KR102265868B1 - 요건에 대한 타겟 및 프로세스 감도 분석 - Google Patents

요건에 대한 타겟 및 프로세스 감도 분석 Download PDF

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KR102265868B1
KR102265868B1 KR1020167017463A KR20167017463A KR102265868B1 KR 102265868 B1 KR102265868 B1 KR 102265868B1 KR 1020167017463 A KR1020167017463 A KR 1020167017463A KR 20167017463 A KR20167017463 A KR 20167017463A KR 102265868 B1 KR102265868 B1 KR 102265868B1
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parameters
targets
metrics
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KR20160096118A (ko
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미카엘 이. 아델
누리엘 아미르
마크 기노브커
탈 슈스터만
데이비드 그레디
세르게이 보로디얀스키
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation

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  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
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  • Drying Of Semiconductors (AREA)
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KR1020167017463A 2013-12-11 2014-12-10 요건에 대한 타겟 및 프로세스 감도 분석 Active KR102265868B1 (ko)

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US201361914950P 2013-12-11 2013-12-11
US61/914,950 2013-12-11
PCT/US2014/069617 WO2015089231A1 (en) 2013-12-11 2014-12-10 Target and process sensitivity analysis to requirements

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KR20160096118A KR20160096118A (ko) 2016-08-12
KR102265868B1 true KR102265868B1 (ko) 2021-06-16

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US (1) US10726169B2 (enExample)
JP (1) JP6509225B2 (enExample)
KR (1) KR102265868B1 (enExample)
CN (1) CN105830069B (enExample)
SG (1) SG10201804964TA (enExample)
TW (1) TWI661324B (enExample)
WO (1) WO2015089231A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101906289B1 (ko) * 2014-02-21 2018-10-10 에이에스엠엘 네델란즈 비.브이. 리소그래피를 수반하는 제조 공정을 위한 공정 파라미터의 측정
CN112698551B (zh) * 2014-11-25 2024-04-23 科磊股份有限公司 分析及利用景观
US9903711B2 (en) * 2015-04-06 2018-02-27 KLA—Tencor Corporation Feed forward of metrology data in a metrology system
WO2017114662A1 (en) * 2015-12-31 2017-07-06 Asml Netherlands B.V. Selection of measurement locations for patterning processes
CN112255892B (zh) * 2016-02-22 2023-07-18 Asml荷兰有限公司 对量测数据的贡献的分离
CN109923476B (zh) * 2016-09-01 2021-11-19 Asml荷兰有限公司 量测目标测量选配方案的自动选择
EA037650B1 (ru) * 2016-10-18 2021-04-27 Райфенхойзер Гмбх Унд Ко. Кг Машиненфабрик Способ контроля производственного процесса, способ косвенного выведения систематической зависимости, способ адаптации качества, способ запуска производственного процесса, способ и установка для изготовления экструзионного продукта
US10527952B2 (en) * 2016-10-25 2020-01-07 Kla-Tencor Corporation Fault discrimination and calibration of scatterometry overlay targets
JP6798263B2 (ja) * 2016-11-14 2020-12-09 富士通株式会社 シミュレーション支援装置、シミュレーション支援方法、およびシミュレーション支援プログラム
CN110249268B (zh) 2017-02-02 2021-08-24 Asml荷兰有限公司 量测方法和设备以及关联的计算机产品
US20230214690A1 (en) * 2017-06-12 2023-07-06 Palantir Technologies Inc. Database systems and user interfaces for processing discrete data items with statistical models associated with continuous processes
JP7097757B2 (ja) 2017-06-18 2022-07-08 コベンター・インコーポレーテッド 仮想半導体デバイス製作環境におけるキーパラメータ識別、プロセスモデル較正、及び変動性解析のためのシステムと方法
US10699969B2 (en) * 2017-08-30 2020-06-30 Kla-Tencor Corporation Quick adjustment of metrology measurement parameters according to process variation
KR102327116B1 (ko) * 2017-08-30 2021-11-16 케이엘에이 코포레이션 프로세스 변동에 따른 계측 측정 파라미터들의 신속한 조정
EP3624068A1 (en) * 2018-09-14 2020-03-18 Covestro Deutschland AG Method for improving prediction relating to the production of a polymer-ic produc
DE102018128254A1 (de) * 2018-11-12 2020-05-14 Endress+Hauser SE+Co. KG Verfahren zur Verbesserung derMessperformance eines zu konfigurierenden Feldgeräts der Automatisierungstechnik
CN109933854B (zh) * 2019-02-15 2023-07-07 中国北方车辆研究所 一种基于情境需求的移动机器人设计方法
TWI831968B (zh) * 2019-05-10 2024-02-11 美商科文特股份有限公司 虛擬半導體裝置製造環境中之製程窗的最佳化系統及方法
DE102019207059A1 (de) * 2019-05-15 2020-11-19 Siemens Aktiengesellschaft Verfahren zur Validierung von Systemparametern eines Energiesystems, Verfahren zum Betrieb eines Energiesystems sowie Energiemanagementsystem für ein Energiesystem
US11727159B2 (en) * 2019-05-15 2023-08-15 Lawrence Livermore National Security, Llc Mission-driven design methodology for optical systems
US11360397B2 (en) 2019-09-17 2022-06-14 Kla Corporation System and method for application of harmonic detectivity as a quality indicator for imaging-based overlay measurements
CN110991101B (zh) * 2019-11-15 2022-08-02 湖南城市学院 一种压缩式压电加速度计结构优化设计方法
CN111160489A (zh) * 2020-01-02 2020-05-15 中冶赛迪重庆信息技术有限公司 基于大数据的多维对标分析服务器、系统、方法及电子终端
US11686576B2 (en) 2020-06-04 2023-06-27 Kla Corporation Metrology target for one-dimensional measurement of periodic misregistration
CN111863652B (zh) * 2020-07-31 2024-05-03 华天科技（西安）有限公司 一种弹坑超敏感产品生产参数优化方法
JP2023550904A (ja) 2020-11-27 2023-12-06 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジ方法並びに関連付けられたメトロロジ及びリソグラフィ装置
US12530183B2 (en) 2022-08-30 2026-01-20 T-Mobile Usa, Inc. Framework for automated productization in telecommunications networks

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060290947A1 (en) * 2005-06-16 2006-12-28 Timbre Technologies, Inc. Optical metrology model optimization for repetitive structures
US20100175033A1 (en) * 2009-01-08 2010-07-08 Kla-Tencor Corporation Scatterometry metrology target design optimization

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06332976A (ja) * 1993-05-25 1994-12-02 Mitsubishi Electric Corp モデルパラメータ抽出装置
US6411373B1 (en) * 1999-10-08 2002-06-25 Instrumentation Metrics, Inc. Fiber optic illumination and detection patterns, shapes, and locations for use in spectroscopic analysis
US6853942B2 (en) * 2002-03-26 2005-02-08 Timbre Technologies, Inc. Metrology hardware adaptation with universal library
US7330279B2 (en) * 2002-07-25 2008-02-12 Timbre Technologies, Inc. Model and parameter selection for optical metrology
US6834213B1 (en) * 2003-01-06 2004-12-21 Advanced Micro Devices, Inc. Process control based upon a metrology delay
US7171284B2 (en) * 2004-09-21 2007-01-30 Timbre Technologies, Inc. Optical metrology model optimization based on goals
US7925486B2 (en) * 2006-03-14 2011-04-12 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
EP3779598B1 (en) * 2011-04-06 2022-12-21 Kla-Tencor Corporation Method for providing a set of process tool correctables
US10255385B2 (en) * 2012-03-28 2019-04-09 Kla-Tencor Corporation Model optimization approach based on spectral sensitivity
SG11201604641PA (en) * 2013-12-30 2016-07-28 Asml Netherlands Bv Method and apparatus for design of a metrology target

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060290947A1 (en) * 2005-06-16 2006-12-28 Timbre Technologies, Inc. Optical metrology model optimization for repetitive structures
US20100175033A1 (en) * 2009-01-08 2010-07-08 Kla-Tencor Corporation Scatterometry metrology target design optimization

Also Published As

Publication number Publication date
JP6509225B2 (ja) 2019-05-08
KR20160096118A (ko) 2016-08-12
US10726169B2 (en) 2020-07-28
TWI661324B (zh) 2019-06-01
SG10201804964TA (en) 2018-07-30
CN105830069B (zh) 2021-04-20
CN105830069A (zh) 2016-08-03
TW201535137A (zh) 2015-09-16
WO2015089231A1 (en) 2015-06-18
US20160042105A1 (en) 2016-02-11
JP2017508273A (ja) 2017-03-23

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