 キヤノン株式会社 インプリント装置およびその動作方法ならびに物品製造方法
JP6643145B2 (ja) * 2016-02-29 2020-02-12 キヤノン株式会社 インプリント装置、モールド、インプリント方法及び物品の製造方法
JP6732475B2 (ja) * 2016-02-29 2020-07-29 キヤノン株式会社 インプリント装置、物品の製造方法、保持装置および露光装置
JP6704769B2 (ja) * 2016-03-29 2020-06-03 キヤノン株式会社 インプリント装置、および物品の製造方法
US10754244B2 (en) * 2016-03-31 2020-08-25 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015115413A (ja) * 2013-12-10 2015-06-22 キヤノン株式会社 インプリント装置及び物品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230386849A1 (en) * 2022-05-31 2023-11-30 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article
US12463042B2 (en) * 2022-05-31 2025-11-04 Canon Kabushiki Kaisha Planarization system and method

Also Published As

Publication number Publication date
KR102179737B1 (ko) 2020-11-17
JP6735656B2 (ja) 2020-08-05
WO2018092454A1 (ja) 2018-05-24
US20190265589A1 (en) 2019-08-29
JP2018082127A (ja) 2018-05-24
US11333971B2 (en) 2022-05-17
TW201819153A (zh) 2018-06-01
KR20190073573A (ko) 2019-06-26

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