JP6735656B2 - インプリント装置、インプリント方法及び物品の製造方法 - Google Patents

インプリント装置、インプリント方法及び物品の製造方法 Download PDF

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Publication number
JP6735656B2
JP6735656B2 JP2016225375A JP2016225375A JP6735656B2 JP 6735656 B2 JP6735656 B2 JP 6735656B2 JP 2016225375 A JP2016225375 A JP 2016225375A JP 2016225375 A JP2016225375 A JP 2016225375A JP 6735656 B2 JP6735656 B2 JP 6735656B2
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JP
Japan
Prior art keywords
mold
gas
substrate
imprint
imprint material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016225375A
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English (en)
Japanese (ja)
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JP2018082127A5 (enExample
JP2018082127A (ja
Inventor
一樹 中川
一樹 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016225375A priority Critical patent/JP6735656B2/ja
Priority to KR1020197016503A priority patent/KR102179737B1/ko
Priority to PCT/JP2017/036246 priority patent/WO2018092454A1/ja
Priority to TW106135607A priority patent/TWI661925B/zh
Publication of JP2018082127A publication Critical patent/JP2018082127A/ja
Priority to US16/408,586 priority patent/US11333971B2/en
Publication of JP2018082127A5 publication Critical patent/JP2018082127A5/ja
Application granted granted Critical
Publication of JP6735656B2 publication Critical patent/JP6735656B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2016225375A 2016-11-18 2016-11-18 インプリント装置、インプリント方法及び物品の製造方法 Active JP6735656B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016225375A JP6735656B2 (ja) 2016-11-18 2016-11-18 インプリント装置、インプリント方法及び物品の製造方法
KR1020197016503A KR102179737B1 (ko) 2016-11-18 2017-10-05 임프린트 장치, 임프린트 방법, 및 물품 제조 방법
PCT/JP2017/036246 WO2018092454A1 (ja) 2016-11-18 2017-10-05 インプリント装置、インプリント方法及び物品の製造方法
TW106135607A TWI661925B (zh) 2016-11-18 2017-10-18 壓印裝置、壓印方法及物品的製造方法
US16/408,586 US11333971B2 (en) 2016-11-18 2019-05-10 Imprint apparatus, imprint method, and method of manufacturing article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016225375A JP6735656B2 (ja) 2016-11-18 2016-11-18 インプリント装置、インプリント方法及び物品の製造方法

Publications (3)

Publication Number Publication Date
JP2018082127A JP2018082127A (ja) 2018-05-24
JP2018082127A5 JP2018082127A5 (enExample) 2019-12-19
JP6735656B2 true JP6735656B2 (ja) 2020-08-05

Family

ID=62146147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016225375A Active JP6735656B2 (ja) 2016-11-18 2016-11-18 インプリント装置、インプリント方法及び物品の製造方法

Country Status (5)

Country Link
US (1) US11333971B2 (enExample)
JP (1) JP6735656B2 (enExample)
KR (1) KR102179737B1 (enExample)
TW (1) TWI661925B (enExample)
WO (1) WO2018092454A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12072622B2 (en) 2022-03-11 2024-08-27 Kioxia Corporation Imprint method, method of manufacturing semiconductor device, and imprint device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7149872B2 (ja) * 2019-02-14 2022-10-07 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
US11181819B2 (en) 2019-05-31 2021-11-23 Canon Kabushiki Kaisha Frame curing method for extrusion control
JP7386742B2 (ja) * 2020-03-24 2023-11-27 株式会社Ｓｃｒｅｅｎホールディングス 露光装置
US12353127B2 (en) * 2021-04-14 2025-07-08 Canon Kabushiki Kaisha Imprint apparatus, imprint method and article manufacturing method
TWI837607B (zh) * 2022-03-10 2024-04-01 永嘉光電股份有限公司 大規模壓印之方法
US12463042B2 (en) * 2022-05-31 2025-11-04 Canon Kabushiki Kaisha Planarization system and method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2133154A5 (enExample) 1971-04-09 1972-11-24 Cii
JP2007098779A (ja) 2005-10-05 2007-04-19 Nikon Corp 樹脂の剥離方法及びパターン転写装置
JP5137635B2 (ja) * 2007-03-16 2013-02-06 キヤノン株式会社 インプリント方法、チップの製造方法及びインプリント装置
JP5235506B2 (ja) 2008-06-02 2013-07-10 キヤノン株式会社 パターン転写装置及びデバイス製造方法
JP5868215B2 (ja) * 2012-02-27 2016-02-24 キヤノン株式会社 インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP6123396B2 (ja) * 2013-03-18 2017-05-10 大日本印刷株式会社 インプリント方法およびインプリント装置
JP5865340B2 (ja) 2013-12-10 2016-02-17 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2016031952A (ja) * 2014-07-25 2016-03-07 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6661397B2 (ja) * 2015-04-22 2020-03-11 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6603678B2 (ja) * 2016-02-26 2019-11-06 キヤノン株式会社 インプリント装置およびその動作方法ならびに物品製造方法
JP6643145B2 (ja) * 2016-02-29 2020-02-12 キヤノン株式会社 インプリント装置、モールド、インプリント方法及び物品の製造方法
JP6732475B2 (ja) * 2016-02-29 2020-07-29 キヤノン株式会社 インプリント装置、物品の製造方法、保持装置および露光装置
JP6704769B2 (ja) * 2016-03-29 2020-06-03 キヤノン株式会社 インプリント装置、および物品の製造方法
US10754244B2 (en) * 2016-03-31 2020-08-25 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12072622B2 (en) 2022-03-11 2024-08-27 Kioxia Corporation Imprint method, method of manufacturing semiconductor device, and imprint device

Also Published As

Publication number Publication date
KR102179737B1 (ko) 2020-11-17
TWI661925B (zh) 2019-06-11
WO2018092454A1 (ja) 2018-05-24
US20190265589A1 (en) 2019-08-29
JP2018082127A (ja) 2018-05-24
US11333971B2 (en) 2022-05-17
TW201819153A (zh) 2018-06-01
KR20190073573A (ko) 2019-06-26

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