TWI661324B - 用於分析目標之系統、方法及設備 - Google Patents

用於分析目標之系統、方法及設備 Download PDF

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Publication number
TWI661324B
TWI661324B TW103143368A TW103143368A TWI661324B TW I661324 B TWI661324 B TW I661324B TW 103143368 A TW103143368 A TW 103143368A TW 103143368 A TW103143368 A TW 103143368A TW I661324 B TWI661324 B TW I661324B
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Taiwan
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target
measurement
parameters
targets
measurements
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TW103143368A
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English (en)
Chinese (zh)
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TW201535137A (zh
Inventor
麥克Ｅ 艾黛兒
紐瑞爾 艾米爾
馬克 吉納渥克
塔爾 夏斯特曼
大衛 格瑞奧迪
瑟吉 博羅迪揚斯凱
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克萊譚克公司
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Drying Of Semiconductors (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
TW103143368A 2013-12-11 2014-12-11 用於分析目標之系統、方法及設備 TWI661324B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361914950P 2013-12-11 2013-12-11
US61/914,950 2013-12-11

Publications (2)

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TW201535137A TW201535137A (zh) 2015-09-16
TWI661324B true TWI661324B (zh) 2019-06-01

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TW103143368A TWI661324B (zh) 2013-12-11 2014-12-11 用於分析目標之系統、方法及設備

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US (1) US10726169B2 (enExample)
JP (1) JP6509225B2 (enExample)
KR (1) KR102265868B1 (enExample)
CN (1) CN105830069B (enExample)
SG (1) SG10201804964TA (enExample)
TW (1) TWI661324B (enExample)
WO (1) WO2015089231A1 (enExample)

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CN112698551B (zh) * 2014-11-25 2024-04-23 科磊股份有限公司 分析及利用景观
US9903711B2 (en) * 2015-04-06 2018-02-27 KLA—Tencor Corporation Feed forward of metrology data in a metrology system
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EA037650B1 (ru) * 2016-10-18 2021-04-27 Райфенхойзер Гмбх Унд Ко. Кг Машиненфабрик Способ контроля производственного процесса, способ косвенного выведения систематической зависимости, способ адаптации качества, способ запуска производственного процесса, способ и установка для изготовления экструзионного продукта
US10527952B2 (en) * 2016-10-25 2020-01-07 Kla-Tencor Corporation Fault discrimination and calibration of scatterometry overlay targets
JP6798263B2 (ja) * 2016-11-14 2020-12-09 富士通株式会社 シミュレーション支援装置、シミュレーション支援方法、およびシミュレーション支援プログラム
CN110249268B (zh) 2017-02-02 2021-08-24 Asml荷兰有限公司 量测方法和设备以及关联的计算机产品
US20230214690A1 (en) * 2017-06-12 2023-07-06 Palantir Technologies Inc. Database systems and user interfaces for processing discrete data items with statistical models associated with continuous processes
JP7097757B2 (ja) 2017-06-18 2022-07-08 コベンター・インコーポレーテッド 仮想半導体デバイス製作環境におけるキーパラメータ識別、プロセスモデル較正、及び変動性解析のためのシステムと方法
US10699969B2 (en) * 2017-08-30 2020-06-30 Kla-Tencor Corporation Quick adjustment of metrology measurement parameters according to process variation
KR102327116B1 (ko) * 2017-08-30 2021-11-16 케이엘에이 코포레이션 프로세스 변동에 따른 계측 측정 파라미터들의 신속한 조정
EP3624068A1 (en) * 2018-09-14 2020-03-18 Covestro Deutschland AG Method for improving prediction relating to the production of a polymer-ic produc
DE102018128254A1 (de) * 2018-11-12 2020-05-14 Endress+Hauser SE+Co. KG Verfahren zur Verbesserung derMessperformance eines zu konfigurierenden Feldgeräts der Automatisierungstechnik
CN109933854B (zh) * 2019-02-15 2023-07-07 中国北方车辆研究所 一种基于情境需求的移动机器人设计方法
TWI831968B (zh) * 2019-05-10 2024-02-11 美商科文特股份有限公司 虛擬半導體裝置製造環境中之製程窗的最佳化系統及方法
DE102019207059A1 (de) * 2019-05-15 2020-11-19 Siemens Aktiengesellschaft Verfahren zur Validierung von Systemparametern eines Energiesystems, Verfahren zum Betrieb eines Energiesystems sowie Energiemanagementsystem für ein Energiesystem
US11727159B2 (en) * 2019-05-15 2023-08-15 Lawrence Livermore National Security, Llc Mission-driven design methodology for optical systems
US11360397B2 (en) 2019-09-17 2022-06-14 Kla Corporation System and method for application of harmonic detectivity as a quality indicator for imaging-based overlay measurements
CN110991101B (zh) * 2019-11-15 2022-08-02 湖南城市学院 一种压缩式压电加速度计结构优化设计方法
CN111160489A (zh) * 2020-01-02 2020-05-15 中冶赛迪重庆信息技术有限公司 基于大数据的多维对标分析服务器、系统、方法及电子终端
US11686576B2 (en) 2020-06-04 2023-06-27 Kla Corporation Metrology target for one-dimensional measurement of periodic misregistration
CN111863652B (zh) * 2020-07-31 2024-05-03 华天科技（西安）有限公司 一种弹坑超敏感产品生产参数优化方法
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US20060290947A1 (en) * 2005-06-16 2006-12-28 Timbre Technologies, Inc. Optical metrology model optimization for repetitive structures
US20100175033A1 (en) * 2009-01-08 2010-07-08 Kla-Tencor Corporation Scatterometry metrology target design optimization

Also Published As

Publication number Publication date
JP6509225B2 (ja) 2019-05-08
KR20160096118A (ko) 2016-08-12
US10726169B2 (en) 2020-07-28
SG10201804964TA (en) 2018-07-30
CN105830069B (zh) 2021-04-20
CN105830069A (zh) 2016-08-03
TW201535137A (zh) 2015-09-16
WO2015089231A1 (en) 2015-06-18
KR102265868B1 (ko) 2021-06-16
US20160042105A1 (en) 2016-02-11
JP2017508273A (ja) 2017-03-23

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