JP6509225B2 - 要件に対するターゲット及びプロセス感度の分析 - Google Patents

要件に対するターゲット及びプロセス感度の分析 Download PDF

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JP6509225B2
JP6509225B2 JP2016538764A JP2016538764A JP6509225B2 JP 6509225 B2 JP6509225 B2 JP 6509225B2 JP 2016538764 A JP2016538764 A JP 2016538764A JP 2016538764 A JP2016538764 A JP 2016538764A JP 6509225 B2 JP6509225 B2 JP 6509225B2
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target
parameters
metrology
measurement
metric
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JP2017508273A5 (enExample
JP2017508273A (ja
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マイケル イー アデル
マイケル イー アデル
ヌリエル アミール
ヌリエル アミール
マーク ジノフカー
マーク ジノフカー
タル シャスターマン
タル シャスターマン
デービット グレディ
デービット グレディ
セルゲイ ボロディヤンスキー
セルゲイ ボロディヤンスキー
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KLA Corp
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KLA Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Drying Of Semiconductors (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
JP2016538764A 2013-12-11 2014-12-10 要件に対するターゲット及びプロセス感度の分析 Active JP6509225B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361914950P 2013-12-11 2013-12-11
US61/914,950 2013-12-11
PCT/US2014/069617 WO2015089231A1 (en) 2013-12-11 2014-12-10 Target and process sensitivity analysis to requirements

Publications (3)

Publication Number Publication Date
JP2017508273A JP2017508273A (ja) 2017-03-23
JP2017508273A5 JP2017508273A5 (enExample) 2019-03-14
JP6509225B2 true JP6509225B2 (ja) 2019-05-08

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JP2016538764A Active JP6509225B2 (ja) 2013-12-11 2014-12-10 要件に対するターゲット及びプロセス感度の分析

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US (1) US10726169B2 (enExample)
JP (1) JP6509225B2 (enExample)
KR (1) KR102265868B1 (enExample)
CN (1) CN105830069B (enExample)
SG (1) SG10201804964TA (enExample)
TW (1) TWI661324B (enExample)
WO (1) WO2015089231A1 (enExample)

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US9903711B2 (en) * 2015-04-06 2018-02-27 KLA—Tencor Corporation Feed forward of metrology data in a metrology system
US10962886B2 (en) 2015-12-31 2021-03-30 Asml Netherlands B.V. Selection of measurement locations for patterning processes
CN108700823B (zh) * 2016-02-22 2020-11-27 Asml荷兰有限公司 对量测数据的贡献的分离
CN109923476B (zh) * 2016-09-01 2021-11-19 Asml荷兰有限公司 量测目标测量选配方案的自动选择
JP7179722B2 (ja) * 2016-10-18 2022-11-29 ライフェンホイザー・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング・ウント・コンパニー・コマンデイトゲゼルシャフト・マシイネンファブリーク 製造プロセスの監視方法、系統的依存性の間接的な推定方法、品質の適合方法、製造プロセスの開始方法、押出製品の製造方法、および押出製品の製造システム
US10527952B2 (en) * 2016-10-25 2020-01-07 Kla-Tencor Corporation Fault discrimination and calibration of scatterometry overlay targets
JP6798263B2 (ja) * 2016-11-14 2020-12-09 富士通株式会社 シミュレーション支援装置、シミュレーション支援方法、およびシミュレーション支援プログラム
WO2018141503A1 (en) 2017-02-02 2018-08-09 Asml Netherlands B.V. Metrology method and apparatus and associated computer product
US20230214690A1 (en) * 2017-06-12 2023-07-06 Palantir Technologies Inc. Database systems and user interfaces for processing discrete data items with statistical models associated with continuous processes
US11144701B2 (en) 2017-06-18 2021-10-12 Coventor, Inc. System and method for key parameter identification, process model calibration and variability analysis in a virtual semiconductor device fabrication environment
US10699969B2 (en) * 2017-08-30 2020-06-30 Kla-Tencor Corporation Quick adjustment of metrology measurement parameters according to process variation
EP3624068A1 (en) * 2018-09-14 2020-03-18 Covestro Deutschland AG Method for improving prediction relating to the production of a polymer-ic produc
DE102018128254A1 (de) * 2018-11-12 2020-05-14 Endress+Hauser SE+Co. KG Verfahren zur Verbesserung derMessperformance eines zu konfigurierenden Feldgeräts der Automatisierungstechnik
CN109933854B (zh) * 2019-02-15 2023-07-07 中国北方车辆研究所 一种基于情境需求的移动机器人设计方法
TWI866734B (zh) * 2019-05-10 2024-12-11 美商科文特股份有限公司 虛擬半導體裝置製造環境中之製程窗的最佳化系統及方法
US11727159B2 (en) * 2019-05-15 2023-08-15 Lawrence Livermore National Security, Llc Mission-driven design methodology for optical systems
DE102019207059A1 (de) * 2019-05-15 2020-11-19 Siemens Aktiengesellschaft Verfahren zur Validierung von Systemparametern eines Energiesystems, Verfahren zum Betrieb eines Energiesystems sowie Energiemanagementsystem für ein Energiesystem
US11360397B2 (en) * 2019-09-17 2022-06-14 Kla Corporation System and method for application of harmonic detectivity as a quality indicator for imaging-based overlay measurements
CN110991101B (zh) * 2019-11-15 2022-08-02 湖南城市学院 一种压缩式压电加速度计结构优化设计方法
CN111160489A (zh) * 2020-01-02 2020-05-15 中冶赛迪重庆信息技术有限公司 基于大数据的多维对标分析服务器、系统、方法及电子终端
US11686576B2 (en) 2020-06-04 2023-06-27 Kla Corporation Metrology target for one-dimensional measurement of periodic misregistration
CN111863652B (zh) * 2020-07-31 2024-05-03 华天科技（西安）有限公司 一种弹坑超敏感产品生产参数优化方法
CN116529673A (zh) 2020-11-27 2023-08-01 Asml荷兰有限公司 量测方法及相关量测和光刻装置
US20230083184A1 (en) * 2021-09-10 2023-03-16 International Business Machines Corporation Optimization of processes for manufacturing amorphous silicon

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US6411373B1 (en) * 1999-10-08 2002-06-25 Instrumentation Metrics, Inc. Fiber optic illumination and detection patterns, shapes, and locations for use in spectroscopic analysis
US6853942B2 (en) * 2002-03-26 2005-02-08 Timbre Technologies, Inc. Metrology hardware adaptation with universal library
US7330279B2 (en) * 2002-07-25 2008-02-12 Timbre Technologies, Inc. Model and parameter selection for optical metrology
US6834213B1 (en) * 2003-01-06 2004-12-21 Advanced Micro Devices, Inc. Process control based upon a metrology delay
US7171284B2 (en) * 2004-09-21 2007-01-30 Timbre Technologies, Inc. Optical metrology model optimization based on goals
US7355728B2 (en) * 2005-06-16 2008-04-08 Timbre Technologies, Inc. Optical metrology model optimization for repetitive structures
US7925486B2 (en) * 2006-03-14 2011-04-12 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
US8214771B2 (en) * 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
CN103582819B (zh) * 2011-04-06 2016-09-14 科磊股份有限公司 用于提供经改进过程控制的质量度量的方法及系统
US10255385B2 (en) * 2012-03-28 2019-04-09 Kla-Tencor Corporation Model optimization approach based on spectral sensitivity
KR102246286B1 (ko) * 2013-12-30 2021-04-30 에이에스엠엘 네델란즈 비.브이. 메트롤로지 타겟의 디자인을 위한 방법 및 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12530183B2 (en) 2022-08-30 2026-01-20 T-Mobile Usa, Inc. Framework for automated productization in telecommunications networks

Also Published As

Publication number Publication date
CN105830069B (zh) 2021-04-20
SG10201804964TA (en) 2018-07-30
US10726169B2 (en) 2020-07-28
US20160042105A1 (en) 2016-02-11
CN105830069A (zh) 2016-08-03
TW201535137A (zh) 2015-09-16
WO2015089231A1 (en) 2015-06-18
JP2017508273A (ja) 2017-03-23
TWI661324B (zh) 2019-06-01
KR102265868B1 (ko) 2021-06-16
KR20160096118A (ko) 2016-08-12

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